ATE519360T1 - Flexible heizkabelvorrichtung - Google Patents

Flexible heizkabelvorrichtung

Info

Publication number
ATE519360T1
ATE519360T1 AT06026855T AT06026855T ATE519360T1 AT E519360 T1 ATE519360 T1 AT E519360T1 AT 06026855 T AT06026855 T AT 06026855T AT 06026855 T AT06026855 T AT 06026855T AT E519360 T1 ATE519360 T1 AT E519360T1
Authority
AT
Austria
Prior art keywords
heat
interface unit
thermal
heating cable
cable device
Prior art date
Application number
AT06026855T
Other languages
English (en)
Inventor
Berk Yesin
Mervi Jylhakallio
Matti Kauhanen
Jose Balta
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Application granted granted Critical
Publication of ATE519360T1 publication Critical patent/ATE519360T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT06026855T 2006-12-23 2006-12-23 Flexible heizkabelvorrichtung ATE519360T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06026855A EP1937047B1 (de) 2006-12-23 2006-12-23 Flexible Heizkabelvorrichtung

Publications (1)

Publication Number Publication Date
ATE519360T1 true ATE519360T1 (de) 2011-08-15

Family

ID=38229769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06026855T ATE519360T1 (de) 2006-12-23 2006-12-23 Flexible heizkabelvorrichtung

Country Status (3)

Country Link
US (1) US20080179047A1 (de)
EP (1) EP1937047B1 (de)
AT (1) ATE519360T1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070227701A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Thermosiphon with flexible boiler plate
CN102300440A (zh) * 2010-06-22 2011-12-28 侯宗志 可挠式散热导管
RU2473982C1 (ru) * 2011-10-27 2013-01-27 Валентин Николаевич Хабаров Устройство тепловой защиты электронного модуля памяти
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US9733680B1 (en) 2016-03-16 2017-08-15 Microsoft Technology Licensing, Llc Thermal management system including an elastically deformable phase change device
US10638648B2 (en) 2016-04-28 2020-04-28 Ge Energy Power Conversion Technology Ltd. Cooling system with pressure regulation
US11168583B2 (en) * 2016-07-22 2021-11-09 General Electric Company Systems and methods for cooling components within a gas turbine engine
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter
JP7099144B2 (ja) * 2018-07-31 2022-07-12 株式会社デンソー サーモサイフォン式温調装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3913665A (en) * 1973-10-01 1975-10-21 Boeing Co External tube artery flexible heat pipe
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US6152213A (en) * 1997-03-27 2000-11-28 Fujitsu Limited Cooling system for electronic packages
US6084769A (en) * 1997-08-20 2000-07-04 Compaq Computer Corporation Docking station with auxiliary heat dissipation system for a docked portable computer
US6209626B1 (en) * 1999-01-11 2001-04-03 Intel Corporation Heat pipe with pumping capabilities and use thereof in cooling a device
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
US6597573B2 (en) * 2001-02-05 2003-07-22 Mark A. Gummin Vacuum feedthrough heatpipe assembly
AU2002306161A1 (en) * 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
TW510532U (en) * 2001-07-25 2002-11-11 Wen-Chen Wei Flexible heat tube structure
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6643132B2 (en) * 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US20050180109A1 (en) * 2002-04-16 2005-08-18 Yoshiro Miyazaki Self-excited vibration heat pipe and computer with the heat pipe
US7013955B2 (en) * 2003-07-28 2006-03-21 Thermal Corp. Flexible loop thermosyphon
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
US20050219820A1 (en) * 2004-04-01 2005-10-06 Belady Christian L System and method for heat dissipation
US20060162903A1 (en) * 2005-01-21 2006-07-27 Bhatti Mohinder S Liquid cooled thermosiphon with flexible partition
TWI285081B (en) * 2005-08-10 2007-08-01 Cooler Master Co Ltd Heat-dissipation structure and method thereof
US20070227703A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Evaporatively cooled thermosiphon

Also Published As

Publication number Publication date
EP1937047B1 (de) 2011-08-03
US20080179047A1 (en) 2008-07-31
EP1937047A1 (de) 2008-06-25

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Legal Events

Date Code Title Description
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