JP5568289B2 - Heat dissipation component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a heat radiating component and a manufacturing method thereof, and more specifically, a heat radiating component typified by a heat pipe used for cooling a heat generating component such as a CPU incorporated in a personal computer or an electronic device, etc. It relates to a manufacturing method.

  Heat pipes have the advantage that non-fluorocarbon water can be used as the working fluid (refrigerant) and do not require external power, such as large-capacity power semiconductors (thyristors, diodes, power modules, etc.), computer servers It is widely used as a heat dissipating member such as a closed casing of a control panel of an MPU for a machine or a machine tool. In particular, the use as a cooling component for heat-generating components (such as semiconductor devices such as CPUs that require high-speed operation with high integration and emit a large amount of heat) incorporated in small electronic devices such as notebook computers is increasing. Yes.

  Heat pipes used in these fields are becoming smaller and smaller in diameter as electronic devices become smaller. In addition, a flat heat pipe is preferably used because it can be easily attached to a component to be cooled (such as a CPU) and a wide contact surface can be obtained.

  Conventionally, various heat pipe structures have been proposed. The basic structure is that when a working fluid (typically water) enclosed in a sealed pipe is heated from the outside at one end (heating part) of the pipe and evaporated (latent heat absorption), the vapor Moves to the low temperature part at the other end of the pipe, condenses (latent heat release) at that part and cools the surroundings, and the condensed working fluid returns to the heating part along the inner wall of the pipe. is there. A capillary structure called “wick” is provided in a portion where the working fluid returns (inner wall of the pipe). The wick has various forms such as a bundle of metal wires, a metal mesh, a groove, and a sintered body of metal powder.

  Of these, the groove type is the mainstream, but the groove type heat pipe is superior in terms of the thermal resistance (thermal conductivity) of the pipe material itself, but the capillary force is inferior to other methods, There is a problem of lack of tilt dependency (that is, heat transport is not sufficient when the heat pipe itself is tilted). For example, when installed in a notebook computer, such a device often tilts when used, but the groove-type heat pipe does not have much capillary force, so heat transport is insufficient and the pipe itself does not cool so well. There may be a case where a sufficient cooling effect cannot be expected.

  For this reason, in recent years, a sintered metal type heat pipe (in which a sintered body such as copper powder is formed on the inner surface of the pipe) has been developed, and its inclination dependency is being solved by its high capillary force.

  FIG. 1 shows an example of a heat pipe provided with a conventional sintered metal type wick (capillary structure). In the illustrated heat pipe 10, a sealed metal pipe 12 has a flattened shape when viewed in cross section, and a sintered wick layer 14 is formed on the inner wall surface of the metal pipe 12. Further, an appropriate amount of water 16 as a working fluid is contained in the metal pipe 12 (in the illustrated example, white ○: evaporated water W1 and black ●: condensed water W2 schematically represented in a molecular level form) Is sealed in a vacuum.

  When the heat pipe 10 is functioning, the working fluid (water 16) evaporates by being heated from the outside on one end side (the evaporation section on the left end side in the illustrated example), and the vapor W1 is transferred to the other part of the pipe 12. It moves to the end side (the condensing part on the right end side), condenses in that part and cools the surroundings, and the condensed water W2 moves to one end side via the wick layer 14 on the inner wall surface of the pipe 12 Thereafter, the same movement is repeated and the inside of the pipe 12 is refluxed.

  The sintered wick layer 14 formed on the inner wall surface of the metal pipe 12 is made of, for example, copper powder, a metal plate made of copper or an alloy thereof (a state before being subjected to bending, flattening, etc. to a required shape of the metal pipe) It is obtained by depositing to the required thickness on the surface of the metal plate) and heating and sintering it. At this time, when viewed microscopically, the cross-sectional structure of the sintered wick layer 14 has a structure in which copper powders having an average particle diameter of approximately the same are partially in contact with each other as if stones are stacked (for example, FIG. 4 (c)). That is, there are gaps (voids) between the particles (copper powder).

  As an example of the technology related to the above-described conventional technology, for example, there is an electrically insulating heat pipe described in Patent Document 1 below. The heat pipe has a first metal tube whose inner surface is smooth or has a plurality of grooves, one end of which is sealed, a plurality of grooves on the inner surface, and a metal having a predetermined particle diameter in the grooves. Forming a porous layer formed by sintering powder, and having a second metal tube sealed at one end, and joining the first and second metal tubes via an electric insulating cylinder to form a communication tube; An electrically insulating hydraulic fluid is sealed inside.

  In addition, as described in Patent Document 2 below, in a heat pipe in which water is sealed as a heat medium in a copper or copper alloy container, the oxide film thickness of the surface in contact with the heat medium of the container is a predetermined value or less. There is something that I tried to do.

  Moreover, there exists a flat type heat pipe described in the following patent document 3 as a technique relevant to this. The heat pipe includes a sealed container formed by flattening a cylindrical container and a plurality of pipes arranged in the longitudinal direction in the container so as to form an acute curve portion having a large capillary force at least partially. A wick structure composed of individual wicks, a cavity formed by the outer peripheral surface of the wick structure and the inner wall surface of the container, and a working fluid sealed in the container are provided.

  Further, as a technique related to a wick using a sintered metal, as described in Patent Document 4 below, the inner wall surface of a metal pipe is not sintered with a mixture of at least two kinds of powders having different average particle diameters. There is one in which a wick layer is formed and this unsintered wick layer is heated and sintered in a reducing atmosphere to form a sintered wick layer.

  Further, as described in Patent Document 5 below, the inner surface of the heat pipe using water as a working fluid is made of a Ni-based alloy, and the inner surface of the heat pipe is plated with Cu, or this There is one in which Cr plating is applied to the inner surface of the heat pipe and an oxide is formed on the Cr plating surface.

Japanese Patent Laid-Open No. 4-98093 JP-A-9-113162 JP 2009-180437 A JP 2007-56302 A JP-A-7-90534

  As described above, in the conventional wick structure using sintered metal, copper powder is used as the metal powder to be sintered. Therefore, there are the following problems in sintering this.

  First, when sintering in an inert gas (nitrogen gas, argon gas, etc.) atmosphere, for example, in the case of a copper heat pipe, it is necessary to carry out under high temperature (around 900 to 1050 ° C.), so that the equipment cost increases. There was a problem. In addition, the crystal grains of the pipe material (copper) are easily coarsened during sintering and are liable to cause non-uniform deformation, which makes it difficult to perform subsequent bending and flattening.

  Moreover, since the average particle diameter of the copper powder used is almost the same, it is difficult to obtain an ideal wick layer (a wick layer having a large capillary force and a low flow resistance in which the working fluid easily flows). There was also a problem. That is, when the particle size of the copper powder is small, the gap between the particles becomes small and a high capillary force is obtained, but the circulation of the working fluid is deteriorated by the narrow gap, and conversely, the copper powder particles This is because, when the diameter is large, the gaps between the particles become large and the circulation of the working fluid is improved, but a high capillary force cannot be obtained.

  In addition, when metal powder such as copper powder is sintered, voids are formed in the crystal grain boundaries of the sintered body (see FIG. 4C), so that the bulk of the same size as the sintered body ( It is generally said that the electrical conductivity and thermal conductivity are inferior to those of a lump of metal such as copper. In the case of copper powder before sintering, there is a literature that its thermal conductivity is 0.14 to 0.18 W / (m · K). Therefore, when a sintered body of metal powder is used for a wick, the thermal conductivity is often lower than that of a groove type heat pipe for processing a pipe material (copper) as it is.

  In the invention described in Patent Document 4 above, by heating and sintering an unsintered wick layer formed using two types of copper powder in a reducing atmosphere, productivity is high and capillary force is high. In addition, a heat pipe sintered wick layer with excellent working fluid circulation is proposed. However, the technology disclosed here is not changed to using sintered metal for the wick, and similarly, the thermal resistance (heat conduction) compared to the groove type heat pipe that processes the copper material as it is. It is estimated that it is inferior in terms of rate.

  The present invention has been created in view of the problems in the prior art, and provides a heat dissipating component that can maintain high capillary force and good circulation of working fluid, and can increase thermal conductivity, and a method for manufacturing the same. For the purpose.

In order to solve the above-described problems of the prior art, according to one aspect of the present invention, the heat dissipation is provided by including a wick layer formed on the inner wall of a metal hermetic container and enclosing a working fluid inside the hermetic container. The wick layer is a first wick formed from a sintered copper powder in which a large number of copper powders are deposited and sintered, and voids exist between the copper powders, and a carbon nanotube. or made of carbon nanofibers copper plating layer which has been mixed, and filling portions of the first filled part of the gap in the wick, and the copper plating layer formed to leave other portions of the gap, There is provided a heat dissipating component comprising a composite structure of a second wick having a covering portion of the copper plating layer covering a surface layer portion of the first wick.

According to another aspect of the present invention, there is provided a method of manufacturing a heat dissipation component comprising a wick layer formed on an inner wall of a metal sealed container, wherein a working fluid is sealed inside the sealed container. A step of forming a wick layer is performed by depositing and sintering a large number of copper powders on one surface of a metal plate in a state before being formed into a required shape as the closed container. A step of forming a first wick made of a sintered copper powder having voids therein, and a copper plating solution in which carbon nanotubes or carbon nanofibers are dispersed, to form a part of the voids in the first wick. Forming a filling portion of the copper plating layer so as to fill and leave another part of the gap, and forming a covering portion of the copper plating layer covering the surface of the first wick, obtaining a wick Method for producing a heat radiation member, characterized in that it comprises is provided.

  According to the heat dissipation component and the manufacturing method thereof according to the present invention, fine carbon fibers (for example, carbon nanotubes) are mixed into metal powder (for example, copper powder) in the wick layer formed on the inner wall of the metal sealed container. Therefore, the size of voids (gap between metal particles) formed in the wick layer can be reduced.

  That is, by appropriately changing the thickness of the metal layer (the layer in which fine carbon fibers are mixed in the metal powder) according to the particle size of the metal powder, the size of the gap can be easily controlled. As a result, a wick layer having a high capillary force and excellent working fluid circulation is obtained.

  In addition, since the carbon layer is mixed with fine carbon fibers having high thermal conductivity (for example, carbon nanotubes or carbon nanofibers having a thermal conductivity higher than that of diamond), it is possible to increase the thermal conductivity of the wick layer as a whole. it can.

It is a figure for demonstrating the effect | action of the heat pipe provided with the conventional sintered metal type wick (capillary structure). It is a figure which shows the structure of the heat pipe which concerns on one Embodiment of this invention, (a) is a longitudinal cross-sectional view of a heat pipe, (b) is an expanded sectional view of a part (evaporation part) in (a), (c) FIG. 4 is an enlarged cross-sectional view of a portion A (wick layer) in FIG. It is the figure which showed the effect acquired by the heat pipe (invention technique) of FIG. 2 in contrast with the case of a prior art. It is a figure which shows the structure of the heat pipe which concerns on the modification of embodiment of FIG. 2, (a) is a longitudinal cross-sectional view of a heat pipe, (b) is an expanded cross section of the part A (wick layer) in (a). FIG. 4C is an enlarged cross-sectional view of a portion B (sintered wick layer) in FIG. It is a figure which shows the structure of the vapor chamber which concerns on other embodiment of this invention, (a) is the application example, (b) is a longitudinal cross-sectional view of a vapor chamber, (c) is the A part in (b) ( It is an expanded sectional view of a wick layer.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings.

(First embodiment)
FIG. 2 shows a configuration of a heat pipe according to an embodiment of the present invention, where (a) is a longitudinal sectional structure of the heat pipe 20, and (b) is an enlarged view of a part (evaporating part) in (a). Sectional structure (c) shows an enlarged sectional structure of the portion A (wick layer 24) in (b).

  The heat pipe 20 of the present embodiment includes a sealed metal pipe 22 as shown in the figure, and the metal pipe 22 has a flattened shape when viewed in cross section. A wick layer 24 (capillary structure) characterizing the present invention is formed on the inner wall surface of the metal pipe 22. Further, a working fluid as a heat medium is vacuum sealed inside the metal pipe 22.

  The material of the metal pipe 22 is preferably a material having excellent thermal conductivity, and preferably copper or an alloy thereof (for example, low oxygen copper, oxygen free copper, etc.) is used. In this case, an appropriate amount of water is sealed inside the metal pipe 22 as a working fluid. In particular, pure water such as ion-exchanged water or distilled water is desirable because it is difficult to cause an electrochemical reaction. Although this working fluid (water) is not shown in FIG. 2, when the heat pipe 20 is functioning, it recirculates in the pipe as illustrated in FIG. That is, the metal pipe 22 is moved from one end side (evaporating part) to the other end side (condensing part), from the other end side (condensing part) to the one end side (evaporating part) via the wick layer 24, and thereafter The pipe 22 is recirculated by repeating the same movement.

  Note that the material of the metal pipe 22 is not limited to copper or an alloy thereof, and other materials can be used as appropriate.

  The wick layer 24 formed on the inner wall surface of the metal pipe 22 has a structure in which two types of wicks are combined. The first wick is a copper powder sintered body (sintered wick layer) 26 obtained by sintering copper powder, and the second wick is mixed with carbon nanotubes (CNT) or carbon nanofibers (CNF) 28b. This is the copper plating layer 28a. The copper plating layer 28a mixed with the CNT (or CNF) 28b is also referred to as “CNT-mixed copper plating wick layer 28” or simply “plating wick layer 28” for convenience in the following description.

  The sintered wick layer 26 (first wick) is equivalent to a conventional sintered metal type wick (sintered wick layer 14 in FIG. 1). Accordingly, when the cross-sectional structure of the sintered wick layer 26 is viewed microscopically, the copper powder 26a having an average particle diameter of approximately the same is in a structure in which the parts are in contact with each other as if they were stacked with stones (for example, (Refer FIG.4 (c)). That is, there are voids between the particles (copper powder 26a).

  As described later, the CNT-mixed copper plating wick layer 28 (second wick) is formed by performing copper plating combining CNT (or CNF) on the surface of the sintered wick layer 26. The plating wick layer 28 is formed so as to fill the voids in the sintered wick layer 26 and cover the surface of the sintered body (surface layer portion of the sintered wick layer 26) as shown in FIG. Yes. In the formation thereof, it is important not to completely fill the voids in the sintered wick layer 26, but to adjust so as to partially fill the voids.

  The illustrated example shows a state in which the voids of the copper powder sintered body 26 are completely filled with the plating wick layer 28, but in reality, a slight void is left in a part of the voids. This is to maintain the required capillary force by leaving a slight gap in the wick layer 24.

  Next, in the method for manufacturing the heat pipe 20 of the present embodiment, a method for forming the wick layer 24 characterizing the present invention will be described.

  As one of the methods, first, a metal plate having a size necessary for forming the metal pipe 22 is prepared. That is, a metal plate in a state before bending, flattening or the like to a required shape is prepared as a metal pipe 22 that is finally sealed with a working fluid. As a material of this metal plate, copper or an alloy thereof excellent in thermal conductivity is preferably used.

  Next, copper powder is deposited to a required thickness on one surface of the metal plate (copper plate), and this is heated and sintered. Thereby, the sintered wick layer (copper powder sintered body) 26 which is a 1st wick is formed (state of FIG.4 (c)).

  Next, the surface of the sintered wick layer 26 is subjected to copper plating that combines CNT (or CNF). As a result, the CNT-mixed copper plating wick layer 28 as the second wick layer is formed (state shown in FIG. 2C).

  As the plating solution used to form the plating wick layer 28, for example, a solution in which CNT (or CNF) is dispersed in a copper plating solution using a protein as a dispersant is suitably used. By using a protein (gelatin, collagen peptide, etc.) as a dispersant, the dispersibility of CNTs can be improved and the flatness of the formed plating film can be improved (uniform film thickness can be realized). is there. In addition, when CNT (or CNF) is dispersed, if an ultrasonic wave is applied, dispersibility can be further improved.

  When the CNT composite copper plating is applied to the copper powder sintered body (sintered wick layer) 26, the copper plating solution penetrates into the voids in the copper powder sintered body 26 as shown (the copper powder 26a has copper on the surface thereof). A plating layer 28a is formed), which serves to fill the voids. However, if the gap is completely filled, the capillary force as the wick layer 24 is reduced.

  Therefore, when the CNT composite copper plating is performed, the plating time is set so as to partially fill the voids in the copper powder sintered body 26 (that is, leave a slight void to maintain sufficient capillary force). Need to be adjusted accordingly. For example, when the size of the copper powder 26a is 100 μm, the thickness of the plating (plating wick layer 28) applied to the surface of the sintered body is about 30 μm or less.

  When the heat pipe 20 of the present embodiment is functioning, the heat generated from the metal pipe 22 due to the heat supplied from the outside (semiconductor element such as a CPU that generates heat) is the wick layer 24 (sintered wick layer 26). And the CNT-mixed copper plating wick layer 28) and the working fluid (in this case, water) in the metal pipe 22. Thereby, the water of the said part (evaporation part) in the pipe 22 evaporates, the vapor | steam moves to the low temperature part (condensation part) of the other side in the pipe 22, is condensed in that part, and cools the circumference | surroundings. Further, the condensed water returns to one end side through the wick layer 24 on the inner wall surface of the pipe 22, and thereafter the same operation is repeated to circulate in the pipe 22.

  As described above, according to the heat pipe 20 and the manufacturing method thereof according to the first embodiment, for the copper powder sintered body (sintered wick layer) 26 formed on the inner wall surface of the metal pipe 22, Using a copper plating solution in which CNT (or CNF) is dispersed, CNT mixed copper is used to partially fill the voids (interstices between the copper powders 26a) in the copper powder sintered body 26 and to cover the surface layer portion. Since the plating wick layer 28 is formed, the size of the voids in the copper powder sintered body 26 can be reduced.

  That is, the gap size can be easily controlled by appropriately changing the thickness of the plating wick layer 28 in accordance with the particle size of the copper powder 26a. At that time, the gap is not completely filled, but the gap is partially filled (leaving a small gap to maintain sufficient capillary force), so that high capillary force and working fluid Good circulation can be maintained.

  As shown in FIG. 3B, the conventional copper powder sintered body has a problem that a large number of voids exist, so that the thermal conductivity is lower than that of the bulk. On the other hand, in the structure of the heat pipe 20 (wick layer 24) of the present embodiment, as shown in FIG. 3 (a), copper plating is applied to the voids (gap between the copper powders 26a) in the copper powder sintered body 26. The liquid (copper plating layer 28) invades and partially fills the gap. As a result, a structure having high capillary force and excellent working fluid circulation is realized.

  In addition, since the wick (or CNF) 28b having a thermal conductivity higher than that of diamond is mixed (dispersed) in the plating wick layer 28 (copper plating solution), the thermal conductivity of the wick layer 24 as a whole can be increased. . Although it depends on the amount of CNT (or CNF) 28b to be mixed, it can be expected that the thermal conductivity is increased by 10 to 20% compared to the conventional type (FIG. 1). Incidentally, the thermal conductivity of CNT is around 3000 W / (m · K), and the thermal conductivity of CNF is around 1200 W / (m · K).

  In the embodiment described above, the case where the wick layer 24 (a structure in which the copper powder sintered wick layer 26 and the CNT-mixed copper plating wick layer 28 are combined) is formed over the entire inner wall surface of the metal pipe 22 has been described as an example. However, as apparent from the gist of the present invention (the wick layer formed on the inner wall of the sealed container has a layer in which fine carbon fibers such as CNT are mixed in metal powder such as copper powder). The wick layer 24 is not necessarily formed over the entire inner wall surface of the pipe 22. In short, it is sufficient if a temperature gradient sufficient to circulate the working fluid (in this case, water) in the pipe 22 is formed.

  FIG. 4 shows an example thereof, and shows a configuration of a heat pipe according to a modification of the embodiment of FIG. In the figure, (a) is a longitudinal sectional structure of the heat pipe 20a, (b) is an enlarged sectional structure of the portion A (wick layer 24) in (a), and (c) is a portion B (firing) in (a). An enlarged cross-sectional structure of the wicking wick layer 26) is shown.

  Compared with the configuration of the heat pipe 20 (FIG. 2) of the above-described embodiment, the heat pipe 20a of this embodiment is a portion of the inner wall surface of the metal pipe 22 where the heat pipe 20a exchanges heat with the outside ( A copper powder sintered body (sintered wick layer) is formed on the other portion of the inner wall surface of the metal pipe 22 in that the wick layer 24 is formed only at locations corresponding to the evaporation portion and the condensation portion at both ends of the pipe. 26) is the only difference. Since other configurations are the same as those in the embodiment of FIG. 2, the description thereof is omitted.

  The method for manufacturing the heat pipe 20a is basically the same as in the above-described embodiment. However, in the present embodiment, the surface of a required metal plate (a metal plate in a state before being subjected to bending, flattening, etc. into a required shape as a sealed metal pipe) in the same manner as in the above-described embodiment. After forming a copper powder sintered body (sintered wick layer 26) on (see FIG. 4 (c)), on the sintered wick layer 26, other than the portions corresponding to both pipe end portions (evaporating portion and condensing portion) This portion is covered with an appropriate mask (plating resist), and the portion not covered with this resist is subjected to CNT-mixed copper plating to form a plating wick layer 28 (see FIG. 4B). Thereby, the wick layer 24 is formed only in the said location of the inner wall surface of the metal pipe 22 (location corresponding to the evaporation part and the condensation part of both ends of the pipe).

(Second Embodiment)
In the above-described embodiment, the wick layer 24 that characterizes the present invention is formed by using a conventional sintered metal-type first wick (sintered wick layer 26) and a second wick (plated layer mixed with CNTs or the like). The case where the second wick is formed by a wet process using plating while having a composite structure with the CNT-mixed copper plating wick layer 28) has been described, but as is apparent from the gist of the present invention, the wick Of course, the method of forming the layer 24 is not limited to this. The method described below is an example.

  In the second embodiment, a sintered wick layer (a wick layer mixed with CNT (or CNF)) corresponding to the wick layer 24 is formed using a dry process. As a method of forming the CNT mixture by sintering, a method disclosed in the invention previously proposed by the applicant of the present application (Japanese Patent Laid-Open No. 2005-343749) can be used.

  First, copper powder and CNT are uniformly mixed using a high-speed gas mixing method. At that time, the treatment atmosphere is preferably an inert gas (such as nitrogen gas or argon gas), and the powder flow rate is preferably 50 to 400 Km / H.

  Next, on one surface of a required copper plate (a copper plate in a state before bending, flattening, etc. into a required shape as a metal pipe 22 that is finally sealed with a working fluid sealed) The mixture of the copper powder and CNT formed by the method is brought into close contact while pressing at a pressure that does not destroy the copper powder using copper pulse current sintering, and sintered and sintered wick layer (CNT is mixed) A wick layer). At this time, the treatment atmosphere is preferably vacuum or nitrogen gas, the temperature is about 400 to 1050 ° C., and the energization method is preferably pulse energization.

  When the method according to the second embodiment is used, it is not necessary to perform the plating process as in the above-described embodiment, and the entire process is a dry process. A highly sintered wick layer can be formed.

  In each of the above-described embodiments, the heat pipes 20 and 20a (FIGS. 2 and 4) have been described as examples of the heat radiating component. However, as is apparent from the gist of the present invention, the heat radiating component is configured in this manner. Of course, it is not limited to. For example, the present invention can be applied to a vapor chamber called a heat sink type heat pipe.

  FIG. 5 shows an example thereof, (a) is an application example of the vapor chamber 30, (b) is a longitudinal sectional structure of the vapor chamber 30, and (c) is a portion A in (b) (wick layer 24). The enlarged sectional structure of is shown.

  The vapor chamber 30 is disposed so as to be interposed between a semiconductor element (chip) 40 such as a CPU and a heat sink 42 as shown in FIG. The chip 40 and the heat sink 42 are bonded to each other through an adhesive such as an epoxy resin having high thermal conductivity.

  As shown in FIG. 5B, the vapor chamber 30 is different from the configuration of the heat pipe 20 (FIG. 2) of the above-described embodiment in that a metal container 32 is provided instead of the metal pipe 22. The internal structure is the same as the internal structure of the heat pipe 20. Therefore, the description is omitted.

  As shown in the figure, the vapor chamber 30 realizes efficient cooling of the CPU 40 by widely diffusing the heat generated from the CPU 40 to the heat sink 42 having a large cooling area. Since the calorific value of an electronic device such as the CPU 40 is expected to increase further in the future as its performance increases, the vapor chamber 30 is very effective for cooling such an electronic device.

  The vapor chamber includes a type in which a heat sink 42 is provided on the top of the vapor chamber 30 (FIG. 5), a type in which heat fins are provided on the top of the vapor chamber, and a type in which heat pipes are provided. In any type of vapor chamber, heat can be efficiently exchanged between a heat generating component (a semiconductor element such as a CPU) and a heat radiating member (a heat sink, a heat fin, a heat pipe, or the like).

20, 20a ... heat pipe (heat dissipating part),
22 ... Metal pipe (sealed container),
24 ... Wick layer,
26 ... sintered wick layer (copper powder sintered body / first wick),
26a ... Copper powder (metal powder),
28 ... CNT mixed copper plating wick layer (second wick),
28a ... copper plating layer,
28b ... CNT (or CNF) (fine carbon fiber),
30 ... Vapor chamber (heat dissipating part),
32 ... Metal container (sealed container),
40 ... CPU (chip / heat generating component),
42 ... Heat sink.

Claims (3)

A heat dissipating component comprising a wick layer formed on the inner wall of a metal hermetic container and enclosing a working fluid inside the hermetic container,
The wick layer is
A first wick formed from a copper powder sintered body in which a large number of copper powders are deposited and sintered, and voids exist between the copper powders,
Filled portion of the copper plating layer formed of a copper plating layer mixed with carbon nanotubes or carbon nanofibers, filling a part of the gap in the first wick and leaving the other part of the gap And a second wick having a covering portion of the copper plating layer covering a surface layer portion of the first wick,
A heat dissipating part characterized by comprising a composite structure.   2. The heat dissipation according to claim 1, wherein the wick layer is formed at least on the inner wall of the sealed container and corresponding to a portion where the heat dissipation component exchanges heat with the outside. parts. In a method of manufacturing a heat dissipating component comprising a wick layer formed on the inner wall of a metal sealed container and enclosing a working fluid inside the sealed container,
Forming the wick layer comprises:
Copper powder firing in which a large number of copper powders are deposited and sintered on one surface of a metal plate in a state before being formed into a required shape as the closed container, and voids exist between the copper powders. Forming a first wick comprising a combination;
Using copper plating solution obtained by dispersing carbon nanotubes or carbon nanofibers, filling a portion of the void in the first wick, and to leave the other portion of the gap, the filling portion of the copper plating layer And forming a covering portion of the copper plating layer covering the surface of the first wick to obtain a second wick.

Images