CN113453494A - Preparation method of vapor chamber, vapor chamber and electronic equipment - Google Patents
Preparation method of vapor chamber, vapor chamber and electronic equipment Download PDFInfo
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- CN113453494A CN113453494A CN202110540106.0A CN202110540106A CN113453494A CN 113453494 A CN113453494 A CN 113453494A CN 202110540106 A CN202110540106 A CN 202110540106A CN 113453494 A CN113453494 A CN 113453494A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The embodiment of the invention discloses a preparation method of a vapor chamber, the vapor chamber and electronic equipment, wherein the preparation method of the vapor chamber comprises the steps of arranging a plurality of capillary grooves on a plate body; and arranging a capillary structure in at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles, and the inorganic oxide particles are dried and fixed on the inner wall surface of the capillary groove. By adopting the mode, the capillary structure comprising the inorganic oxide particles is arranged on the inner wall surface in the capillary groove, so that the stability of the capillary structure can be enhanced, the capillary force of the capillary groove can be enhanced, and the heat dissipation effect of the soaking plate can be enhanced.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a preparation method of a vapor chamber, the vapor chamber and electronic equipment.
Background
With the development of science and technology, the processing functions of electronic devices in electronic equipment become more and more powerful, and the power consumption and the heat productivity of the electronic equipment also become higher and higher. In the related art, in order to achieve a light and thin design of an electronic device, a VC (vacuum Chamber Vapor Chamber) Vapor Chamber is often used to dissipate heat from an electronic device (e.g., a chip, a battery, etc.).
In the related art, the capillary groove is mainly formed by etching the soaking plate, but the method is greatly influenced by etching capacity, the width of the capillary groove formed by etching is not small enough due to insufficient etching capacity, and the heat dissipation effect of the soaking plate is influenced due to insufficient capillary force of the capillary groove.
Disclosure of Invention
The embodiment of the invention discloses a preparation method of a vapor chamber, the vapor chamber and electronic equipment.
In order to achieve the above object, in a first aspect, an embodiment of the present invention discloses a method for manufacturing a vapor chamber, including:
a plurality of capillary grooves are formed in the plate body;
arranging a capillary structure in at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles;
and drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove.
Adopt this kind of mode, through be equipped with the capillary structure including inorganic oxide granule in capillary recess to can strengthen the capillary force of capillary recess, through drying inorganic oxide granule and being fixed in the internal face of capillary recess, can strengthen the stability of capillary structure, and can overcome because the width of capillary recess is little enough to lead to the problem that the capillary force of capillary recess is not enough to influence the radiating effect of soaking plate, thereby be favorable to strengthening the radiating effect of soaking plate.
As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the disposing a capillary structure in at least one of the capillary grooves to increase a capillary force of the capillary groove includes:
placing the inorganic oxide particles in a liquid working medium to form a suspension of the inorganic oxide particles;
and placing the plate body with the capillary grooves into the suspension liquid so that the inorganic oxide particles are adsorbed to the capillary grooves under the capillary force of the capillary grooves. By adopting the mode, the inorganic oxide particles are adsorbed in the capillary grooves by utilizing the capillary force of the capillary grooves of the plate body, and the inorganic oxide particles are arranged in the capillary grooves without a complex mode, so that the preparation method of the vapor chamber is simple.
As an alternative embodiment, in the embodiment of the first aspect of the present invention, the inorganic oxide particles include at least one of silicon dioxide, zirconium dioxide, and cerium oxide. The capillary structure of locating the capillary groove is adopted to silica, zirconium dioxide, cerium oxide, can strengthen the capillary force of capillary groove to promote the radiating effect of vapor chamber. And because the silicon dioxide, the zirconium dioxide and the cerium oxide have better stability, the heat dissipation effect of the soaking plate is favorably maintained.
As an alternative mode, in the embodiment of the first aspect of the present invention, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove in the direction perpendicular to the plate body is greater than or equal to 30 μm, thereby ensuring that the inorganic oxide particles attached to the inner wall surface of the capillary groove have sufficient capillary force to ensure the heat dissipation effect of the soaking plate. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove is less than 30 μm, although the capillary force of the capillary groove can be increased by the arrangement of the inorganic oxide particles, the effect of increasing the capillary force of the capillary groove is weak, and the improvement of the heat dissipation effect of the soaking plate is not obvious.
As an alternative embodiment, in an embodiment of the first aspect of the invention, the inorganic oxide particles have a diameter in the range of 200nm to 300 nm. The diameter of the inorganic oxide particles is controlled to be in the range of 200nm to 300nm, and the gaps between the inorganic oxide particles disposed in the capillary grooves are appropriate, so that sufficient capillary force can be generated to enhance the capillary force of the capillary grooves. When the diameter of the inorganic oxide particles is less than 200nm, the gaps between the inorganic oxide particles are too small, and when the diameter of the inorganic oxide particles is greater than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, and the effect of enhancing the capillary force of the capillary grooves is weak.
As an alternative, in an embodiment of the first aspect of the present invention, the plate body comprises at least one of a copper plate, a stainless steel plate, and an aluminum alloy plate. By adopting the mode, the heat transfer efficiency of the plate body is higher, thereby being beneficial to improving the heat dissipation effect of the soaking plate. It can be understood that the material of the plate body can be selected in various ways according to the use requirement.
As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the plate body includes a first heat conducting plate and a second heat conducting plate hermetically connected to the first heat conducting plate, a side of the first heat conducting plate facing the second heat conducting plate is provided with the capillary groove, and/or a side of the second heat conducting plate facing the first heat conducting plate is provided with the capillary groove. When the first heat-conducting plate is equipped with the capillary recess towards one side of second heat-conducting plate, and, the second heat-conducting plate is equipped with the capillary recess towards one side of first heat-conducting plate, because first heat-conducting plate and second heat-conducting plate all have the capillary recess to convenient to use more. When first heat-conducting plate is equipped with the capillary recess towards one side of second heat-conducting plate, perhaps, when one side of second heat-conducting plate towards first heat-conducting plate is equipped with the capillary recess, the processing mode of first heat-conducting plate and second heat-conducting plate is simple, is favorable to improving the production efficiency of this soaking plate.
As an optional implementation manner, in an embodiment of the first aspect of the present invention, when the capillary grooves are disposed on both the first heat conducting plate and the second heat conducting plate, the capillary grooves disposed on the first heat conducting plate correspond to and are communicated with the capillary grooves disposed on the second heat conducting plate, so that more liquid working mediums can flow, and the heat dissipation effect of the soaking plate is increased.
In a second aspect, the invention also discloses a soaking plate, which is manufactured by the preparation method of the soaking plate in the first aspect. Because the capillary structure comprises inorganic oxide particles, the inorganic oxide particles have capillary action, so that the capillary grooves have enough capillary force to realize the flow of the liquid working medium in the plate body, and further the heat dissipation effect of the vapor chamber is improved. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body can be increased, and the heat dissipation effect of the soaking plate is further improved. In addition, the inorganic oxide particles are dried to be fixed on the inner wall surface of the capillary groove, so that the stability of the capillary structure can be enhanced, and the heat dissipation effect of the vapor chamber is further improved. Compared with the method of sintering and fixing the inorganic oxide particles in the capillary groove, the inorganic oxide particles are fixed in the capillary groove in a drying mode, so that more pores can be formed among the inorganic oxide particles, the capillary force of the capillary structure is improved, and the heat dissipation effect of the vapor chamber is improved.
In a third aspect, the present invention also discloses an electronic device, which includes:
a heat generating member;
the soaking plate, the piece that generates heat is laminated in the soaking plate, the soaking plate is as above-mentioned second aspect the soaking plate. Like this, carry out the heat exchange through setting up the soaking plate to the piece that generates heat, can reach the effect of quick heat dissipation, cooling.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
adopt the preparation method and soaking pit, electronic equipment of a soaking pit that this embodiment provided, capillary structure has been add in this soaking pit's capillary groove, capillary structure includes inorganic oxide granule, inorganic oxide granule dries the internal face of being fixed in capillary groove, utilize inorganic oxide granule can increase capillary force of capillary groove, thereby make capillary groove have sufficient capillary force in order to realize that liquid working medium flows in the plate body, and the internal face that oxide granule dries and is fixed in capillary groove, can strengthen capillary structure's stability, and then improve this soaking pit's radiating effect. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body can be increased, and the heat dissipation effect of the soaking plate is further improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic partial structure view of a soaking plate according to a first embodiment;
fig. 2 is a partial structural view of another soaking plate provided in the first embodiment;
fig. 3 is a flow chart of a method for manufacturing a vapor chamber according to the second embodiment;
fig. 4 is a block diagram of an electronic device provided in the third embodiment.
Icon: 100. an electronic device; 10. a vapor chamber; 1. a plate body; 1a, a first heat conducting plate; 1b, a second heat-conducting plate; 11. a capillary groove; 2. a capillary structure; 20. a heat generating member.
Detailed Description
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
Example one
Referring to fig. 1 and 2, fig. 1 is a partial structural view of a soaking plate, and fig. 2 is a partial structural view of another soaking plate. The embodiment of the invention discloses a soaking plate 10 which comprises a plate body 1, wherein the plate body 1 is provided with a plurality of capillary grooves 11, at least one capillary groove 11 is internally provided with a capillary structure 2, the capillary structure 2 is used for increasing the capillary force of the capillary groove 11, the capillary structure 2 comprises inorganic oxide particles, and the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11 through drying.
In the related art, the vapor chamber mostly adopts the following two modes: one of the soaking plates adopts a copper mesh clamped in a plate body, and the capillary force of the copper mesh realizes the flowing of a liquid working medium so as to realize the heat dissipation effect of the soaking plate. The thickness of the soaking plate is generally thicker, and the requirement of light and thin design of electronic equipment is difficult to meet. In order to reduce the thickness of the soaking plate, the other soaking plate adopts capillary grooves formed on the plate body to realize the flowing of the liquid working medium through the capillary force of the capillary grooves so as to realize the heat dissipation effect of the soaking plate. However, the width of the capillary groove is not small enough due to the limitation of the process capability of the vapor chamber, so that the capillary force of the capillary groove is not sufficient, and the heat dissipation effect of the vapor chamber is affected.
In the soaking plate 10 according to the first embodiment of the present invention, the capillary grooves 11 are formed on the plate body 1, so that the soaking plate 10 can be thinner and lighter, and the light and thin design of the electronic device 100 can be satisfied. Simultaneously, be provided with capillary structure 2 in capillary groove 11, capillary structure 2 includes inorganic oxide granule, because the space has between the inorganic oxide granule, make inorganic oxide granule self have the capillary action, thereby can increase capillary groove 11's capillary force, because inorganic oxide granule is fixed in capillary groove 11's internal face, can strengthen capillary structure 2's stability, thereby can overcome because capillary groove 11's width is little enough to lead to the problem that capillary groove 11's capillary force is not enough to influence soaking plate 10's radiating effect, improve this soaking plate 10's radiating effect. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body 1 can be increased, and the heat dissipation effect of the soaking plate 10 is further improved. In addition, since the inorganic oxide particles are fixed to the inner wall surface of the capillary groove 11 by baking, the stability of the capillary structure can be enhanced.
In some embodiments, the plate body 1 comprises a first heat-conducting plate 1a and a second heat-conducting plate 1b hermetically connected to the first heat-conducting plate 1a, a side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b is provided with capillary grooves 11, and/or a side of the second heat-conducting plate 1b facing the first heat-conducting plate 1a is provided with capillary grooves 11.
When first heat-conducting plate 1a is equipped with capillary groove 11 towards one side of second heat-conducting plate 1b, and, when second heat-conducting plate 1b was equipped with capillary groove 11 towards one side of first heat-conducting plate 1a, because first heat-conducting plate 1a and second heat-conducting plate 1b all have capillary groove 11, can increase the quantity of capillary groove 11, the liquid working medium of being convenient for flows back and forth between the district that generates heat corresponding to the source that generates heat and the condensation zone that is used for carrying out the condensation to liquid working medium, be favorable to improving soaking plate 10's radiating effect. Further, the capillary grooves 11 arranged on the first heat conducting plate 1a correspond to and are communicated with the capillary grooves 11 arranged on the second heat conducting plate 1b, so that the liquid working medium can flow on the capillary grooves 11 of the first heat conducting plate 1a and the second heat conducting plate 1b conveniently, and the heat dissipation effect of the vapor chamber 10 is improved.
When first heat-conducting plate 1a is equipped with capillary groove 11 towards one side of second heat-conducting plate 1b, perhaps, when second heat-conducting plate 1b is equipped with capillary groove 11 towards one side of first heat-conducting plate 1a, first heat-conducting plate 1a and second heat-conducting plate 1 b's processing method is simple, and need not to consider capillary groove 11's counterpoint problem, is favorable to improving the production efficiency of this soaking plate 10.
Alternatively, the first and second heat conduction plates 1a and 1b may include at least one of a copper plate, an aluminum alloy plate, and a stainless steel plate. Thus, the heat transfer efficiency of the first heat conduction plate 1a and the second heat conduction plate 1b is high, thereby being beneficial to improving the heat dissipation effect of the soaking plate 10. It can be understood that the materials of the first heat-conducting plate 1a and the second heat-conducting plate 1b can be selected in various ways, and can be specifically selected according to the use requirement.
In some embodiments, the plate body 1 may be etched to form the capillary groove 11. In an alternative embodiment, the plate body 1 is laser etched to form the capillary grooves 11. By adopting the mode, the etching precision is higher, so that the uniformity of the width of the capillary groove 11 can be ensured, the problem that the capillary force of the soaking plate 10 is insufficient due to the uneven width of the capillary groove 11 is avoided, the capillary force of the soaking plate 10 is enhanced, and the heat dissipation effect of the soaking plate 10 is improved. In another alternative embodiment, the plate body 1 is etched with a chemical solution to form the capillary grooves 11. The mode that the plate body 1 is etched by adopting the liquid medicine to form the capillary groove 11 has higher etching efficiency and lower production cost. It is understood that the manner of etching the capillary grooves 11 on the plate body 1 can be varied, and can be selected according to the production and processing requirements, so as to meet different production requirements and product requirements.
It will be appreciated that in other embodiments, the plate body 1 may also be provided with capillary grooves 11 by plating. For example, the plate body 1 is plated with projections arranged at intervals, so that the capillary groove 11 is formed between two adjacent projections.
Alternatively, the capillary groove 11 has a capillary force so that the inorganic oxide particles are adsorbed to the inner wall surface of the capillary groove 11 by the capillary force of the capillary groove 11 or filled in the capillary groove 11. By adopting the mode, the property that the capillary groove 11 has the capillary force is utilized, so that the inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove 11 or filled in the capillary groove 11, the inorganic oxide particles are conveniently arranged in the capillary groove 11, and the production and the manufacture of the vapor chamber 10 are facilitated.
In this embodiment, as an example, as shown in fig. 1, inorganic oxide particles may be attached to the inner wall surface of the capillary groove 11. By attaching inorganic oxide particles to the inner wall surface of the capillary groove 11, the amount of inorganic oxide particles can be reduced, and the production cost can be reduced.
Alternatively, the inorganic oxide particles adhering to the inner wall surfaces of the capillary grooves 11 includes inorganic oxide particles adhering to the side wall surfaces of the capillary grooves 11 and/or the bottom wall surfaces of the capillary grooves. In one example, when the inorganic oxide particles are attached to the side wall surfaces of the capillary grooves 11, the inorganic oxide particles can reduce the width of the capillary grooves 11, so that not only the inorganic oxide particles can provide capillary force to realize capillary action, but also the width of the capillary grooves 11 can improve the capillary action of the capillary grooves 11, and the heat dissipation effect of the vapor chamber 10 is improved. In another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11, the inorganic oxide particles increase the capillary force of the capillary groove 11 by their own capillary force, thereby improving the heat dissipation effect of the soaking plate 10.
In another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11 and the side wall surface of the capillary groove 11 (see fig. 1), the inorganic oxide particles can not only increase the capillary force of the capillary groove 11 by reducing the width of the capillary groove 11, but also increase the capillary force of the capillary groove 11 by the capillary force of the inorganic oxide particles themselves, thereby increasing the heat dissipation effect of the vapor chamber 10. In addition, since the inorganic oxide particles may be provided on the side wall surface of the capillary groove 11 or on the bottom wall surface of the capillary groove 11, when the inorganic oxide particles are added to the capillary groove 11, there is no need to select the position of the inorganic oxide particles, and there is no need to avoid the side wall surface or the bottom wall surface of the capillary groove 11, thereby facilitating the installation of the inorganic oxide particles.
Alternatively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 may be greater than or equal to 30 μm, and illustratively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is 30 μm, 31 μm, 33 μm, 35 μm, 40 μm, or the like, so as to ensure that the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 have a sufficient capillary force to ensure the heat dissipation effect of the heat spreader 10. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is less than 30 μm, although the capillary force of the capillary groove 11 can be increased by the arrangement of the inorganic oxide particles, the effect of increasing the capillary force of the capillary groove 11 is weak, and the effect of improving the heat dissipation of the soaking plate 10 is not ideal.
In other embodiments, as shown in fig. 2, inorganic oxide particles may also fill the capillary grooves 11. The mode that inorganic oxide particles are filled in the capillary grooves 11 is adopted, the thickness of the inorganic oxide particles attached to the capillary grooves 11 does not need to be controlled, and the production control is easy, so that the production and the manufacture of the vapor chamber 10 are facilitated.
In some embodiments, when the inorganic oxide particles are disposed in the capillary grooves 11, the inorganic oxide particles may be placed in a liquid working medium to form a suspension of the inorganic oxide particles, and then the plate body 1 having the capillary grooves 11 is placed in the suspension of the inorganic oxide particles, so that the inorganic oxide particles are adsorbed in the capillary grooves 11 by the capillary force of the capillary grooves 11, and thus, the inorganic oxide particles do not need to be disposed in the capillary grooves 11 in a complicated manner, thereby simplifying the manufacturing method of the soaking plate 10. Optionally, the liquid working medium may include water, ethanol, ethylene glycol, and the like, which is not specifically limited in this embodiment.
Further, the plate body 1 adsorbed with the inorganic oxide particles may be dried to further fix the inorganic oxide particles in the inner wall surface of the capillary groove 11, so as to enhance the stability of the capillary structure 2, and further improve the heat dissipation effect of the vapor chamber 10. In addition, compared with the inorganic oxide particles sintered and fixed in the capillary grooves 11, the inorganic oxide particles are fixed in the capillary grooves 11 in a drying manner, so that more pores are formed among the inorganic oxide particles, which is beneficial to improving the capillary force of the capillary structure 2 and improving the heat dissipation effect of the vapor chamber 10.
Optionally, the inorganic oxide particles have a diameter in the range of 200nm to 300 nm. Illustratively, the inorganic oxide particles have diameters of 200nm, 220nm, 240nm, 250nm, 270nm, 300nm, and the like. The diameter range of the inorganic oxide particles is controlled to be 200nm to 300nm, and the gap between the inorganic oxide particles is appropriately sized so that sufficient capillary force can be generated to enhance the capillary force of the capillary groove 11. When the diameter of the inorganic oxide particles is less than 200nm, the gaps between the inorganic oxide particles are too small, or when the diameter of the inorganic oxide particles is greater than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, the capillary force enhancing effect on the capillary grooves 11 is weak, and the heat dissipation effect of the soaking plate 10 is not ideal.
Optionally, the inorganic oxide particles comprise at least one of silicon dioxide, zirconium dioxide, cerium oxide. The capillary structure 2 with the capillary grooves 11 is formed by taking silicon dioxide, zirconium dioxide and cerium oxide as inorganic oxide particles, so that the capillary force of the capillary grooves 11 can be enhanced, and the heat dissipation effect of the vapor chamber 10 is improved. And because the silicon dioxide, the zirconium dioxide and the cerium oxide have better stability, the heat dissipation effect of the soaking plate is favorably maintained.
According to the soaking plate 10 of the first embodiment of the invention, the capillary structure 2 is arranged in the capillary groove 11, so that the capillary force of the capillary groove 11 can be increased, and the heat dissipation effect of the soaking plate 10 can be improved. In addition, the capillary structure 2 may be an inorganic oxide particle, and may be adsorbed in the capillary groove 11 by using the capillary force of the capillary groove 11, so that the inorganic oxide particle is conveniently disposed in the capillary groove 11, and the production and manufacturing are convenient.
Example two
Referring to fig. 3, fig. 3 is a flow chart illustrating a method for manufacturing a vapor chamber. The second embodiment of the invention discloses a preparation method of a soaking plate, which is used for preparing the soaking plate 10 of the first embodiment, and specifically comprises the following steps:
201: a plurality of capillary grooves are arranged on the plate body.
Compared with the heat dissipation effect of the vapor chamber realized by clamping the copper mesh in the plate body of the vapor chamber to realize the flow of the liquid working medium in the plate body, the preparation method of the vapor chamber of the embodiment realizes the heat dissipation effect of the vapor chamber 10 by arranging the plurality of capillary grooves 11 in the plate body 1 to realize the flow of the liquid working medium in the plate body 1, so that the thickness of the vapor chamber 10 can be thinner to meet the requirement of the light and thin design of the electronic device 100.
In some embodiments, the plate body 1 comprises a first heat-conducting plate 1a and a second heat-conducting plate 1b hermetically connected to the first heat-conducting plate 1a, a side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b is provided with capillary grooves 11, and/or a side of the second heat-conducting plate 1b facing the first heat-conducting plate 1a is provided with capillary grooves 11.
When first heat-conducting plate 1a is equipped with capillary groove 11 towards one side of second heat-conducting plate 1b, and, when second heat-conducting plate 1b was equipped with capillary groove 11 towards one side of first heat-conducting plate 1a, because first heat-conducting plate 1a and second heat-conducting plate 1b all have capillary groove 11, can increase the quantity of capillary groove 11, the liquid working medium of being convenient for flows back and forth between the district that generates heat corresponding to the source that generates heat and the condensation zone that is used for carrying out the condensation to liquid working medium, be favorable to improving soaking plate 10's radiating effect. Further, the capillary grooves 11 arranged on the first heat conducting plate 1a correspond to and are communicated with the capillary grooves 11 arranged on the second heat conducting plate 1b, so that the liquid working medium can flow on the capillary grooves 11 of the first heat conducting plate 1a and the second heat conducting plate 1b conveniently, and the heat dissipation effect of the vapor chamber 10 is improved.
When first heat-conducting plate 1a is equipped with capillary groove 11 towards one side of second heat-conducting plate 1b, perhaps, when second heat-conducting plate 1b is equipped with capillary groove 11 towards one side of first heat-conducting plate 1a, first heat-conducting plate 1a and second heat-conducting plate 1 b's processing method is simple, and need not to consider capillary groove 11's counterpoint problem, is favorable to improving the production efficiency of this soaking plate 10. Alternatively, the first and second heat conduction plates 1a and 1b may include at least one of a copper plate, an aluminum alloy plate, and a stainless steel plate. Thus, the heat transfer efficiency of the first heat conduction plate 1a and the second heat conduction plate 1b is high, thereby being beneficial to improving the heat dissipation effect of the soaking plate 10. It can be understood that the materials of the first heat-conducting plate 1a and the second heat-conducting plate 1b can be selected in various ways, and can be specifically selected according to the use requirement.
In some embodiments, the plate body 1 may be etched to form the capillary groove 11. In an alternative embodiment, the plate body 1 is laser etched to form the capillary grooves 11. By adopting the mode, the etching precision is higher, so that the uniformity of the width of the capillary groove 11 can be ensured, the problem that the capillary force of the soaking plate 10 is insufficient due to the uneven width of the capillary groove 11 is avoided, the capillary force of the soaking plate 10 is enhanced, and the heat dissipation effect of the soaking plate 10 is improved. In another alternative embodiment, the plate body 1 is etched with a chemical solution to form the capillary grooves 11. The mode that the plate body 1 is etched by adopting the liquid medicine to form the capillary groove 11 has higher etching efficiency and lower production cost. It is understood that the manner of etching the capillary grooves 11 on the plate body 1 can be varied, and can be selected according to the production and processing requirements, so as to meet different production requirements and product requirements.
It will be appreciated that in other embodiments, the plate body 1 may be provided with capillary grooves 11 by plating. For example, the plate body 1 is plated with projections arranged at intervals, so that the capillary groove 11 is formed between two adjacent projections.
202: and arranging a capillary structure in the at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles.
Adopt this kind of mode, through set up capillary structure 2 in capillary recess, and adopt inorganic oxide granule as capillary structure 2, because have the space between the inorganic oxide granule for inorganic oxide granule self has the capillary action, thereby can increase capillary groove 11's capillary force, and then promotes soaking plate 10's heat-sinking capability. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body 1 can be increased, and the heat dissipation effect of the soaking plate 10 is further improved. Alternatively, the inorganic oxide particles are adsorbed to the inner wall surface of the capillary groove 11 by the capillary force of the capillary groove 11 or filled in the capillary groove 11. By adopting the mode, the property that the capillary groove 11 has the capillary force is utilized, so that the inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove 11 or filled in the capillary groove 11, the inorganic oxide particles are conveniently arranged in the capillary groove 11, and the production and the manufacture of the vapor chamber 10 are facilitated.
In this embodiment, as an example, as shown in fig. 1, inorganic oxide particles may be attached to the inner wall surface of the capillary groove 11. By attaching inorganic oxide particles to the inner wall surface of the capillary groove 11, the amount of inorganic oxide particles can be reduced, and the production cost can be reduced.
Alternatively, the inorganic oxide particles adhering to the inner wall surfaces of the capillary grooves 11 includes inorganic oxide particles adhering to the side wall surfaces of the capillary grooves 11 and/or the bottom wall surfaces of the capillary grooves. In one example, when the inorganic oxide particles are attached to the side wall surfaces of the capillary grooves 11, the inorganic oxide particles can reduce the width of the capillary grooves 11, so that not only the inorganic oxide particles can provide capillary force to realize capillary action, but also the width of the capillary grooves 11 can improve the capillary action of the capillary grooves 11, and the heat dissipation effect of the vapor chamber 10 is improved. In another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11, the inorganic oxide particles increase the capillary force of the capillary groove 11 by their own capillary force to improve the heat dissipation effect of the soaking plate 10. In another example, when inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11 and the side wall surface of the capillary groove 11 (see fig. 1), the inorganic oxide particles can not only increase the capillary force of the capillary groove 11 by reducing the width of the capillary groove 11, but also increase the capillary force of the capillary groove 11 by the capillary force of the inorganic oxide particles themselves, thereby increasing the heat dissipation effect of the soaking plate 10, and further, since the inorganic oxide particles can be disposed on both the side wall surface of the capillary groove 11 and the bottom wall surface of the capillary groove 11, when the inorganic oxide particles are added to the capillary groove 11, there is no need to select the disposition position of the inorganic oxide particles, and there is no need to avoid the side wall surface or the bottom wall surface of the capillary groove 11.
Alternatively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 may be greater than or equal to 30 μm, and illustratively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is 30 μm, 31 μm, 33 μm, 35 μm, 40 μm, or the like, so as to ensure that the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 have a sufficient capillary force to ensure the heat dissipation effect of the heat spreader 10. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is less than 30 μm, although the capillary force of the capillary groove 11 can be increased by the arrangement of the inorganic oxide particles, the effect of increasing the capillary force of the capillary groove 11 is weak, and the effect of improving the heat dissipation of the soaking plate 10 is not ideal.
In other embodiments, as shown in fig. 2, inorganic oxide particles may also fill the capillary grooves 11. The mode that inorganic oxide particles are filled in the capillary grooves 11 is adopted, the thickness of the inorganic oxide particles attached to the capillary grooves 11 does not need to be controlled, and the production control is easy, so that the production and the manufacture of the vapor chamber 10 are facilitated.
When the inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove 11 by the capillary force of the capillary groove 11, the step 202 may specifically include the following steps:
placing inorganic oxide particles in a liquid working medium to form a suspension of the inorganic oxide particles;
and placing the plate body with the capillary grooves into the suspension, so that the inorganic oxide particles are adsorbed to the capillary grooves under the capillary force of the capillary grooves.
By adopting the mode, the inorganic oxide particles are adsorbed in the capillary grooves 11 by utilizing the capillary force of the capillary grooves 11 of the plate body 1, and the inorganic oxide particles are arranged in the capillary grooves 11 without a complex mode, so that the preparation method of the vapor chamber 10 is simple. Optionally, the liquid working medium may include water, ethanol, ethylene glycol, and the like, which is not specifically limited in this embodiment.
Optionally, the inorganic oxide particles have a diameter in the range of 200nm to 300 nm. Illustratively, the inorganic oxide particles have diameters of 200nm, 220nm, 240nm, 250nm, 270nm, 300nm, and the like. The diameter range of the inorganic oxide particles is controlled to be 200nm to 300nm, and the gap between the inorganic oxide particles is appropriately sized so as to generate a sufficient capillary force to enhance the capillary force of the capillary groove 11. When the diameter of the inorganic oxide particles is less than 200nm, the gaps between the inorganic oxide particles are too small, or when the diameter of the inorganic oxide particles is greater than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, the capillary force enhancing effect on the capillary grooves 11 is weak, and the heat dissipation effect of the soaking plate 10 is not ideal.
Optionally, the inorganic oxide particles comprise at least one of silicon dioxide, zirconium dioxide, cerium oxide. The capillary structure 2 with the capillary grooves 11 is formed by taking silicon dioxide, zirconium dioxide and cerium oxide as inorganic oxide particles, so that the capillary force of the capillary grooves 11 can be enhanced, and the heat dissipation effect of the vapor chamber 10 is improved. Moreover, the stability of the silicon dioxide, zirconium dioxide and cerium oxide materials is better, so that the heat dissipation effect of the soaking plate 10 is favorably maintained.
203: and drying and fixing inorganic oxide particles on the inner wall surface of the capillary groove.
By adopting the mode, the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11 through drying, the stability of the capillary structure 2 can be enhanced, and the heat dissipation effect of the vapor chamber 10 is further improved. In addition, compared with the inorganic oxide particles sintered and fixed in the capillary grooves 11, the inorganic oxide particles are fixed in the capillary grooves 11 in a drying manner, so that more pores are formed among the inorganic oxide particles, which is beneficial to improving the capillary force of the capillary structure 2 and improving the heat dissipation effect of the vapor chamber 10.
By adopting the manufacturing method of the soaking plate 10 disclosed by the second embodiment of the invention, the capillary grooves 11 are arranged on the plate body 1 to allow the liquid working medium to flow in the plate body 1, so that the heat dissipation effect of the soaking plate 10 is realized, and the soaking plate 10 can have a thinner thickness to meet the light and thin design of the electronic equipment 100. In addition, still be equipped with capillary structure 2 in capillary recess 11, capillary structure 2 includes inorganic oxide granule, and inorganic oxide granule is fixed in through drying the internal face of capillary recess 11 to can strengthen capillary recess 11's capillary force, overcome because capillary recess 11's width is little enough to lead to capillary recess 11's capillary force not enough thereby to influence the radiating effect's of vapor chamber 10 problem, thereby be favorable to strengthening vapor chamber 10's radiating effect.
EXAMPLE III
Referring to fig. 4, fig. 4 is a block diagram of an electronic device according to an embodiment of the disclosure. The third embodiment of the invention discloses an electronic device 100, which comprises a heating element 20 and a vapor chamber 10, wherein the vapor chamber 10 is the vapor chamber 10 according to the first embodiment, and the heating element 20 is attached to the vapor chamber 10.
Specifically, the electronic device 100 may include, but is not limited to, a smart phone, a smart watch, a tablet computer, a handheld game console, and the like. The heat generating member 20 may be an electronic device emitting heat during operation in the electronic apparatus 100, and may exemplarily include a battery, a chip (or a main board), a camera, a flash, a speaker, and the like. When actually setting up, because of generating heat 20 and being located inside electronic equipment 100, then corresponding with it, this soaking plate 10 also sets up the inside at electronic equipment 100, and this soaking plate 10 can adopt and directly paste the mode of establishing on generating heat 20 and link to each other with generating heat 20 to can carry out the condensation in conduction to soaking plate 10 as much as possible with the heat, and then reach heat dissipation, cooling effect, thereby prolong electronic equipment's life.
Alternatively, the area of the soaking plate 10 is larger than that of the heat generating member 20. By adopting the mode, the heat generated by the heating piece 20 can be radiated through the soaking plate 10 more quickly, and the cooling speed of the heating piece 20 is accelerated.
By adopting the electronic device 100 disclosed in the third embodiment of the present invention, the soaking plate 10 is arranged to exchange heat with the heating member 20, so that the effects of rapid heat dissipation and cooling can be achieved, and the service life of the electronic device can be prolonged.
The vapor chamber manufacturing method, the vapor chamber and the electronic device disclosed in the embodiments of the present invention are described in detail, and the principle and the embodiments of the present invention are explained in the present document by applying specific examples, and the description of the above embodiments is only used to help understanding the vapor chamber manufacturing method, the vapor chamber, the electronic device and the core concept thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method for preparing a vapor chamber is characterized by comprising the following steps:
a plurality of capillary grooves are formed in the plate body;
arranging a capillary structure in at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles;
and drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove.
2. The method for preparing a vapor chamber according to claim 1, wherein the step of providing a capillary structure in at least one of the capillary grooves to increase the capillary force of the capillary groove comprises:
placing the inorganic oxide particles in a liquid working medium to form a suspension of the inorganic oxide particles;
and placing the plate body with the capillary grooves into the suspension liquid so that the inorganic oxide particles are adsorbed to the capillary grooves under the capillary force of the capillary grooves.
3. The method of manufacturing a vapor chamber according to claim 1, wherein the inorganic oxide particles comprise at least one of silicon dioxide, zirconium dioxide, and cerium oxide.
4. The method for producing a vapor chamber according to claim 1, wherein the inorganic oxide particles are attached to the inner wall surface of the capillary groove in a thickness of 30 μm or more in a direction perpendicular to the plate body.
5. The method for manufacturing a soaking plate according to claim 1, wherein the inorganic oxide particles have a diameter ranging from 200nm to 300 nm.
6. The method of manufacturing a vapor chamber according to claim 1, wherein the plate body comprises at least one of a copper plate, a stainless steel plate, and an aluminum alloy plate.
7. The method for preparing a soaking plate according to claim 1, wherein the plate body comprises a first heat-conducting plate and a second heat-conducting plate hermetically connected to the first heat-conducting plate, the capillary groove is provided on one side of the first heat-conducting plate facing the second heat-conducting plate, and/or the capillary groove is provided on one side of the second heat-conducting plate facing the first heat-conducting plate.
8. The method according to claim 7, wherein when the capillary grooves are formed in both the first heat-conducting plate and the second heat-conducting plate, the capillary grooves formed in the first heat-conducting plate correspond to and communicate with the capillary grooves formed in the second heat-conducting plate.
9. A soaking plate characterized by being produced by the method for producing a soaking plate according to any one of claims 1 to 8.
10. An electronic device, comprising:
a heat generating member;
a soaking plate, wherein the heating piece is attached to the soaking plate, and the soaking plate is the soaking plate according to claim 9.
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