1260388 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種平板導熱裝置可透過蒸發與冷凝產生的循環機制， 使得一工作流體得以進行熱傳，而無需額外的能源，其特別係具有更薄的 結構且更能抵抗外加衝擊而避免結構發生變形者。 【先前技術】 近年來，諸如筆記型電腦或個人數位助理（pers〇nal digital assistant，PDA)這類的電子裝置，隨著整合技術的進步而變地更輕 薄點小，以及對於高速且多功能的電子裝置之需求也不對增加， 能源損耗也因此增加。於是，電子裝置内作運作時會產生更多的 熱，所以導致各種平板導熱裝置。 習知一般所使用的平板導熱裝置係一熱導管(heat pipe)結構，其係將一 金屬製的平板狀盒體内部抽真空後，在注入工作流體並將盒體密封。 這類的熱導管的設置係直接接觸電子元件發熱處或是一發熱體。在此 盒體中，接近發熱體的工作流體會被加熱而蒸發，且蒸氣會分散至相對較 低溫的區域。接著，這些蒸氣將熱散發出該盒體並再次凝結為液體，之 後又回到初始位置。在此金屬製的平板狀盒體中，透過這種具有循環機制 之工作流體的裝置，該發熱體所產生的熱會被發散至盒體外部，因而該電 子元件的溫度得以維持在適當的範圍中。 第1圖係顯示習知的平板導熱裝置10係設置於一發熱體2〇與一散熱 1260388 體30之間，用以將該發熱體2Q所產生的祕輸至該散熱體％。 苓考第i圖所顯示，習知的平板導熱裝置1〇具有—金屬盒體％，並在 其内部的__ 了工作频。—燈蕊結卿形成於在_盒體5〇 中的—内表面上，用以使得其轉流體有效地形成循環機制。 該發熱體2〇產生的熱會傳輪經過貼附在該發熱體2〇的平板導熱裝置 川中的燈蕊結構60。接著，幾乎係設置在該發熱體2〇上方以 魄蕊結構财的工作流體，會蒸發且四處分散流動至該内部間隙^ 幾乎係設置在該散熱體3〇下方作為冷凝區的燈蕊結構6〇中的工作流體， 會因此散熱而再次凝結驗體。#熱經由該散熱體抑散熱後，該散熱體 30會在藉由一風扇7〇進行強制冷卻。 為了實現前述該平板導熱裝置10之熱傳機制，必須將液體幾乎置於該‘ 發熱體20正上方㈣舰喊發，並可再流至冷龍。目此，該平板‘ 導熱裝置10内部必須具有足__，㈣導引魏分流至冷凝區。若間 隙不足以使虹作流體自紐區分流至冷凝區，作流體的蒸發與冷 凝產生的熱傳機制可能就無法實現，因此會導致熱傳裝置的散熱效率受損。籲 同時’由於近年來電子裝置的厚度不斷地變薄，因此也必須有更考的 平板導熱裝置。無論如何’由於習知技術的平板導熱裝置1〇必須維持其内-部的真空或者是低壓狀態，且不具有足夠之機械強度的結構，而無法接受-承受外力的衝擊’該金屬盒體5〇容易因為其製造過程中所產生的衝擊力而 被壓誇’尤其是對於蒸氣分散通道的破壞，更會因此而有損熱傳裝置的散 熱效率。於是本發明基於習用辭板導歸置1G之缺失*進行改良。 1260388 【發明内容】 關於本發明係—平板導熱裝置，以實際解決—個甚至是數個前述相關 技射的限制及缺失。因此，本發明之一目的係提供一平板導熱裝置，炎 進八内°卩、、、"構，形成一種更薄的結構，同時可有效地利用工作流體的蒸 發與冷凝而達到熱循環機制，謂免製造過程中所產生的衝擊力破壞了該、 平板導熱裝置的結構。 、 未貫現前述之各項目的，本發明提供一平板導熱裝置，其包括·一熱 傳導盒體’其係設置於—發熱體以及—散熱體之間，且填充有讀流體，_ 而該工作流體會吸收該發誠之熱能而紐，並藉由該散熱體的冷卻而凝 結；以及—層峨部，其係設置機倾巾且祕體相互交錯重疊所編織 而成’其巾-統分散通道係沿著#近發舰之網格部交錯處的絲而形、 成，以及-液體導引通道係沿著靠近散熱體的網格部線體延伸方向直到接、 近該發熱體的毛細管現象發生區域所形成。 較佳的狀況下，其網格部係具有網格數1〇至6〇的方型網袼。 更進-步較佳的狀況下，該網格部係由外徑介於〇 12 至〇 4咖的_ 線體所編織而成。 再者，該熱傳導盒體的高度最好是介於〇 3至1 〇。 在盒體中的網格部係方型網格，其較佳的狀況係其縱向線體的延伸方 向，係沿著熱傳導引方向者。 該熱傳導盒體係由電解銅箱所形成，且此電解銅箱具有一相 τ旦的表 1260388 面，而此表面係形成於該盒體的内表面。 _格部係係由金屬、高分子、塑膠以及玻璃纖維中的-種材質所製 成。攻裡’所選擇之金屬可以係銅、鋁、不銹鋼以及錮等材質中的一種， 或者是這些金屬材料所形成的合金。 益體係由$熱性t的金屬或導熱性南分子(a poiy^r)或彼 覆‘熱性问分子之金屬(a metal c〇ated with a 或導熱性塑 膠(a heat-conductive plastic)中的一種材質所製成。這裡，所選擇之金屬可以 φ 係銅、銘、不銹鋼以及鱗材質中的—種，或妓這些金屬材料所形成的 合金。 該盒體之密封方式係透過雷射焊接、電將焊接、TIG(tungsteninertgas) - 焊接、超音波焊接、銅辞合金焊接(brazing)、錫焊(s〇ldering)以及熱壓接合· (thermo-compression lamination)中的一種技術所達成者。 該工作流體係水、曱醇、乙醇、丙裥、氨水、含就氣碳化合物(CFC)的 工作流體、含氫氟氣礙化合物㈣叩的工作流體以及含氫氣碳化合物阳叩 · 的工作流财的-種液體巾的-種材質，或者魏些㈣的混合物。 【實施方式】 兹將詳細參照本發明之例示實施例，其細侧絲鱗所附諸圖中。 請參考第2圖所顯示，關於本發明之一種較佳實施例，其平板導熱裝置觸 包括：一盒體130設置於一發熱體no與提供吸熱之一散熱體12〇之間； 1260388 、罔格σ|Π40嵌設入該盒體130中；以及-工作流體注入該盒體13〇,用以 作為V熱媒介’而將該發熱體u〇之熱源導引該散熱體12〇。 如同白知技術中的蒸發區域，在該平板導熱裝置100中，其工作流體 於接近雜熱體11G的正上方進行吸熱反應而氣化為水蒸氣，且其水蒸氣 分散至該離部⑽卿成的各個蒸氣分散通道(雛將作進—步的描述）。 接著’如同習知技術中的凝結區域，在溫度相對於該發熱體110較低 處，例如在接近該散熱體120正下方處，這些水蒸氣會凝結為液態。隨後， 每些凝結的液體會藉由毛細現象而逆流回該網格部14〇所形成的各個液體 導引通道(稱後將作進一步的描述），並接近該發熱體11()正上方處。 在此過程中，其工作流體將熱源自該發熱體110攜帶離開，並將熱源 傳送至該散熱體120。再者，藉由該風扇ι5〇所產生的強制對流，會將這些 傳送至該散熱體120的熱源向外散發，且該發熱體110的溫度會維持在適 當的狀態。在理想的狀況中，這種藉由工作流體以蒸發與凝結的方式進行 熱傳的機制，可持續到該發熱體110的溫度降至幾乎與該散熱體12〇為止。 該盒體130内部具有許多減壓至真空狀態的間隙(160)，而且該盒體bo 係由導熱性佳的金屬或導熱性高分子(a conductive polymer)或披覆導熱性高 分子之金屬（a metal coated with a conductive polymer)或導熱性塑膠(a heat-conductive plastic)所製成，因此可輕易地吸走該發熱體110的熱源，並 且又將這些熱源輕易地釋放至該散熱體120。在較佳的狀況下，前述之金屬 係銅、铭、不銹鋼以及錮等材質中的一種，或者是這些金屬材料所形成的 1260388 合金。特職在該盒體m係由—單面形成不平坦的電解鋪所製成的狀 況下，此不平坦的表面朝向該盒體⑽的魄面。在此狀況下，工作流體 會在毛細管現象的作用下更緩慢地回流，因此可增進該平板導熱裝置卿 之效率。销時考慮鱗雜與其频強度τ，該讀⑽的厚度係以謂 _至1.0 mm較佳。 網格部140係設置於該盒體130上 、下兩板體之間，且具有橫向線體 論以及縱向線體觸形成上下相互交錯的編織結構。該網格部刚可以 係由任何金屬、高分子、玻璃纖維或塑膠所製成，在較佳的狀況下，最好 是銅、銘、不_以及鱗金屬材質中的—種。該網格部⑽可以形成各 獅狀，用以配合該平板導熱裝置100之盒體13〇的形狀。1260388 IX. Description of the Invention: [Technical Field] The present invention relates to a circulation mechanism generated by evaporation and condensation of a flat plate heat-conducting device, so that a working fluid can be heat-transferred without additional energy, and particularly Thinner structure and more resistant to external impacts to avoid deformation of the structure. [Prior Art] In recent years, electronic devices such as notebook computers or personal digital assistants (PDAs) have become lighter and thinner with the advancement of integration technology, and are high-speed and multifunctional. The demand for electronic devices is also increasing, and energy consumption is also increasing. As a result, more heat is generated during operation of the electronic device, resulting in various flat plate heat conducting devices. The flat plate heat conducting device generally used is a heat pipe structure in which a working liquid is injected and the casing is sealed after evacuating the inside of a metal flat case. Such heat pipes are arranged to directly contact the heating element of the electronic component or a heating element. In this case, the working fluid close to the heating element is heated to evaporate, and the vapor is dispersed to a relatively low temperature region. Then, the vapors dissipate the heat to the casing and condense again into a liquid, and then return to the initial position. In the metal flat plate case, the heat generated by the heat generating body is dissipated to the outside of the casing through the device having the circulating working fluid, so that the temperature of the electronic component is maintained in an appropriate range. in. Fig. 1 shows a conventional flat plate heat conducting device 10 disposed between a heating element 2 and a heat dissipating 1260388 body 30 for transmitting the secret generated by the heating element 2Q to the heat dissipating body. As shown in Fig. i, the conventional flat plate heat conducting device 1 has a metal case % and has a working frequency of __ inside it. - The lamp core is formed on the inner surface of the casing 5 to enable its fluid transfer to effectively form a cyclical mechanism. The heat generated by the heating element 2 passes through the lamp core structure 60 attached to the flat heat conducting device of the heating element 2〇. Then, almost all of the working fluid disposed above the heating element 2〇 is structured to evaporate and dispersed to the internal gap. The lamp core structure 6 is disposed under the heat sink 3〇 as a condensation zone. The working fluid in the crucible will thus dissipate heat and re-condense the specimen. After the heat is dissipated through the heat sink, the heat sink 30 is forcibly cooled by a fan 7〇. In order to realize the heat transfer mechanism of the above-mentioned flat plate heat conducting device 10, it is necessary to place the liquid almost immediately above the 'heat generating body 20' (four), and then flow to the cold dragon. For this reason, the flat plate 'the heat conducting device 10 must have a foot __ inside, and (4) guide the Wei shunt to the condensing zone. If the gap is not sufficient to allow the rainbow fluid to flow from the kiln to the condensing zone, the heat transfer mechanism caused by evaporation and condensing of the fluid may not be achieved, and thus the heat dissipation efficiency of the heat transfer device may be impaired. At the same time, as the thickness of electronic devices has been steadily thinning in recent years, there is also a need for a flat-plate heat-conducting device. In any case, the flat case heat-conducting device 1 of the prior art must maintain its inner-part vacuum or low-pressure state, and does not have sufficient mechanical strength, and cannot accept the impact of external force. It is easy to be blamed for the impact force generated in the manufacturing process, especially for the destruction of the vapor dispersion channel, and thus the heat dissipation efficiency of the heat transfer device is impaired. Therefore, the present invention is improved based on the deletion of the 1G in the conventional use. 1260388 SUMMARY OF THE INVENTION The present invention relates to a flat plate heat conducting device that solves the limitations and disadvantages of one or even a few of the aforementioned related art. Accordingly, it is an object of the present invention to provide a flat plate heat-conducting device, which is formed into a thinner structure while effectively utilizing evaporation and condensation of a working fluid to achieve a thermal cycling mechanism. That is, the impact force generated during the manufacturing process is destroyed by the structure of the flat plate heat conducting device. In the foregoing, the present invention provides a flat plate heat conducting device comprising: a heat conducting box body disposed between the heat generating body and the heat sink, and filled with a reading fluid, and the work The fluid absorbs the heat of the hair and is condensed by the cooling of the heat sink; and the layer of the scorpion is woven by the machine and the secret body is interlaced and woven to form a towel-distributing channel. The wire is shaped along the line of the cross section of the near-ship ship, and the liquid guiding channel is along the direction of the wire body extending close to the heat radiating body until the capillary phenomenon of the heating element is connected The area where the occurrence occurred. In a preferred situation, the mesh portion has a square mesh with a grid number of 1 〇 to 6 。. In a more advanced step, the mesh portion is woven from a _ wire body having an outer diameter of 〇 12 to 咖 4 coffee. Furthermore, the height of the heat conducting box body is preferably between 〇 3 and 1 〇. The mesh portion of the mesh in the box is preferably in the direction in which the longitudinal line extends, along the direction of heat conduction. The heat transfer box system is formed by an electrolytic copper box having a phase 1260388 face which is formed on the inner surface of the case. _ Grid system is made of metal, polymer, plastic and fiberglass. The metal selected for the attack can be one of materials such as copper, aluminum, stainless steel, and tantalum, or an alloy formed of these metal materials. The benefit system consists of a metal of heat t or a thermal conductive south molecule (a poiy^r) or a metal of a metal c〇ated with a or a heat-conductive plastic. Made of material. Here, the selected metal can be φ type copper, Ming, stainless steel and squama material, or an alloy formed by these metal materials. The sealing method of the box is through laser welding and electricity. It is achieved by one of welding, TIG (tungsteninertgas) - welding, ultrasonic welding, brazing, soldering, and thermo-compression lamination. Flow system water, sterol, ethanol, propionate, ammonia, working fluid containing gaseous carbon compound (CFC), working fluid containing hydrogen fluoride gas barrier compound (IV), and work flow of hydrogen-containing carbon compound impotence - A material of a liquid towel, or a mixture of Wei (4). [Embodiment] Reference will be made in detail to the exemplary embodiments of the present invention, and the thin side wire scales are attached to the drawings. Please refer to Fig. 2, Regarding one of the inventions In a preferred embodiment, the flat heat conduction device comprises: a box 130 disposed between a heating element no and a heat sink 12 提供 providing heat absorption; 1260388, 罔 σ | Π 40 embedded in the box 130 And a working fluid is injected into the casing 13 for guiding the heat source of the heating element to the heat sink 12 as a V heat medium. As in the evaporation region of the white technology, the flat heat conducting device In 100, the working fluid is subjected to an endothermic reaction directly above the heat generating body 11G to be vaporized into water vapor, and the water vapor is dispersed to the respective vapor dispersion channels of the separation portion (10). Description] Then, as in the condensation zone in the prior art, the water vapor condenses into a liquid state at a lower temperature relative to the heat generating body 110, for example, immediately below the heat sink 120. Subsequently, each condensation The liquid will flow back to the respective liquid guiding passages formed by the mesh portion 14 by capillary action (refer to be described later), and is located directly above the heating body 11(). , its working fluid will be hot from the hair The heat body 110 carries away and transmits the heat source to the heat sink 120. Further, the forced convection generated by the fan ι5 会将 dissipates the heat source transmitted to the heat sink 120 outward, and the heat generating body The temperature of 110 will be maintained in an appropriate state. In an ideal situation, the mechanism of heat transfer by means of evaporation and condensation of the working fluid can be continued until the temperature of the heating element 110 is reduced to almost the same. The inside of the casing 130 has a plurality of gaps (160) which are decompressed to a vacuum state, and the casing bo is made of a metal having good thermal conductivity or a conductive polymer or a coating having high thermal conductivity. Made of a metal coated with a conductive polymer or a heat-conductive plastic, so that the heat source of the heat generating body 110 can be easily sucked away, and these heat sources are easily released to the Heat sink 120. In a preferred embodiment, the aforementioned metal is one of a material such as copper, indium, stainless steel, and tantalum, or a 1260388 alloy formed of these metal materials. The special position is such that the uneven surface faces the kneading surface of the casing (10) in the case where the casing m is made of an electrolytic flat which is formed by unevenness on one side. Under this condition, the working fluid will flow back more slowly under the action of capillary action, thereby improving the efficiency of the flat plate heat transfer device. The pin is considered to have a scale and its frequency intensity τ, and the thickness of the read (10) is preferably _ to 1.0 mm. The mesh portion 140 is disposed between the upper and lower plates of the casing 130, and has a transverse linear body structure and a longitudinal line body to form a woven structure in which the upper and lower sides are alternately interlaced. The mesh portion can be made of any metal, polymer, fiberglass or plastic. In the preferred case, it is preferably copper, inscription, not in the form of a scale metal. The mesh portion (10) may be formed in a lion shape for matching the shape of the casing 13 of the flat plate heat conducting device 100.
參考第3圖以及第4圖所顯示，該網格部⑽係由數條橫肖線體圖 以及縱向線體1她相互交錯編織所形成的網格狀結構。該網格部⑽各個 單位格子形成寬度a的開口，通常可表示成如下之方程式丨所示者。 方程式1 a = (l-N · d)/N 其中，N係該網格部140在-英忖(inch)中所具有的單位格子數，且㈣各 個線體的外徑(單位係英对）。舉例來說，若該關1〇〇，則每_英忖長的網 格部140範圍中，具有1〇〇個單位格子。 本發明中’該網格部140作為提供一蒸氣分散通道(I)u,藉以流 通受到該發熱體m加《發的統。參考細圖雌示，特職該網格 10 1260388 部140之橫向線體140a以及縱向線體14〇b會交錯所形成間隙1的，而此門 隙160即可作為該蒸氣分散通道①，並使得蒸氣可被分流。 /、T g亥縱向 線體140b係網格線中縱向排列者，在圖中係在編織結構中的較長方向上， 而該橫向線體140a則係網格線中垂直該縱向線體14%所排列者 該蒸氣分散通道(I)所形成的幾何面積大小(以A示之)係可透過方程式】 所計算得知。 方程式2 A = (a + d)d - πά2/4 參考方程式2，鶴氣分顏道騎形成的幾何面積會隨著網格數(Ν) 的減少以及網格線體之外徑(句的減少而增加。 細格部14G巾的各解祕子巾，會與姉的單赌子形成四個蒸 氣刀政通道(I)，因此工作流體會和缓地分流至四個方向，以單位格子的中 心點(〇)，如第3圖中的箭頭(aa)所顯示。 在該網格部140係形成方型網格(screenmesh)的例子中，自寬度方向延 展的橫向線體140a之延伸方向看進去(圖中未顯示），垂直該橫向線體獅 而排列在長度方向延展的縱向線體14〇b斜率，以及自長度方向延展的縱向 線體14〇b之延伸方向看進去，垂直縱向線體140b排列之橫向線體14〇a斜 率如第4圖所顯示’其中，前者較後者傾斜。因此，沿著該網格部“ο 之縱向線體140b的延伸方向流動的蒸氣，以及沿著該網格部刚之橫向線 體140a峡伸方向流動的蒸氣，其中前者會較為平順 ，因此縱向線體140b 11 1260388 的延伸方向具錄佳的熱傳效率。故’在該網格部⑽係形成方型網格的 例子中，該平板導熱裝置100的設置以及其運作時，最好能配合使得其熱 傳方向會沿著該縱向線體140b的延伸方向。 同時，當本發明之平板導熱裝置觸實際運作時，其網格部⑽合附 者液體，且這體會被該盒體13之上、下板體所分_，如同第5圖所 顯不。因此，在該網格部140之蒸氣分散通道⑴中的模型間隙17〇内會形 成一液膜180。 參考第6圖所顯示，該液膜係形成於所有網格線體的交錯處。若 適當地控制該網格部⑽之參數，如該網格之寬度a或網格線體之外徑⑼， 該液膜18〇會形成於網格線體的交錯處且相互連接，因而產生毛細現象。 因此’若讀流體進人於蒸發區_各_格中並形·賴卿，則會 發生蒸發财，糾’進人驗_財的工作频相為毛細現象而 沿著網格線體延伸方向流入蒸發區域之網格，且其流量係等於蒸發區域之 蒸發量。 “那就是說，在本發明之平板導熱裝置1〇〇中，既然工作流體會不斷地 蒸發分散，减籠域係處於缺乏液_麟，㈣喊工傾體會在凝 結區域不斷地凝結，_凝結區域會有過多的液體。無論如何， 產生的液膜180表面張力所導致的毛細現象，可造成液體自凝結區域流向 蒸發區域，所以工作流體會沿著網格線體延伸方向不斷地補充至蒸發區 域因此透過工作流體之療發與凝結而維持了熱傳機制的運作。也就是說，Referring to Figures 3 and 4, the mesh portion (10) is a grid-like structure formed by a plurality of transverse lines and a longitudinal line body 1 interlaced with each other. An opening of the width a of each unit grid of the mesh portion (10) is generally expressed as the following equation 丨. Equation 1 a = (l - N · d) / N where N is the number of unit grids of the mesh portion 140 in -inch and (4) the outer diameter of each line body (unit pairs). For example, if the level is off, there is one unit grid in the range of the grid portion 140 per _ inch length. In the present invention, the mesh portion 140 serves as a vapor dispersion passage (I) u, thereby flowing through the heat generating body m. Referring to the fine figure female, the transverse line body 140a and the longitudinal line body 14〇b of the special portion of the grid 10 1260388 140 are interlaced to form the gap 1 which serves as the vapor dispersion channel 1 and This allows the vapor to be split. /, T ghai longitudinal line body 140b is longitudinally arranged in the grid line, in the drawing in the longer direction in the woven structure, and the transverse line body 140a is perpendicular to the longitudinal line body 14 in the grid line % The geometrical area (shown in A) formed by the vapor dispersion channel (I) is calculated by the equation. Equation 2 A = (a + d)d - πά2/4 With reference to Equation 2, the geometric area formed by the arrogance of the arrogant road will decrease with the number of grids (Ν) and the outer diameter of the grid body (sentence Reduce and increase. The secrets of the 14G towel will form four steam knife channels (I) with the single gambling, so the working fluid will be gently divided into four directions, in unit grid The center point (〇) is displayed by an arrow (aa) in Fig. 3. In the example in which the mesh portion 140 forms a screen mesh, the extending direction of the transverse line body 140a extending from the width direction Looked in (not shown in the figure), perpendicular to the transverse line body lion and arranged in the longitudinal direction of the longitudinal line body 14〇b slope, and from the extension of the longitudinal direction of the longitudinal line body 14〇b, vertical vertical The slope of the transverse line body 14〇a of the line body 140b is as shown in Fig. 4, wherein the former is inclined to the latter. Therefore, the vapor flowing along the extending direction of the longitudinal line body 140b of the mesh portion "o" The vapor flowing in the direction of the gorge of the transverse line body 140a of the mesh portion, wherein the former It is relatively smooth, so the extending direction of the longitudinal wire body 140b 11 1260388 has a good heat transfer efficiency. Therefore, in the example in which the mesh portion (10) forms a square mesh, the arrangement of the flat plate heat conducting device 100 and its operation time are Preferably, the heat transfer direction thereof is along the extending direction of the longitudinal line body 140b. Meanwhile, when the flat plate heat conducting device of the present invention is actually operated, the mesh portion (10) is attached to the liquid, and the body is The upper and lower plates of the casing 13 are divided as shown in Fig. 5. Therefore, a liquid film 180 is formed in the model gap 17A in the vapor dispersion passage (1) of the mesh portion 140. As shown in Fig. 6, the liquid film is formed at the intersection of all the grid lines. If the parameters of the grid portion (10) are appropriately controlled, such as the width a of the grid or the outer diameter of the grid body (9), The liquid film 18〇 is formed at the intersection of the grid lines and connected to each other, thereby causing a capillary phenomenon. Therefore, if the reading fluid enters the evaporation zone, and the shape is formed, the evaporation occurs. , correcting the 'into the test of people's money, the frequency of work is a capillary phenomenon along The grid extending direction flows into the grid of the evaporation zone, and its flow rate is equal to the evaporation amount of the evaporation zone. "That is to say, in the flat heat conduction device of the present invention, since the working fluid is continuously evaporated and dispersed, The cage system is in the absence of liquid _ lin, (4) the slanting work will condense continuously in the condensation area, and there will be too much liquid in the condensed area. In any case, the capillary phenomenon caused by the surface tension of the liquid film 180 can cause liquid self-induced The condensation zone flows to the evaporation zone, so the working fluid is continuously replenished to the evaporation zone along the direction of the extension of the grid line, thereby maintaining the operation of the heat transfer mechanism through the treatment and condensation of the working fluid.
液體的流賴沿著網猶體延伸方向㈣彡成者。 D 12 1260388 無論如何，若該網格部140之網格數⑼增加過多或者是網格線體外徑 ⑼減少太多’卿為液體的表面張力的翻而堵住整個該統分散通道 ，在_情形下，蒸發區域中蒸發的碎流體無法經由蒸氣分散通· 以分散至凝結區域，因而阻礙了流暢的熱傳現象。因此，該網格部⑽之 各錄，諸如網格數⑼以及網格線體外徑⑼，應該要同時考慮網格部_ 之蒸氣分散通道_及由毛細現象所造成的液體流道，以作適當地選擇。 卿各部_網格數(N)最好是介於1G至G之間，且其網格線體外徑⑼ 是介於0.12mm至〇.4mm的範圍内。 關於本發明之輪導絲置，_聽_幡_何同時形成基 氣分散通道⑺以及液體導引通道，該盒體130不需在其内表面开域燈_ 構。因此，該平_熱裝置⑽在免除了燈蕊結構下，可減少⑽圆幻麵 厚度。再者’相較於習知結構而言’由於該平板導熱裝置1〇〇之網格部⑽ 开>成支撐該盒體130之結構，因而可增進其機械強度。 參考第7至第9圖所顯示，關於本發明之平板導熱裝f 1〇〇，可具有各 種不同的造型’諸如正方形、長方形或τ字型。再者，該平板導熱裝置1〇〇 之盒體130可由-上盒體i3〇a以及-下盒體所裝配形成者，如第⑺ 及第11 ®所顯示，或者也可由如第12 _顯示，係具有單—盒體者。 S亥盒體130係在其内部間隙中填滿工作流體之後，並使間隙内部壓力 降至真錄態，再完成密封者。其密封方式可以係透過雷射焊接、電將坪 接、TIG (tungsten rnert gas)焊接、超音波焊接、銅辞合金焊接㈣㈣）、錫 焊(soldering)以及熱壓接合(themio_c〇mpressi〇n⑽恤㈣等。 13 !26〇388 工作流體可以係水、甲醇、乙醇、丙酮、氨水、含氟氣碳化合物(CFC)的工 作流體、含氫氟氯碳化合物(HCFC)的工作流體以及含氫氟碳化合物(HFC) 的工作流體中的一種液體，或者係這些液體的混合物。 1例實驗 為了評估本發明之平板導熱裝置的效率，發明人製作了一平板導熱裝 置’其長、寬、高尺寸分別係40 mm、70 mm以及0·65 mm。一盒體係如 第10圖所顯示者，由上下相對應的兩個盒體結合所構成，且這些合體係由 滾軋為0.1 mm厚的銅箔所製成。該盒體中的一網格部係由網格數為15的 鋼製網格體所形成，其網格線體外徑為0.20 mm，且其同含量為99%以上。 為了製作該平板導熱裝置以實施此實驗，其網格體係設置於上下盒體 之間，以致於各個盒體係面向該網格體，如第1〇圖所顯示，且該上下盒體 的密封係由日本之DENKA(其商標為HAR则〇所製造的變質雙鍵壓 克力(denatured acrylic binary bond)，並再左側具有工作流體注入孔。 接著’在工作流體狀盒财，該纽__贿式真”浦㈣^ vacuum pump)以及擴散式真空幫浦(diffilsi 1·0 X 10-7 torr， 咖vacuum pump)先將壓力降至The flow of liquid depends on the direction in which the net body extends (4). D 12 1260388 In any case, if the number of meshes (9) of the mesh portion 140 is excessively increased or the outer diameter of the mesh body (9) is reduced too much, the surface tension of the liquid is blocked by the turning of the surface tension of the liquid, in the _ In this case, the fragmented fluid evaporated in the evaporation zone cannot be dispersed through the vapor to be dispersed to the condensation zone, thus hindering the smooth heat transfer phenomenon. Therefore, the records of the mesh portion (10), such as the number of meshes (9) and the outer diameter of the mesh body (9), should simultaneously consider the vapor dispersion channel of the mesh portion_ and the liquid flow path caused by the capillary phenomenon. Choose as appropriate. The number of grids (N) is preferably between 1 G and G, and the outer diameter (9) of the grid line is in the range of 0.12 mm to 〇.4 mm. Regarding the wheel guide wire of the present invention, the base gas dispersing passage (7) and the liquid guiding passage are simultaneously formed, and the casing 130 does not need to be open on the inner surface thereof. Therefore, the flat-thermal device (10) can reduce the (10) circular phantom thickness without eliminating the lamp core structure. Further, the mechanical strength can be improved by the fact that the mesh portion (10) of the flat heat conduction device 1 is opened to support the structure of the casing 130. Referring to Figures 7 through 9, the flat heat-conducting device f 1 本 of the present invention may have various shapes such as square, rectangular or τ-shaped. Furthermore, the case 130 of the flat heat conduction device 1 can be formed by the upper case i3〇a and the lower case, as shown in the (7) and 11th, or can be displayed as the 12th_ , has a single-box body. The S-box 130 is filled with the working fluid in its internal gap, and the internal pressure of the gap is reduced to the true recording state, and the seal is completed. The sealing method can be through laser welding, electric welding, TIG (tungsten rnert gas) welding, ultrasonic welding, copper alloy welding (four) (four)), soldering and thermocompression bonding (themio_c〇mpressi〇n (10) shirt (4) Etc. 13 !26〇388 Working fluid can be water, methanol, ethanol, acetone, ammonia, working fluid of fluorine-containing carbon compound (CFC), working fluid containing hydrochlorofluorocarbon (HCFC) and containing hydrogen fluoride. A liquid in a working fluid of a carbon compound (HFC), or a mixture of these liquids. One experiment In order to evaluate the efficiency of the flat plate heat conducting device of the present invention, the inventors fabricated a flat plate heat conducting device 'its length, width, and height. 40 mm, 70 mm and 0·65 mm respectively. A box system, as shown in Fig. 10, consists of a combination of two boxes corresponding to each other, and these systems are rolled to a thickness of 0.1 mm. Made of foil. A mesh part of the box is formed by a steel mesh body with a mesh number of 15, and the outer diameter of the mesh body is 0.20 mm, and the same content is 99% or more. Fabricating the flat plate heat transfer device to implement this The grid system is disposed between the upper and lower casings, so that the respective box systems face the grid body, as shown in the first drawing, and the sealing of the upper and lower casings is by DENKA of Japan (its trademark is HAR) Then, the denatured acrylic binary bond is made, and the working fluid injection hole is left on the left side. Then 'in the working fluid-like box, the new __ bribe-like true Pu (four) ^ vacuum pump) And the diffusion vacuum pump (diffilsi 1·0 X 10-7 torr, coffee vacuum pump) first reduces the pressure
。最後， 再將盒體密封。. Finally, the box is sealed.
一端中心 將長、寬分別為12……^ ^ -- 的一端中心處，並保持： 長、見分別為25 mm， 14 1260388 處’並也保持10 mm的間隙距離。接著，量測該發熱體表面的溫度，當作 功至該發熱體，並且其功率係從丨w增加到5 w。 關於此實驗的結果，在供給至最大功率5界後，該發熱體的溫度不會 超過47°C。因此，可以被了解的是，關於本發明之平板導熱裝置可作為一 熱傳冷部I置(cooling heat transfer device)，並具有厚度薄且殘餘較低的熱 能，以應用於相對較小的電子裝置。 工業上的應用性 關於本發明之平板導熱裝置，其係在一盒體中，利用網格部取代習用 技術中的燈蕊結構’該網格部係同時具有蒸氣分散通道以及液體導引通 道，因此可形成一種非常薄的平板導熱裝置。再者，由於該網格部可堅固 地支撐該盒體，使得該平板導熱裝置不會在製作加工過程中所產生的衝擊 力而發生變形的現象。 雖然本發明業已透過具體實施例詳細揭露如上，然其並非用以限定本 發明，任何熟悉此技藝者，在不脫離本發明之精神和範圍内，當可作各種 之更動與潤飾’其所作之更動與潤飾皆屬於本發明之射，本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 - 【圖式簡單說明】 此等所附被納人來提供本發明之進_步_及使合併進而構成此一說 明書之-部分驗圖，侧示本發明之實施例，以及配合其綱來轉本 發明之原理。 15 1260388 諸圖中： 第ι圖係顯示一習知技術之平板導熱裝置的剖面視圖; 第2圖係顯示本發明平板導熱裝置一具體實施例之剖面視圖； 第3圖係顯示本發明平板導熱裝置中，埋在合體之編織狀網格中的單 一網格的平面視圖； 第4圖係顯示第3圖中Α-Α’剖面線之局部剖面視圖； 第5及第6圖分職顯示平板導熱裝置之局部勤視圖以及局部平面 視圖，並顯示當本發明平板導熱裝置運作時，其網袼中會形成液膜；The center of one end will be at the center of one end of 12...^ ^ -- and keep: long, see 25 mm, 14 1260388, respectively, and also maintain a gap distance of 10 mm. Next, the temperature of the surface of the heating element was measured to be a work of the heating element, and its power was increased from 丨w to 5 w. As a result of this experiment, the temperature of the heating element did not exceed 47 ° C after being supplied to the maximum power of 5 boundaries. Therefore, it can be understood that the flat heat conduction device of the present invention can be used as a cooling heat transfer device and has a thin thickness and low residual heat energy for application to relatively small electrons. Device. INDUSTRIAL APPLICABILITY The flat plate heat-conducting device of the present invention is incorporated in a casing, and the mesh portion is used to replace the lamp core structure in the prior art. The mesh portion has both a vapor dispersion channel and a liquid guiding channel. Therefore, a very thin flat plate heat conducting device can be formed. Further, since the mesh portion can strongly support the casing, the flat plate heat conducting device does not deform due to the impact force generated during the manufacturing process. While the present invention has been described in detail above by way of specific embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The invention is directed to the invention, and the scope of the invention is defined by the scope of the appended claims. - [Simplified description of the drawings] These accompanying persons are provided to provide the invention with the steps of the present invention, and the combination of the embodiments of the present invention, and the embodiment thereof, and the outline thereof The principle of the invention is transferred. 15 1260388 In the drawings: Fig. 1 is a cross-sectional view showing a conventional plate heat conducting device; Fig. 2 is a cross-sectional view showing a specific embodiment of the flat plate heat conducting device of the present invention; Fig. 3 is a view showing heat conduction of the flat plate of the present invention In the device, a plan view of a single mesh buried in a woven mesh of the fit; Figure 4 shows a partial cross-sectional view of the Α-Α' section line in Fig. 3; a partial view of the heat conducting device and a partial plan view, and showing that when the flat plate heat conducting device of the present invention operates, a liquid film is formed in the mesh;
體視圖；以及 第10至第12圖係 圖。 係顯示本㈣平板魏裝置之錄各種態樣 的剖面視 【主要元件符號說明】 平板導熱裝置10 發熱體20 散熱體30 間隙40 金屬盒體50 16 1260388 燈蕊結構60 平板導熱裝置100 發熱體110 散熱體120 盒體130 上盒體130a 下盒體130b 網格部140 橫向線體140a 縱向線體140b 風扇150 間隙160 楔型間隙170 液膜180 網格數(N) 中心點(0) 箭頭(aa) 1260388 蒸氣分散通道(i)Body view; and figures 10 through 12 are diagrams. This section shows the cross section of the various parts of this (4) flat-plate device. [Main component symbol description] Flat plate heat-conducting device 10 Heating element 20 Heat sink 30 Gap 40 Metal case 50 16 1260388 Light core structure 60 Flat plate heat-conducting device 100 Heating element 110 Heat sink 120 Case 130 Upper case 130a Lower case 130b Mesh portion 140 Transverse line body 140a Longitudinal line body 140b Fan 150 Gap 160 Wedge gap 170 Liquid film 180 Number of grids (N) Center point (0) Arrow ( Aa) 1260388 Vapor dispersion channel (i)