CN102077704A - 用于容纳电子设备的机柜的热管理系统 - Google Patents

用于容纳电子设备的机柜的热管理系统 Download PDF

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Publication number
CN102077704A
CN102077704A CN200980125420XA CN200980125420A CN102077704A CN 102077704 A CN102077704 A CN 102077704A CN 200980125420X A CN200980125420X A CN 200980125420XA CN 200980125420 A CN200980125420 A CN 200980125420A CN 102077704 A CN102077704 A CN 102077704A
Authority
CN
China
Prior art keywords
evaporator
condenser
cabinet
heat
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980125420XA
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English (en)
Chinese (zh)
Inventor
弗里德里希·威廉·登特
赫伯特·安德斯
曼弗雷德·鲍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102077704A publication Critical patent/CN102077704A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN200980125420XA 2008-05-07 2009-05-04 用于容纳电子设备的机柜的热管理系统 Pending CN102077704A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08155830A EP2117288A1 (en) 2008-05-07 2008-05-07 Heat-management system for a cabinet containing electronic equipment
EP08155830.6 2008-05-07
PCT/US2009/042672 WO2009137387A1 (en) 2008-05-07 2009-05-04 Heat-management system for a cabinet containing electronic equipment

Publications (1)

Publication Number Publication Date
CN102077704A true CN102077704A (zh) 2011-05-25

Family

ID=39789712

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980125420XA Pending CN102077704A (zh) 2008-05-07 2009-05-04 用于容纳电子设备的机柜的热管理系统

Country Status (8)

Country Link
US (1) US20110063798A1 (https=)
EP (1) EP2117288A1 (https=)
JP (1) JP2011520287A (https=)
CN (1) CN102077704A (https=)
IL (1) IL208709A0 (https=)
RU (1) RU2010142253A (https=)
TW (1) TW200952617A (https=)
WO (1) WO2009137387A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102256477A (zh) * 2011-07-25 2011-11-23 李俊晖 机房设备并联散热系统
CN102318457A (zh) * 2011-07-26 2012-01-11 华为技术有限公司 通信设备用散热柜
CN103959926A (zh) * 2011-12-01 2014-07-30 日本电气株式会社 电子基板外罩装置和电子设备
CN104470335A (zh) * 2014-12-11 2015-03-25 中国航天空气动力技术研究院 基于热管技术的数据中心节能冷却系统
CN106796072A (zh) * 2014-08-28 2017-05-31 Abb瑞士股份有限公司 用于凝固极性物质的方法及设备

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8783336B2 (en) * 2008-12-04 2014-07-22 Io Data Centers, Llc Apparatus and method of environmental condition management for electronic equipment
JP5460362B2 (ja) * 2010-02-04 2014-04-02 株式会社日立製作所 電子機器の冷却システム
JP2012190884A (ja) * 2011-03-09 2012-10-04 Panasonic Corp ラック型電子機器の冷却装置
WO2012127383A1 (en) 2011-03-18 2012-09-27 Ecolab Usa Inc. Heat system for killing pests
SG10201705879SA (en) * 2012-08-20 2017-08-30 Adc Technology Inc Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of acooling rack enclosure, and related components, systems, and methods
US10240850B1 (en) * 2013-03-15 2019-03-26 Joseph P. Stine Supplemental refrigeration heat sink and related systems and methods
EP3291494B1 (en) * 2016-08-31 2020-09-30 Corning Optical Communications LLC Distribution point unit to exchange communication data between a service provider and subscribers
KR102389976B1 (ko) * 2020-06-17 2022-04-22 김광일 수냉식 옥외 함체
CN112229253B (zh) * 2020-10-30 2022-07-08 上海卫星装备研究所 热管支路连接装置与热管系统
JP7651903B2 (ja) * 2021-03-26 2025-03-27 富士通株式会社 冷却装置
CN113099702A (zh) * 2021-04-29 2021-07-09 江西新电汽车空调系统有限公司 一种双柜及多联柜基站空调

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002017698A2 (en) * 2000-08-22 2002-02-28 Hb Innovation Ltd. Distributed thermal management system for electronic components
US6942193B2 (en) * 2002-08-16 2005-09-13 Eaton Corporation Self-sealing end fitting
US20060000582A1 (en) * 2003-07-28 2006-01-05 Phillips Alfred L Flexible loop thermosyphon
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB698571A (en) 1951-07-09 1953-10-21 Aeroquip Corp Improved composite fluid sealing structure applicable to valves and method of makingthe same
US2753195A (en) 1953-07-14 1956-07-03 William D Palmer Self-sealing coupling
US4046193A (en) * 1976-02-18 1977-09-06 Westinghouse Electric Corporation Closed electrical apparatus cabinet embodying a vaporization chamber and cabinet top thereof
JPS6441792A (en) * 1987-08-07 1989-02-14 Actronics Kk Heat pipe type casing cooler
US5467250A (en) 1994-03-21 1995-11-14 Hubbell Incorporated Electrical cabinet with door-mounted heat exchanger
US6030934A (en) 1997-02-19 2000-02-29 3M Innovative Properties Company Azeotropic compositions of methoxy-perfluoropropane and their use
US6022842A (en) 1998-02-11 2000-02-08 3M Innovative Properties Company Azeotrope-like compositions including perfluorobutyl methyl ether, 1- bromopropane and alcohol
JP3315649B2 (ja) * 1998-08-11 2002-08-19 富士通株式会社 電子機器
FI981909L (fi) 1998-09-07 2000-03-08 Nokia Networks Oy Lämmönsiirrin
EP1003006A1 (en) * 1998-11-19 2000-05-24 Franz Isella S.p.A. Hybrid system of passive cooling using heat pipes
IL129392A0 (en) 1999-04-11 2000-06-01 Eci Telecom Ltd System and method for heat exchanging
FI108962B (fi) 1999-08-20 2002-04-30 Nokia Corp Laitekaapin jäähdytysjärjestelmä
WO2002032202A1 (en) 2000-10-10 2002-04-18 3M Innovative Properties Company Heat exchanger for sealed cabinets
US6499717B1 (en) 2000-11-27 2002-12-31 International Business Machines Corporation System and method of use for a refrigerant quick-connect coupling
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
US20080006037A1 (en) * 2001-12-26 2008-01-10 Coolit Systems Inc. Computer cooling apparatus
US7061763B2 (en) 2002-01-29 2006-06-13 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
JP2003287329A (ja) * 2002-03-28 2003-10-10 Mitsubishi Electric Corp 冷却装置
JP2003324174A (ja) * 2002-04-30 2003-11-14 Toshiba Corp 電子機器
US6603660B1 (en) 2002-08-12 2003-08-05 Netrix Technologies, Inc. Remote distribution frame
US6788535B2 (en) 2002-12-12 2004-09-07 3M Innovative Properties Company Outdoor electronic equipment cabinet
JP4199018B2 (ja) * 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
JP4350606B2 (ja) * 2004-07-23 2009-10-21 シャープ株式会社 プリント配線板の製造方法
JP4321413B2 (ja) * 2004-09-02 2009-08-26 株式会社日立製作所 ディスクアレイ装置
US20060181848A1 (en) * 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
CN100590377C (zh) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 热管冷却系统及其热传递连接器
EP1859336A2 (de) * 2005-03-07 2007-11-28 Asetek A/S Kühlsystem für elektronische geräte, insbesondere computer
US7686071B2 (en) * 2005-07-30 2010-03-30 Articchoke Enterprises Llc Blade-thru condenser having reeds and heat dissipation system thereof
US7614445B2 (en) * 2005-12-21 2009-11-10 Sun Microsystems, Inc. Enhanced heat pipe cooling with MHD fluid flow
JP2008085144A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 冷却装置
US7963118B2 (en) * 2007-09-25 2011-06-21 International Business Machines Corporation Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002017698A2 (en) * 2000-08-22 2002-02-28 Hb Innovation Ltd. Distributed thermal management system for electronic components
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US6942193B2 (en) * 2002-08-16 2005-09-13 Eaton Corporation Self-sealing end fitting
US20060000582A1 (en) * 2003-07-28 2006-01-05 Phillips Alfred L Flexible loop thermosyphon

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102256477A (zh) * 2011-07-25 2011-11-23 李俊晖 机房设备并联散热系统
CN102318457A (zh) * 2011-07-26 2012-01-11 华为技术有限公司 通信设备用散热柜
CN103959926A (zh) * 2011-12-01 2014-07-30 日本电气株式会社 电子基板外罩装置和电子设备
CN106796072A (zh) * 2014-08-28 2017-05-31 Abb瑞士股份有限公司 用于凝固极性物质的方法及设备
CN106796072B (zh) * 2014-08-28 2019-12-06 Abb瑞士股份有限公司 用于凝固极性物质的方法及设备
CN104470335A (zh) * 2014-12-11 2015-03-25 中国航天空气动力技术研究院 基于热管技术的数据中心节能冷却系统
CN104470335B (zh) * 2014-12-11 2017-03-15 中国航天空气动力技术研究院 基于热管技术的数据中心节能冷却系统

Also Published As

Publication number Publication date
EP2117288A1 (en) 2009-11-11
JP2011520287A (ja) 2011-07-14
US20110063798A1 (en) 2011-03-17
RU2010142253A (ru) 2012-06-20
TW200952617A (en) 2009-12-16
WO2009137387A1 (en) 2009-11-12
IL208709A0 (en) 2010-12-30

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Application publication date: 20110525