JP3181382U - Heat dissipation device - Google Patents

Abstract

Disclosed is a heat dissipation device that can be manufactured at low cost and can greatly reduce thermal resistance.
A heat dissipation device includes a first plate and a second plate, and the first plate has a first side and a second side, and a rough structure is formed on the second side. The second plate body has a third side surface and a fourth side surface, and the fourth side surface is put on the opposite second side surface, jointly defines the chamber 113, and is filled with the working fluid 12. In addition, a plating film layer 1022 can be further coated on the rough structure 1021, and the installation of the rough structure and the plating film layer can reduce the cost and reduce the overall thermal resistance.
[Selection] Figure 3

Description

  The present invention relates to a heat radiating device, and more particularly, to a heat radiating device capable of reducing cost and greatly reducing the overall thermal resistance.

  With the rapid advancement of the science and technology industry, the functions of electronic devices are becoming more and more powerful. For example, the electronic element operation speed of a CPU (Central Processing Unit), chipset or display unit is increased, and the electronic elements are unit time. The amount of heat generated is relatively increased. Therefore, when the amount of heat released by the electronic member cannot be radiated in a timely manner, the operation of the entire electronic device is affected or the electronic device is damaged.

  Most of the heat dissipation devices for electronic devices used in the general industry radiate heat via heat radiating members such as fans, heat sinks, and heat tubes. The heat sink is brought into contact with a heat source, and heat is radiated to a remote place through the heat tubes. Or, forcibly induce airflow with a fan, forcibly dissipate heat to the heat sink, select a soaking plate for a heat source with a small space or large area, use it as a heat conducting member, It is used for conducting.

  A conventional temperature equalizing plate is formed by covering two pieces of plate materials correspondingly. The plate members corresponding to each other are provided with any one of grooves and capillaries (for example, mesh, sintered body) or a combination thereof, and the plate members are covered and sealed in a sealed manner. Forming a chamber, the sealed chamber is in a vacuum state, filled with a working fluid therein, increases the capillary limit, and utilizes a capillary structure such as copper pillar coating sintered, sintered pillar, foam pillar, The working fluid in the soaking plate is evaporated by receiving heat in the evaporating region, the working fluid is converted from liquid to gas, and the gaseous working fluid is cooled in the soaking plate. After being cooled and solidified from gas to liquid, the copper column is started, circulated to the evaporation zone, and the circulation action is continued. After the gas working fluid is cooled to a small liquid bead in the cooling zone. The working fluid is circulated into the evaporation zone due to gravity or capillary action Rukoto can.

  The conventional temperature equalizing plate is prone to air combustion or poor temperature equalization because the circulating speed of the working fluid is too slow, making it impossible for the working fluid to efficiently perform heat exchange for gas-liquid changes. Since the soaking effect will not be noticeable, when considering increasing the capillary suction force for the working fluid with a capillary structure in the design, the circulatory (suction) force of the cooling working fluid is accelerated and the capillary force is greatly improved. Although the heat conduction capacity of the soaking plate is efficiently improved, the conventional capillary absorption force and fluid resistance force are two mutually colliding design elements. When considering an increase in capillary absorption, it is necessary to provide a capillary structure with relatively small pores, but these small pores provide a relatively large fluid resistance and impede the circulatory action of the working fluid. When considering the reduction of fluid resistance, the pores provide a relatively large capillary structure, which favors the circulation of the working fluid, but the large pores are not advantageous for increasing the capillary absorbency.

  Therefore, there is another kind of soaking plate in the market which employs a composite microstructure, which includes a first capillary layer and a second capillary layer, the first and second structural layers having different pores. Have dimensions. The conventional soaking plate employing the single layer or the soaking plate employing the composite type is complicated in its process, is not easy to reduce in thickness, and is difficult to control the quality, and the production cost and Yield deteriorates.

As described above, the prior art has the following defects.
1. Cost is relatively high.
2. The temperature uniformity is not relatively good.
3. Thinning is not easy.
4). Thermal resistance is relatively high.

  How to solve the above-mentioned conventional problems and deficiencies is where the inventor and related companies want the direction of research improvement.

  Therefore, in order to efficiently solve the above problem, an object of the present invention is to provide a heat dissipation device that greatly reduces the cost.

  Another object of the present invention is to provide a heat dissipation device that can reduce the overall thermal resistance.

  Another object of the present invention is to provide a heat dissipating device that can improve the temperature uniformity in the cooling region.

  In order to achieve the above object, a heat dissipating device provided by the present invention includes a first plate and a second plate, the first plate having a first side and a second side, and the second plate. A rough structure is formed (or installed) on the side surface, and the second plate body has a third side surface and a fourth side surface, and the fourth side surface of the second plate body is the opposite side of the first plate body. Covered on the second side, jointly defines a chamber, and is filled with a working fluid, and the heat dissipation device further includes a plating film layer, either on the rough structure on the second side or on the fourth side. Either on one side or on the coarse structure on the second side and on the fourth side.

  The design of this structure of the present invention makes use of the local structure or the entire rough structure formed on the second side surface, and the plating film layer covering the rough structure is made of silicon dioxide, and is hydrophilic. Or when the third side surface of the second plate body receives heat, the liquid working fluid is converted into liquid working fluid by receiving heat, and the formation of the rough structure causes the liquid to The working fluid is pulled back to the position corresponding to the heat source on the second side faced oppositely, and the terminated liquid working fluid flows back to the third side face, accelerating the recirculation of the cooled working liquid and reducing the thermal resistance of the entire heat radiating device. To improve the temperature uniformity of the heat dissipation device. In addition, the conventional soaking plate process is complicated and difficult to control the quality, and the yield and production cost can be greatly reduced.

It is a three-dimensional exploded view of the first embodiment of the heat dissipation device of the present invention. It is a three-dimensional combination diagram of the first embodiment of the heat dissipation device of the present invention. It is sectional drawing of 1st Example of the thermal radiation apparatus of this invention. It is expansion explanatory drawing of 1st Example of the thermal radiation apparatus of this invention. It is another sectional drawing of 1st Example of the thermal radiation apparatus of this invention. It is another expansion explanatory drawing of 1st Example of the thermal radiation apparatus of this invention. It is sectional drawing of 2nd Example of the thermal radiation apparatus of this invention. It is expansion explanatory drawing of 2nd Example of the thermal radiation apparatus of this invention. It is sectional drawing of 3rd Example of the thermal radiation apparatus of this invention. It is expansion explanatory drawing of 3rd Example of the thermal radiation apparatus of this invention. It is sectional drawing of 4th Example of the thermal radiation apparatus of this invention. It is expansion explanatory drawing of 4th Example of the thermal radiation apparatus of this invention. It is sectional drawing of 5th Example of the thermal radiation apparatus of this invention. It is expansion explanatory drawing of 5th Example of the thermal radiation apparatus of this invention. It is a three-dimensional exploded view of a sixth embodiment of the heat dissipation device of the present invention. It is a three-dimensional exploded view of a seventh embodiment of the heat dissipation device of the present invention.

  The above object and the characteristics of the structure and effect of the present invention will be described below with reference to preferred embodiments with drawings.

1, 2, 3, 4, 5, and 6, which are a three-dimensional exploded view, a three-dimensional combination diagram, a cross-sectional view, and an enlarged explanatory view of the first embodiment of the heat dissipation device of the present invention. The heat radiating device includes a first plate body 10 and a second plate body 11, and the first plate body 10 has a first side surface 101 and a second side surface 102 (cooling region), on the second side surface 102. In this invention, the local rough structure 1021 is formed (or installed) one of the local parts (FIGS. 3 and 4) and all (FIGS. 5 and 6). (Or other object that generates heat, etc.) and the plated film layer 102 is coated on the rough structure 1021 of the second side surface 102, and the plated film layer 102 is made of silicon dioxide. And
The rough structure 1021 of the second side surface 102 is preferably a capillary structure laid with a micro-groove in the present invention, which is machined (can be imprinting, marking, carving, etc.) Alternatively, the rough structure 1021 also has an uneven shape, and the plating film layer 1022 is one of a hydrophilic thin film and a hydrophobic thin film. An example will be described using a hydrophilic thin film, but is not limited thereto.

The second plate body 11 has a third side surface 111 and a fourth side surface 112 (evaporation region), and the fourth side surface 112 of the second plate body 11 is opposed to the first plate body 10 and the second side surface 102. The chamber 113 is jointly defined, and the third side surface 111 and the heat source 2 are in contact with each other,
The chamber 113 is filled with a working fluid 12, and the working fluid 12 may be any one of pure water, methanol, acetone, a refrigerant, and ammonia.

  Through the design of the heat dissipating device of the present invention, a local part or all of the rough structure 1021 formed on the second side surface 102 and a plating film layer 1022 having a hydrophilic or hydrophobic characteristic covering the rough structure 1021 are used. When the third side surface 1111 contacts the heat source 2 and the third side surface 111 of the second plate 11 receives heat, the liquid working fluid 12 receives heat and is converted into the gas working fluid 12. Subsequently, the gaseous working fluid 12 is cooled and converted to the liquid working fluid 12 on the second side surface 102 of the first plate body 10, and the formation of the rough structure 1012 rapidly causes the liquid working fluid 12 to be quickly formed. To the corresponding position of the heat source 2 (the hottest portion of the cooling coagulation region) opposite to the second side surface 102 and further to the liquid working fluid 2 to the third side surface 111 of the second plate 11. Flush back and remove the coarse structure 1012 And, it is possible to accelerate the circumfluence of the working fluid 2 cold coagulation, and facilitates reducing thermal resistance of the entire heat dissipation device 1, thereby improving the HitoshiAtsushisei. In addition, the conventional soaking plate process is complicated and quality control is difficult, which improves the yield and production efficiency significantly.

  7 and 8 are a cross-sectional view and an enlarged explanatory view of a second embodiment of the heat dissipating device of the present invention, and the relative relationship between some members of the heat dissipating device is the same as that of the heat dissipating device. Therefore, it is not described here again, and the main difference between the present heat dissipation device and the above is that the rough structure 1021 has a wavy shape and the plated film layer 1022 is coated on the rough structure 1021. In addition, the circulating speed of the cooled working fluid can be accelerated, the temperature uniformity can be increased, and the overall thermal resistance can be greatly reduced and the production cost can be reduced.

  9 and 10 are a cross-sectional view and an enlarged explanatory view of a third embodiment of the heat dissipation device of the present invention, and the relative relationship between some members of the heat dissipation device is the same as that of the heat dissipation device. Therefore, it is not described here again, and the main difference between the present heat dissipation device and the above is that the rough structure 1021 has a sawtooth shape and the plated film layer 1022 is coated on the rough structure 1021. Similarly, it is possible to accelerate the circulating speed of the cooled working fluid, increase the temperature uniformity, greatly reduce the overall thermal resistance, and reduce the production cost.

  11 and 12 are a cross-sectional view and an enlarged explanatory view of a fourth embodiment of the heat dissipation device of the present invention, and the relative relationship between some members of the heat dissipation device is the same as that of the heat dissipation device. Therefore, it is not described here again, and the main difference between the present heat dissipation device and the above is that the plating film layer 1022 covers the fourth side surface 112 (evaporation region).

  FIGS. 13 and 14 are a sectional view and an enlarged explanatory view of a fifth embodiment of the heat dissipating device of the present invention, and the relative relationship between some members of the heat dissipating device is the same as that of the heat dissipating device. Therefore, it is not described here again. The main difference between the present heat radiating device and the above is that the plated film layer 1022 covers the rough structure 1021 and the fourth side surface 112 of the second side surface 102 at the same time. Similarly, it is possible to accelerate the circulation speed of the cooled working fluid, increase the temperature uniformity, greatly reduce the overall thermal resistance, and reduce the production cost.

  FIG. 15 is a three-dimensional exploded view of a sixth embodiment of the heat dissipating device of the present invention, and the relative relationship between some members of the heat dissipating device is the same as that of the heat dissipating device. Although not described again, the present heat dissipation device and the main difference are that the second plate 11 further has a capillary structure 1121, and the capillary structure 1121 is formed on the fourth side surface 112, and the capillary structure 1121. Can be any one of a plurality of grooves, sintered powder, and mesh body, and this embodiment will be described using sintered powder, but is not limited thereto.

  Referring to FIGS. 16 and 5, it is a three-dimensional exploded view of a seventh embodiment of the heat dissipation device of the present invention, and the relative relationship between some members of the heat dissipation device is the same as that of the heat dissipation device. Therefore, it is not described again here, and the main difference between the present heat radiating device and the above is that the chamber 113 further has at least one support column 1131, and both ends of the support column 1131 are respectively the second side surface 120. (Cooling region) and the fourth side surface 112 (evaporation region), and has a capillary structure 1131a outside the support column 1131. The capillary structure 1131a includes a plurality of grooves, sintered powder, and mesh bodies. Any one of them can be used, and the present embodiment will be described using sintered powder, but is not limited thereto.

  The height of the rough structure 1021 (not shown) of the present invention is in a state of gradually decreasing from the center of the plate body toward the edge of the plate body.

  When the third side surface 111 of the second plate body 11 receives heat through the above-described embodiment, the gaseous working fluid 12 cools on the second side surface 102 of the first plate body 10 to operate the liquid. The liquid working fluid 12 is converted back into the fluid 12 and pulled back from the cooling region to the evaporation region by the hydrophilic property of the plating film layer 1022 and by the pulling of the capillary force of the capillary structure 1131a on the support column 1131. Accelerate the circulating speed of the working fluid that has been chilled, improve the temperature uniformity, and reduce the overall thermal resistance of the heat dissipation device 1.

As described above, the present invention has the following advantages over the prior art.
1. Reduce costs.
2. Improve the temperature uniformity of the heat dissipation device.
3. Reduce the overall thermal resistance of the heat dissipation device.

  In the present invention, preferred embodiments have been disclosed as described above, but these are not intended to limit the present invention in any way, and anyone who is familiar with the technology has an equivalent scope that does not depart from the spirit and scope of the present invention. Of course, various fluctuations and hydration colors can be added.

DESCRIPTION OF SYMBOLS 1 Heat sink 10 1st plate body 101 1st side surface 102 2nd side surface 1021 Coarse structure 1022 Plating film layer 11 2nd plate body 111 3rd side surface 112 4th side surface 1121 Capillary structure 113 Chamber 1131 Support pillar 1131a Capillary structure body 12 Action | operation Fluid 2 Heat source

Claims (16)

A first plate having a first side and a second side and having a rough structure on the second side;
A second plate having a third side surface and a fourth side surface,
A heat dissipating device that is overlapped with the second side surface of the first plate body facing the fourth side surface of the second plate body, forms a chamber therein, and fills the chamber with a working fluid.   The heat dissipation device according to claim 1, wherein the third side surface is bonded to a heat source.   The heat radiating device according to claim 2, further comprising a plating film layer covering the rough structure of the second side surface or the fourth side surface.   The heat radiating device according to claim 2, further comprising a plating film layer covering the rough structure of the second side surface and the fourth side surface.   The heat dissipation device according to claim 4, wherein the rough structure is formed in a local portion or all over the second side surface.   The heat dissipation device according to claim 5, wherein the rough structure of the local portion is formed at a location corresponding to the heat source of the second side surface immediately above the heat source.   The heat dissipation device according to claim 3, wherein the plating film layer is a hydrophilic thin film or a hydrophobic thin film.   The heat dissipation device according to claim 1, wherein the working fluid is one of pure water, methanol, acetone, a refrigerant, and ammonia.   The heat dissipation device according to claim 6, wherein the rough structure of the second side surface is a capillary structure having a minute groove path, and is formed by machining or etching.   The heat dissipation device according to claim 9, wherein the machining is any one of imprinting, marking, and carving.   The heat dissipation device according to claim 1, wherein the rough structure is any one of an uneven shape, a wave shape, and a sawtooth shape.   The heat dissipation device according to claim 1, wherein the second plate body has a capillary structure, and the capillary structure is formed on the fourth side surface.   The heat dissipation device according to claim 12, wherein the capillary structure is one of a plurality of grooves, sintered powder, and a mesh body.   2. The heat dissipation according to claim 1, wherein the chamber has at least one support column, both ends of the support column are connected to the second side surface and the fourth side surface, respectively, and a capillary structure is provided outside the support column. apparatus.   The heat dissipation device according to claim 14, wherein the capillary structure is one of a plurality of grooves, sintered powder, and a mesh body.   The heat dissipation device according to claim 3, wherein the plating film layer is formed of silicon dioxide.

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