CN112996339B - Uniform temperature plate device - Google Patents
Uniform temperature plate device Download PDFInfo
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- CN112996339B CN112996339B CN201911275141.3A CN201911275141A CN112996339B CN 112996339 B CN112996339 B CN 112996339B CN 201911275141 A CN201911275141 A CN 201911275141A CN 112996339 B CN112996339 B CN 112996339B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The invention provides a temperature equalizing plate device which is suitable for being thermally coupled with a heat source. The first shell comprises a first plate part, a first capillary structure and a first side wall, wherein the first capillary structure is positioned on the inner surface of the first plate part, the first side wall protrudes out of the inner surface and surrounds the first capillary structure, and the heat source is suitable for contacting the outer surface of the first plate part. The second shell is overlapped with the first shell and comprises a second plate part, a plurality of support columns protruding from the second plate part and a second side wall protruding from the second plate part and surrounding the support columns. The support column faces the first capillary structure, and the first side wall is connected with the second side wall. The temperature equalizing plate device comprises a second capillary structure and a third capillary structure. The second capillary structure is arranged between the first capillary structure and the support column. The third capillary structure is arranged on the inner surface of the first plate part in a region corresponding to the heat source.
Description
Technical Field
The present invention relates to a temperature equalizing plate device, and more particularly, to a high-performance temperature equalizing plate device.
Background
The temperature equalizing plate is a common heat dissipation device. The temperature equalizing plate mainly comprises a flat closed shell, capillary tissues formed in the flat closed shell and working fluid filled in the flat closed shell. The flat sealed housing contacts a heat source, such as a Central Processing Unit (CPU), and dissipates heat from the heat source by vapor-liquid phase changes of the working fluid in the temperature equalization plate. How to increase the heat dissipation capacity of the temperature equalization plate is the direction of research in the field.
Disclosure of Invention
The invention provides a temperature equalizing plate device which has good heat dissipation efficiency.
The invention relates to a temperature equalizing plate device which contains working fluid and is suitable for being thermally coupled with a heat source. The first shell comprises a first plate part, a first capillary structure and a first side wall, wherein the first capillary structure is positioned on the inner surface of the first plate part, the first side wall protrudes out of the inner surface and surrounds the first capillary structure, and the heat source is suitable for contacting the outer surface of the first plate part. The second shell is overlapped with the first shell and comprises a second plate part, a plurality of support columns protruding from the second plate part and a second side wall protruding from the second plate part and surrounding the support columns, wherein a plurality of steam channels are formed between the support columns, the support columns face the first capillary structure, and the first side wall is connected with the second side wall. The temperature equalizing plate device also comprises a second capillary structure and a third capillary structure. The second capillary structure is arranged between the first capillary structure and the support columns of the second shell. The third capillary structure is arranged on the inner surface of the first plate part in a region corresponding to the heat source.
In an embodiment of the invention, the first capillary structure includes a plurality of grooves formed between a plurality of ribs, and the third capillary structure fills the plurality of grooves in the region corresponding to the heat source.
In an embodiment of the invention, the second capillary structure is a mesh structure woven by a plurality of wires, and includes a plurality of holes, and the third capillary structure is filled in the grooves of the first capillary structure and the plurality of holes in the area corresponding to the heat source.
In an embodiment of the invention, the second capillary structure has an opening corresponding to the heat source, and the third capillary structure fills the opening and the groove of the first capillary structure.
In an embodiment of the invention, the first plate portion has a cavity corresponding to the heat source, the first capillary structure is located outside the cavity, and the third capillary structure fills the cavity.
In an embodiment of the invention, the second capillary structure is a mesh structure woven by a plurality of wires, and includes a plurality of holes, and the third capillary structure is filled in the plurality of holes in the area corresponding to the heat source.
In an embodiment of the invention, the second capillary structure has an opening corresponding to the heat source, and the third capillary structure fills the opening.
In an embodiment of the invention, the support columns are uniformly distributed in the second plate portion, and cross-shaped steam channels are formed between the support columns.
In an embodiment of the invention, the support columns include a plurality of first support columns and a plurality of second support columns, wherein the shapes of the first support columns are different from those of the second support columns, the first support columns are configured at the positions corresponding to the heat sources, and the second support columns are located beside the first support columns and extend along an axial direction, and cross-shaped steam channels are formed between the support columns.
In an embodiment of the invention, a portion of the support columns is disposed at a location corresponding to the heat source, another portion of the support columns is arranged radially around the portion, and cross-shaped steam channels are formed between the support columns.
In an embodiment of the present invention, the support columns include rectangular columns, tapered columns, trapezoidal columns, cylindrical columns, or irregular columns.
In an embodiment of the invention, the first capillary structure includes a plurality of grooves, and at least a portion of the grooves are arranged radially.
In an embodiment of the invention, the third capillary structure includes metal powder or non-woven metal velvet.
Based on the above, in the temperature equalizing plate device of the present invention, the first capillary structure and the second capillary structure are disposed between the first housing and the second housing to improve the heat dissipation efficiency, and the third capillary structure is disposed in the area of the inner surface of the first plate portion corresponding to the heat source. The third capillary structure can make the liquid arranged in the temperature equalizing plate device receive larger capillary force, and meanwhile, the grooves in the first capillary structure covered by the second capillary structure have lower flow resistance, so that the liquid can be more rapidly supplemented to the area corresponding to the heat source, and the drying resistance of the area is improved. Thus, the region may hold a sufficient amount of liquid to undergo a phase change, and the tendency to dry in the region may be reduced. Therefore, the temperature equalizing plate device can have better heat dissipation efficiency.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
FIG. 1A is a schematic view of a temperature uniformity plate apparatus according to an embodiment of the present invention;
FIG. 1B is a schematic cross-sectional view of the isopipe apparatus of FIG. 1A along line A-A;
FIG. 1C is a schematic cross-sectional view of the isopipe apparatus of FIG. 1A along line B-B;
FIG. 1D is a schematic view of the inner surface of a second housing of the isopipe apparatus of FIG. 1A;
FIG. 1E is a schematic cross-sectional view of a cryopanel apparatus in accordance with another embodiment of the present invention;
FIGS. 2A and 2B are schematic views of a second housing of various cryopanel apparatuses according to other embodiments of the present invention;
FIG. 2C is a schematic view of the inner surface of a first housing of a cryopanel apparatus in accordance with other embodiments of the present invention;
FIG. 3 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention;
FIG. 4 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention;
fig. 5 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention.
Description of the reference numerals
A1: axial direction;
g: a working fluid;
10: a heat source;
100. 100', 100c, 100d, 100e: a temperature equalizing plate device;
110. 110": a first housing;
111: a first plate portion;
1112: an inner surface;
1114: a first housing outer surface;
112: a convex strip;
113: a first capillary structure;
112", 114, 115, 119: a groove;
116: a cavity;
117: a first side wall;
120. 120a, 120b: a second housing;
121: a second plate portion;
122. 122': a support column;
122a: a first support column;
123. 125, 127: a second support column;
124. 124', 124a: a steam channel;
126: a wall surface;
128: a second side wall;
129: a second housing outer surface;
130. 130c: a second capillary structure;
132: a wire rod;
134: a hole;
136: an opening;
140: and a third capillary structure.
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Fig. 1A is a schematic view of an embodiment of a temperature equalization plate device according to the present invention, but the shape of the appearance is not limited to a square plate shape, and may be any shape. FIG. 1B is a schematic cross-sectional view of the isopipe apparatus of FIG. 1A along line A-A. FIG. 1C is a schematic cross-sectional view of the isopipe apparatus of FIG. 1A along line B-B.
Referring to fig. 1A to 1C, a temperature uniformity plate apparatus 100 of the present embodiment is suitable for being thermally coupled to a heat source 10 (fig. 1B). The heat source 10 is, for example, a central processing unit of a motherboard, but the heat source 10 may be other chips, and the type and number of the heat sources 10 are not limited thereto. The apparatus 100 includes a first housing 110 and a second housing 120. As can be seen in fig. 1B, the first housing 110 includes a first plate 111, a first capillary structure 113 located on an inner surface 1112 of the first plate 111, and a first side wall 117 protruding from the inner surface 1112 and surrounding the first capillary structure 113. The heat source 10 is adapted to contact the first housing outer surface 1114 of the first plate portion 111, and transfer heat energy generated by the heat source 10 to the temperature-equalizing plate device 100.
As can be seen in fig. 1B and 1C, the first capillary structure 113 includes a plurality of grooves 114 formed between a plurality of ribs 112. More specifically, the ribs 112 protrude from the inner surface 1112 of the first plate 111, such that a groove 114 is defined between two adjacent ribs 112. The first capillary structure 113 may provide a smaller flow resistance using the design of the grooves 114. In the present embodiment, the width of the trench 114 is, for example, between 50 micrometers and 200 micrometers, and the depth of the trench 114 is, for example, between 50 micrometers and 200 micrometers, but the width and depth of the trench 114 are not limited thereto. However, the capillary force of the simple open groove is insufficient, and the device is not suitable for a non-horizontal temperature equalization plate device, but if a layer of net-shaped second capillary structure 130 is covered, the advantage of low flow resistance of the groove is maintained, and the capillary force can be obviously improved, so that the device is suitable for non-horizontal placement. If metal powder or metal velvet with stronger capillary force is further added into the capillary structure near the heat source 10, the capillary force at the position can be further increased, and the drying resistance can be improved.
Thus, as shown in fig. 1B, the present temperature uniformity plate device 100 further includes a second capillary structure 130 and a third capillary structure 140 disposed near the corresponding heat source 10. The second capillary structure 130 is disposed between the first capillary structure 113 and the support pillars 122 to cover the first capillary structure 113, so as to enhance the capillary and channel functions of the first capillary structure 113. The third capillary structure 140 is disposed only in the capillary structure in the vicinity of the position corresponding to the heat source 10, and does not block the path that the liquid passes through when flowing back.
In addition, in the present embodiment, the first plate portion 111 and the protruding strips 112 are integrally formed, and such a design can have a relatively simple structure. Since there is no thermal contact resistance between the first plate 111 and the ribs 112 (i.e., between the first plate 111 and the grooves 114), the heat transfer effect is good.
The second housing 120 is stacked on the first housing 110, and includes a second plate 121, a plurality of support columns 122 protruding from the second plate 121, and a second side wall 128 protruding from the second plate 121 and surrounding the support columns 122. In the present embodiment, the supporting columns 122 are flush with the second side walls 128, but the relationship between the supporting columns 122 and the second side walls 128 is not limited thereto.
Fig. 1D is a schematic view of the inner surface of the second housing of the isopipe apparatus of fig. 1A. Referring to fig. 1D, in the present embodiment, the support columns 122 are uniformly and evenly distributed on the inner surface of the second plate 121, and a plurality of steam channels 124 are formed between the support columns 122. The support columns 122 are, for example, square columns, but in other embodiments, the support columns 122 may be rectangular columns, cylinders, elliptical columns, polygonal columns, tapered columns, irregular columns, or/and combinations thereof. The shape and distribution of the support columns 122 are not limited in this regard. The support columns 122 are integrally formed with the second plate portion 121, but may be joined by welding, bonding, or the like.
Fig. 1E is a schematic cross-sectional view of a cryopanel apparatus in accordance with another embodiment of the present invention. The cross-sectional shape of the support column 122' of the temperature equalization plate device 100' is an inverted trapezoid, and thus the constructed steam channel 124' is a trapezoid in cross-sectional shape. In other embodiments, the support columns 122 'may include rectangular columns, tapered columns, trapezoidal columns, or irregular columns, and thus, the support columns 122' may have triangular, arcuate, or other cross-sectional shapes. Likewise, the steam channel 124' may have a triangular, arcuate, or other cross-sectional shape.
Referring back to fig. 1B, in the present embodiment, the support columns 122 face the first capillary structure 113. In addition, in the present embodiment, the first housing 110 and the second housing 120 are, for example, two metal housings, and the first side wall 117 is bonded to the second side wall 128, so as to provide good structural strength. The first side wall 117 and the second side wall 128 are bonded by, for example, diffusion bonding or welding, but not limited thereto.
In this embodiment, the first capillary structure 113 is slightly lower than the first side wall 117, and the second capillary structure 130 is disposed on the first capillary structure 113 to be approximately flush with the first side wall 117, so that the support column 122 can be pressed against the second capillary structure 130 when the first side wall 117 is connected to the second side wall 128. Of course, in other embodiments, the above height relationship is not limited thereto.
It should be noted that, in the present embodiment, the internal space surrounded by the first housing 110 and the second housing 120 is filled with a proper amount of the working fluid g, such as water, but the type of the working fluid g is not limited thereto. The working fluid g flows, for example, in the form of a liquid within the grooves 114 of the first capillary structure 113 of the first housing 110. The vapor passage 124 of the second housing 120 may be evacuated to a pressure less than 1 atmosphere (e.g., near vacuum) to avoid excessive pressure in the vapor passage where the first housing 110 is separated from the second housing 120 during subsequent phase changes of the working fluid g.
Therefore, in the present embodiment, the support columns 122 are abutted against the second capillary structure 130, so as to support the second plate 121, thereby effectively avoiding the collapse of the first housing 110, the second housing 120 and the steam channel 124 during the vacuum pumping. In addition, when the working fluid g is condensed from a gas to a liquid, the working fluid g may also flow down along the side walls of the support columns 122. That is, the support column 122 may also serve as a structure for guiding the working fluid g (liquid) to flow down.
In the present embodiment, the second capillary structure 130 is a mesh structure woven by a plurality of wires 132, for example, a copper mesh. Of course, in other embodiments, the second capillary structure 130 may be a non-woven mesh or a porous foam metal capillary structure, and the form of the second capillary structure 130 is not limited thereto.
It should be noted that, as shown in fig. 1B, since the second capillary structure 130 is disposed on the groove 114 of the first capillary structure 113, the upper portion of the groove 114 of the first capillary structure 113 is covered by the second capillary structure 130, and a capillary-like structure is formed in the extending direction (the direction of injecting or injecting the working fluid g in the groove 114 against the gravity, so that the thermal cycle of the thermal plate device 100 can be well completed under non-horizontal condition.
In addition, in the present embodiment, the third capillary structure 140 is provided on the inner surface 1112 of the first plate portion 111 in a region corresponding to the heat source 10. In detail, in the present embodiment, since the grooves 114 of the first capillary structure 113 are uniformly distributed on the first plate portion 111, a portion (particularly, a central portion) of the grooves 114 corresponds to the first plate portion 111 in a region corresponding to the heat source 10. Therefore, in the present embodiment, the third capillary structure 140 fills the grooves 114 in the region corresponding to the heat source 10.
As can be seen in fig. 1C, the second capillary structure 130 includes a plurality of holes 134. Note that in the cross section of fig. 1B, the wires 132 of the second capillary structure 130 are cut out, and the holes 134 are not visible. In the cross-section of fig. 1C, the relationship between the wires 132 and the holes 134 of the second capillary structure 130 can be seen. In addition, the section of fig. 1C is taken along just one of the grooves 114 of the first capillary structure 113, and the ridge 112 is not visible on this section. Fig. 1C does not show the support columns 122 of the second housing 120, but only the steam channels 124.
The third capillary structure 140 fills the holes 134 corresponding to the heat source 10. In the present embodiment, the third capillary structure 140 is, for example, a sintered capillary structure, such as sintering metal powder in a local area of the grooves 114 and the holes 134. Of course, in other embodiments, the form of the third capillary structure 140 is not limited thereto. In addition, in the embodiment not shown, the second capillary structure 130 may also be a foam metal layer (metal foam layer) having a plurality of holes therein, and the third capillary structure 140 (metal powder) is filled in the holes of the foam metal layer and the grooves 114 of the first capillary structure 113.
As can be seen in fig. 1C, the first outer surface 1114 (labeled in fig. 1B) of the first housing 110 of the temperature equalizing plate device 100 contacts the heat source 10, and the heat generated by the heat source 10 is transferred to the first housing 110. The temperature equalizing plate device 100 is called an evaporation zone in a region corresponding to the heat source 10. In the evaporation zone, the liquid located within the channels 114 absorbs heat and evaporates into vapor. The working fluid g (gas) flows up the vapor channels 124 of the second housing 120 and diffuses into the interior vapor chamber of the second housing 120, condensing into liquid in the cold plate condensation zone (e.g., selected areas of the outer surfaces 129 of both housings Wen Bandi or the outer surfaces 1114 of the first housing that are not in contact with the heat source 10) and removing heat from the cold plate device 100. Condensing into a liquid. The condensed working fluid g (liquid) flows down to the groove 114 of the first housing 110, and flows to the third capillary structure 140 by capillary force in the groove 114, thereby completing the cycle.
It should be noted that, in the present embodiment, the third capillary structure 140 is filled in the grooves 114 of the first capillary structure 113 and the holes 134 of the second capillary structure 130 in the evaporation area, and the sintering material can provide a good capillary environment for the liquid, so that the working fluid g can be easily absorbed into the evaporation area, so as to avoid the situation that the liquid in the evaporation area is not replenished after being vaporized, and thus provides good drying resistance. In addition, the grooves 114 of the first capillary structure 113 and the holes 134 of the second capillary structure 130 are not provided with the third capillary structure 140 in the region corresponding to the outside of the heat source 10, so that the low flow resistance can be maintained.
In this way, the temperature equalization plate device 100 can greatly improve the maximum heat dissipation capacity by the design, and can be applied to a thinned device without increasing the thickness (the thickness of the first capillary structure 113 and the second capillary structure 130 can be maintained). As tested, compared with the temperature uniformity plate without the third capillary structure 140, the maximum heat dissipation capacity of the temperature uniformity plate device 100 of the present embodiment can be increased by at least 50%, and the performance is quite good.
The working fluid evaporates in the capillary structure near the heat source, and the formed vapor diffuses to the vapor cavity inside the whole temperature equalizing plate through the cross vapor channel formed among the support columns of the second plate part, so as to condense into liquid in the condensing area of the temperature equalizing plate (such as the surface of the upper plate of the temperature equalizing plate or the surface of the lower plate except the surface contacted with the heat source), and the heat is discharged out of the temperature equalizing plate. Condensed liquid is evaporated from the area near the heat source by the reflux in the lower capillary structure, and the thermal cycle is completed. The third capillary structure corresponding to the heat source area has stronger capillary force, and the grooves in the first capillary structure covered by the second capillary structure have lower flow resistance and stronger capillary force, so that the three capillary structures are properly matched, and the working fluid can flow back to the evaporation area close to the heat source more quickly, so that the evaporation area of the temperature equalizing plate is less prone to drying, and has more heat dissipation efficiency.
The temperature equalizing plate device or the second housing thereof according to other embodiments will be described below, and the same or similar components as those of the previous embodiment will be denoted by the same or similar symbols, and the description thereof will not be repeated, but only the main differences will be described.
Fig. 2A and 2B are schematic views of a second housing of various cryopanel apparatuses according to other embodiments of the present invention. Referring to fig. 2A, the main difference between the second housing 120a of fig. 2A and the second housing 120 of fig. 1D is that in the present embodiment, the support columns include a plurality of first support columns 122A and a plurality of second support columns 123, and the shape of the first support columns 122A is different from the shape of the second support columns 123. The first support columns 122a are disposed at positions corresponding to the heat source 10, the second support columns 123 are located beside the first support columns 122a and extend along the axial direction A1, and the steam channels 124a are formed therebetween.
In the present embodiment, the second housing 120a is provided with the first supporting columns 122a with high density at the location corresponding to the heat source 10, so as to provide good structural strength. The second support columns 123 are disposed at both sides of the first support columns 122a and extend along the axial direction A1 so as to guide the flow direction of the working fluid g (gas).
Referring to fig. 2B, the main difference between the second housing 120B of fig. 2B and the second housing 120a of fig. 2A is that, in the present embodiment, a portion of the support columns (the first support columns 122A) are disposed at the positions corresponding to the heat source 10, and another portion of the support columns (the second support columns 123, 125, 127) are radially arranged around the first support columns 122A. Such a design can also satisfactorily guide the flow direction of the working fluid g (gas) in the same manner.
Fig. 2C is a schematic view of an inner surface of a first housing of a cryopanel apparatus according to other embodiments of the present invention. Referring to fig. 2C, in the present embodiment, the first housing 110″ has a plurality of grooves 114, 112", 115, 119 with different directions, and the grooves are radial to reduce the flow resistance, so that the condensed liquid flows back rapidly. The groove arrangement pattern of the inner surface of the first housing is not limited to radial, and any arrangement pattern sufficient to guide the working fluid g (liquid) may be used.
Fig. 3 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention. Referring to fig. 3, the main difference between the temperature uniformity plate apparatus 100c of fig. 3 and the temperature uniformity plate apparatus 100 of fig. 1B is that, in the present embodiment, the second capillary structure 130c has an opening 136 corresponding to the heat source 10, and the third capillary structure 140 fills the entire opening 136. That is, in the present embodiment, the capillary structure corresponding to the evaporation area of the heat source 10 is mainly composed of the grooves 114 and the third capillary structure 140.
Fig. 4 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention. Referring to fig. 4, the main difference between the temperature uniformity plate apparatus 100d of fig. 4 and the temperature uniformity plate apparatus 100 of fig. 1B is that, in the present embodiment, the first housing 110 has a cavity 116 corresponding to the heat source 10, and the first capillary structure 113 is located outside the cavity 116. The first capillary structure 113 is located at a position that does not overlap the heat source 10. The third capillary structure 140 fills the cavity 116 and the holes 134 (shown in fig. 1C) corresponding to the heat source 10. That is, in the present embodiment, the capillary structure corresponding to the evaporation area of the heat source 10 is mainly composed of the second capillary structure 130 and the third capillary structure 140.
Fig. 5 is a schematic view of a cryopanel apparatus according to another embodiment of the present invention. Referring to fig. 5, the main difference between the temperature uniformity plate apparatus 100e of fig. 5 and the temperature uniformity plate apparatus 100d of fig. 4 is that, in the present embodiment, the second capillary structure 130c has an opening 136 corresponding to the heat source 10, and the third capillary structure 140 fills the entire opening 136. That is, in the present embodiment, the capillary structure corresponding to the evaporation area of the heat source 10 is mainly composed of the third capillary structure 140.
The contact surfaces of the first capillary structure and the second capillary structure can be sintered or combined by hot pressing, and the third capillary structure filled between the first capillary structure and the second capillary structure can also be sintered, so that the structural strength and the heat conduction performance are enhanced.
In summary, in the temperature equalizing plate device of the present invention, the first capillary structure and the second capillary structure are disposed between the first housing and the second housing to improve the heat dissipation efficiency, and the third capillary structure is disposed in the region of the inner surface of the first plate portion corresponding to the heat source. The third capillary structure can enable the fluid arranged in the temperature equalizing plate device to be subjected to larger capillary force, so that the area can be supplemented more quickly, and the drying resistance of the area can be improved. Therefore, the region can hold enough liquid to perform phase change, so that the probability of continuously heating the heat source after the liquid in the region is vaporized can be reduced without replenishing the liquid to the region. Therefore, the temperature equalizing plate device can have better heat dissipation efficiency.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (12)
1. A temperature uniformity plate apparatus adapted to be thermally coupled to a heat source, the temperature uniformity plate apparatus comprising:
a first housing including a first plate portion, a first capillary structure located at an inner surface of the first plate portion, and a first side wall protruding from the inner surface and surrounding the first capillary structure, wherein the heat source is adapted to contact an outer surface of the first plate portion, the first capillary structure serving as a liquid channel;
the second shell is overlapped with the first shell and comprises a second plate part, a plurality of support columns protruding out of the second plate part and a second side wall protruding out of the second plate part and surrounding the support columns, wherein a plurality of steam channels are formed among the support columns, the support columns face the first capillary structure, and the first side wall is connected with the second side wall;
the second capillary structure is configured between the first capillary structure and the plurality of support columns of the second shell; and
the third capillary structure is arranged on the inner surface of the first plate part in a region corresponding to the heat source, the first capillary structure comprises a plurality of grooves formed among a plurality of raised strips, and the third capillary structure is filled in the grooves in the region corresponding to the heat source.
2. The apparatus according to claim 1, wherein the second capillary structure is a mesh structure woven from a plurality of wires, a non-woven mesh structure, or a foamed metal layer, the second capillary structure including a plurality of holes, and the third capillary structure being filled in a plurality of the holes and a plurality of the grooves in a region corresponding to the heat source.
3. The apparatus according to claim 1, wherein the second capillary structure has an opening corresponding to the heat source, and the third capillary structure fills the plurality of grooves of the opening and the first capillary structure in a region corresponding to the heat source.
4. The apparatus of claim 1, wherein the first plate portion has a cavity corresponding to the heat source, the first capillary structure is located outside the cavity, and the third capillary structure fills the cavity.
5. The apparatus according to claim 4, wherein the second capillary structure is a mesh structure woven from a plurality of wires, a non-woven mesh structure, or a foamed metal layer, and includes a plurality of holes, and the third capillary structure fills in the plurality of holes and the cavity in the region corresponding to the heat source.
6. The isopipe apparatus of claim 4 wherein the second capillary structure has an opening corresponding to the heat source, and the third capillary structure fills the opening and the cavity.
7. The apparatus of claim 1, wherein the plurality of support columns are uniformly distributed in the second plate portion.
8. The apparatus of claim 1, wherein the plurality of support columns comprises a plurality of first support columns and a plurality of second support columns, the plurality of first support columns having a shape different from a shape of the plurality of second support columns, the plurality of first support columns being disposed at a location corresponding to the heat source, the plurality of second support columns being located beside the plurality of first support columns and extending in an axial direction.
9. The apparatus according to claim 1, wherein a part of the plurality of support columns is arranged at a position corresponding to the heat source, and another part of the plurality of support columns is arranged radially around the part.
10. The isopipe apparatus of claim 1, wherein the plurality of support columns comprises a plurality of rectangular columns, a plurality of tapered columns, a plurality of trapezoidal columns, a plurality of cylinders, or a plurality of irregular shaped columns.
11. The isopipe apparatus of claim 1, wherein the first capillary structure comprises a plurality of grooves, at least a portion of the plurality of grooves being radially aligned.
12. The isopipe apparatus of claim 1 wherein the third capillary structure comprises a metal powder or a non-woven metal velvet.
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| CN201911275141.3A CN112996339B (en) | 2019-12-12 | 2019-12-12 | Uniform temperature plate device |
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| CN112996339B true CN112996339B (en) | 2023-09-26 |
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