ATE551888T1 - Mittels natürlicher und zwangsbelüftung gekühltes gehäuse eines elektronischen geräts - Google Patents

Mittels natürlicher und zwangsbelüftung gekühltes gehäuse eines elektronischen geräts

Info

Publication number
ATE551888T1
ATE551888T1 AT07857387T AT07857387T ATE551888T1 AT E551888 T1 ATE551888 T1 AT E551888T1 AT 07857387 T AT07857387 T AT 07857387T AT 07857387 T AT07857387 T AT 07857387T AT E551888 T1 ATE551888 T1 AT E551888T1
Authority
AT
Austria
Prior art keywords
natural
forced ventilation
housing
casing
electronic device
Prior art date
Application number
AT07857387T
Other languages
English (en)
Inventor
Gerard Nemoz
Bruno Bellin
Philippe Bieth
Original Assignee
Thales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Sa filed Critical Thales Sa
Application granted granted Critical
Publication of ATE551888T1 publication Critical patent/ATE551888T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT07857387T 2006-12-21 2007-12-11 Mittels natürlicher und zwangsbelüftung gekühltes gehäuse eines elektronischen geräts ATE551888T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0611209A FR2910779A1 (fr) 2006-12-21 2006-12-21 Boitier d'appareillage electronique a refroidissement par ventilation naturelle et forcee
PCT/EP2007/063700 WO2008080776A1 (fr) 2006-12-21 2007-12-11 Boitier d'appareillage electronique a refroidissement par ventilation naturelle et forcee

Publications (1)

Publication Number Publication Date
ATE551888T1 true ATE551888T1 (de) 2012-04-15

Family

ID=38542991

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07857387T ATE551888T1 (de) 2006-12-21 2007-12-11 Mittels natürlicher und zwangsbelüftung gekühltes gehäuse eines elektronischen geräts

Country Status (5)

Country Link
US (1) US8542485B2 (de)
EP (1) EP2098105B1 (de)
AT (1) ATE551888T1 (de)
FR (1) FR2910779A1 (de)
WO (1) WO2008080776A1 (de)

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US8270155B2 (en) * 2008-02-15 2012-09-18 Hewlett-Packard Development Company, L.P. Coolant pulsing for computer system
GB2463956B (en) * 2008-05-20 2010-11-03 Semper Holdings Ltd Rack mounted cooling unit
FR2934905B1 (fr) * 2008-08-05 2010-09-03 Thales Sa Dispositif de refroidissement aeraulique de calculateur "full arinc"
CN102098902A (zh) * 2009-12-11 2011-06-15 华为技术有限公司 散热设备、通信设备的散热方法及通信设备
FR2965140B1 (fr) 2010-09-20 2013-07-05 Ece Dispositif de protection d'un systeme electronique monte dans un rack
MX2013007122A (es) 2010-12-22 2013-10-01 Cooper Technologies Co Control de flujo de aire dentro de un contenedor a prueba de explosiones.
MX2013007123A (es) 2010-12-22 2013-08-01 Cooper Technologies Co Colector para controlar el flujo de aire dentro de un contenedor a prueba de explosiones.
US9820406B1 (en) * 2011-03-11 2017-11-14 Lex Products Corporation Power management and distribution system and method
CN102722230A (zh) * 2011-03-29 2012-10-10 唐兵 一种电脑电源
CN102892270B (zh) * 2012-09-24 2015-05-13 西安电子工程研究所 一种多通道复合散热密封机箱
US9578781B2 (en) * 2014-05-09 2017-02-21 Advanced Cooling Technologies, Inc. Heat management for electronic enclosures
US9370090B2 (en) * 2014-09-29 2016-06-14 General Electric Company Circuit card assembly and method of manufacturing thereof
US10015914B2 (en) 2015-02-05 2018-07-03 Vertiv Energy Systems, Inc. Enclosures and methods of managing heat in heat generating modules
JP6497113B2 (ja) * 2015-02-19 2019-04-10 富士通株式会社 電子装置、及び搭載ユニットの搭載方法
EP3266288A4 (de) * 2015-04-20 2018-11-14 Hewlett Packard Enterprise Development LP Zusätzliche luftkühlung
JP2017005010A (ja) * 2015-06-05 2017-01-05 富士通株式会社 電子機器
US10080067B2 (en) * 2015-12-31 2018-09-18 Infinera Corporation Heat relay network system for telecommunication equipment
CN108990392B (zh) * 2018-09-06 2023-08-18 郑州云海信息技术有限公司 一种多冷源模块化数据中心
US20220312622A1 (en) * 2021-03-25 2022-09-29 Baidu Usa Llc Server chassis design for high power density electronics thermal management

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US5943211A (en) * 1997-04-18 1999-08-24 Raytheon Company Heat spreader system for cooling heat generating components
DE19653523A1 (de) * 1996-12-20 1998-07-02 Magnet Motor Gmbh Bauelementträger mit Luft-Umwälzkühlung der elektrischen Bauelemente
US6850415B2 (en) * 1998-12-31 2005-02-01 Honeywell International Inc. Methods and apparatus for circuit integration
US6377453B1 (en) * 1999-01-29 2002-04-23 Hewlett-Packard Company Field replaceable module with enhanced thermal interface
JP3565767B2 (ja) * 2000-07-19 2004-09-15 トラストガード株式会社 カートリッジ型サーバユニットおよび該サーバユニット搭載用筐体ならびにサーバ装置
FR2812378B1 (fr) * 2000-07-25 2005-08-12 Aldes Aeraulique Dispositif d'insufflation d'air dans un local
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JP2002366259A (ja) * 2001-06-11 2002-12-20 Matsushita Electric Ind Co Ltd 可搬型情報処理装置
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
JP3757200B2 (ja) * 2002-09-25 2006-03-22 株式会社日立製作所 冷却機構を備えた電子機器
US7075788B2 (en) * 2003-06-11 2006-07-11 Hewlett-Packard Development Company, L.P. Computer cooling system and method
KR101059522B1 (ko) * 2003-09-30 2011-08-26 트랜스퍼시픽 소닉, 엘엘씨 히트 파이프를 이용한 통신장비의 방열장치
US7457118B1 (en) * 2003-12-19 2008-11-25 Emc Corporation Method and apparatus for dispersing heat from high-power electronic devices
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US7183500B2 (en) * 2004-06-30 2007-02-27 Intel Corporation Electromagnetic interference (EMI) filter with passive noise cancellation
US7152418B2 (en) * 2004-07-06 2006-12-26 Intel Corporation Method and apparatus to manage airflow in a chassis
FR2886509B1 (fr) * 2005-05-24 2007-09-14 Thales Sa Dispositif electronique modulaire fonctionnant dans des environnements severes
US7719837B2 (en) * 2005-08-22 2010-05-18 Shan Ping Wu Method and apparatus for cooling a blade server
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
US7369412B2 (en) * 2006-05-02 2008-05-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
FR2905556B1 (fr) * 2006-08-30 2009-06-26 Thales Sa Baie electronique associant convection naturelle et circulation d'air force pour son refroidissement
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
US8064200B1 (en) * 2008-04-16 2011-11-22 Cyan Optics, Inc. Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another

Also Published As

Publication number Publication date
US8542485B2 (en) 2013-09-24
FR2910779A1 (fr) 2008-06-27
WO2008080776A1 (fr) 2008-07-10
EP2098105A1 (de) 2009-09-09
EP2098105B1 (de) 2012-03-28
US20090318071A1 (en) 2009-12-24

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