CN113453494B - Vapor chamber preparation method, vapor chamber and electronic equipment - Google Patents
Vapor chamber preparation method, vapor chamber and electronic equipment Download PDFInfo
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- CN113453494B CN113453494B CN202110540106.0A CN202110540106A CN113453494B CN 113453494 B CN113453494 B CN 113453494B CN 202110540106 A CN202110540106 A CN 202110540106A CN 113453494 B CN113453494 B CN 113453494B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the application discloses a preparation method of a vapor chamber, the vapor chamber and electronic equipment, wherein the preparation method of the vapor chamber comprises the steps of arranging a plurality of capillary grooves on a plate body; and arranging a capillary structure in at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles, and the inorganic oxide particles are dried and fixed on the inner wall surface of the capillary groove. By adopting the mode, the capillary structure comprising the inorganic oxide particles is arranged on the inner wall surface in the capillary groove, so that the stability of the capillary structure can be enhanced, the capillary force of the capillary groove can be enhanced, and the heat dissipation effect of the vapor chamber can be enhanced.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a preparation method of a vapor chamber, the vapor chamber and electronic equipment.
Background
With the development of technology, electronic devices in electronic equipment have more and more powerful processing functions, and power consumption and heat productivity of the electronic equipment are also higher and higher. In the related art, in order to achieve a light and thin design of electronic equipment, VC (Vapor Chamber) Vapor Chamber heat dissipation technology) is often used to dissipate heat of electronic devices (such as chips, batteries, etc.).
In the related art, the capillary groove is mainly formed on the vapor chamber by etching, but the mode is greatly influenced by etching capability, the insufficient etching capability easily causes insufficient width of the capillary groove formed by etching, and the insufficient capillary force of the capillary groove influences the heat dissipation effect of the vapor chamber.
Disclosure of Invention
The embodiment of the application discloses a preparation method of a vapor chamber, the vapor chamber and electronic equipment, wherein the vapor chamber has larger capillary force and better heat dissipation effect.
In order to achieve the above object, in a first aspect, an embodiment of the present application discloses a method for preparing a vapor chamber, including:
a plurality of capillary grooves are arranged on the plate body;
disposing a capillary structure in at least one of the capillary grooves to increase a capillary force of the capillary groove, the capillary structure comprising inorganic oxide particles;
and drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove.
By adopting the mode, the capillary structure comprising the inorganic oxide particles is arranged in the capillary groove, so that the capillary force of the capillary groove can be enhanced, the stability of the capillary structure can be enhanced by drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove, and the problem that the heat dissipation effect of the vapor chamber is affected due to insufficient capillary force of the capillary groove caused by insufficient width of the capillary groove can be solved, so that the heat dissipation effect of the vapor chamber is enhanced.
In an optional implementation manner, in an embodiment of the first aspect of the present application, the disposing a capillary structure in at least one of the capillary grooves to increase a capillary force of the capillary groove includes:
placing the inorganic oxide particles in a liquid working medium to form a suspension of the inorganic oxide particles;
and placing the plate body with the capillary grooves in the suspension so that the inorganic oxide particles are adsorbed to the capillary grooves under the action of capillary force of the capillary grooves. By adopting the mode, the inorganic oxide particles are adsorbed in the capillary grooves by utilizing the capillary force of the capillary grooves of the plate body, and the inorganic oxide particles are arranged in the capillary grooves in a no complex mode, so that the preparation method of the vapor chamber is simple.
As an alternative embodiment, in an example of the first aspect of the present application, the inorganic oxide particles include at least one of silica, zirconia, and ceria. The silica, the zirconium dioxide and the cerium oxide are adopted as capillary structures arranged in the capillary grooves, so that the capillary force of the capillary grooves can be enhanced, and the heat dissipation effect of the vapor chamber is improved. And the stability of the silicon dioxide, zirconium dioxide and cerium oxide materials is better, so that the heat dissipation effect of the vapor chamber is favorably maintained.
As an alternative embodiment, in the embodiment of the first aspect of the present application, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove is greater than or equal to 30 μm along the direction perpendicular to the plate body, so as to ensure that the inorganic oxide particles attached to the inner wall surface of the capillary groove have sufficient capillary force to ensure the heat dissipation effect of the vapor chamber. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove is less than 30 μm, although the capillary force of the capillary groove can be increased by the arrangement of the inorganic oxide particles, the effect of increasing the capillary force of the capillary groove is weak, and the improvement of the heat dissipation effect of the vapor chamber is not obvious.
As an alternative embodiment, in an example of the first aspect of the present application, the diameter of the inorganic oxide particles ranges between 200nm and 300 nm. The diameter range of the inorganic oxide particles is controlled between 200nm and 300nm, and gaps among the inorganic oxide particles arranged in the capillary grooves are proper, so that enough capillary force can be generated to strengthen the capillary force of the capillary grooves. When the diameter of the inorganic oxide particles is less than 200nm, the gaps between the inorganic oxide particles are too small, and when the diameter of the inorganic oxide particles is more than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, and the capillary force enhancing effect on the capillary grooves is weak.
As an alternative embodiment, in the example of the first aspect of the present application, the plate body includes at least one of a copper plate, a stainless steel plate, and an aluminum alloy plate. By adopting the mode, the heat transfer efficiency of the plate body is higher, thereby being beneficial to improving the heat dissipation effect of the vapor chamber. It can be appreciated that the material of the plate body can be selected in various ways, and can be selected according to the use requirement.
As an alternative embodiment, in an embodiment of the first aspect of the present application, the plate body includes a first heat conducting plate and a second heat conducting plate connected to the first heat conducting plate in a sealing manner, and the capillary groove is disposed on a side of the first heat conducting plate facing the second heat conducting plate, and/or the capillary groove is disposed on a side of the second heat conducting plate facing the first heat conducting plate. When the first heat conducting plate is provided with the capillary groove towards one side of the second heat conducting plate, and the capillary groove is arranged on one side of the second heat conducting plate towards the first heat conducting plate, the first heat conducting plate and the second heat conducting plate are provided with the capillary grooves, so that the use is more convenient. And when the capillary groove is arranged on one side of the first heat conducting plate facing the second heat conducting plate, or when the capillary groove is arranged on one side of the second heat conducting plate facing the first heat conducting plate, the processing mode of the first heat conducting plate and the second heat conducting plate is simple, and the production efficiency of the vapor chamber is improved.
In an embodiment of the first aspect of the present application, when the capillary grooves are formed in both the first heat conducting plate and the second heat conducting plate, the capillary grooves formed in the first heat conducting plate correspond to and are communicated with the capillary grooves formed in the second heat conducting plate, so that more liquid working medium can flow, and the heat dissipation effect of the vapor chamber is increased.
In a second aspect, the application also discloses a soaking plate, which is manufactured by the manufacturing method of the soaking plate in the first aspect. Because the capillary structure comprises the inorganic oxide particles, the inorganic oxide particles have capillary action, so that the capillary grooves have enough capillary force to realize the flow of the liquid working medium in the plate body, and the heat dissipation effect of the vapor chamber is improved. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body can be improved, and the heat dissipation effect of the soaking plate is further improved. In addition, the inorganic oxide particles are dried to be fixed on the inner wall surface of the capillary groove, so that the stability of the capillary structure can be enhanced, and the heat dissipation effect of the vapor chamber is further improved. Compared with the method that the inorganic oxide particles are sintered and fixed in the capillary grooves, the inorganic oxide particles are fixed in the capillary grooves in a drying mode, so that more pores are formed among the inorganic oxide particles, and the capillary force of the capillary structure is improved, and the heat dissipation effect of the vapor chamber is improved.
In a third aspect, the present application also discloses an electronic device, which includes:
a heat generating member;
and the heat-generating component is attached to the soaking plate, and the soaking plate is the soaking plate in the second aspect. Therefore, the heat exchange is carried out on the heating element through the vapor chamber, and the effect of rapid heat dissipation and cooling can be achieved.
Compared with the prior art, the embodiment of the application has the beneficial effects that:
by adopting the preparation method of the vapor chamber, the vapor chamber and the electronic equipment provided by the embodiment, the capillary structure is additionally arranged in the capillary groove of the vapor chamber, the capillary structure comprises the inorganic oxide particles, the inorganic oxide particles are dried and fixed on the inner wall surface of the capillary groove, and the capillary force of the capillary groove can be increased by utilizing the inorganic oxide particles, so that the capillary groove has enough capillary force to realize the flow of the liquid working medium in the plate body, and the oxide particles are dried and fixed on the inner wall surface of the capillary groove, so that the stability of the capillary structure can be enhanced, and the heat dissipation effect of the vapor chamber is improved. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body can be improved, and the heat dissipation effect of the soaking plate is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a partial structure of a soaking plate according to a first embodiment;
fig. 2 is a schematic partial structure of another soaking plate according to the first embodiment;
fig. 3 is a flowchart of a method for manufacturing a vapor chamber according to the second embodiment;
fig. 4 is a block diagram of an electronic device according to the third embodiment.
Icon: 100. an electronic device; 10. a soaking plate; 1. a plate body; 1a, a first heat-conducting plate; 1b, a second heat-conducting plate; 11. a capillary groove; 2. a capillary structure; 20. a heating element.
Detailed Description
In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present application and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.
The technical scheme of the application will be further described with reference to the examples and the accompanying drawings.
Example 1
Referring to fig. 1 and 2, fig. 1 is a schematic partial structure of a vapor chamber, and fig. 2 is a schematic partial structure of another vapor chamber. The embodiment of the application discloses a soaking plate 10, which comprises a plate body 1, wherein the plate body 1 is provided with a plurality of capillary grooves 11, at least one capillary groove 11 is provided with a capillary structure 2, the capillary structure 2 is used for increasing the capillary force of the capillary groove 11, the capillary structure 2 comprises inorganic oxide particles, and the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11 after being dried.
In the related art, the soaking plate mostly adopts the following two modes: one of the soaking plates adopts a mode that a copper net is clamped in a plate body, and the flow of liquid working medium is realized through the capillary force of the copper net so as to realize the heat dissipation effect of the soaking plate. The thickness of the vapor chamber is generally thicker, and the demand of the thin and light design of the electronic equipment is difficult to meet. In order to reduce the thickness of the vapor chamber, the other vapor chamber adopts a capillary groove formed on the plate body to realize the flow of liquid working medium by the capillary force of the capillary groove so as to realize the heat dissipation effect of the vapor chamber. However, the width of the capillary groove is not small enough due to the limitation of the process capability of the vapor chamber, so that the capillary force of the capillary groove is insufficient, and the heat dissipation effect of the vapor chamber is affected.
In the soaking plate 10 of the first embodiment of the present application, the capillary groove 11 is formed on the plate body 1, so that the soaking plate 10 can be configured to be lighter and thinner to satisfy the light and thin design of the electronic device 100. Meanwhile, the capillary structure 2 is arranged in the capillary groove 11, the capillary structure 2 comprises inorganic oxide particles, and the inorganic oxide particles have capillary action due to gaps among the inorganic oxide particles, so that the capillary force of the capillary groove 11 can be increased, the stability of the capillary structure 2 can be enhanced due to the fact that the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11, the problem that the heat dissipation effect of the vapor chamber 10 is affected due to insufficient capillary force of the capillary groove 11 caused by insufficient width of the capillary groove 11 can be solved, and the heat dissipation effect of the vapor chamber 10 is improved. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body 1 can be improved, and the heat dissipation effect of the soaking plate 10 is further improved. Further, since the inorganic oxide particles are fixed to the inner wall surface of the capillary groove 11 by baking, the stability of the capillary structure can be enhanced.
In some embodiments, the plate body 1 includes a first heat-conducting plate 1a and a second heat-conducting plate 1b connected to the first heat-conducting plate 1a in a sealing manner, wherein a capillary groove 11 is disposed on a side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b, and/or a capillary groove 11 is disposed on a side of the second heat-conducting plate 1b facing the first heat-conducting plate 1 a.
When the capillary groove 11 is disposed on the side of the first heat conducting plate 1a facing the second heat conducting plate 1b, and the capillary groove 11 is disposed on the side of the second heat conducting plate 1b facing the first heat conducting plate 1a, the number of the capillary grooves 11 can be increased due to the fact that the first heat conducting plate 1a and the second heat conducting plate 1b are both provided with the capillary groove 11, so that the liquid working medium can flow back and forth between the heating area corresponding to the heating source and the condensing area for condensing the liquid working medium, and the heat dissipation effect of the vapor chamber 10 can be improved. Further, the capillary groove 11 arranged on the first heat conducting plate 1a corresponds to and is communicated with the capillary groove 11 arranged on the second heat conducting plate 1b, so that the liquid working medium can flow on the capillary grooves 11 of the first heat conducting plate 1a and the second heat conducting plate 1b conveniently, and the heat dissipation effect of the vapor chamber 10 is increased.
When the capillary groove 11 is disposed on the side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b, or when the capillary groove 11 is disposed on the side of the second heat-conducting plate 1b facing the first heat-conducting plate 1a, the processing modes of the first heat-conducting plate 1a and the second heat-conducting plate 1b are simple, and alignment of the capillary groove 11 is not required to be considered, which is beneficial to improving the production efficiency of the soaking plate 10.
Alternatively, the first and second heat conductive plates 1a and 1b may include at least one of a copper plate, an aluminum alloy plate, and a stainless steel plate. In this way, the heat transfer efficiency of the first heat conductive plate 1a and the second heat conductive plate 1b is high, thereby facilitating the improvement of the heat dissipation effect of the soaking plate 10. It will be appreciated that the materials of the first heat-conducting plate 1a and the second heat-conducting plate 1b may be selected in various ways, and may be specifically selected according to the requirements of use.
In some embodiments, the plate body 1 may be etched to form the capillary groove 11. In an alternative embodiment, the plate body 1 is laser etched to form the capillary grooves 11. By adopting the mode, the etching precision is higher, so that the uniformity of the width of the capillary groove 11 can be ensured, the problem of insufficient capillary force of the vapor chamber 10 caused by uneven width of the capillary groove 11 is avoided, the capillary force of the vapor chamber 10 is enhanced, and the heat dissipation effect of the vapor chamber 10 is improved. In an alternative embodiment, the plate body 1 is etched with chemical liquid to form capillary grooves 11. The method of etching the plate body 1 by using the medicinal water to form the capillary groove 11 has the advantages of higher etching efficiency and lower production cost. It will be appreciated that the manner in which the plate body 1 is etched to form the capillary groove 11 may be varied, and may be specifically selected according to the production and processing requirements, so as to meet different production requirements and product requirements.
It will be appreciated that in other embodiments, the plate body 1 may also be plated to form the capillary groove 11. For example, the plate body 1 is plated with convex parts at intervals, so that a capillary groove 11 is formed between two adjacent convex parts.
Alternatively, the capillary groove 11 has a capillary force so that the inorganic oxide particles are adsorbed to the inner wall surface of the capillary groove 11 or filled in the capillary groove 11 by the capillary force of the capillary groove 11. By adopting the mode, the property that the capillary groove 11 has capillary force is utilized, so that inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove 11 or filled in the capillary groove 11, and the inorganic oxide particles are conveniently arranged in the capillary groove 11, so that the vapor chamber 10 is convenient to produce and manufacture.
In this embodiment, as an example, as shown in fig. 1, inorganic oxide particles may be attached to the inner wall surface of the capillary groove 11. By attaching the inorganic oxide particles to the inner wall surface of the capillary groove 11, the amount of the inorganic oxide particles can be reduced, and the production cost can be reduced.
Alternatively, the inner wall surface of the capillary groove 11 to which the inorganic oxide particles are attached includes the side wall surface of the capillary groove 11 and/or the bottom wall surface of the capillary groove to which the inorganic oxide particles are attached. In an example, when the inorganic oxide particles are attached to the side wall surface of the capillary groove 11, the inorganic oxide particles can reduce the width of the capillary groove 11, so that not only the inorganic oxide particles themselves can provide capillary force to realize capillary action on the one hand, but also the reduction of the width of the capillary groove 11 can promote capillary action of the capillary groove 11 to improve the heat dissipation effect of the vapor chamber 10 on the other hand. In another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11, the inorganic oxide particles pass through the capillary force of themselves to increase the capillary force of the capillary groove 11, thereby improving the heat dissipation effect of the vapor chamber 10.
In still another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11 and the side wall surface of the capillary groove 11 (as in fig. 1), the inorganic oxide particles can not only increase the capillary force of the capillary groove 11 by reducing the width of the capillary groove 11, but also increase the capillary force of the capillary groove 11 by the capillary force of the inorganic oxide particles themselves, thereby increasing the heat dissipation effect of the vapor chamber 10. In addition, since the inorganic oxide particles can be disposed on the side wall surface of the capillary groove 11 or the bottom wall surface of the capillary groove 11, when the inorganic oxide particles are added to the capillary groove 11, the position of the inorganic oxide particles does not need to be selected, and the side wall surface or the bottom wall surface of the capillary groove 11 does not need to be avoided, thereby facilitating the arrangement of the inorganic oxide particles.
Alternatively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 may be 30 μm or more, and illustratively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is 30 μm, 31 μm, 33 μm, 35 μm, 40 μm, etc., thereby ensuring that the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 have a sufficient capillary force to ensure the heat dissipation effect of the vapor chamber 10. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is less than 30 μm, although the arrangement of the inorganic oxide particles can still increase the capillary force of the capillary groove 11, the effect of increasing the capillary force of the capillary groove 11 is weak, and the heat radiation effect of the vapor chamber 10 is not ideal.
In other embodiments, as shown in fig. 2, the inorganic oxide particles may also fill the capillary grooves 11. The mode that the capillary groove 11 is filled with the inorganic oxide particles is adopted, the thickness of the inorganic oxide particles attached to the capillary groove 11 is not required to be controlled, and the production control is easy, so that the production and the manufacture of the vapor chamber 10 are convenient.
In some embodiments, when the inorganic oxide particles are disposed in the capillary groove 11, the inorganic oxide particles may be placed in a liquid working medium to form a suspension of the inorganic oxide particles, and then the plate body 1 having the capillary groove 11 is placed in the suspension of the inorganic oxide particles, so that the inorganic oxide particles are adsorbed in the capillary groove 11 by the capillary force of the capillary groove 11, and thus, the inorganic oxide particles do not need to be disposed in the capillary groove 11 in a complicated manner, thereby making the manufacturing method of the soaking plate 10 simple. Alternatively, the liquid working medium may include water, ethanol, ethylene glycol, and the like, which is not particularly limited in this embodiment.
Further, the plate body 1 having the inorganic oxide particles adsorbed thereon may be dried to further fix the inorganic oxide particles in the inner wall surface of the capillary groove 11, thereby enhancing the stability of the capillary structure 2 and further enhancing the heat dissipation effect of the soaking plate 10. In addition, compared with sintering and fixing the inorganic oxide particles to the capillary groove 11, the drying method is adopted to fix the inorganic oxide particles to the capillary groove 11, so that more pores are formed between the inorganic oxide particles, thereby being beneficial to improving the capillary force of the capillary structure 2 and improving the heat dissipation effect of the vapor chamber 10.
Alternatively, the diameter of the inorganic oxide particles ranges between 200nm and 300 nm. Illustratively, the inorganic oxide particles have diameters of 200nm, 220nm, 240nm, 250nm, 270nm, 300nm, etc. The diameter of the inorganic oxide particles is controlled to be in the range of 200nm to 300nm, and the size of the gaps between the inorganic oxide particles is appropriate, so that a sufficient capillary force can be generated to enhance the capillary force of the capillary grooves 11. When the diameter of the inorganic oxide particles is smaller than 200nm, the gaps between the inorganic oxide particles are too small, or when the diameter of the inorganic oxide particles is larger than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, the capillary force enhancing effect on the capillary grooves 11 is weak, and the heat radiation effect of the vapor chamber 10 is improved undesirably.
Optionally, the inorganic oxide particles comprise at least one of silica, zirconia, ceria. The capillary structure 2 with the silica, the zirconium dioxide and the cerium oxide as the inorganic oxide particles arranged in the capillary groove 11 can enhance the capillary force of the capillary groove 11, thereby improving the heat dissipation effect of the vapor chamber 10. And the stability of the silicon dioxide, zirconium dioxide and cerium oxide materials is better, so that the heat dissipation effect of the vapor chamber is favorably maintained.
According to the vapor chamber 10 of the first embodiment of the present application, the capillary structure 2 is disposed in the capillary groove 11, so that the capillary force of the capillary groove 11 can be increased, so as to improve the heat dissipation effect of the vapor chamber 10. In addition, the capillary structure 2 can be inorganic oxide particles and can be adsorbed in the capillary groove 11 by utilizing the capillary force of the capillary groove 11, so that the inorganic oxide particles are conveniently arranged in the capillary groove 11, and the production and the manufacture are convenient.
Example two
Referring to fig. 3, fig. 3 shows a flowchart of a method for manufacturing a soaking plate. The second embodiment of the present application discloses a method for preparing a soaking plate, which is used for preparing the soaking plate 10 of the first embodiment, and specifically, the method comprises:
201: a plurality of capillary grooves are arranged on the plate body.
Compared with the method that a copper mesh is clamped in the plate body of the soaking plate to realize the heat dissipation effect of the soaking plate by flowing the liquid working medium in the plate body, the preparation method of the soaking plate of the embodiment realizes the heat dissipation effect of the soaking plate 10 by arranging the plurality of capillary grooves 11 on the plate body 1 to realize the heat dissipation effect of the soaking plate 10 by flowing the liquid working medium in the plate body 1, so that the thickness of the soaking plate 10 can be thinner to meet the requirements of the light and thin design of the electronic equipment 100.
In some embodiments, the plate body 1 includes a first heat-conducting plate 1a and a second heat-conducting plate 1b connected to the first heat-conducting plate 1a in a sealing manner, wherein a capillary groove 11 is disposed on a side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b, and/or a capillary groove 11 is disposed on a side of the second heat-conducting plate 1b facing the first heat-conducting plate 1 a.
When the capillary groove 11 is disposed on the side of the first heat conducting plate 1a facing the second heat conducting plate 1b, and the capillary groove 11 is disposed on the side of the second heat conducting plate 1b facing the first heat conducting plate 1a, the number of the capillary grooves 11 can be increased due to the fact that the first heat conducting plate 1a and the second heat conducting plate 1b are both provided with the capillary groove 11, so that the liquid working medium can flow back and forth between the heating area corresponding to the heating source and the condensing area for condensing the liquid working medium, and the heat dissipation effect of the vapor chamber 10 can be improved. Further, the capillary groove 11 arranged on the first heat conducting plate 1a corresponds to and is communicated with the capillary groove 11 arranged on the second heat conducting plate 1b, so that the liquid working medium can flow on the capillary grooves 11 of the first heat conducting plate 1a and the second heat conducting plate 1b conveniently, and the heat dissipation effect of the vapor chamber 10 is increased.
When the capillary groove 11 is disposed on the side of the first heat-conducting plate 1a facing the second heat-conducting plate 1b, or when the capillary groove 11 is disposed on the side of the second heat-conducting plate 1b facing the first heat-conducting plate 1a, the processing modes of the first heat-conducting plate 1a and the second heat-conducting plate 1b are simple, and alignment of the capillary groove 11 is not required to be considered, which is beneficial to improving the production efficiency of the soaking plate 10. Alternatively, the first and second heat conductive plates 1a and 1b may include at least one of a copper plate, an aluminum alloy plate, and a stainless steel plate. In this way, the heat transfer efficiency of the first heat conductive plate 1a and the second heat conductive plate 1b is high, thereby facilitating the improvement of the heat dissipation effect of the soaking plate 10. It will be appreciated that the materials of the first heat-conducting plate 1a and the second heat-conducting plate 1b may be selected in various ways, and may be specifically selected according to the requirements of use.
In some embodiments, the plate body 1 may be etched to form the capillary groove 11. In an alternative embodiment, the plate body 1 is laser etched to form the capillary grooves 11. By adopting the mode, the etching precision is higher, so that the uniformity of the width of the capillary groove 11 can be ensured, the problem of insufficient capillary force of the vapor chamber 10 caused by uneven width of the capillary groove 11 is avoided, the capillary force of the vapor chamber 10 is enhanced, and the heat dissipation effect of the vapor chamber 10 is improved. In an alternative embodiment, the plate body 1 is etched with chemical liquid to form capillary grooves 11. The method of etching the plate body 1 by using the medicinal water to form the capillary groove 11 has the advantages of higher etching efficiency and lower production cost. It will be appreciated that the manner in which the plate body 1 is etched to form the capillary groove 11 may be varied, and may be specifically selected according to the production and processing requirements, so as to meet different production requirements and product requirements.
It will be appreciated that in other embodiments, the plate body 1 may be plated to form the capillary groove 11. For example, the plate body 1 is plated with convex parts at intervals, so that a capillary groove 11 is formed between two adjacent convex parts.
202: a capillary structure is disposed in the at least one capillary groove to increase the capillary force of the capillary groove, the capillary structure comprising inorganic oxide particles.
In this way, by arranging the capillary structure 2 in the capillary groove and adopting the inorganic oxide particles as the capillary structure 2, the inorganic oxide particles have capillary action due to the gaps among the inorganic oxide particles, so that the capillary force of the capillary groove 11 can be increased, and the heat dissipation capability of the vapor chamber 10 is further improved. In addition, the inorganic oxide particles have better hydrophilicity, so that the flowing speed of the liquid working medium in the plate body 1 can be improved, and the heat dissipation effect of the soaking plate 10 is further improved. Alternatively, the inorganic oxide particles are adsorbed to the inner wall surface of the capillary groove 11 or filled in the capillary groove 11 by capillary force of the capillary groove 11. By adopting the mode, the property that the capillary groove 11 has capillary force is utilized, so that inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove 11 or filled in the capillary groove 11, and the inorganic oxide particles are conveniently arranged in the capillary groove 11, so that the vapor chamber 10 is convenient to produce and manufacture.
In this embodiment, as an example, as shown in fig. 1, inorganic oxide particles may be attached to the inner wall surface of the capillary groove 11. By attaching the inorganic oxide particles to the inner wall surface of the capillary groove 11, the amount of the inorganic oxide particles can be reduced, and the production cost can be reduced.
Alternatively, the inner wall surface of the capillary groove 11 to which the inorganic oxide particles are attached includes the side wall surface of the capillary groove 11 and/or the bottom wall surface of the capillary groove to which the inorganic oxide particles are attached. In an example, when the inorganic oxide particles are attached to the side wall surface of the capillary groove 11, the inorganic oxide particles can reduce the width of the capillary groove 11, so that not only the inorganic oxide particles themselves can provide capillary force to realize capillary action on the one hand, but also the reduction of the width of the capillary groove 11 can promote capillary action of the capillary groove 11 to improve the heat dissipation effect of the vapor chamber 10 on the other hand. In another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11, the inorganic oxide particles pass through the capillary force of themselves to increase the capillary force of the capillary groove 11 to improve the heat dissipation effect of the vapor chamber 10. In still another example, when the inorganic oxide particles are attached to the bottom wall surface of the capillary groove 11 and the side wall surface of the capillary groove 11 (as shown in fig. 1), the inorganic oxide particles can not only increase the capillary force of the capillary groove 11 by reducing the width of the capillary groove 11, but also increase the capillary force of the capillary groove 11 by the capillary force of the inorganic oxide particles themselves, thereby improving the heat dissipation effect of the vapor chamber 10, and furthermore, since the inorganic oxide particles can be provided on either the side wall surface of the capillary groove 11 or the bottom wall surface of the capillary groove 11, there is no need to select the installation position of the inorganic oxide particles without avoiding the side wall surface or the bottom wall surface of the capillary groove 11 when the inorganic oxide particles are added to the capillary groove 11.
Alternatively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 may be 30 μm or more, and illustratively, the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is 30 μm, 31 μm, 33 μm, 35 μm, 40 μm, etc., thereby ensuring that the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 have a sufficient capillary force to ensure the heat dissipation effect of the vapor chamber 10. When the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove 11 is less than 30 μm, although the arrangement of the inorganic oxide particles can still increase the capillary force of the capillary groove 11, the effect of increasing the capillary force of the capillary groove 11 is weak, and the heat radiation effect of the vapor chamber 10 is not ideal.
In other embodiments, as shown in fig. 2, the inorganic oxide particles may also fill the capillary grooves 11. The mode that the capillary groove 11 is filled with the inorganic oxide particles is adopted, the thickness of the inorganic oxide particles attached to the capillary groove 11 is not required to be controlled, and the production control is easy, so that the production and the manufacture of the vapor chamber 10 are convenient.
When the inorganic oxide particles are adsorbed to the inner wall surface of the capillary groove 11 by the capillary force of the capillary groove 11, the step 202 may specifically include the steps of:
placing inorganic oxide particles in a liquid working medium to form a suspension of inorganic oxide particles;
the plate body with the capillary grooves is placed in the suspension, so that the inorganic oxide particles are adsorbed to the capillary grooves under the capillary force of the capillary grooves.
In this way, the capillary force of the capillary groove 11 of the plate body 1 is utilized to adsorb the inorganic oxide particles in the capillary groove 11, and the inorganic oxide particles do not need to be arranged in the capillary groove 11 in a complicated manner, so that the preparation method of the soaking plate 10 is simple. Alternatively, the liquid working medium may include water, ethanol, ethylene glycol, and the like, which is not particularly limited in this embodiment.
Alternatively, the diameter of the inorganic oxide particles ranges between 200nm and 300 nm. Illustratively, the inorganic oxide particles have diameters of 200nm, 220nm, 240nm, 250nm, 270nm, 300nm, etc. The diameter of the inorganic oxide particles is controlled to be in the range of 200nm to 300nm, and the gaps between the inorganic oxide particles are sized appropriately so that a sufficient capillary force can be generated to enhance the capillary force of the capillary grooves 11. When the diameter of the inorganic oxide particles is smaller than 200nm, the gaps between the inorganic oxide particles are too small, or when the diameter of the inorganic oxide particles is larger than 300nm, the gaps between the inorganic oxide particles are too large, so that sufficient capillary force cannot be generated, the capillary force enhancing effect on the capillary grooves 11 is weak, and the heat radiation effect of the vapor chamber 10 is improved undesirably.
Optionally, the inorganic oxide particles comprise at least one of silica, zirconia, ceria. The capillary structure 2 with the silica, the zirconium dioxide and the cerium oxide as the inorganic oxide particles arranged in the capillary groove 11 can enhance the capillary force of the capillary groove 11, thereby improving the heat dissipation effect of the vapor chamber 10. In addition, the stability of the silica, zirconia and ceria materials is good, so that the heat dissipation effect of the soaking plate 10 is advantageously maintained.
203: and drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove.
In this way, the inorganic oxide particles are dried and fixed on the inner wall surface of the capillary groove 11, so that the stability of the capillary structure 2 can be enhanced, and the heat dissipation effect of the soaking plate 10 can be improved. In addition, compared with sintering and fixing the inorganic oxide particles to the capillary groove 11, the drying method is adopted to fix the inorganic oxide particles to the capillary groove 11, so that more pores are formed between the inorganic oxide particles, thereby being beneficial to improving the capillary force of the capillary structure 2 and improving the heat dissipation effect of the vapor chamber 10.
According to the manufacturing method of the vapor chamber 10 disclosed in the second embodiment of the application, the capillary groove 11 is arranged on the plate body 1 so that the liquid working medium flows in the plate body 1, and therefore, the heat dissipation effect of the vapor chamber 10 is achieved, and the vapor chamber 10 can have a thinner thickness so as to meet the design of lightening and thinning of the electronic equipment 100. In addition, the capillary groove 11 is further provided with a capillary structure 2, the capillary structure 2 comprises inorganic oxide particles, and the inorganic oxide particles are fixed on the inner wall surface of the capillary groove 11 after being dried, so that the capillary force of the capillary groove 11 can be enhanced, the problem that the heat dissipation effect of the vapor chamber 10 is affected due to insufficient capillary force of the capillary groove 11 caused by insufficient width of the capillary groove 11 is solved, and the heat dissipation effect of the vapor chamber 10 is enhanced.
Example III
Referring to fig. 4, fig. 4 is a block diagram of an electronic device according to an embodiment of the present application. The third embodiment of the application discloses an electronic device 100, which comprises a heat generating element 20 and a soaking plate 10, wherein the soaking plate 10 is the soaking plate 10 according to the first embodiment, and the heat generating element 20 is attached to the soaking plate 10.
In particular, the electronic device 100 may include, but is not limited to, a smart phone, a smart watch, a tablet computer, a palm game console, and the like. The heat generating component 20 may be an electronic device in the electronic apparatus 100 that emits heat when in operation, and may include, for example, a battery, a chip (or motherboard), a camera, a flash, a speaker, etc. In actual setting, because the heating element 20 is located inside the electronic device 100, the soaking plate 10 is correspondingly disposed inside the electronic device 100, and the soaking plate 10 can be directly attached to the heating element 20 to be connected with the heating element 20, so that heat can be conducted into the soaking plate 10 as much as possible for condensation, thereby achieving the effects of heat dissipation and temperature reduction, and prolonging the service life of the electronic device.
Alternatively, the area of the soaking plate 10 is larger than the area of the heat generating member 20. By adopting the mode, the heat generated by the heating element 20 can be radiated through the vapor chamber 10 more rapidly, and the cooling speed of the heating element 20 is increased.
By adopting the electronic device 100 disclosed in the third embodiment of the present application, the heat dissipation and cooling effects can be achieved by arranging the vapor chamber 10 to exchange heat with the heating element 20, so as to prolong the service life of the electronic device.
The above describes the preparation method of the vapor chamber, the vapor chamber and the electronic device disclosed in the embodiments of the present application in detail, and specific examples are applied to the description of the principles and the embodiments of the present application, where the description of the above examples is only used to help understand the preparation method of the vapor chamber, the electronic device and the core ideas thereof; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present application, the present disclosure should not be construed as limiting the present application in summary.
Claims (9)
1. The preparation method of the vapor chamber is characterized by comprising the following steps of:
a plurality of capillary grooves are formed in the plate body through etching;
arranging a capillary structure in at least one capillary groove to increase the capillary force of the capillary groove, wherein the capillary structure comprises inorganic oxide particles, the inorganic oxide particles are adsorbed on the inner wall surface of the capillary groove under the capillary force of the capillary groove, and the thickness of the inorganic oxide particles attached to the inner wall surface of the capillary groove is more than or equal to 30 mu m;
and drying and fixing the inorganic oxide particles on the inner wall surface of the capillary groove.
2. The method of manufacturing a vapor chamber according to claim 1, wherein said disposing a capillary structure in at least one of said capillary grooves to increase a capillary force of said capillary groove comprises:
placing the inorganic oxide particles in a liquid working medium to form a suspension of the inorganic oxide particles;
and placing the plate body with the capillary grooves in the suspension so that the inorganic oxide particles are adsorbed to the capillary grooves under the action of capillary force of the capillary grooves.
3. The method for producing a vapor chamber according to claim 1, wherein the inorganic oxide particles include at least one of silica, zirconia, and ceria.
4. The method for producing a vapor chamber according to claim 1, wherein the diameter of the inorganic oxide particles is in the range of 200nm to 300 nm.
5. The method for producing a vapor chamber according to claim 1, wherein the plate body comprises at least one of a copper plate, a stainless steel plate, and an aluminum alloy plate.
6. The method for manufacturing a vapor chamber according to claim 1, wherein the plate body comprises a first heat conducting plate and a second heat conducting plate connected to the first heat conducting plate in a sealing manner, the capillary groove is formed in one side of the first heat conducting plate facing the second heat conducting plate, and/or the capillary groove is formed in one side of the second heat conducting plate facing the first heat conducting plate.
7. The method according to claim 6, wherein when the first heat conductive plate and the second heat conductive plate are each provided with the capillary groove, the capillary groove provided on the first heat conductive plate corresponds to and communicates with the capillary groove provided on the second heat conductive plate.
8. A soaking plate, characterized in that the soaking plate is manufactured by the manufacturing method of the soaking plate according to any one of claims 1-7.
9. An electronic device, comprising:
a heat generating member;
and the heat generating component is attached to the soaking plate, and the soaking plate is the soaking plate as claimed in claim 8.
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