CN100590377C - 热管冷却系统及其热传递连接器 - Google Patents
热管冷却系统及其热传递连接器 Download PDFInfo
- Publication number
- CN100590377C CN100590377C CN200510007414A CN200510007414A CN100590377C CN 100590377 C CN100590377 C CN 100590377C CN 200510007414 A CN200510007414 A CN 200510007414A CN 200510007414 A CN200510007414 A CN 200510007414A CN 100590377 C CN100590377 C CN 100590377C
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting block
- cooling system
- pipe cooling
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 64
- 238000012546 transfer Methods 0.000 title abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 230000008859 change Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (22)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510007414A CN100590377C (zh) | 2005-02-18 | 2005-02-18 | 热管冷却系统及其热传递连接器 |
US11/307,685 US7819174B2 (en) | 2005-02-18 | 2006-02-17 | Heat pipe cooling system and thermal connector thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510007414A CN100590377C (zh) | 2005-02-18 | 2005-02-18 | 热管冷却系统及其热传递连接器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1821701A CN1821701A (zh) | 2006-08-23 |
CN100590377C true CN100590377C (zh) | 2010-02-17 |
Family
ID=36911415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510007414A Expired - Fee Related CN100590377C (zh) | 2005-02-18 | 2005-02-18 | 热管冷却系统及其热传递连接器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7819174B2 (zh) |
CN (1) | CN100590377C (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI225713B (en) * | 2003-09-26 | 2004-12-21 | Bin-Juine Huang | Illumination apparatus of light emitting diodes and method of heat dissipation thereof |
FR2876812B1 (fr) * | 2004-10-15 | 2006-12-22 | J C C Chereau Aeronautique | Dispositif a fluide de refroidissement pour ordinateur |
CN101072482A (zh) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | 散热装置及使用该散热装置的散热系统 |
JP2008085144A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 冷却装置 |
US20080093052A1 (en) * | 2006-10-20 | 2008-04-24 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
US8297061B2 (en) * | 2007-08-02 | 2012-10-30 | Cree, Inc. | Optoelectronic device with upconverting luminophoric medium |
US9157687B2 (en) * | 2007-12-28 | 2015-10-13 | Qcip Holdings, Llc | Heat pipes incorporating microchannel heat exchangers |
US20090205810A1 (en) * | 2008-02-19 | 2009-08-20 | Man Zai Industrialco., Ltd. | Liquid cooling device |
EP2117288A1 (en) * | 2008-05-07 | 2009-11-11 | 3M Innovative Properties Company | Heat-management system for a cabinet containing electronic equipment |
JP5433987B2 (ja) * | 2008-06-13 | 2014-03-05 | ダイキン工業株式会社 | 冷凍装置 |
TWI333539B (en) * | 2008-06-26 | 2010-11-21 | Inventec Corp | Loop heat pipe |
US20110162818A1 (en) * | 2008-09-23 | 2011-07-07 | Tyrell Kyle Kumlin | Providing Connection Elements For Connecting Fluid Pipes To Carry Cooling Fluid In A System |
US9557117B2 (en) * | 2008-10-29 | 2017-01-31 | Nec Corporation | Cooling structure, electronic device using same, and cooling method |
EP2246653B1 (en) | 2009-04-28 | 2012-04-18 | ABB Research Ltd. | Twisted tube thermosyphon |
EP2246654B1 (en) * | 2009-04-29 | 2013-12-11 | ABB Research Ltd. | Multi-row thermosyphon heat exchanger |
CN101929816B (zh) * | 2009-06-24 | 2012-06-27 | 扬光绿能股份有限公司 | 回路式热管及其制作方法 |
US20100326627A1 (en) * | 2009-06-30 | 2010-12-30 | Schon Steven G | Microelectronics cooling system |
WO2011035943A2 (en) * | 2009-09-28 | 2011-03-31 | Abb Research Ltd | Cooling module for cooling electronic components |
US8811014B2 (en) * | 2011-12-29 | 2014-08-19 | General Electric Company | Heat exchange assembly and methods of assembling same |
CN104619156B (zh) * | 2015-02-16 | 2017-10-17 | 华为技术有限公司 | 散热装置及通信产品 |
US9801313B2 (en) * | 2015-06-26 | 2017-10-24 | Microsoft Technology Licensing, Llc | Underwater container cooling via integrated heat exchanger |
US9844167B2 (en) | 2015-06-26 | 2017-12-12 | Microsoft Technology Licensing, Llc | Underwater container cooling via external heat exchanger |
KR200494468Y1 (ko) * | 2017-02-23 | 2021-10-18 | 엘에스일렉트릭(주) | 모듈형 냉각장치를 이용한 방열 시스템 |
JP6948832B2 (ja) * | 2017-05-22 | 2021-10-13 | 株式会社Uacj鋳鍛 | 真空装置用伝熱板及びその製造方法 |
US10622282B2 (en) * | 2017-07-28 | 2020-04-14 | Qualcomm Incorporated | Systems and methods for cooling an electronic device |
CN108106289A (zh) * | 2017-12-11 | 2018-06-01 | 南京天加环境科技有限公司 | 一种制冷系统控制器冷却装置 |
TWI672478B (zh) * | 2018-05-04 | 2019-09-21 | 泰碩電子股份有限公司 | 迴路式均溫板 |
JP7236825B2 (ja) * | 2018-07-11 | 2023-03-10 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
CN109341393B (zh) * | 2018-10-22 | 2023-11-21 | 华南理工大学 | 多种毛细吸液芯的分离式微通道铝热管管坯及其制造方法 |
KR102173228B1 (ko) * | 2019-01-04 | 2020-11-03 | 한국과학기술원 | 연성 평판 진동형 히트파이프 및 이의 제작 방법 |
JP2023106006A (ja) * | 2022-01-20 | 2023-08-01 | 新光電気工業株式会社 | ループ型ヒートパイプ |
JP2023120521A (ja) * | 2022-02-18 | 2023-08-30 | 新光電気工業株式会社 | ループ型ヒートパイプ |
Family Cites Families (23)
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US2819883A (en) * | 1954-08-25 | 1958-01-14 | Metal Specialty Company | Pressure-welded tubing turn |
US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
US4085728A (en) * | 1976-08-16 | 1978-04-25 | Tomchak Sigfrid A | Solar energy heater |
DE8429523U1 (de) * | 1984-10-08 | 1984-11-29 | Nixdorf Computer Ag, 4790 Paderborn | Kühlkörper für elektronische Bauelemente und/oder Geräte |
JPH03141663A (ja) * | 1989-10-26 | 1991-06-17 | Koufu Nippon Denki Kk | ヒートシンクの取付け構造 |
US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
JP3164518B2 (ja) | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
US5787976A (en) * | 1996-07-01 | 1998-08-04 | Digital Equipment Corporation | Interleaved-fin thermal connector |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6196003B1 (en) * | 1999-11-04 | 2001-03-06 | Pc/Ac, Inc. | Computer enclosure cooling unit |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
DE10220532A1 (de) * | 2001-05-11 | 2002-11-14 | Behr Gmbh & Co | Wärmetauscher |
CA2352997A1 (en) * | 2001-07-13 | 2003-01-13 | Coolit Systems Inc. | Computer cooling apparatus |
US6477045B1 (en) * | 2001-12-28 | 2002-11-05 | Tien-Lai Wang | Heat dissipater for a central processing unit |
US6600649B1 (en) * | 2002-05-24 | 2003-07-29 | Mei-Nan Tsai | Heat dissipating device |
JP4032954B2 (ja) * | 2002-07-05 | 2008-01-16 | ソニー株式会社 | 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法 |
AU2003277199A1 (en) | 2002-10-02 | 2004-04-23 | Swales And Associates, Inc. | Evaporator for a heat transfer system |
US7013956B2 (en) * | 2003-09-02 | 2006-03-21 | Thermal Corp. | Heat pipe evaporator with porous valve |
US7316263B2 (en) * | 2003-11-19 | 2008-01-08 | Intel Corporation | Cold plate |
US6880346B1 (en) * | 2004-07-08 | 2005-04-19 | Giga-Byte Technology Co., Ltd. | Two stage radiation thermoelectric cooling apparatus |
US20070199679A1 (en) * | 2006-02-24 | 2007-08-30 | Ming-Hang Hwang | Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device Thereof |
JP2007294891A (ja) * | 2006-03-30 | 2007-11-08 | Dowa Metaltech Kk | 放熱器 |
-
2005
- 2005-02-18 CN CN200510007414A patent/CN100590377C/zh not_active Expired - Fee Related
-
2006
- 2006-02-17 US US11/307,685 patent/US7819174B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7819174B2 (en) | 2010-10-26 |
US20060185827A1 (en) | 2006-08-24 |
CN1821701A (zh) | 2006-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YANG SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: JIANGLING ELECTROMECHANICAL CO., LTD. Effective date: 20070907 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070907 Address after: B2, 3 Wanning street, Wenshan District, Taiwan, Taipei Applicant after: Advanced Thermal Devices, Inc. Address before: No. three, 207 section, North Road, new store, Taipei County, Taiwan province B2 Applicant before: Jiangling Electromechanical Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20140218 |