CN210868523U - Vapor chamber, electronic device, and network device - Google Patents

Abstract

The application provides a vapor chamber, electronic equipment and network equipment, relates to the technical field of heat dissipation, and is used for solving the problems of complex preparation process, high process cost and low heat dissipation efficiency of the vapor chamber. A vapor chamber comprising: a first housing having a first groove; the second shell is involutory with the first shell and forms a closed containing cavity with the first groove; the working medium is positioned in the accommodating cavity; at least one support column is arranged on the bottom of the first groove, and the support column and the first shell are forged into an integral structure and are connected with the second shell.

Description

Vapor chamber, electronic device, and network device

Technical Field

The application relates to the technical field of heat dissipation, in particular to a vapor chamber, electronic equipment and network equipment.

Background

In recent years, with the trend toward high performance, miniaturization and miniaturization of various heating elements, such as computer chips, mobile phone chips, base station chips, etc., whether heat generated by the heating elements during operation can be timely and effectively dissipated will directly affect the operating performance and reliability of the heating elements.

The existing vapor chamber is generally manufactured by adopting a sheet metal stamping process to prepare a shell, a mechanical processing process is adopted to prepare support columns, then the support columns are placed on the shell, and the support columns are welded on the shell through a diffusion welding process. Because the number of the supporting columns in the soaking plate of the soaking plate is large, the processes of positioning and placing the copper columns are time-consuming. And when the support column is machined, the requirement on the height and size precision of the support column is high. This results in a complex process for manufacturing the vapor chamber, high process cost, and low heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a vapor chamber, electronic equipment and network equipment, and is used for solving the problems of complex preparation process, high process cost and low heat dissipation efficiency of the vapor chamber.

In order to achieve the above purpose, the following technical solutions are adopted in this embodiment:

in a first aspect, there is provided a vapor chamber comprising: the first shell is provided with a first groove; the second shell is involutory with the first shell and forms a closed containing cavity with the first groove; the working medium is positioned in the accommodating cavity; at least one support column is arranged on the bottom of the first groove, and the support column and the first shell are forged into an integral structure and are connected with the second shell. The soaking plate that this application embodiment provided through forging support column and first casing structure as an organic whole, need not to weld support column and first casing together through welding process again. Therefore, on the one hand, the situation that the support column and the first shell are in false welding due to the fact that the support column and the first shell have process errors or other impurities between the support column and the first shell can be avoided, the situation that welding is carried out does not exist, and the yield of the soaking plate can be improved. On the other hand, the materials of the connecting interface of the first shell and the supporting column are the same as those of the first shell and the supporting column, so that the thermal resistance of the connecting interface of the first shell and the supporting column can be reduced, and the heat dissipation effect of the soaking plate is improved. On the other hand, the influence of the height of the supporting column on the reliable welding of the first shell and the supporting column does not need to be considered, the requirement on the precision of the height of the supporting column is reduced, and the cost is reduced. In addition, the support column and the first shell are forged into an integral structure, the support column does not need to be manufactured through machining firstly, the first shell is manufactured through a sheet metal stamping process, then the support column is placed on the groove bottom of the first shell, and then the first shell is connected with the support column through a diffusion welding process. The preparation process can be simplified, and the preparation efficiency can be improved. In addition, the supporting columns placed on the bottom of the groove according to a set rule can be forged only by designing a model used in forging, the supporting columns do not need to be positioned on the bottom of the groove one by one, the preparation process can be simplified, and the preparation time can be saved.

Optionally, the vapor chamber further comprises a first capillary structure; the first capillary structure is arranged on the cylindrical surface of the support column; the first capillary structure comprises a plurality of first raised lines arranged at intervals, and two ends of each first raised line are respectively connected with the first shell and the second shell; a first drainage groove is formed between every two adjacent first convex strips and used for draining the working medium located on the second shell to the groove bottom. The first capillary structure comprising the first convex strips is formed by forging the cylindrical surface of the supporting column, the powder column can be formed without sintering on the cylindrical surface of the supporting column, and compared with a sintering process needing high tool precision and long time, the first capillary structure formed by the forging process can reduce the process cost and improve the production efficiency.

Optionally, the first capillary structure and the support pillar are forged into an integral structure. The preparation process can be simplified.

Optionally, the first capillary structure further includes at least one second protruding strip disposed on a surface of the first protruding strip away from the cylindrical surface, and two ends of the second protruding strip are respectively connected to the first housing and the second housing; the cross sectional area of the second convex strip is smaller than that of the first convex strip; the cross-sectional area is the area of the cross-section parallel to the bottom of the tank. The capillary effect of the first capillary structure can be further improved, so that the heat dissipation effect of the soaking plate is improved.

Optionally, the soaking plate further comprises a second capillary structure arranged on the bottom of the groove; the second capillary structure comprises a plurality of third convex strips which are positioned between adjacent support columns and are arranged in a crossed manner; the second capillary structure and the first shell are forged into an integral structure. The second capillary structure integrated with the groove bottom is directly forged on the groove bottom of the first shell, and the second capillary structure has the function equivalent to a copper mesh, but does not need to be formed and welded separately. The preparation process can be simplified, and the cost can be reduced. And in the preparation process of the soaking plate, the second capillary structure is directly forged, copper powder does not need to be sintered, and the preparation time can be reduced.

Optionally, the soaking plate further comprises a third capillary structure and at least one convex ring arranged on the groove bottom; the third capillary structure comprises metal powder sintered on the bottom of the groove; at least one supporting column is arranged in the convex ring, and a third capillary structure is arranged in a first gap part formed between the convex ring and the supporting column positioned in the convex ring. Through forming the bulge loop on the groove bottom, the sintering and positioning of the third capillary structure around the supporting column can be realized, the regional sintering of the third capillary structure can be realized, the communication of the third capillary structure in a local region can be realized, and the metal powder is saved.

Optionally, a plurality of convex rings are arranged on the groove bottom, and each convex ring comprises a plurality of convex blocks arranged at intervals; and a third capillary structure is arranged in a second gap part formed between the adjacent convex rings. In this way, the third capillary structure on the bottom of the groove can communicate to facilitate heat propagation.

Optionally, the thickness of the groove wall of the first groove is greater than the thickness of the groove bottom. The wall thickness of each position of the first shell is forged to be different, so that the thin wall can be formed at the position needing heat dissipation, and the thick wall can be formed at the position needing structure reinforcement. The heat dissipation effect of the soaking plate is guaranteed, the local structural strength of the first shell can be improved, the edge of the first shell can provide stronger supporting force, and the optimal structural strength of the first shell is favorably realized.

Optionally, the first shell further includes a connecting plate disposed around a circumference of a groove wall of the first groove; the thickness of the connecting plate is larger than that of the groove bottom. The wall thickness of each position of the first shell is forged to be different, so that the thin wall can be formed at the position needing heat dissipation, and the thick wall can be formed at the position needing structure reinforcement. The heat dissipation effect of the soaking plate is guaranteed, the local structural strength of the first shell can be improved, the edge of the first shell can provide stronger supporting force, and the optimal structural strength of the first shell is favorably realized.

Optionally, the first shell further includes a connecting plate disposed around a circumference of a groove wall of the first groove; the flatness requirement of the groove bottom is greater than that of the connecting plate. The flatness requirement of the groove bottom is set to be larger than that of the groove wall, so that the requirement on the flatness of the groove bottom is only improved, the flatness requirement on the connecting plate is lower, the heat dissipation effect of the soaking plate can be guaranteed, and the production cost of the soaking plate can be reduced.

Optionally, the soaking plate comprises a plurality of supporting columns, and the plurality of supporting columns comprise a first supporting column and a second supporting column; the cross-sectional area of the first support column is larger than that of the second support column; the cross-sectional area is the area of the cross-section parallel to the bottom of the tank. Can meet different requirements.

In a second aspect, there is provided an electronic apparatus including the heat generating element and the vapor chamber of any one of the first to third aspects; the heating element is contacted with the groove bottom of the first shell in the soaking plate.

In a third aspect, a network device is provided, which comprises a heating element and the soaking plate of any one of the first aspect; the heating element is contacted with the groove bottom of the first shell in the soaking plate.

Drawings

Fig. 1a is a schematic structural diagram of a network device according to an embodiment of the present application;

fig. 1b is a schematic diagram illustrating a positional relationship between a heating element and a soaking plate according to an embodiment of the present disclosure;

fig. 2a is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2b is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating a positional relationship between a vapor chamber and a casing according to an embodiment of the present disclosure;

fig. 4a is a schematic structural diagram of a first housing according to an embodiment of the present disclosure;

FIG. 4b is a schematic cross-sectional view taken along line A-A' of FIG. 4 a;

fig. 4c is a schematic structural diagram of another first housing according to an embodiment of the present disclosure;

FIG. 4d is a schematic cross-sectional view taken along line B-B' of FIG. 4 c;

fig. 5a is a schematic structural diagram of a second housing according to an embodiment of the present disclosure;

fig. 5b is a schematic structural diagram of a second housing according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram illustrating a relationship between a working medium and an accommodating chamber according to an embodiment of the present disclosure;

fig. 7a is a schematic diagram illustrating a relationship between a supporting column and a first housing according to an embodiment of the present disclosure;

fig. 7b is a schematic diagram illustrating an arrangement of support pillars according to an embodiment of the present disclosure;

FIG. 7c is a schematic view of another arrangement of support pillars according to an embodiment of the present disclosure;

FIG. 7d is a schematic diagram of another arrangement of support pillars according to an embodiment of the present disclosure;

fig. 7e is a schematic view of another arrangement of support pillars according to the embodiment of the present disclosure;

fig. 8 is a schematic structural view of a soaking plate according to an embodiment of the present disclosure;

fig. 9a is a schematic structural view of another soaking plate provided in the embodiment of the present application;

fig. 9b is a schematic structural diagram of a supporting pillar and a first capillary structure according to an embodiment of the present disclosure;

fig. 9c is a schematic structural diagram of a first capillary structure provided in an embodiment of the present application;

FIG. 9d is a schematic diagram of another first capillary structure provided in an embodiment of the present application;

fig. 9e is a schematic structural diagram of another first capillary structure provided in the embodiments of the present application;

fig. 9f is a schematic structural diagram of yet another first capillary structure provided in an embodiment of the present application;

fig. 10 is a schematic view illustrating an operation principle of a vapor chamber according to an embodiment of the present disclosure;

fig. 11a is a schematic structural diagram of a fourth capillary structure provided in the embodiments of the present application;

fig. 11b is a schematic structural view of another soaking plate provided in the embodiment of the present application;

fig. 12a is a schematic structural diagram of a first capillary structure according to an embodiment of the present disclosure;

FIG. 12b is a schematic structural diagram of a first capillary structure according to an embodiment of the present disclosure;

fig. 13a is a schematic structural diagram of a second capillary structure provided in an embodiment of the present application;

FIG. 13b is a schematic cross-sectional view taken along line O-O' in FIG. 13 a;

fig. 14a is a schematic structural diagram of a convex ring according to an embodiment of the present disclosure;

fig. 14b is a schematic structural view of a fourth rib according to an embodiment of the present application;

FIG. 14c is a schematic structural diagram of another embodiment of a male ring;

FIG. 14d is a schematic structural diagram of another embodiment of a protruding ring;

FIG. 14e is a schematic structural diagram of another collar provided in the embodiment of the present application;

FIG. 14f is a schematic structural diagram of another embodiment of a protruding ring;

FIG. 14g is a schematic structural diagram of another embodiment of a protruding ring;

fig. 14h is a schematic structural view of a protruding ring and a supporting pillar according to an embodiment of the present disclosure;

FIG. 15 is a schematic structural view of another soaking plate provided in the embodiments of the present application;

FIG. 16 is a schematic structural view of another soaking plate provided in the embodiments of the present application;

fig. 17a is a schematic process diagram of a first housing according to an embodiment of the present disclosure;

FIG. 17b is a schematic cross-sectional view taken along line M-M' in FIG. 17 a;

fig. 17c is a schematic process diagram of a first housing according to an embodiment of the present disclosure;

FIG. 17d is a schematic cross-sectional view taken along the direction N-N' in FIG. 17 c.

Reference numerals:

01-an electronic device; 02-base station; 10-a display module; 101-a liquid crystal display screen; 102-a backlight module; 11-middle frame; 12-a housing; 13-a cover plate; 20-a main board; 30-a heating element; 40-soaking plates; 41-a first housing; 410-a first groove; 411-cell bottom; 412-cell wall; 413-a connecting plate; 414-bottom of blank groove; 42-a second housing; 420-a second groove; q-containing cavity; 43-working substance; 44-support columns; 441-a first support column; 442-a second support column; 45-a first capillary structure; 451-a first rib; 452-second ribs; 453-first drainage channel; 454-a second drainage groove; 46-a fourth capillary structure; 461-opening; 47-a second capillary structure; 471-third convex strip; 48-a third capillary structure; 49-convex ring; 491-a bump; 50-fourth ribs; 501-radio remote unit; 502-digital unit; 511-antenna; 512-a radio frequency unit; 521-a memory; 522-a processor; 53-a heat sink; 54-housing.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

Further, in the present application, directional terms such as "upper", "lower", "left", "right", and the like are defined with respect to a schematically placed orientation of a component in the drawings, and it is to be understood that these directional terms are relative concepts, which are used for descriptive and clarifying purposes, and may vary accordingly depending on the orientation in which the component is placed in the drawings.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate.

The embodiment of the application provides a network device, which is an entity for sending a signal, or receiving a signal, or sending and receiving a signal on a network side. The network device may be a device deployed in a Radio Access Network (RAN) to provide a wireless communication function for a terminal, for example, a base station. The network device may be a macro base station, a micro base station (also referred to as a small station), a relay station, an Access Point (AP), or the like in various forms, and may also include a control node in various forms, such as a network controller. The control node may be connected to a plurality of base stations and configure resources for a plurality of terminals under the coverage of the plurality of base stations.

In systems using different radio access technologies, the names of devices that function as base stations may differ. For example, a global system for mobile communication (GSM) or Code Division Multiple Access (CDMA) network may be referred to as a Base Transceiver Station (BTS), a Wideband Code Division Multiple Access (WCDMA) network may be referred to as a base station (NodeB), an LTE system may be referred to as an evolved node b (eNB or eNodeB), and an NR communication system may be referred to as a next generation base station (next evolved node b (gNB), and specific names of the base stations are not limited in this application.

The network device may also be a wireless controller in a Cloud Radio Access Network (CRAN) scene, a network device in a Public Land Mobile Network (PLMN) for future evolution, a transmission and reception node (TRP for short), and the like.

In some embodiments of the present application, a network device is taken as an example for description.

As shown in fig. 1a, the base station 02 includes one or more radio remote units (RRUs 501), and one or more BBUs (also called Digital Units (DUs)) 502.

RRU501, which may be referred to as a transceiver unit, transceiver circuitry, or transceiver, etc., may include at least one antenna feed system (i.e., antenna) 511 and a radio frequency unit 512. The RRU501 is mainly used for transceiving radio frequency signals and converting the radio frequency signals and baseband signals.

The BBU502 is a control center of a network device, and may also be referred to as a processing unit, and is mainly used for performing baseband processing functions, such as channel coding, multiplexing, modulation, spreading, and the like.

In some embodiments, the BBU502 may be formed by one or more boards, and a plurality of boards may jointly support a radio access network with a single access indication (e.g., an LTE network), or may respectively support radio access networks with different access schemes (e.g., an LTE network, a 5G network, or other networks). The BBU502 also includes a memory 521 and a processor 522, the memory 521 for storing necessary instructions and data. The processor 522 is used to control the network devices to perform the necessary actions. The memory 521 and the processor 522 may serve one or more boards. That is, the memory and processor may be provided separately on each board. Multiple boards may share the same memory and processor. In addition, each single board can be provided with necessary circuits.

Optionally, the RRU501 and the BBU502 in fig. 1a may be physically disposed together, or may be physically disposed separately, for example, a distributed base station, which is not specifically limited in this embodiment of the present application.

Based on this, through the description of the base station 02, the processor 522 and other components in the base station 02 are the heating elements in the base station 02.

In order to dissipate heat from the heat generating elements in the base station 02, the base station 02 further includes a Vapor Chamber (VC) 40 in contact with the heat generating elements 30, as shown in fig. 1 b. The heating element 30 is disposed on a Printed Circuit Board (PCB), and the soaking plate 40 is disposed on a side of the heating element 30 away from the PCB.

In order to further improve the heat dissipation effect on the heating element 30, a heat sink 53 is further provided on the side of the soaking plate 40 away from the heating element 30, and a housing 54 is provided on the side of the heat sink 53 away from the soaking plate 40.

Other embodiments of the present application provide an electronic device, which includes, for example, a mobile phone, a tablet computer, a notebook computer, a car computer, a Personal Digital Assistant (PDA), a smart wearable product, and the like. The embodiment of the present application does not specifically limit the specific form of the electronic device.

In some embodiments of the present application, an electronic device is taken as an example for description.

In this case, as shown in fig. 2a, the electronic device 01 mainly includes a display module 10, a middle frame 11, a housing 12, and a cover 13, wherein the display module 10 and the middle frame 11 are disposed in the housing 12.

The middle frame 11 is located between the display module 10 and the housing 12, and the surface of the middle frame 11 away from the display module 10 is used for mounting internal components.

The cover plate 13 is located on a side of the display module 10 away from the middle frame 11, and the cover plate 13 may be, for example, Cover Glass (CG), which may have certain toughness.

The display module 10 has a light-emitting side capable of viewing a display picture and a back side opposite to the light-emitting side, the back side of the display module 10 is close to the middle frame 11, and the cover plate 13 is arranged on the light-emitting side of the display module 10.

The display module 10 includes a Display Panel (DP).

In some embodiments of the present application, the display module 10 is a liquid crystal display module. In this case, the display module 10 includes a Liquid Crystal Display (LCD) 101 and a backlight unit (BLU) 102 disposed on a back surface (a surface of the LCD101 away from a side where the LCD101 displays a picture) of the LCD101 as shown in fig. 2 b.

The backlight module 102 may provide a light source to the liquid crystal display panel 101, so that each sub pixel in the liquid crystal display panel 101 can emit light to realize image display.

Alternatively, in other embodiments of the present application, the display module 10 may be an Organic Light Emitting Diode (OLED) display. Because the electroluminescent layer is arranged in each sub-pixel in the OLED display screen, the OLED display screen can realize self-luminescence after receiving the working voltage. In this case, the backlight module 102 is not required to be disposed in the display module 10 having the OLED display.

As shown in fig. 2a, the electronic device 01 further includes a main board 20 mounted on the middle frame 11, and a heating element 30 mounted on the main board 20.

The heat generating element 30 may be a System On Chip (SOC), a Central Processing Unit (CPU), or a Graphics Processing Unit (GPU). The main board 20 may be a PCB.

The main board 20 and the driving circuit in the display module 10 can pass through the middle frame 11 through a Flexible Printed Circuit (FPC) and then be electrically connected to the main board on the middle frame 11, so that the display module 10 can be controlled by the processor on the PCB to display images.

In addition, in order to dissipate heat from the heat generating element 30, the electronic device 01 further includes a Vapor Chamber (VC) 40 in contact with the heat generating element 30 as shown in fig. 3.

The soaking plate 40 is disposed between the middle frame 11 and the rear case 12. When the middle frame 11 is coupled to the rear case 12, the soaking plate 40 is positioned inside the rear case 12.

On this basis, in order to improve the heat dissipation effect of the soaking plate 40 to the heat generating element 30, in some embodiments, as shown in fig. 3, the soaking plate 40 is in contact with the rear case 12. The heat on the soaking plate 40 is radiated to the air through the rear case 12.

The soaking plate 40 reduces the heat of the heating element 30 by absorbing the heat emitted from the heating element 30 and emitting the heat.

The structure of the soaking plate 40 provided in the embodiment of the present application will be described below.

The soaking plate 40 includes a first case 41 as shown in fig. 4a, and the first case 41 has a first groove 410.

The first groove 410 of the first housing 41 is surrounded by a groove bottom 411 and a groove wall 412.

Wherein the first groove 410 may be a straight cylindrical groove as shown in fig. 4a, and at this time, the groove wall 412 of the first groove 410 may be a straight groove wall as shown in fig. 4b (a cross-sectional view along a-a' direction in fig. 4 a).

First recess 410 may also be a stepped recess as shown in fig. 4c, in which case, recess wall 412 of first recess 410 may be a stepped recess wall as shown in fig. 4d (a cross-sectional view taken along line B-B' of fig. 4 c).

Of course, the shape of the first groove 410 may be other shapes, but the groove bottom 411 of the first groove 410 is always the plane farthest from the notch of the first groove 410.

In the embodiment of the present application, the first housing 41 may be prepared by a forging process, for example.

The forging is a processing method for obtaining a forging with certain mechanical property, certain shape and size by applying pressure to a metal blank by using a forging machine to generate plastic deformation.

In the embodiment of the present application, the material of the first housing 41 is a heat conductive material, and may include at least one of gold, silver, copper, and aluminum, for example.

On the basis, the soaking plate 40 further comprises a second shell 42 as shown in fig. 5a, and the second shell 42 is aligned with the first shell 41 and forms a closed accommodating cavity Q with the first groove 410.

The second housing 42 may be flat as shown in fig. 5 a. At this time, the flat plate and the first recess 410 form the receiving chamber Q.

The second housing 42 may also be configured with a second recess 420 as shown in fig. 5 b. At this time, the second recess 420 and the first recess 410 form the above-described receiving chamber Q.

In the embodiment of the present application, the second housing 42 may be prepared by a forging process or a sheet metal stamping process, for example.

In the embodiment of the present application, the material of the second casing 42 is a heat conductive material, and may include at least one of gold, silver, copper, and aluminum, for example.

The material of the second housing 42 and the first housing 41 may be the same or different.

On the basis, the soaking plate 40 also comprises a working medium 43 shown in fig. 6 and positioned in the accommodating cavity Q.

It will be appreciated that the holding chamber Q is not filled with the working medium 43 in order to provide a space for the working medium 43 to evaporate and ensure the performance of the soaking plate 40. Working substance 43 may be pure water, methanol, acetone, sodium, etc.

On the basis, the soaking plate 40 further comprises a supporting column 44 as shown in fig. 7a, the supporting column 44 is arranged on the groove bottom 411 of the first groove 410, and the supporting column 44 and the first shell 41 are forged into a whole structure.

The soaking plate 40 includes at least one supporting column 44, and fig. 7a illustrates an example in which the soaking plate 40 includes a plurality of supporting columns 44.

That is, the first housing 41 and the support column 44 are both prepared by a forging process, and both are prepared and formed in the same forging process. In this case, the material of the supporting column 44 is the same as that of the first housing 41, and the supporting column 44 and the groove bottom 411 of the first housing 41 are of an integral structure.

In the embodiment of the present application, the shape of the supporting column 44 is not limited, and the supporting column 44 may be a cylinder as shown in fig. 7a, or the supporting column 44 may be a triangular prism, a quadrangular prism, or other shapes.

It should be noted that the support posts 44 are arranged differently according to different requirements.

In some embodiments, as shown in fig. 7b, the plurality of support posts 44 disposed on the bottom 411 have the same cross-sectional area, and the plurality of support posts 44 are arranged in an array on the bottom 411, which facilitates manufacturing.

Here, the cross-sectional area in the present embodiment means a cross-sectional area parallel to the groove bottom 411.

In some embodiments, the soaking plate 40 comprises a plurality of support posts 44 disposed on the trough bottom 411 as shown in fig. 7c, the plurality of support posts 44 comprising a first support post 441 and a second support post 442.

Wherein the cross-sectional area of the first support column 441 is larger than that of the second support column 442.

For example, since the middle region of the soaking plate 40 has a higher probability of bulging deformation or dent deformation than the edge region, the connection effect of the middle region support columns 44 is improved. In some embodiments, as shown in fig. 7c, the middle region is provided with a first support post 441 and the edge region is provided with a second support post 442.

Illustratively, in order to improve the structural strength of the soaking plate 40, in some embodiments, as shown in fig. 7d, first support pillars 441 having a larger cross-sectional area are provided at the top corners of the groove bottom 411 to improve the support strength of the soaking plate 40.

In view of the different degree of demand of the support columns 44 at different regions of the soaking plate 40, in some embodiments, as shown in fig. 7e, the arrangement density of the plurality of support columns 44 on the groove bottom 411 is different. Or may be understood as a difference in spacing between adjacent support posts 44.

On this basis, as shown in fig. 8, the support column 44 is connected to the second housing 42.

That is, one end of the supporting column 44 is integrally connected to the first housing 41, and the other end of the supporting column 44 is connected to the second housing 42, so as to prevent the accommodating cavity Q from being deformed by depression due to vacuum negative pressure or from being deformed by expansion due to heating.

In order to connect the support columns 44 and the second housing 42 in the embodiment of the present application, the first housing 41 and the second housing 42, and the second housing 42 and the support columns 44 may be welded together by, for example, a diffusion welding process.

The diffusion welding is a welding method in which a welding member (for example, the first case 41 and the second case 42) is closely attached and held at a certain temperature and pressure for a certain period of time to diffuse atoms between the contact surfaces to form a bond.

The soaking plate 40 provided by the embodiment of the application has the advantages that the supporting column 44 and the first shell 41 are forged into an integral structure, and the supporting column 44 and the first shell 41 do not need to be welded together through a welding process. Therefore, on one hand, the situation that the support post 44 and the first housing 41 are in a faulty welding (not welded) due to a process error between the support post 44 and the first housing 41 or other impurities between the support post 44 and the first housing 41 can be avoided, and the yield of the soaking plate 40 can be improved. On the other hand, the material at the joint interface between the first housing 41 and the supporting columns 44 is the same as the material of the first housing 41 and the supporting columns 44, and no solder is accumulated, so that the thermal resistance at the joint interface between the first housing 41 and the supporting columns 44 can be reduced, and the heat dissipation effect of the soaking plate 40 can be improved. On the other hand, the influence of the height dimension of the supporting column 44 on the reliable welding of the first housing 41 and the supporting column 44 does not need to be considered, so that the requirement on the height dimension precision of the supporting column 44 is reduced, and the cost is reduced.

In addition, the supporting column 44 and the first housing 41 are forged into an integral structure, so that the supporting column 44 does not need to be prepared by machining, the first housing 41 is prepared by a sheet metal stamping process, the supporting column 44 is placed on the groove bottom 411 of the first housing 41, and then the first housing 41 is connected with the supporting column 44 by a diffusion welding process. The preparation process can be simplified, the process steps can be reduced, and the preparation efficiency can be improved.

In addition, the supporting columns 44 arranged on the groove bottom 411 according to a set rule can be forged only by designing a model used in forging, the supporting columns 44 do not need to be positioned on the groove bottom 411 one by one, the preparation process can be simplified, and the preparation time can be saved.

Hereinafter, the structure of the soaking plate 40 provided in the embodiment of the present application is illustrated by some examples.

Example 1

As shown in fig. 9a, the soaking plate 40 includes a first casing 41, a second casing 42, a working substance 43, a plurality of support columns 44, a first capillary structure 45, and a fourth capillary structure 46.

The first housing 41 has a first groove 410, and a plurality of support columns 44 forged into a unitary structure with the first housing 41 are disposed on a groove bottom 411 of the first groove 410.

The second housing 42 is aligned with the first housing 41, the second housing 42 and the first groove 410 form a closed accommodating cavity Q, and the supporting column 44 is connected with the second housing 42. The fourth capillary structure 46 is disposed on each of the first housing 41 and the second housing 42.

And the working medium 43 is positioned in the accommodating cavity Q.

As shown in fig. 9a, the first capillary structure 45 structure is arranged on the cylindrical surface of the support column 44.

It is to be understood that, since one end of the supporting column 44 is connected to the first housing 41 and the opposite end is connected to the second housing 42, the cylindrical surface of the supporting column 44 refers to a surface of the supporting column 44 intersecting both the first housing 41 and the second housing 42.

The material of the first capillary structure 45 may be the same as the material of the supporting column 44, or may be different from the material of the supporting column 44.

In order to simplify the preparation process and reduce the cost. In some embodiments, the support posts 44 are integral with the first capillary structure 45.

For example, the support posts 44 are forged as a unitary structure with the first capillary structure 45. Since the support column 44 is integrally formed with the first housing 41 through a forging process, the first capillary structure 45 is integrally formed with the support column 44 and the first housing 41 in the same forging process.

Based on this, the structure shown in fig. 9b can be formed by one forging process. That is, the first capillary structure 45, the support column 44, and the first housing 41 are all of an integral structure.

Regarding the structure of the first capillary structure 45, as shown in fig. 9c (an enlarged view at S in fig. 9 b), the first capillary structure 45 includes a plurality of first convex strips 451 arranged at intervals, and a gap between two adjacent first convex strips 451 forms a first drainage groove 453.

The two ends of the first protruding strip 451 are respectively connected to the first casing 41 and the second casing 42.

That is, the surface of the first rib 451 adjacent to the first housing 41 is flush with the surface of the support column 44 adjacent to the first housing 41, and the surface of the first rib 451 adjacent to the second housing 42 is flush with the surface of the support column 44 adjacent to the second housing 42.

Regarding the structure of the first strips 451, in some embodiments, as shown in fig. 9 c-9 e, the cross-sectional area of the first strips 451 is quadrilateral. Here, the cross-sectional area refers to a cross-sectional area of the first protrusion 451 parallel to the groove bottom 411.

Here, fig. 9c illustrates an example in which the cross-sectional area of the first protrusion 451 is rectangular, fig. 9d illustrates an example in which the cross-sectional area of the first protrusion 451 is trapezoidal, and fig. 9e illustrates an example in which the cross-sectional area of the first protrusion 451 is inverted trapezoidal.

In some embodiments, as shown in fig. 9f, the cross-sectional area of the first strip 451 is triangular.

The cross-sectional area of the first protruding strip 451 may be an equilateral triangle, an isosceles triangle, or a right-angled triangle.

Since the surface area of the first convex strips 451 in the first capillary structure 45 is much smaller than that of the support columns 44, the surface hydrophobicity of the first convex strips 451 is greater than that of the support columns 44.

As shown in fig. 10, first drainage groove 453 is used to drain working medium on second housing 42 to groove bottom 411.

Wherein, the soaking plate 40 is a two-phase fluid device formed by injecting the working medium 43 into the containing cavity Q. In the following, working medium 43 is exemplified by pure water.

The heat dissipation principle of the vapor chamber 40 is as follows: as shown in fig. 10, heat generated from the heating element 30 is conducted from the first case 41 into the soaking plate 40 at the position where the heating element 30 is in contact with the groove bottom 411 of the first case 41 in the soaking plate 40. The pure water near the periphery of the heating element 30 will quickly absorb heat and gasify into steam, moving to the side of the second housing 42, and taking away a large amount of heat.

By utilizing the latent heat of the water vapor, when the water vapor in the soaking plate 40 diffuses from the high-pressure region to the low-pressure region (i.e., the low-temperature region), that is, when the water vapor in the soaking plate 40 diffuses from the side of the first shell 41 to the side of the second shell 42, the water vapor contacts the inner surface a1 of the second shell 42 having a lower temperature, the water vapor will be rapidly condensed into liquid and release heat energy when it is cooled.

The condensed water moves to the position of the first capillary structure 45 by the capillary action of the fourth capillary structure 46 located on the inner surface a1 of the second casing 42 and flows back to the heat source point (the side of the first casing 41) by the capillary action of the first capillary structure 45, completing a heat transfer cycle, forming a two-phase fluid device in which water and water vapor coexist.

Further, the water flowing back to the heat source point is accumulated around the supporting beams 44, and then the water accumulated around the supporting beams 44 is moved to the area between the adjacent supporting beams 44 by the capillary action of the fourth capillary structure 46 located on the inner surface b1 of the first housing 41 to be uniformly and rapidly dispersed, so that the working fluid 43 is uniformly distributed on the tank bottom 411.

Based on the above, the working medium condensed on the second housing 42 is drawn to the position of the first protrusion 451 by the capillary action of the first protrusion 451, and the condensed working medium flows to the position of the first housing 41 along the surface of the first protrusion 451 and the first drainage groove 453.

In this regard, the first flow-guiding groove 453 serves to guide the working medium 43 located on the second housing 42 to the groove bottom 411. At this time, the working medium 43 guided by the first guiding groove 453 is a working medium precooled and condensed on the second housing 42.

On this basis, as shown in fig. 10, the inner surface b1 of the groove bottom 411 of the first housing 41 facing the second housing 42 is further provided with a fourth capillary structure 46.

As shown in fig. 10, the fourth capillary structure 46 may be metal powder, and the metal powder may be elemental metal powder or alloy metal powder. For example, the fourth capillary structure 46 is copper powder.

As shown in fig. 11a, the fourth capillary structure 46 may also be a metal mesh, for example, the fourth capillary structure 46 is a copper mesh.

Based on this, in some embodiments of the present application, the fourth capillary structure 46 is copper powder, as shown in fig. 9a, sintered on the groove bottom 411.

In some embodiments of the present application, the fourth capillary structure 46 is a copper mesh, as shown in fig. 11a, sintered on the groove bottom 411.

It will be appreciated that where the fourth capillary structure 46 is copper powder, as shown in fig. 10, the support posts 44 are necessarily not located where copper powder is located, but rather is located around the support posts 44.

Wherein the fourth capillary structure 46 may be only one layer of copper powder, as shown in fig. 10. As shown in fig. 11b, the fourth capillary structure 46 may also be a multilayer copper powder.

In the case that the fourth capillary structure 46 is a copper mesh, as shown in fig. 11a, openings 461 should be arranged on the copper mesh, and each opening 461 corresponds to one support column 44.

The fourth capillary structure 46 is directly sleeved on the supporting column 44, so that the fourth capillary structure 46 can be positioned, and then the fourth capillary structure 46 is sintered on the groove bottom 411. It is not necessary to first weld the fourth capillary structure 46 to the groove bottom 411 by means of a spot welding process and then sinter the fourth capillary structure 46 to the groove bottom 411.

The fourth capillary structure 46 may be only one copper mesh, and the fourth capillary structure 46 may also be a plurality of copper meshes.

By arranging the fourth capillary structure 46 on the groove bottom 411 of the first groove 410, the working medium 43 stacked around the supporting column 44 can be uniformly and quickly dispersed, so that the working medium 43 is uniformly distributed on the groove bottom 411, and the heat dissipation effect is improved.

In addition, as shown in fig. 11b, the fourth capillary structure 46 is provided on the inner surface a1 of the second housing 42 facing the first housing 41.

Due to the capillary action of the fourth capillary structure 46, the moving speed of the working medium 43 on the fourth capillary structure 46 is higher than the moving speed of the working medium 43 on the second shell 42, so that the working medium 43 is accelerated to be gathered into water drops and move to the position of the first capillary structure 45.

Wherein, as shown in fig. 11b, the fourth capillary structure 46 may be copper powder sintered on the inner surface a1 of the second casing 42. The fourth capillary structure 46 may also be a copper mesh sintered on the inner surface a1 of the second housing 42 as shown in fig. 11 a.

Similarly, when the fourth capillary structure 46 is provided on the inner surface a1 of the second housing 42, the fourth capillary structure 46 is not provided at the position of the supporting column 44, and the fourth capillary structure 46 is provided at the periphery of the supporting column 44.

The vapor chamber 40 provided in this example is provided with the first capillary structure 45 on the cylindrical surface of the support column 44, since the surface hydrophobicity of the first capillary structure 45 is larger than that of the support column 44. Therefore, the capillary force of the first capillary structure 45 is greater than that of the support column 44, so that the working medium 43 located on the second housing 42 moves at a greater speed on the first capillary structure 45 than on the support column 44. Therefore, the return flow rate of the working medium 43 between the first shell 41 and the second shell 42 can be increased, and the heat dissipation effect of the soaking plate 40 can be improved.

In addition, in some embodiments, as shown in fig. 12a, the first capillary structure 45 further includes at least one second rib 452 disposed on a surface of the first rib 541 away from the cylindrical surface, the cross-sectional area of the second rib 452 being smaller than the cross-sectional area of the first rib 451.

In this case, the support columns 44, the first ribs 451, and the second ribs 452 are integrally formed by a forging process.

In order to reduce the difficulty of the process, in some embodiments, as shown in fig. 12a, a second protrusion 452 is disposed on a surface of the first protrusion 451 away from the cylindrical surface.

In order to enhance the capillary effect of the first capillary structure 451, in some embodiments, as shown in fig. 12b, a plurality of second convex strips 452 are disposed on the surface of the first convex strips 451 away from the cylindrical surface.

It should be understood that, in the embodiment of the present application, the shape of the cross-sectional area of the second protruding strip 452 is not limited, and may be a triangle or a polygon.

In this case, second drainage grooves 454 are formed between the adjacent second ribs 452. The capillary action of the second protruding strip 452 enables the working medium 43 to move towards the second protruding strip 452, and the second drainage groove 454 can promote the working medium 43 to flow at an accelerated speed, so that the drainage effect of the first capillary structure 451 can be improved.

It can be understood that, in order to improve the drainage effect of the second rib 452, two ends of the second rib 452 are respectively connected to the first housing 41 and the second housing 42.

In this example, the first capillary structure 45 including the first protruding strips 451 is formed by forging the cylindrical surface of the supporting pillars 44, so that the powder pillars can be formed without sintering the cylindrical surface of the supporting pillars 44, and compared with a sintering process requiring higher tool precision and longer time, the first capillary structure 45 formed by the forging process in the embodiment of the present application can reduce the process cost and improve the production efficiency.

Example two

The difference between the second example and the first example is that the fourth capillary structure 46 is not provided on the groove bottom 411 of the first housing 41 in the soaking plate 40, but the second capillary structure 47 is directly forged integrally with the first housing 41.

The soaking plate 40, as shown in fig. 13a, further includes a second capillary structure 47 provided on the groove bottom 411.

The second capillary structure 47 includes a plurality of third protruding strips 471 arranged between adjacent supporting columns 44 and intersecting with each other.

Wherein the second capillary structure 47 is forged as one piece with the slot bottom 411 as shown in fig. 13b (cross-sectional view along O-O' in fig. 13 a). That is, the second capillary structure 47 is forged as an integral structure with the first housing 41.

It will be appreciated that the height s1 of the second capillary structure 47 is necessarily smaller than the height s2 of the support posts 44, as shown in fig. 13 b.

In this example, by forging the second capillary structure 47 integrally with the groove bottom 411 directly on the groove bottom 411 of the first housing 41, the second capillary structure 47 functions as the copper mesh shown in fig. 11a in the first example, but does not need to form the copper mesh separately, and does not need to spot weld and sinter the copper mesh on the groove bottom 411. The preparation process can be simplified, and the cost can be reduced. And in the preparation process of soaking plate 40, directly forge second capillary structure 47, need not to sinter the copper powder, can reduce and prepare consuming time.

Example three

Example three differs from example one in that a convex ring is further provided on the groove bottom 411 of the first housing 41.

The soaking plate 40, as shown in fig. 14a, further comprises a third capillary structure 48 and at least one raised ring 49 disposed on the bottom 411 of the groove.

At least one supporting column 44 is provided in the convex ring 49, and a third capillary structure 48 is provided in a first gap portion formed between the convex ring 49 and the supporting column 44 located in the convex ring 49.

The third capillary structure 48 comprises metal powder sintered on the bottom 411 of the groove.

The metal powder may be elemental metal powder or alloy metal powder.

It should be noted that the first gap portion formed between the convex ring 49 and the supporting column 44 located in the convex ring 49 is actually a groove, which is equivalent to forming the third capillary structure 48 only at the first gap portion, and not forming the third capillary structure 48 at other positions.

In some embodiments, as shown in fig. 14a, a third capillary structure 48 is required to be disposed around a portion of the support posts 44, and a third capillary structure 48 is not required to be disposed around a portion of the support posts 44.

For example, the middle region is hot and needs rapid heat transfer, and therefore the third capillary structure 48 is provided in the middle region to facilitate rapid heat transfer. But the peripheral area has less heat, so the third capillary structure 48 need not be disposed around the support posts 44 in the peripheral area.

Based on this, as shown in fig. 14a, the convex ring 49 can divide the region where the third capillary structure 48 needs to be formed and the region where the third capillary structure 48 does not need to be formed, so as to facilitate the location sintering of the third capillary structure 48, thereby saving the usage amount of the third capillary structure 48.

On the basis, the soaking plate 40, as shown in fig. 14b, further includes a fourth rib 50 disposed on the groove bottom 411 and forged with the first shell 41 as a unitary structure, and the fourth rib 50 is disposed between adjacent ones of the support columns 44 outside the convex ring 49.

For example, the heat in the peripheral region is relatively small, the third capillary structures 48 are not required, and the fourth ribs 50 may be formed by forging to serve as capillary structures, so as to reduce the usage amount of the third capillary structures 48.

To facilitate communication of the third capillary structure 48 on the slot bottom 411 to facilitate heat propagation. In some embodiments, the soaking plate 40 comprises a plurality of collars 49, as shown in fig. 14c, each collar 49 comprising a plurality of spaced apart lugs 491.

Of course, as shown in fig. 14c, a plurality of support posts 44 may be provided in each of the collars 49. Wherein, for the sake of illustration and clarity of the structure of the convex ring 49, there is a convex ring 49 and the supporting column 44 between which the third capillary structure 48 is not illustrated.

As shown in fig. 14d, only one support column 44 may be provided in each collar 49. Wherein, for the sake of illustration and clarity of the structure of the convex ring 49, there is a convex ring 49 and the supporting column 44 between which the third capillary structure 48 is not illustrated.

On this basis, as shown in fig. 14d, the third capillary structure 48 is provided in the second gap portion formed between the adjacent convex rings 49. It will be understood that the second gap portions formed between the adjacent collars 49 also correspond to grooves. Of course, the third capillary structure 48 may be provided in the third gap portion formed between the adjacent bumps 491.

The shape of the bump 491 can be set as required, and the shape of the bump 491 in fig. 14c and 14d is only one illustration and is not limited at all.

In other embodiments, as shown in fig. 14e, the third capillary structure 48 is required to be disposed around each support post 44, but the third capillary structure 48 is not required to be disposed on the entire slot bottom 411.

For example, third capillary structure 48 is configured to draw working medium 43 to the location of support column 44 by capillary action, such that working medium 43 flows along support column 44 to tank bottom 411. But the effect of the third capillary structure 48 at a position farther from the support columns 44 is insignificant and the third capillary structure 48 need not be provided.

Based on this, as shown in fig. 14e, the convex ring 49 divides the area around the supporting pillars 44 where the third capillary structure 48 is needed, so as to facilitate the sintering of the third capillary structure 48.

Of course, one support column 44 may be provided in one convex ring 49 as shown in fig. 14e, or a plurality of support columns 44 may be provided in one convex ring 49. Thus, at least one raised ring 49 is provided on the slot bottom 411.

Similarly, the third capillary structure 48 on the slot bottom 411 can be in communication to facilitate heat transfer. In some embodiments, the soaking plate 40 comprises a plurality of collars 49, each collar 49 comprising a plurality of spaced apart lugs 491 as shown in fig. 14 f. Fig. 14f illustrates an example where a collar 49 surrounds a support post 44.

On this basis, as shown in fig. 14g, the third capillary structure 48 is provided in the second gap portion formed between the adjacent convex rings 49. That is, the third capillary structure 48 is formed at a position where the convex ring 49 is not formed.

At this time, the bump 491 is equivalent to a part of the capillary structure, and the third capillary structure 48 is not required to be formed at the position of the bump 491, so that the usage amount of the third capillary structure 48 can be saved.

Of course, as shown in fig. 14h, the structure of the supporting column 44 in this example may be any one of the structures of the supporting column 44 illustrated in example one.

In this example, by forming the convex ring 49 on the groove bottom 411, sintering and positioning of the third capillary structure 48 around the supporting column 44 can be realized, and meanwhile, sintering of the third capillary structure 48 in different regions can be realized, and the third capillary structure 48 in a local region is communicated, which is beneficial to saving the usage amount of metal powder.

Based on the foregoing, for any of the above examples, in some embodiments, as shown in fig. 15, a thickness h1 of a groove wall 412 of first groove 410 is greater than a thickness h2 of a groove bottom 411.

It is to be understood that the thickness here is the wall thickness. Local wall thickness variation can be achieved through the forging process, and therefore the first grooves 410 with different wall thicknesses can be directly formed through the forging process.

In some embodiments, as shown in fig. 16, the first housing 41 further includes a connecting plate 413 disposed around the groove wall 412 of the first groove 410, wherein a thickness h3 of the connecting plate 413 is greater than a thickness h2 of the groove bottom 411.

It will be appreciated that the connection plate 413 and the slot walls 412 are forged as a unitary structure by a forging process.

Illustratively, as shown in FIG. 16, connection plate 413 is located at an end of slot wall 412 that is distal from slot bottom 411.

By forging the first case 41 to have different wall thicknesses, it is possible to make the first case thin where heat dissipation is required (for example, the groove bottom 411) and thick where structural reinforcement is required (for example, the groove wall 412 or the connecting plate 413). Both guaranteed the radiating effect of soaking board 40, can promote the local structural strength of first casing 41 again for the edge of first casing 411 can provide stronger holding power, is favorable to realizing the best structural strength of first casing 41.

And, directly form first casing 41 that the wall thickness differs through forging process and strengthen in order to realize the structure, compare simple material itself and strengthen or other parts of panel beating welding realize strengthening, it is easier, and need not to increase other parts and processes, can improve space utilization.

Based on this, in order to reduce the process difficulty of the forging process, in some embodiments, the connection plate 413 and the groove bottom 411 in the first housing 41 are prepared by different processes.

Assuming that it is desired to prepare a groove bottom 411 having a thickness h1, as shown in fig. 17a, in forging the first housing 41, a blank groove bottom 414 is forged.

As shown in fig. 17b (a cross-sectional view taken along M-M' of fig. 17 a), the thickness of the slab groove bottom 414 is h 4. A machining allowance is reserved on the equivalent of the blank groove bottom 414, so that the groove bottom 411 with higher flatness can be prepared.

The forging process requires a very high process requirement to obtain a groove bottom 411 with a high flatness requirement. Therefore, in order to reduce the process difficulty, the blank groove bottom 414 and the connecting plate 413 with lower flatness requirement are forged firstly.

Then, the rough groove bottom 414 is machined by a machining process to remove the thickness allowance in the rough groove bottom 414, as shown in fig. 17c, so as to obtain a groove bottom 411. As can be seen by comparing fig. 17b and 17d (cross-sectional view along N-N' in fig. 17 c), the thickness h4 of the slab groove bottom 414 is greater than the thickness h1 of the groove bottom 411.

Wherein, the tank bottom 411 is obtained by a mechanical processing technology, and can meet the requirement of higher planeness.

It will be appreciated that machining the blank groove bottom 414 entails machining the surface of the blank groove bottom 414 where the support posts 44 are not located, and the resulting surface is the outer surface b2 that is in contact with the heat-generating component 30.

Based on this, in some embodiments, the flatness requirements of the slot bottom 411 are greater than the flatness requirements of the connection plate 413.

The flatness requirement refers to the flatness that the groove bottom 411 should meet, and the higher the flatness requirement is, the smaller the flatness error is.

It will be appreciated that as shown in fig. 17d, the flatness of the slot bottom 411 refers to the flatness of the outer surface b2 of the slot bottom 411 facing away from the second housing 42, and not the flatness of the inner surface b1 of the slot bottom 411 where the support posts 44 are located.

Since the flatness of the connection plate 413 has less influence on the heat dissipation effect of the soaking plate 40, the groove bottom 411 is in direct contact with the heat generating element 30. If the flatness requirement of the groove bottom 411 is low, the contact effect of the heating element 30 and the soaking plate 40 is directly influenced, and the heat dissipation effect of the soaking plate 40 on the heating element 30 is influenced.

Therefore, the flatness requirement of the groove bottom 411 is set to be larger than that of the connecting plate 413, so that the flatness requirement of the groove bottom 411 is only improved, the flatness requirement of the connecting plate 413 is lower, the heat dissipation effect of the soaking plate 40 can be ensured, and the production cost of the soaking plate 40 can be reduced.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (13)

1. A vapor chamber, comprising:

a first housing having a first groove;

the second shell is involutory with the first shell and forms a closed containing cavity with the first groove;

the working medium is positioned in the accommodating cavity;

at least one support column is arranged on the bottom of the first groove, and the support column and the first shell are forged into an integral structure and are connected with the second shell.

2. The heat spreader of claim 1, further comprising a first capillary structure;

the first capillary structure is arranged on the cylindrical surface of the supporting column;

the first capillary structure comprises a plurality of first raised lines arranged at intervals, and two ends of each first raised line are respectively connected with the first shell and the second shell;

and a first drainage groove is formed between every two adjacent first raised lines and is used for draining the working medium on the second shell to the groove bottom.

3. The soaking plate according to claim 2, wherein the first capillary structure is forged as a unitary structure with the support columns.

4. The vapor chamber according to claim 2, wherein the first capillary structure further comprises at least one second rib disposed on a surface of the first rib remote from the cylindrical surface, and both ends of the second rib are respectively connected to the first shell and the second shell;

the cross sectional area of the second convex strip is smaller than that of the first convex strip; the cross-sectional area is the area of a section parallel to the bottom of the tank.

5. The heat spreader of claim 1, further comprising a second capillary structure disposed on the trough bottom;

the second capillary structure comprises a plurality of third convex strips which are positioned between the adjacent support columns and are arranged in a crossed manner;

the second capillary structure and the first shell are forged into an integral structure.

6. The vapor chamber of claim 1, further comprising a third capillary structure and at least one raised ring disposed on the bottom of the trough;

the third capillary structure comprises metal powder sintered on the bottom of the groove;

at least one supporting column is arranged in the convex ring, and the third capillary structure is arranged in a first gap part formed between the convex ring and the supporting column positioned in the convex ring.

7. The soaking plate according to claim 6, wherein a plurality of the convex rings are arranged on the groove bottom, and the convex rings comprise a plurality of convex blocks which are arranged at intervals;

the third capillary structure is arranged in a second gap part formed between the adjacent convex rings.

8. The soaking plate according to claim 1, wherein the thickness of the groove wall of the first groove is larger than the thickness of the groove bottom.

9. The soaking plate according to claim 1, wherein the first shell further comprises a connecting plate disposed around a circumference of a groove wall of the first groove;

the thickness of the connecting plate is larger than that of the groove bottom.

10. The soaking plate according to claim 1, wherein the first shell further comprises a connecting plate disposed around a circumference of a groove wall of the first groove;

the flatness requirement of the groove bottom is greater than that of the connecting plate.

11. The vapor chamber of any one of claims 1 to 10, wherein the vapor chamber comprises a plurality of the support columns, the plurality of support columns comprising a first support column and a second support column;

the cross-sectional area of the first support column is larger than that of the second support column;

the cross-sectional area is the area of a section parallel to the bottom of the tank.

12. An electronic device comprising a heat generating element and the soaking plate according to any one of claims 1 to 11;

the heating element is in contact with the groove bottom of the first shell in the soaking plate.

13. A network device comprising a heat generating component and the vapor chamber of any of claims 1-11;

the heating element is in contact with the groove bottom of the first shell in the soaking plate.

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