TWI333539B - Loop heat pipe - Google Patents

Loop heat pipe Download PDF

Info

Publication number
TWI333539B
TWI333539B TW097123967A TW97123967A TWI333539B TW I333539 B TWI333539 B TW I333539B TW 097123967 A TW097123967 A TW 097123967A TW 97123967 A TW97123967 A TW 97123967A TW I333539 B TWI333539 B TW I333539B
Authority
TW
Taiwan
Prior art keywords
capillary
working fluid
heat pipe
conduit
evaporation
Prior art date
Application number
TW097123967A
Other languages
Chinese (zh)
Other versions
TW201000843A (en
Inventor
Feng Ku Wang
Chiun Peng Chen
Ting Chiang Huang
Shaw Fuu Wang
Sheng Jie Syu
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW097123967A priority Critical patent/TWI333539B/en
Publication of TW201000843A publication Critical patent/TW201000843A/en
Application granted granted Critical
Publication of TWI333539B publication Critical patent/TWI333539B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

080249.TW 27932twf.doc/n 九、發明說明: 【發明所屬的技術領域】 且特別是有關於一種迴路 本發明是有關於一種熱管, 式熱管。 …’ 【先前技術】 吝口5年、通訊與資訊等相關產業迅速發展,電子 愈趨向於輕薄短小,因而促使其㈣量與發 =漸增加,為解決這方面的問題,一種利用 的熱管裝置已逐漸被廣泛地應用。 支化 *圖1為習知一種熱管的結構示意圖。請參考圖1,熱 & 1〇〇包括-封閉的金屬管11〇、一配置於金屬管内 壁,:毛細結構(eapillai:y stmet刪)l2G錢—配置於金 屬& 110以及毛細結構no的孔隙内的工作流體。其中, 毛細結構120可利用金屬粉末燒結(Sintered body mide of metal powder )而成。 曰當^屬官110 # —受熱端接觸一發熱源時,發熱源的 熱量會經由金屬管11G傳遞至毛細結構跡巾,以蒸發位 於毛細結構120的孔隙内的液態工作流體。此時,位於毛 細結構120孔隙内的液態工作流體會藉由毛細作用 (capillarity)持續由金屬管u〇的一冷卻端流動至金屬管 110的受熱端,而氣態工作流體則會經由金屬管11〇的中 空部份持續朝向金屬管11〇的冷卻端流動。 同時,位於冷卻端的氣態工作流體的熱量會再經由金 1333539 080249.TW 27932twf.doc/n 屬管110的管壁而散逸至金屬管110外。因此,位於冷卻 端的氣態工作流體會逐漸在毛細結構12〇的孔隙中冷凝。 如此一來,熱管100即可藉由工作流體的相變化與流動持 續對發熱源進行散熱。 ' 值得注意的是,熱管100在對發熱源進行散熱時,氣 態工作流體和液態工作流體的流向正好相反。因此,工作 流體在金屬管110内流動時會承受較大的阻力。另一方 面,配置於電子裝置内部的熱管100通常會被折彎或打 爲’以配合電子裝置的内部空間。如此一來’毛細結構12〇 容易被破壞,造成液態工作流體不易藉由毛細作用在毛細 結構120的孔隙内流動。 圖2為習知一種迴路式熱管的結構示意圖。請參考圖 2,迴路式熱管200包含一蒸發器210、一與蒸發器21〇共 同形成一封閉迴路的連接管220、一配置於連接管220上 的冷凝器230以及一適於在蒸發器210與連接管220中流 動的工作流體。蒸發器210包括一外管212、一配置於外 管中並具有多個毛*細結構的内管214、一形成於内管中的 液體通道216以及一形成於外管212與内管214之間的蒸 氣通道218。 位於液體通道216中的液態工作流體會經由内管214 的多個毛細結構滲透至這些蒸氣通道218中,並會藉由吸 收發熱源的熱能而轉換成氣態。然後,氣態工作流體會再 經由這些蒸氣通道218而流動至連接營220中。接著,流 動於連接管220中的氣態工作流體會被冷凝器230冷卻而 6 1333539 080249.TW 27932twf.doc/n 轉換成液態,並繼續回流至蒸發器210。如此一來,工作 流體即可持續對發熱源進行散熱。 ☆在迴路式熱管200中,氣態工作流體和液態工作流體 的流向大致上相同。因此,連接管22〇中的液態工作流體 =僅可藉由毛細作用朝向蒸發器210流動,氣態工作流體 藉由壓力差流動時還可推動液態工作流體流動。也因此,080249.TW 27932twf.doc/n IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat pipe, a heat pipe. ...' [Previous technology] In the past five years, the related industries such as communication and information have developed rapidly, and the electrons tend to be lighter and thinner, which has prompted their (four) quantity and development to gradually increase. To solve this problem, a heat pipe device is utilized. It has gradually been widely used. Branching * Figure 1 is a schematic view of the structure of a conventional heat pipe. Referring to Fig. 1, the heat & 1〇〇 includes a closed metal tube 11〇, one disposed on the inner wall of the metal tube, a capillary structure (eapillai: y stmet deleted) l2G money—disposed on the metal & 110 and the capillary structure no The working fluid within the pores. The capillary structure 120 can be formed by sintering a metal powder (Sintered body mide of metal powder). When the heated end contacts a heat source, the heat of the heat source is transferred to the capillary structure through the metal tube 11G to evaporate the liquid working fluid located in the pores of the capillary structure 120. At this time, the liquid working fluid located in the pores of the capillary structure 120 will continue to flow from a cooling end of the metal tube u〇 to the heat receiving end of the metal tube 110 by capillary action, and the gaseous working fluid will pass through the metal tube 11 The hollow portion of the crucible continues to flow toward the cooling end of the metal tube 11〇. At the same time, the heat of the gaseous working fluid at the cooling end is again dissipated outside the metal tube 110 via the wall of the tube 1333539 080249.TW 27932 twf.doc/n. Therefore, the gaseous working fluid at the cooling end will gradually condense in the pores of the capillary structure 12〇. In this way, the heat pipe 100 can heat the heat source by the phase change and the flow of the working fluid. It is worth noting that when the heat pipe 100 dissipates heat from the heat source, the flow of the gaseous working fluid and the liquid working fluid is reversed. Therefore, the working fluid is subjected to a large resistance when flowing in the metal pipe 110. On the other hand, the heat pipe 100 disposed inside the electronic device is usually bent or slid to fit the internal space of the electronic device. As a result, the capillary structure 12 is easily broken, so that the liquid working fluid is less likely to flow in the pores of the capillary structure 120 by capillary action. 2 is a schematic structural view of a conventional loop heat pipe. Referring to FIG. 2, the loop heat pipe 200 includes an evaporator 210, a connecting pipe 220 formed together with the evaporator 21A to form a closed circuit, a condenser 230 disposed on the connecting pipe 220, and a suitable for the evaporator 210. The working fluid flowing in the connecting pipe 220. The evaporator 210 includes an outer tube 212, an inner tube 214 disposed in the outer tube and having a plurality of thin structures, a liquid passage 216 formed in the inner tube, and a tube 214 formed in the outer tube 212 and the inner tube 214. A vapor passage 218 between. The liquid working fluid located in the liquid passage 216 is infiltrated into the vapor passages 218 via a plurality of capillary structures of the inner tube 214 and is converted into a gaseous state by the heat energy of the heat-absorbing and heat-absorbing source. The gaseous working fluid then flows through the vapor passages 218 into the connection battalion 220. Next, the gaseous working fluid flowing in the connecting pipe 220 is cooled by the condenser 230 and converted into a liquid state, and is continuously returned to the evaporator 210. In this way, the working fluid can continuously dissipate heat from the heat source. ☆ In the loop heat pipe 200, the flow directions of the gaseous working fluid and the liquid working fluid are substantially the same. Therefore, the liquid working fluid in the connecting pipe 22 can only flow toward the evaporator 210 by capillary action, and the gaseous working fluid can also push the liquid working fluid to flow by the pressure difference. So,

相較於熱管1GG ’迴路式齡的玉作越在流動時备 承受較小的阻力。 B 士值#注意的是,雖然迴路式熱管2〇〇的工作流體在流 動%會承叉較小的阻力,但氣態工作流體通過冷凝器2邓 後必須^全冷凝成液態工作趙才能藉由毛細仙再回流 至蒸發盗210。如此一來,迴路式熱管2〇〇才可藉由工作 流體^相變化錢動胸對發熱驗行散熱。然*,相較 於熱官10G ’迴路式熱管細的熱平衡及工作溫度較不容 【發明内容】 本發明提供一種迴路式熱管,其可具有較佳的傳熱效 率,且其使用時的穩定度較高。 本發明提出一種迴路式熱管,適於對一發熱源進行散 ^此迴路式熱管包括―第—導管、一第—毛細結構、一 第二,細結構、一第二導管以及一工作流體。第一導管具 有一洛發部以及一冷凝部,其中蒸發部鄰近於發熱源。第 毛、,.田、構配置於第一導管的一内表面上,並由蒸發部延 7 1333539 · 080249.TW 27932twf.doc/n 伸^部。第二毛細結構配置於内表面上,並位於塞發 部卜弟一導管連接於蒸發部與冷凝部之間。工作流體配 置於Ϊ 一導ί與第二導管中,其中工作流體適於由蒸發部 通過弟一導f㈣遞至冷凝部,並適 凝部傳遞至蒸如卜 月的實施例中’上述的第-毛細結構為多個 =於内表面上的溝槽1上述的第二毛域構為-燒結 在本發明的-實施例中,上述的第一毛細結構與上述 的弟一毛細結構為一體成型的燒結結構。 在本發明的—實施财,上述的第二毛細結構且有一 排出鳊以及-回流端,且發熱源與第二導 而上=:的-實施例中,上述的排出端為-:端 而上述的回以端為一封閉端。 述的==實施例中’上述的排出端的⑽^ 在本發明的迴路式熱,液m流體能 流f的流動方向大致上相同。因此,工作流體在第二導管 與第二導管中流動時會承受較小的阻力。再者 流體通過冷凝部後可不需要完全轉換成液態工作^。換 句話說,在第-導管中由冷凝部朝向蒸發部流動ς工作流 體可處於液氣共存的狀態。因此,本發明 熱平衡以及工作溫度易㈣卜 路式熱&的 為讓本發明的上述特徵和優點能更明顯易懂,下文特 080249.TW 27932twf.doc/n 舉-實施例’並配合所關式,作詳細說明如下。 【實施方式】 s 明一實施例的一種迴路式熱管的結構示意 絲管_適射卜發熱源進行散 CPm + (central processing unit, ί他電子科。迴路式熱管包括-第-導 :^ 弟一毛細結構320、—第二毛細結構330、-第 —^官340以及一工作流體。 第-導管310的相對兩端分別為一蒸發部312以及一 ^是部314,其中蒸發部312鄰近於發熱源。再者,第一 =結構32〇配置於第—導管的一内表面上,並由装 J:^12延伸至冷凝部314 ’而第二毛崎構330則配置 2表面上,並位於蒸發部祀中。另外 冷凝部314之間,而工作流體則適於 在第一;導官310與第二導管340中流動。 W更詳而""&熱源所產生的熱量會經由第一導管 =至=312的第一毛細結構32。與第:毛= 330中的液離工作产髀门t構與苐二毛細結構 作#P,丨Ί同k ’位於冷凝部314的氣態工 ^體則會被冷部,以在第—導管3K)的内表面凝結成液 〜、。因此,位於瘵發部312的 工 而位於冷凝部314的氣離n:、 體"逐漸、加, 來,作流體則會逐漸減少。如此— 束’麟工作流體即可藉由壓力差而由蒸發部M2通過第 1333539 · 080249.TW 27932twf.doc/n 導管340流向冷凝部 ,r, 4义恐丄作济辦 第毛細結構320的孔隙中藉由毛細作用梏錄二、^在 314朝向蒸發部312流動。也因此,本發明的二2 = 3 0 〇可藉由工作流體的相變化與流動持續對發熱源=二二 值得注意的是,液態工作流體是在第—毛細社 的孔隙中藉由毛細作用由冷凝部314朝向鮮邱。= =二因,’部份未在冷凝部314凝結成液態 ‘ =可在第-導管310的中空部份316中由冷凝部3= 向祭發部312流動。換句話說,即使氣態工作流體 ^部叫完全冷凝成液態工作流體,本發明的迴路 仍可持續對發熱源進行散熱。也因此,相較於習: ΞίΓ的迴路式熱管細,本發明的迴路式熱管3⑻的敎 千衡及工作溫度較容易控制。 … ^外,在本發_迴路式熱f _中,氣態工作流體 流體的流向大致上相同。因此,液態工作流體 細結構320的孔隙中藉由毛細作用持續由 314朝向蒸發部312流動,氣態工作流體在第一導 中㈣份316中由冷凝部314朝向蒸發部312流 動T還可推動液態工作流體流動。也因此, 二本,迴路式熱管300的嚷 導g 310中流動時會承受較小的阻力。 ΒΒ 圖3中沿A_A線的剖面圖,而圖5為圖3中沿 -線的剖面圖。請先參考圖3及圖4,於此實施例中, 1333539 080249.TW 27932twf.doc/n 第一導管310例如是—滏 形成;弟—毛細結構320即為 L β 表面的多個溝槽。再者,第二導管 疋、’滑管,以使氣態工作流體在第二導管34〇 有較,動效率。另外,在其他树示的 二二A ^導官310與第二導管340 /亦可為一體成型 W 9官,以縮短迴路式熱管300的製程。 $成5 =考圖3及圖5,第二毛細結構330例如是Compared to the heat pipe 1GG 'loop age jade, it is less resistant to flow when it flows. B value # Note that although the working fluid of the loop type heat pipe will have a small resistance in the flow %, the gaseous working fluid must pass through the condenser 2 and then must be completely condensed into a liquid work. The velvet is then returned to the evaporative thief 210. In this way, the loop type heat pipe can be used to dissipate heat from the heat test by the working fluid. However, compared with the thermal thermal balance and operating temperature of the thermal 10G 'loop type heat pipe, the present invention provides a loop type heat pipe which can have better heat transfer efficiency and stability in use. Higher. The present invention provides a loop type heat pipe suitable for dissipating a heat source. The loop type heat pipe comprises a - duct, a first capillary structure, a second, a fine structure, a second duct, and a working fluid. The first conduit has a flare portion and a condensation portion, wherein the evaporation portion is adjacent to the heat source. The first hair, the field, and the structure are disposed on an inner surface of the first conduit, and are extended by the evaporation portion 7 1333539 · 080249.TW 27932twf.doc/n. The second capillary structure is disposed on the inner surface and is located between the evaporation portion and the condensation portion of the plug. The working fluid is disposed in the first conduit and the second conduit, wherein the working fluid is adapted to be passed from the evaporation portion to the condensation portion through the guide f(4), and the suitable condensation portion is transferred to the embodiment of the steaming method. - the capillary structure is a plurality of = the groove 1 on the inner surface, the second hair field described above is - sintered. In the embodiment of the present invention, the first capillary structure is integrally formed with the above-mentioned bristles Sintered structure. In the embodiment of the present invention, the second capillary structure has a discharge port and a return end, and the heat source and the second guide are in the embodiment: the discharge end is the -: end and the above The back end is a closed end. In the embodiment, the above-mentioned discharge end (10) is substantially the same in the flow direction of the liquid-type fluid flow f of the present invention. Therefore, the working fluid will bear less resistance when flowing in the second conduit and the second conduit. Furthermore, the fluid does not need to be completely converted into a liquid operation after passing through the condensation section. In other words, in the first conduit, the condensing portion flows toward the evaporation portion, and the working fluid can be in a state in which the liquid gas coexists. Therefore, the heat balance of the present invention and the operating temperature are easy (4), and the above features and advantages of the present invention can be more clearly understood, and the following is a special 080249.TW 27932 twf.doc/n The closed type is described in detail below. [Embodiment] The structure of a loop type heat pipe according to an embodiment of the present invention is a schematic diagram of a wire tube _ suitable for a heat source to perform a CPm + (central processing unit, ί他电子科. A loop type heat pipe includes - a guide: ^ brother a capillary structure 320, a second capillary structure 330, a first actuator 340, and a working fluid. The opposite ends of the first conduit 310 are respectively an evaporation portion 312 and a portion 314, wherein the evaporation portion 312 is adjacent to a heat source. Further, the first = structure 32 is disposed on an inner surface of the first conduit, and extends from the assembly J: 12 to the condensation portion 314' and the second Maosha 330 is disposed on the surface of the second surface, and Located in the evaporation section 。. Between the condensation sections 314, the working fluid is adapted to flow in the first; the guide 310 and the second conduit 340. W is more detailed and "" & heat generated by the heat source The first capillary structure 32 is passed through the first conduit = to 312. The liquid separation from the working capillary gate and the second capillary structure is #P, and the same k' is located in the condensation portion 314. The gaseous working body is then condensed into a liquid on the inner surface of the first conduit 3K. Therefore, the work located in the burst portion 312 and the air separation n:, the body " gradually, plus, the fluid is gradually reduced. In this way, the bundle 'Lin working fluid can flow from the evaporation portion M2 through the first portion of the 1333539 · 080249.TW 27932 twf.doc/n conduit 340 to the condensing portion by the pressure difference, and the r, 4 is the first capillary structure 320. The pores are flown by the capillary action in the pores 314 toward the evaporation portion 312. Therefore, the second 2 = 30 本 of the present invention can be continued by the phase change and flow of the working fluid to the heat source = 22. It is noted that the liquid working fluid is by capillary action in the pores of the first capillary. The condensation portion 314 faces the fresh air. = = two factors, 'the portion is not condensed into a liquid state in the condensation portion 314' = can flow from the condensation portion 3 = to the sacrifice portion 312 in the hollow portion 316 of the first conduit 310. In other words, the circuit of the present invention continues to dissipate heat from the heat source even if the gaseous working fluid is completely condensed into a liquid working fluid. Therefore, compared with the loop heat pipe of the : Γ Γ ,, the loop heat and the operating temperature of the loop heat pipe 3 (8) of the present invention are relatively easy to control. ... ^, in the present invention, the flow direction of the gaseous working fluid is substantially the same. Therefore, the pores of the liquid working fluid fine structure 320 continue to flow from the 314 toward the evaporation portion 312 by capillary action, and the gaseous working fluid flows from the condensation portion 314 toward the evaporation portion 312 in the first conduction portion (four) portions 316 to push the liquid state. Working fluid flows. Therefore, in the second case, the loop heat pipe 300 is subjected to less resistance when flowing in the guide g 310.剖面 A cross-sectional view taken along line A_A in Fig. 3, and Fig. 5 is a cross-sectional view taken along line - in Fig. 3. Please refer to FIG. 3 and FIG. 4 first. In this embodiment, 1333539 080249.TW 27932 twf.doc/n first conduit 310 is formed, for example, by 滏; and the capillary structure 320 is a plurality of grooves of the L β surface. Further, the second conduit 疋, 'slide tube, so that the gaseous working fluid has a higher dynamic efficiency in the second conduit 34. In addition, the other two T2A guides 310 and the second conduit 340 may also be integrally formed to shorten the process of the loop heat pipe 300. $5 = FIG. 3 and FIG. 5, the second capillary structure 330 is, for example,

瓜成於第m1G内表管狀燒結結構,且其可以 疋利用金屬粉末燒結而成。除此之外,第二毛細結構330 可具有-排出端E以及—回流端Σ,且發熱源可鄰近 出端Ε。 值得注意的是’在形成第二毛細賴33G時可使其排 出端Ε的厚度小於回流端I的厚度。換句話說,即是使第 二毛細結構33G在排出端Ε關餘的内徑大於回流端工所 剩餘的内徑。如此—來,位於蒸發部312的氣態工作流體 通過排出端Ε的阻力即會小於其通過回流^的阻力。因 此,當位於瘵發部312的氣態工作流體逐漸增加時,氣態 工作流體大致上會朝向第二導管34〇流動。如此一來,即 可避免氣態工作流體和液態工作流體在第一導管中朝 向相反的方向流動。 另方面’此實施例中的發熱源鄰近於排出端ε,以 使液悲工作流體在排出端Ε的蒸發速率會大於液態工作流 體在回流端I的蒸發速率。因此,當第二毛細結構Mo在 回流I所剩餘的内徑極小時,累積在第二毛細結構Mo 11 1333539 080249.TW 27932twf.doc/n 的孔隙中的液態工作流體可能會填滿回流端j所剩餘的内 徑。如此一來,更可避免氣態工作流體和液態工作流體 第一導管310中朝向相反的方向流動。 此外,在其他未繪示的實施例中,排出端E可為— 放端,而回流端I則可為一封閉端。如此一來,位於: 部312的氣態工作流體將只能朝向第二導管34〇产動…* 坌墓社内表面的溝才曰。而且,即使使用者對 弟一 W 3H)進行折彎或打扁等加工.步驟 于 溝槽中藉由毛細作用流動。因此:相㈡ 本發明的迴路式熱管觸於配 可不3被的:施例中,當迴路式熱管3〇° 結構型=構32。與第二毛細 與氣態工作流體路式熱管中,液態工作流體 流體不僅可藉由毛乍二致上相同。因此,液態工作 推動液態工作為,.氣紅作流體流動時還可 管,本發明的也因此’相較於習知技藝中的熱 的阻力。 &的工作流體在流動時會承受較小 流體可在第-毛通過冷凝部後,冷凝成液態的工作 向蒸發部流動,:二隙中藉由毛細作用由冷凝部朝 ^ 、、氣態工作流體則可在第一導管的 12 080249.TW 27932twf.d〇c/n 部流動。因此,即使氣態工 迴路式熱管㈣二成液態工作流體,本發明的 習知枯蓺Φ66、#、,料_進行散熱。也因此,相較於 及工作;管’本發明的迴路式熱管的熱平衡 份的本發㈣迴路式^可藉由溝槽來取代部 ^ 構。而且,即使使用者對第—導管進行折彎或 丁=加王步驟’雜玉作趙大致均可在溝槽中藉由 毛:·田作用流動。因此,相較於習知技藝中的鮮,本發明 的迴路式熱管較適於配合組裝空間再加工。 —雖然本發明已以-實施例揭露如上,然其並非用以限 定本發明,任何所屬技術領域中具有通常知識者,在不脫 離本發明的精神和範_,當可作些許的更動與潤飾,因 此本發明的保護範圍當視後附的申請專利範圍所界定者為 準。 【圖式簡單說明】 圖1為習知一種熱管的結構示意圖。 圖2為習知一種迴路式熱管的結構示意圖。 圖3為本發明一實施例的一種迴路式熱管的結構示意 圖。 圖4為圖3中沿A-Α線的剖面圖。 圖5為圖3中沿B-B線的剖面圖。 13 1333539 080249.TW 27932twf.doc/n 【主要元件符號說明】 100 :熱管 110 :金屬管 120 :毛細結構 200 :迴路式熱管 210 :蒸發器 212 :外管 214 :内管 216 :液體通道 218 :蒸氣通道 220 :連接管 230 :冷凝器 300 :迴路式熱管 310 :第一導管 312 :蒸發部 314 :冷凝部 316 :中空部份 320 :第一毛細結構 330 :第二毛細結構 340 :第二導管 E :排出端 I :回流端 .14The melon is formed into a tubular sintered structure in the m1G, and it can be sintered by using metal powder. In addition to this, the second capillary structure 330 may have a discharge end E and a return end port, and the heat source may be adjacent to the output port. It is worth noting that the thickness of the discharge end turn can be made smaller than the thickness of the reflow end I when the second capillary 33G is formed. In other words, the inner diameter of the second capillary structure 33G at the discharge end is larger than the inner diameter remaining at the return end. As such, the resistance of the gaseous working fluid located at the evaporation portion 312 through the discharge port is less than the resistance through the reflux. Therefore, as the gaseous working fluid at the flare portion 312 gradually increases, the gaseous working fluid will generally flow toward the second conduit 34. In this way, the gaseous working fluid and the liquid working fluid can be prevented from flowing in opposite directions in the first conduit. On the other hand, the heat source in this embodiment is adjacent to the discharge end ε so that the evaporation rate of the liquid-working fluid at the discharge port is greater than the evaporation rate of the liquid working fluid at the reflux end I. Therefore, when the inner diameter of the second capillary structure Mo at the reflux I is extremely small, the liquid working fluid accumulated in the pores of the second capillary structure Mo 11 1333539 080249.TW 27932 twf.doc/n may fill the reflow end j The remaining inner diameter. In this way, it is further avoided that the gaseous working fluid and the liquid working fluid flow in the opposite direction in the first conduit 310. In addition, in other embodiments not shown, the discharge end E may be a discharge end, and the return end I may be a closed end. As a result, the gaseous working fluid at: portion 312 will only be able to produce toward the second conduit 34. * The gully on the inner surface of the tomb is smashed. Moreover, even if the user performs a process such as bending or flattening on the W 3H), the step flows by capillary action in the groove. Therefore: Phase (2) The loop type heat pipe of the present invention is in contact with the configuration: in the embodiment, when the loop type heat pipe is 3 〇 structure type = structure 32. In the second capillary and gaseous working fluid path heat pipe, the liquid working fluid fluid can be not only the same by the bristles. Therefore, the liquid working promotes the liquid working, and the gas red can also be used as the fluid flow, and the present invention is thus compared to the heat resistance in the prior art. The working fluid of & will withstand a small fluid when flowing, and after the first hair passes through the condensation portion, the liquid condenses into a liquid to flow to the evaporation portion: the two gaps work by the condensing action from the condensation portion to the gas state. The fluid can then flow in the 12 080 249. TW 27932 twf.d 〇 c / n portion of the first conduit. Therefore, even if the gas circuit type heat pipe (4) is a liquid working fluid, the conventional Φ66, #, material_ of the present invention dissipates heat. Therefore, the heat transfer portion of the loop type heat pipe of the present invention can be replaced by a groove instead of the portion. Moreover, even if the user bends the first conduit or the D-plus step, the jade can be used to flow in the groove by the action of the hair: field. Therefore, the loop type heat pipe of the present invention is more suitable for reworking with the assembly space than in the prior art. The present invention has been disclosed in the above-described embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a conventional heat pipe. 2 is a schematic structural view of a conventional loop heat pipe. Fig. 3 is a schematic view showing the structure of a loop type heat pipe according to an embodiment of the present invention. Figure 4 is a cross-sectional view taken along line A-Α of Figure 3. Figure 5 is a cross-sectional view taken along line B-B of Figure 3. 13 1333539 080249.TW 27932twf.doc/n [Main component symbol description] 100: Heat pipe 110: Metal pipe 120: Capillary structure 200: Loop heat pipe 210: Evaporator 212: Outer pipe 214: Inner pipe 216: Liquid passage 218: Vapor passage 220: connection pipe 230: condenser 300: circuit type heat pipe 310: first duct 312: evaporation portion 314: condensation portion 316: hollow portion 320: first capillary structure 330: second capillary structure 340: second conduit E: discharge end I: return end. 14

Claims (1)

1333539 080249.TW 27932twf.doc/n 十、申請專利範圍: 1. 一種迴路式熱管,適於對一發熱源進行散熱,該迴 路式熱管包括: 一第一導管,具有一蒸發部以及一冷凝部,其中該蒸 發部鄰近於該發熱源; 一第一毛細結構,配置於該第一導管的一内表面上, 並由該蒸發部延伸至該冷凝部; 一第二毛細結構,配置於該内表面上,並位於該蒸發 • 部中; 一第二導管,連接於該蒸發部與該冷凝部之間;以及 一工作流體,配置於該第一導管與該第二導管中,其 中該工作流體適於由該蒸發部通過該第二導管而傳遞至該 冷凝部,並適於在該第一導管中由該冷凝部傳遞至該蒸發 部。 2. 如申請專利範圍第1項所述的迴路式熱管,其中該 第一毛細結構為多個形成於該内表面上的溝槽,而該第二 毛細結構為一燒結結構。 • 3.如申請專利範圍第1項所述的迴路式熱管,其中該 第一毛細結構與該第二毛細結構為一體成型的燒結結構。 4. 如申請專利範圍第1項所述的迴路式熱管,其中該 第二毛細結構具有一排出端以及一回流端,且該發熱源與 該第二導管鄰近於該排出端。 5. 如申請專利範圍第4項所述的迴路式熱管,其中該 排出端為一開放端,而該回流端為一封閉端。 6. 如申請專利範圍第4項所述的迴路式熱管,其中該 排出端的厚度小於該回流端的厚度。 151333539 080249.TW 27932twf.doc/n X. Patent Application Range: 1. A loop type heat pipe suitable for dissipating heat from a heat source. The loop type heat pipe comprises: a first duct having an evaporation portion and a condensation portion The evaporation portion is adjacent to the heat source; a first capillary structure is disposed on an inner surface of the first conduit and extends from the evaporation portion to the condensation portion; a second capillary structure is disposed therein Surfacely located in the evaporation portion; a second conduit connected between the evaporation portion and the condensation portion; and a working fluid disposed in the first conduit and the second conduit, wherein the working fluid It is adapted to be transferred by the evaporation portion to the condensation portion through the second conduit, and is adapted to be transferred from the condensation portion to the evaporation portion in the first conduit. 2. The loop type heat pipe according to claim 1, wherein the first capillary structure is a plurality of grooves formed on the inner surface, and the second capillary structure is a sintered structure. 3. The loop type heat pipe according to claim 1, wherein the first capillary structure and the second capillary structure are integrally formed sintered structures. 4. The loop heat pipe of claim 1, wherein the second capillary structure has a discharge end and a return end, and the heat source and the second conduit are adjacent to the discharge end. 5. The loop heat pipe of claim 4, wherein the discharge end is an open end and the return end is a closed end. 6. The loop type heat pipe of claim 4, wherein the discharge end has a thickness smaller than a thickness of the return end. 15
TW097123967A 2008-06-26 2008-06-26 Loop heat pipe TWI333539B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097123967A TWI333539B (en) 2008-06-26 2008-06-26 Loop heat pipe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097123967A TWI333539B (en) 2008-06-26 2008-06-26 Loop heat pipe
US12/491,752 US20090321055A1 (en) 2008-06-26 2009-06-25 Loop heat pipe

Publications (2)

Publication Number Publication Date
TW201000843A TW201000843A (en) 2010-01-01
TWI333539B true TWI333539B (en) 2010-11-21

Family

ID=41446009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097123967A TWI333539B (en) 2008-06-26 2008-06-26 Loop heat pipe

Country Status (2)

Country Link
US (1) US20090321055A1 (en)
TW (1) TWI333539B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9504185B2 (en) 2011-03-29 2016-11-22 Asia Vital Components (Shen Zhen) Co., Ltd. Dual chamber loop heat pipe structure with multiple wick layers

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101762194B (en) * 2008-12-24 2012-09-19 富准精密工业(深圳)有限公司 Evaporator and loop type heat pipe applying same
JP5636803B2 (en) * 2010-08-04 2014-12-10 国立大学法人名古屋大学 Loop heat pipe and electronic equipment
CN102760709B (en) * 2011-04-29 2015-05-13 北京奇宏科技研发中心有限公司 Loop heat pipe structure
CN103017585B (en) * 2011-09-23 2015-01-28 北京兆阳光热技术有限公司 Phase change heat exchange device
US20130206369A1 (en) * 2012-02-13 2013-08-15 Wei-I Lin Heat dissipating device
CN103851939A (en) * 2012-12-07 2014-06-11 林唯耕 Loop-type heat transfer structure
TWI595828B (en) * 2016-07-29 2017-08-11 雙鴻科技股份有限公司 Electronic device having loop heat pipe
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
CN108267037A (en) * 2018-03-08 2018-07-10 广州华钻电子科技有限公司 A kind of loop soaking plate of multiple-limb condensation heat pipe

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184477A (en) * 1977-05-03 1980-01-22 Yuan Shao W Solar heating and storage
US4470450A (en) * 1981-10-22 1984-09-11 Lockheed Missiles & Space Co. Pump-assisted heat pipe
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4890668A (en) * 1987-06-03 1990-01-02 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US4899810A (en) * 1987-10-22 1990-02-13 General Electric Company Low pressure drop condenser/heat pipe heat exchanger
US4869313A (en) * 1988-07-15 1989-09-26 General Electric Company Low pressure drop condenser/evaporator pump heat exchanger
US5303768A (en) * 1993-02-17 1994-04-19 Grumman Aerospace Corporation Capillary pump evaporator
TW407455B (en) * 1997-12-09 2000-10-01 Diamond Electric Mfg Heat pipe and its processing method
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US6863117B2 (en) * 2002-02-26 2005-03-08 Mikros Manufacturing, Inc. Capillary evaporator
TWI225713B (en) * 2003-09-26 2004-12-21 Bin-Juine Huang Illumination apparatus of light emitting diodes and method of heat dissipation thereof
US20050077030A1 (en) * 2003-10-08 2005-04-14 Shwin-Chung Wong Transport line with grooved microchannels for two-phase heat dissipation on devices
CN100590377C (en) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 Heat pipe cooling system and its heat transfer connector
US20080078530A1 (en) * 2006-10-02 2008-04-03 Foxconn Technology Co., Ltd. Loop heat pipe with flexible artery mesh
US20090308576A1 (en) * 2008-06-17 2009-12-17 Wang Cheng-Tu Heat pipe with a dual capillary structure and manufacturing method thereof
TW201100736A (en) * 2009-06-17 2011-01-01 Yeh Chiang Technology Corp Superthin heat pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9504185B2 (en) 2011-03-29 2016-11-22 Asia Vital Components (Shen Zhen) Co., Ltd. Dual chamber loop heat pipe structure with multiple wick layers

Also Published As

Publication number Publication date
TW201000843A (en) 2010-01-01
US20090321055A1 (en) 2009-12-31

Similar Documents

Publication Publication Date Title
TWI333539B (en) Loop heat pipe
TWI275766B (en) Heat pipe
TWI260388B (en) Flat plate heat transfer device
US20070267178A1 (en) Heat pipe
JP5403617B2 (en) Self-excited vibration heat pipe
US8490683B2 (en) Flat plate type micro heat transport device
JP5750188B1 (en) heat pipe
US9179577B2 (en) Flat heat pipe and fabrication method thereof
JP5872985B2 (en) Self-excited vibration heat pipe
US20070235165A1 (en) Heat pipe
TW200931230A (en) Heat pipe structure
JP5759600B1 (en) Flat heat pipe
JP4925597B2 (en) Heat pipe for heat pipe and heat pipe
WO2012147217A1 (en) Flat heat pipe and manufacturing method therefor
JP2014115052A (en) Flat type heat pipe
JP2003247791A (en) Heat pipe
JP4827042B2 (en) Heat pipe manufacturing method
TW201043900A (en) Pipe-loop type heat-pipe
JP2009024996A (en) Method of manufacturing heat pipe
CN101619948A (en) Loop-type heat pipe
TWI292470B (en) Heat pipe
TWI302190B (en) Heat pipe
WO2022102163A1 (en) Heat pipe
TWM393660U (en) Flat heat pipe with scroll-type wick material
TWM439890U (en) Heat pipe structure, heat dissipation module structure and electronic device,

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees