JP2011520014A5 - - Google Patents

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Publication number
JP2011520014A5
JP2011520014A5 JP2011508622A JP2011508622A JP2011520014A5 JP 2011520014 A5 JP2011520014 A5 JP 2011520014A5 JP 2011508622 A JP2011508622 A JP 2011508622A JP 2011508622 A JP2011508622 A JP 2011508622A JP 2011520014 A5 JP2011520014 A5 JP 2011520014A5
Authority
JP
Japan
Prior art keywords
polyamide
weight
reinforcing agent
device cover
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011508622A
Other languages
English (en)
Japanese (ja)
Other versions
JP5411254B2 (ja
JP2011520014A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/042938 external-priority patent/WO2009137548A1/en
Publication of JP2011520014A publication Critical patent/JP2011520014A/ja
Publication of JP2011520014A5 publication Critical patent/JP2011520014A5/ja
Application granted granted Critical
Publication of JP5411254B2 publication Critical patent/JP5411254B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011508622A 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー Expired - Fee Related JP5411254B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12687908P 2008-05-08 2008-05-08
US61/126,879 2008-05-08
PCT/US2009/042938 WO2009137548A1 (en) 2008-05-08 2009-05-06 Portable electronic device cover comprising renewable polyamide resin composition

Publications (3)

Publication Number Publication Date
JP2011520014A JP2011520014A (ja) 2011-07-14
JP2011520014A5 true JP2011520014A5 (enExample) 2012-06-21
JP5411254B2 JP5411254B2 (ja) 2014-02-12

Family

ID=40810269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011508622A Expired - Fee Related JP5411254B2 (ja) 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー

Country Status (6)

Country Link
US (1) US9193866B2 (enExample)
EP (1) EP2274375A1 (enExample)
JP (1) JP5411254B2 (enExample)
KR (1) KR20110004902A (enExample)
CN (1) CN102015870B (enExample)
WO (1) WO2009137548A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体
US8465287B2 (en) * 2010-04-21 2013-06-18 Jeffrey M Drazan Alternative energy powered electronic reader having preloaded educational data
US20130048136A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Copolyamide compositions derived from triacylglycerides
US8845934B2 (en) * 2011-09-12 2014-09-30 Sabic Global Technologies B.V. Compatibilized biopolyamide-poly(arylene ether) thermoplastic resin
JP6276692B2 (ja) * 2011-09-20 2018-02-07 ティコナ・エルエルシー ポータブル電子機器用のハウジング
US20150024158A1 (en) * 2012-01-12 2015-01-22 Shakespeare Company, Llc Light transmitting copolymers
US20140066568A1 (en) * 2012-08-28 2014-03-06 E I Du Pont De Nemours And Company Polyamide resin blends
CN103044901B (zh) * 2012-12-17 2014-11-19 株洲时代新材料科技股份有限公司 一种高流动性无卤阻燃增强尼龙复合材料及其制备方法
HU4487U (en) * 2014-08-01 2015-01-28 Molnár Marianna Juhászné Protective device to reduce the impact of electromagnetic radiation
JP2019515241A (ja) * 2016-05-06 2019-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 外傷低減性ボディアーマーとしての軽量のコーティングされた布
US10763911B1 (en) 2020-04-03 2020-09-01 Open Mind Developments Corporation Protective covering for an electronic device
CN113480845B (zh) * 2021-07-16 2022-08-23 江西省铭新科技有限公司 一种利用废旧布料制备的再生pa塑料粒子及其方法
KR20240002343A (ko) 2022-06-29 2024-01-05 신동호 숙성을 겸한 떡찜기

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
BE621846A (enExample) 1961-08-31 1900-01-01
US3869429A (en) 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
JP2610671B2 (ja) * 1988-12-26 1997-05-14 ポリプラスチックス 株式会社 繊維強化熱可塑性樹脂組成物
DE3926904A1 (de) * 1989-08-16 1991-02-21 Basf Ag Verfahren zur herstellung von verstaerkten, zaehmodifizierten thermoplastischen formmassen
JPH10219026A (ja) * 1997-01-31 1998-08-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂組成物
US20030004248A1 (en) * 1997-09-08 2003-01-02 Kazuyuki Wakamura Polyamide resin composition
US6004784A (en) 1998-09-14 1999-12-21 General Electric Co. Fermentation medium and method for producing α, ω -alkanedicarboxylic acids
US6066480A (en) 1998-09-21 2000-05-23 General Electric Company Method for high specific bioproductivity of α,ω-alkanedicarboxylic acids
US6689835B2 (en) * 2001-04-27 2004-02-10 General Electric Company Conductive plastic compositions and method of manufacture thereof
JPWO2007034905A1 (ja) * 2005-09-22 2009-03-26 富士通株式会社 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
US20070155877A1 (en) * 2005-11-23 2007-07-05 Kenichi Shinohara Polyamide resin composition
KR101443766B1 (ko) * 2006-01-13 2014-09-23 미쓰비시 엔지니어링-플라스틱스 코포레이션 휴대 전자 기기용 폴리아미드 수지 조성물 및 휴대 전자 기기용 성형품
JP2007291161A (ja) * 2006-04-21 2007-11-08 Toray Ind Inc 熱可塑性樹脂組成物およびそれからなる成形品
JP5282371B2 (ja) * 2006-05-16 2013-09-04 三菱化学株式会社 共重合ポリアミド樹脂
EP2025716A4 (en) * 2006-05-30 2011-05-18 Mitsubishi Eng Plastics Corp POLYAMIDE RESIN COMPOSITION AND FORM BODY
US20100059715A1 (en) * 2006-10-23 2010-03-11 Sony Corporation Resin composition, shaped article and method of manufacturing the same, and electronic device
US20080119603A1 (en) 2006-11-22 2008-05-22 Georgios Topoulos Mobile telephone housing comprising polyamide resin composition
US8859665B2 (en) * 2006-12-05 2014-10-14 E I Du Pont De Nemours And Company Polyamide housings for portable electronic devices
ATE427341T1 (de) * 2006-12-28 2009-04-15 Ems Chemie Ag Mit flachen glasfasern verstarkte polyamidformmassen sowie daraus hergestellte spritzgussteile
FR2912753B1 (fr) * 2007-02-16 2012-10-12 Arkema France Copolyamide, composition comprenant un tel copolyamide et leur utilisation
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体

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