201000843 —…….V 27932twf.doc/n 九、發明說明： 【發明所屬的技術領域】 本發明是有關於-種熱管，且特別是有關於一種迴路 式熱管。 【先前技術】 近年來電腦、通訊與資訊等相關產業迅速發展，電子 產σσ與元件愈趨向於輕薄短小，因而促使其中發熱量與發 熱松、度逐漸增加，為解決這方面的問題，一種利用相變化 的熱管裝置已逐漸被廣泛地應用。 圖1為習知一種熱管的結構示意圖。請參考圖丨，熱 g 100包括一封閉的金屬管110、一配置於金屬管U0内 壁的毛細結構（capillary structures) 120以及一配置於金 屬官110以及毛細結構12〇的孔隙内的工作流體。其中， 毛細結構120可利用金屬粉末燒结（細⑽〜办脱此〇f metal powder)而成。 當金屬管110的-受熱端接觸一發熱源時，發熱源的 熱1會經由金屬管110傳遞至毛細結構12〇中，以蒸發位 於毛細結構120的孔隙内的液態工作流體。此時，位於毛 細結構120 1隙内的液態工作流體會藉由毛細作用 持續由金屬管11〇的一冷卻端流動至金屬管 110的钱端’而氣紅作流體則會經由金屬管110的中 空部份持續朝向金屬管UQ的冷卻端流動。 同t位於冷部&的氣態卫作流體的熱量會再經由金 27932twf.(f〇c/n 201000843 屬管110的管壁而散逸至金屬管110外。因此，位於冷郤 端的氣態工作流體會逐漸在毛細結構120的孔隙中冷凝。 如此一來，熱管1〇〇即可藉由工作流體的相變化與流動持 續對發熱源進行散熱。 值得注意的是，熱管1〇〇在對發熱源進行散熱時，氣 恶工作流體和液態工作流體的流向正好相反。因此，工作 流體在金屬管Π0内流動時會承受較大的阻力。另—方 面，配置於電子裝置内部的熱管100通常會被折彎或打 ，，以配合電子裝置的内部空間。如此一來，毛細結構12〇 容易被破壞，造成液態工作流體不易藉由毛細作用在毛細 結構120的孔隙内流動。 圖2為習知一種迴路式熱管的結構示意圖。請參考圖 2 ’迴路式熱管200包含一蒸發器210 ' 一與蒸發器21〇共 同形成一封閉迴路的連接管220、一配置於連接管22〇丄 的冷凝斋230以及一適於在蒸發器21〇與連接管220中户 _工作流體。蒸發器2Π)包括-外管212、:配置^ 官中並具有多個毛細結構的内管214、一形成於内管中的 液體通道216以及一形成於外管212與内管214之 氣通道218。 … 位於液體通道216中的液態工作流體會經由内管214 的多個毛細結構滲透至這些蒸氣通道218中，並會藉由吸 收發熱源的熱能而轉換成氣態。然後，氣態工作流體會再 經由這些蒸氣通道218而流動至連接管220中。接著，流 動於連接管22〇中的氣態工作流體會被冷凝器23〇冷卻而 6 201000843 —27932twf.doc/n 轉換成液態’並繼續回流至蒸發器21〇。如此一來，工作 流體即可持續對發熱源進行散熱。 在迴路式熱管200中，氣態工作流體和液態工作流體 的流向大致上相同。因此，連接管22〇中的液態工作流體 =僅可藉由毛細作用朝向蒸發器21〇流動，氣態工作流體 藉由壓力差流動時還可推動液態工作流體流動。也因此， 相較於熱官100，迴路式熱管200的工作流體在流動時會 承受較小的阻力。 值得注意的是，雖然迴路式熱管200的工作流體在流 動時會承受較小的阻力，但氣態工作流體通過冷凝器23〇 後!!須ΐ全冷凝成液態工作流體才能藉由毛細作用再回流 至瘵發斋210。如此—來，迴路式熱管2〇()才可藉由工 級體^相^:化與流動持續對發熱源進行散熱。然而，相較 於熱& 1GG ’迴路式熱管·的熱平衡及王作溫度較不容 【發明内容】 率 敎 第 本，明提供-種迴路式熱管，其可具有較佳的傳熱效 且，、使用時的穩定度較高。 本毛明提出一種迴路式熱管，適於對一發熱源進行 此坦路式熱管包括—第一導管、一第一毛細結構、— 2、’^、°構、—第二導管以及一工作流體。第一導管具 洛4。卩以及一冷凝部，其中蒸發部鄰近於發熱源。第 毛、1。構配置於第—導管的—内表面上，並由蒸發部延 7 27932twf.doc/n 201000843 伸至冷凝部。第二毛細結構配置於内表面上，並位於蒸發 第管連接於蒸發部與冷凝部之間。工作流體配 通過第；中’其中工作流體適於由蒸發部 凝部遞至冷凝部’並適於在第-導管中由冷 形成例中’上述的第-毛細結構為多個 結構。社㈣槽，社述的第二毛細結構為-燒結 的第:實Γ中’上述的第一毛㈣^ …構為—體成型的燒結結構。 排出蠕細中’上述的第二毛細結構具有-在杯明η，且發熱源與第二導管鄰近於排出端。 述的實施例中’上述的排出端的厚度小於上 流體的流動路式熱官中’液態工作流體與氣態工作 與第二導管h大致上相同。因此’工作流體在第-導管 流體通過冷餐=時會承受較小的阻力。再者，氣態工作 句話說，在第不需要完全轉換成液態工作流體。換 體可處於液氣W官中由冷凝部朝自蒸發部流動的工作流 熱平本發明的迴路式熱管的 δ發明的上述特徵和優點能更明顯易懂，下文特 201000843 ./ 27932twf.doc/n 舉一實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖3為本發明—實施例的一種迴路式熱管的結構示意 圖。請參考圖3，迴路式熱管3〇〇適於對一發熱源進行散 *、'、，、中發熱源例如是中央處理器（central pr〇cessing unit， CPU)或是其他電子元件。迴路式熱管3〇〇包括一第一導 官310、一第一毛細結構32〇、一第二毛細結構33〇、一第 —導管340以及一工作流體。 第一導管310的相對兩端分別為一蒸發部312以及一 冷凝部314，其中蒸發部312鄰近於發熱源。再者，第一 毛細結構320配置於第一導管31〇的一内表面上，並由蒸 發部312延伸至冷凝部314，而第二毛細結構33〇則配置 於内表面上，並位於蒸發部312中。另外，第二導管34〇 連接於洛發部312與冷凝部314之間，而工作流體則適於 在第一導管310與第二導管34〇中流動。 更詳細而言，發熱源所產生的熱量會經由第—導管 310傳遞至瘵發部312的第一毛細結構32〇與第二毛細結 構330巾’以洛發位於第—毛細結構32〇與第二毛細結構 330中的液恕工作流體。同時，位於冷凝部Η*的氣熊工 作流體則會被冷卻，以在第—導管31Q的内表面凝^液 怨。因此’位於蒸發部M2白勺氣態工作流體會逐漸增加， 而位，冷凝部314的氣態工作流體則會逐漸減少。如此一 來’氣態工作流體即可藉由壓力差而由蒸發部312通過第 v 27932twf.doc/n 201000843 一導管340流向冷凝部314。同時，液態工作、、穿 一 第一毛細結構320的孔隙中藉由毛細作用掊二，則會在 314朝向蒸發部312流動。也因此，本發明的姆 3〇〇可藉由工作流體的相變化與流動持續對發熱源=二二 值得注意的是，液態工作流體是在第一毛細 2〇 的孔隙中藉由毛細作用由冷凝部川朝向蒸發部312泣 部2在冷凝部314凝結成液態的氣態工^ 在第mu)的中空部份316中由冷凝部314朝 p热查部312、流動。換句話說，即使氣 冷凝部3M完全冷凝成液態工作流體，本發=== 可持續對ϊ熱源進行散熱。也 平^的^路式熱官膽，本發明的狄式熱管的執 干衡及工作溫度較容易控制。 j.、 和液的迴路式熱管30”，氣態工作流體 冷朝的孔隙中藉由毛細作用持續由 7破口P 314朝向瘵發部312流 管3Π)的中空部份灿中由^却乳悲工作流體在第一導 動時還可推動液態工作流體朝向蒸發部312流 藝中的熱管H)。，本發_、:= f此’她於習知技 第—導管310中产動日士合蚤尺式熱官3〇〇的工作流體在 岡4 ^ '動T曰承雙較小的阻力。 圖4為圖3中沿A_A線 Μ、線的剖面圖。請先參考的=而圖5為圖3中沿 口 j及圖4，於此實施例中， 10 27932twf.doc/i 201000843 第一導管310例如是—、、巷一 形成於第-導管310内^管’而第一毛細結構320即為 φ、、ώ二士，=滑官，以使氣態I作流體在第二導管340 每二二可i t佳的流動效率。另外，在其他未綠示的 只施例中，第一導管3π 10與第二導管340亦可為一體成型 的溝槽管’以縮短迴路式熱管3〇〇的製程。 /、此f ’ ：月f考圖3及圖5 ’第二毛細結構330例如是201000843 —.......V 27932twf.doc/n IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat pipe, and more particularly to a circuit type heat pipe. [Prior Art] In recent years, the related industries such as computer, communication and information have developed rapidly. The σσ and components of electronic products tend to be lighter and thinner, which has led to a gradual increase in heat generation and heat generation. To solve this problem, a use Phase change heat pipe devices have been widely used. FIG. 1 is a schematic structural view of a conventional heat pipe. Referring to the figure, the heat g 100 includes a closed metal tube 110, a capillary structure 120 disposed on the inner wall of the metal tube U0, and a working fluid disposed in the pores of the metal member 110 and the capillary structure 12A. Among them, the capillary structure 120 can be formed by sintering metal powder (fine (10) ~ do not remove this metal powder). When the heated end of the metal tube 110 contacts a heat source, the heat 1 of the heat source is transferred to the capillary structure 12 through the metal tube 110 to evaporate the liquid working fluid located in the pores of the capillary structure 120. At this time, the liquid working fluid located in the gap of the capillary structure 120 1 will continue to flow from the cooling end of the metal pipe 11〇 to the money end of the metal pipe 110 by capillary action, and the gas red will be the fluid through the metal pipe 110. The hollow portion continues to flow toward the cooling end of the metal pipe UQ. The heat of the gaseous coolant in the cold part & the second will be dissipated outside the metal tube 110 via the wall of the gold 27932 twf. (f〇c/n 201000843). Therefore, the gaseous working flow at the cooling end The experience gradually condenses in the pores of the capillary structure 120. In this way, the heat pipe 1 〇〇 can heat the heat source by the phase change and flow of the working fluid. It is worth noting that the heat pipe 1 is in the heat source. When the heat is dissipated, the flow of the gaseous working fluid and the liquid working fluid is reversed. Therefore, the working fluid will bear a large resistance when flowing in the metal pipe 。0. On the other hand, the heat pipe 100 disposed inside the electronic device is usually Bending or hitting to match the internal space of the electronic device. As a result, the capillary structure 12 is easily broken, so that the liquid working fluid is not easily flowed by the capillary action in the pores of the capillary structure 120. Fig. 2 is a conventional Schematic diagram of the loop type heat pipe. Please refer to FIG. 2 'The loop type heat pipe 200 includes an evaporator 210', and the evaporator 21〇 together forms a closed loop connecting pipe 220, The condensation tank 230 disposed in the connecting pipe 22〇丄 and a suitable working fluid in the evaporator 21〇 and the connecting pipe 220. The evaporator 2Π includes an outer pipe 212, a configuration body, and a plurality of capillaries The inner tube 214 of the structure, a liquid passage 216 formed in the inner tube, and a gas passage 218 formed in the outer tube 212 and the inner tube 214. The liquid working fluid located in the liquid passage 216 will permeate into the vapor passages 218 through the plurality of capillary structures of the inner tube 214, and will be converted into a gaseous state by the heat energy of the heat receiving and receiving heat source. The gaseous working fluid then flows through the vapor passages 218 into the connecting tube 220. Then, the gaseous working fluid flowing in the connecting pipe 22 is cooled by the condenser 23 and converted into a liquid state and continues to flow back to the evaporator 21A. In this way, the working fluid can continuously dissipate heat from the heat source. In the loop heat pipe 200, the flow directions of the gaseous working fluid and the liquid working fluid are substantially the same. Therefore, the liquid working fluid in the connecting pipe 22 can only flow toward the evaporator 21 by capillary action, and the gaseous working fluid can also push the liquid working fluid to flow by the pressure difference. Therefore, compared to the heat officer 100, the working fluid of the loop heat pipe 200 is subjected to less resistance when flowing. It is worth noting that although the working fluid of the loop heat pipe 200 will bear less resistance when flowing, the gaseous working fluid passes through the condenser 23!! It must be fully condensed into a liquid working fluid to be reflowed by capillary action. To the 瘵 瘵 210 210. In this way, the loop heat pipe 2〇() can continue to dissipate heat from the heat source by the process body. However, compared with the heat & 1GG 'loop heat pipe · heat balance and Wang Zuo temperature is not allowed [inventory content] rate, the first to provide a loop type heat pipe, which can have better heat transfer efficiency, The stability during use is high. Ben Maoming proposes a loop type heat pipe suitable for performing a heat pipe for a heat source including a first duct, a first capillary structure, a 2, a ^, a structure, a second duct, and a working fluid . The first catheter has a double 4. And a condensation portion, wherein the evaporation portion is adjacent to the heat source. First hair, 1. The structure is disposed on the inner surface of the first conduit, and extends from the evaporation portion to the condensation portion by 7 27932 twf.doc/n 201000843. The second capillary structure is disposed on the inner surface and is located between the evaporation tube and the evaporation portion and the condensation portion. The working fluid is passed through a middle portion in which the working fluid is adapted to be transferred from the evaporation portion to the condensation portion and is adapted to be formed in the first conduit by the formation of the above-described first capillary structure. In the (4) trough, the second capillary structure described in the present invention is a sintered structure in which the first first (four) of the sintered body is formed into a body. The second capillary structure described above has a - in the cup, and the heat source and the second conduit are adjacent to the discharge end. In the embodiment described above, the above-described discharge end has a thickness smaller than that of the upper fluid. The liquid working fluid and the gaseous operation are substantially the same as the second conduit h. Therefore, the working fluid will experience less resistance when the first conduit fluid passes through the cold meal. Furthermore, the gaseous work says that it does not need to be completely converted into a liquid working fluid. The above-mentioned features and advantages of the δ invention of the loop-type heat pipe of the present invention can be more clearly understood, and the following is possible in the following paragraphs: 201000843 ./ 27932 twf.doc /n As an example, in conjunction with the drawings, a detailed description will be given below. [Embodiment] Fig. 3 is a schematic view showing the structure of a loop type heat pipe according to an embodiment of the present invention. Referring to FIG. 3, the loop heat pipe 3 is adapted to disperse a heat source, and the heat source is, for example, a central pr〇cessing unit (CPU) or other electronic components. The loop heat pipe 3 includes a first guide 310, a first capillary structure 32, a second capillary structure 33, a first conduit 340, and a working fluid. The opposite ends of the first conduit 310 are respectively an evaporation portion 312 and a condensation portion 314, wherein the evaporation portion 312 is adjacent to the heat source. Furthermore, the first capillary structure 320 is disposed on an inner surface of the first conduit 31 and extends from the evaporation portion 312 to the condensation portion 314, and the second capillary structure 33 is disposed on the inner surface and located at the evaporation portion. 312. Further, the second duct 34 is connected between the Luo Fa portion 312 and the condensing portion 314, and the working fluid is adapted to flow in the first duct 310 and the second duct 34. In more detail, the heat generated by the heat source is transmitted to the first capillary structure 32〇 and the second capillary structure 330 of the hair 312 via the first conduit 310, and the hair is located at the first capillary structure 32〇 The liquid in the second capillary structure 330 is a working fluid. At the same time, the gas bear working fluid located in the condensing section Η* is cooled to condense liquid on the inner surface of the first conduit 31Q. Therefore, the gaseous working fluid at the evaporation portion M2 gradually increases, and the gaseous working fluid at the condensing portion 314 gradually decreases. Thus, the gaseous working fluid can flow from the evaporation portion 312 through the conduit 340 to the condensation portion 314 by the pressure difference 312. At the same time, the liquid working, through the pores of the first capillary structure 320, acts by capillary action, and then flows toward the evaporation portion 312 at 314. Therefore, the m3〇〇 of the present invention can be continued by the phase change and flow of the working fluid to the heat source=22. The liquid working fluid is caused by capillary action in the pores of the first capillary 2〇. The condensing unit flows toward the p-heating portion 312 by the condensation portion 314 in the hollow portion 316 of the mu portion which is condensed into a liquid state in the condensation portion 314 of the evaporation portion 312. In other words, even if the gas condensing portion 3M is completely condensed into a liquid working fluid, the present invention === can continuously dissipate heat from the heat source. It is also easy to control the dry balance and working temperature of the Di-type heat pipe of the present invention. j., and liquid loop heat pipe 30", the hollow working part of the gaseous working fluid is cooled by the capillary action, and the hollow portion of the flow tube 3 瘵 is turned from the 7-break P 314 toward the burst portion 312. The sorrowful working fluid can also push the liquid working fluid toward the heat pipe H) in the flow of the evaporation portion 312 during the first guiding. The present invention _,:=f The working fluid of the 蚤 式 热 热 热 在 在 在 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 5 is along the mouth j and FIG. 4 in FIG. 3, in this embodiment, 10 27932 twf.doc/i 201000843, the first duct 310 is, for example, a lane formed in the first duct 310 and the first capillary The structure 320 is φ, ώ2, = 滑, so that the gaseous I can be used as a fluid in the second conduit 340. The other embodiments are not green. A conduit 3π 10 and a second conduit 340 may also be an integrally formed grooved tube 'to shorten the process of the loop type heat pipe 3 。. /, this f ' : month f test Figure 3 and Figure 5 'second Fine structure 330, for example,
^成於第-導官310内表面的—管狀燒結結構，且其可以 疋利用金屬粉末燒結而成。除此之外，第二毛細結構· 可具有-排出端E以及—回流端Σ，且發熱源可鄰近 出端Ε。 值知注意的是，在形成第二毛細結構330時可使其排 出端Ε的厚度小於回流端j的厚度。換句話說，即是使第 二毛細結構330在排出端Ε所剩餘的内徑大於回流端工所 剩餘的内徑。如此一來，位於蒸發部312的氣態工作流體 通過排出端Ε的阻力即會小於其通過回流端I的阻力。因 此，當位於蒸發部312的氣態工作流體逐漸增加時，氣態 工作、"iL體大致上會朝向第二導管340流動。如此一來，即 可避免氣態工作流體和液態工作流體在第一導管310中朝 向相反的方向流動。 另一方面’此實施例中的發熱源鄰近於排出端Ε，以 使液態工作流體在排出端Ε的蒸發速率會大於液態工作流 體在回流端I的蒸發速率。因此，當第二毛細結構330在 回流端I所剩餘的内徑極小時，累積在第二毛細結構33〇 11 27932twf.doc/n 201000843 :孔隙中的液態工作流體可能會填滿回流端ς所剩餘的内 Ϊ 一 避免氣態工作流體和液態工作流體在 弟蜍管310中朝向相反的方向流動。 此 放/匕Γ ΐί他错示的實施例中’排出端E可為1 只能朝向第二導二 ’、 卜於此實施例中，第一毛细 形成於第-導管31G内表面的 =4⑽為多個 第-導管310進行折f或打扁 2且’即使使用者對 大致上仍可在溝槽中葬由 你〇工乂驟，液態工作流體 知技藝中的熱管刚，9 二、=動。因此，相較於習 合組裝空間再加工Q X月的题路式熱管3GG較適於配 另外，在其他未繪示的實施 先、 可不需要被折彎或打扁時， 肀*迴路式熱管300 結㈣0還可以是-體成型的燒結:=構320與第二毛細 综上所述，在本發明的迴路式二冓。 與氣態工作流體的流 …、官中，液態工作流體 流體不僅可藉由毛二C。因此，液態工作 推動液態工作流體流動。也因此虱1工作流體流動時還可 管，本發明的迴路式埶其Μ 1，相較於習知技藝中的熱 的阻力。 、工凌體在流動時會承受較小 再者，紅作流體通過 流體可在第-毛細結構的孔，，冷凝成液態的工竹 向蒸發部流動，而剩餘的氣能=由毛細作用由冷凝部截 心作流體則可在第一導管白《 12 27932twf.doc/n 201000843 t空部份巾由冷凝部朝向蒸發部流動。因此，即使氣熊工 作流體亚未在冷凝部完全冷凝成液態工 = 可持續對發熱源進嶋== 管，本發明的迴路式熱管的熱平衡 份的：:=:，ί發明的迴路式熱管可藉由溝槽來取代部 二::驟二即使使用者對第-導管進行折彎或 毛細作用、^，夜悲工作流體大致上仍可在溝槽中藉由 的迴J此，相較於習知技藝中的熱管，本發明 式…、&較適於配合組裝空間再加工。 ^隹’、、:本發明已以—實施例揭露如上，铁JL计韭田、 ^本發明’任何所屬技術領 & 以限 離本發明的藉袖釦浐问* 、百逋吊知硪者，在不脫 此本發明的伴、’ #可作些許的更動與潤錦，因 準。 ，、知^錢_申請專·圍所界定者為 【圖式簡單說明】 =為習知管的結構示意圖。 3 ίΓΓ種迴路式熱管的結構示意圖。 圖。·林Μ—實施例的—種迴路式熱管的結構示意 Ξ4為圖3中沿Μ線的剖面圖。 圖5為圖3中沿钟線的剖面圖。 13 201000843, 27932twf.doc/n 【主要元件符號說明】 100 熱管 110 金屬管 120 毛細結構 200 迴路式熱管 210 蒸發器 212 外管 214 内管 216 液體通道 218 蒸氣通道 220 連接管 230 冷凝器 300 迴路式熱管 310 第一導管 312 蒸發部 314 冷凝部 316 中空部份 320 第一毛細結構 330 第二毛細結構 340 第二導管 E :排出端 I :回流端 14A tubular sintered structure which is formed on the inner surface of the first guide 310 and which can be sintered by using metal powder. In addition to this, the second capillary structure can have a discharge end E and a return end port, and the heat source can be adjacent to the output port. It is to be noted that the thickness of the discharge port Ε can be made smaller than the thickness of the reflow end j when the second capillary structure 330 is formed. In other words, the inner diameter of the second capillary structure 330 at the discharge end is larger than the inner diameter remaining at the return end. As a result, the resistance of the gaseous working fluid located at the evaporation portion 312 through the discharge port is less than the resistance through the return end I. Therefore, when the gaseous working fluid located at the evaporation portion 312 gradually increases, the gaseous operation, "iL body, flows substantially toward the second conduit 340. In this way, the gaseous working fluid and the liquid working fluid can be prevented from flowing in the opposite direction in the first conduit 310. On the other hand, the heat source in this embodiment is adjacent to the discharge port Ε so that the evaporation rate of the liquid working fluid at the discharge port 会 is greater than the evaporation rate of the liquid working fluid at the reflux port I. Therefore, when the inner diameter of the second capillary structure 330 remaining at the reflow end I is extremely small, the liquid working fluid accumulated in the second capillary structure 33〇11 27932twf.doc/n 201000843: the pores may fill the reflow port. The remaining inner lining avoids the flow of the gaseous working fluid and the liquid working fluid in opposite directions in the stern tube 310. In the embodiment in which he is erroneously shown, 'the discharge end E can be 1 and can only face the second guide two'. In this embodiment, the first capillary is formed on the inner surface of the first conduit 31G = 4 (10) Folding or flattening the plurality of first-conductor 310s and 'even if the user is still able to be buried in the trench by your completion, the liquid working fluid knows the heat pipe just in the art, 9 2, = move. Therefore, compared with the QW month of the re-processing of the QX month, the road-type heat pipe 3GG is more suitable for the other, in other unillustrated implementations, without the need to be bent or flattened, the 肀* loop heat pipe 300 knot (d) 0 can also be a body-formed sintered: = structure 320 and a second capillary, as described in the loop type of the present invention. With the flow of the gaseous working fluid, the liquid working fluid can be fluid not only by the hair C. Therefore, liquid work promotes the flow of liquid working fluid. Therefore, the 工作1 working fluid can also be piped, and the circuit of the present invention is the same as the heat resistance in the prior art. The working body will bear less when flowing, and the red fluid can flow through the fluid in the pores of the first-capillary structure, and condenses into liquid liquid to the evaporation part, and the remaining gas energy = by capillary action The condensing portion is configured as a fluid to flow from the condensation portion toward the evaporation portion in the first conduit white portion. Therefore, even if the gas bear working fluid sub is not completely condensed into a liquid state in the condensing section = sustainable heat source 嶋 == tube, the heat balance of the loop type heat pipe of the present invention::=:, ίInvented loop type heat pipe The second part can be replaced by a groove: in the second step, even if the user bends or capillary acts on the first conduit, the night working fluid can still be substantially returned in the groove by J. In the heat pipe of the prior art, the present invention is more suitable for reworking with the assembly space. ^隹,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Those who do not leave this invention, '# can make a little change and run the brocade, because of the standard. , knowing the money _ application for the definition of the enclosure is [simplified description of the schema] = a schematic diagram of the structure of the learned tube. 3 ίΓΓ Structure diagram of the loop heat pipe. Figure. Lin Biao - The structure of the loop type heat pipe of the embodiment Ξ 4 is a cross-sectional view along the Μ line in Fig. 3. Figure 5 is a cross-sectional view along line of the clock of Figure 3. 13 201000843, 27932twf.doc/n [Description of main components] 100 heat pipe 110 metal pipe 120 capillary structure 200 loop heat pipe 210 evaporator 212 outer pipe 214 inner pipe 216 liquid passage 218 steam passage 220 connecting pipe 230 condenser 300 circuit type Heat pipe 310 first pipe 312 evaporation portion 314 condensation portion 316 hollow portion 320 first capillary structure 330 second capillary structure 340 second conduit E: discharge end I: return end 14