CN102015870B - 包含可再生聚酰胺树脂组合物的便携式电子装置外壳 - Google Patents

包含可再生聚酰胺树脂组合物的便携式电子装置外壳 Download PDF

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Publication number
CN102015870B
CN102015870B CN2009801164665A CN200980116466A CN102015870B CN 102015870 B CN102015870 B CN 102015870B CN 2009801164665 A CN2009801164665 A CN 2009801164665A CN 200980116466 A CN200980116466 A CN 200980116466A CN 102015870 B CN102015870 B CN 102015870B
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polyamide
weight
device housing
section
circular cross
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Expired - Fee Related
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English (en)
Chinese (zh)
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CN102015870A (zh
Inventor
G·托普洛斯
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2009801164665A 2008-05-08 2009-05-06 包含可再生聚酰胺树脂组合物的便携式电子装置外壳 Expired - Fee Related CN102015870B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12687908P 2008-05-08 2008-05-08
US61/126879 2008-05-08
PCT/US2009/042938 WO2009137548A1 (en) 2008-05-08 2009-05-06 Portable electronic device cover comprising renewable polyamide resin composition

Publications (2)

Publication Number Publication Date
CN102015870A CN102015870A (zh) 2011-04-13
CN102015870B true CN102015870B (zh) 2013-07-24

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CN2009801164665A Expired - Fee Related CN102015870B (zh) 2008-05-08 2009-05-06 包含可再生聚酰胺树脂组合物的便携式电子装置外壳

Country Status (6)

Country Link
US (1) US9193866B2 (enExample)
EP (1) EP2274375A1 (enExample)
JP (1) JP5411254B2 (enExample)
KR (1) KR20110004902A (enExample)
CN (1) CN102015870B (enExample)
WO (1) WO2009137548A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体
US8465287B2 (en) * 2010-04-21 2013-06-18 Jeffrey M Drazan Alternative energy powered electronic reader having preloaded educational data
US20130048136A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Copolyamide compositions derived from triacylglycerides
US8845934B2 (en) * 2011-09-12 2014-09-30 Sabic Global Technologies B.V. Compatibilized biopolyamide-poly(arylene ether) thermoplastic resin
JP6276692B2 (ja) * 2011-09-20 2018-02-07 ティコナ・エルエルシー ポータブル電子機器用のハウジング
US20150024158A1 (en) * 2012-01-12 2015-01-22 Shakespeare Company, Llc Light transmitting copolymers
US20140066568A1 (en) * 2012-08-28 2014-03-06 E I Du Pont De Nemours And Company Polyamide resin blends
CN103044901B (zh) * 2012-12-17 2014-11-19 株洲时代新材料科技股份有限公司 一种高流动性无卤阻燃增强尼龙复合材料及其制备方法
HU4487U (en) * 2014-08-01 2015-01-28 Molnár Marianna Juhászné Protective device to reduce the impact of electromagnetic radiation
JP2019515241A (ja) * 2016-05-06 2019-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 外傷低減性ボディアーマーとしての軽量のコーティングされた布
US10763911B1 (en) 2020-04-03 2020-09-01 Open Mind Developments Corporation Protective covering for an electronic device
CN113480845B (zh) * 2021-07-16 2022-08-23 江西省铭新科技有限公司 一种利用废旧布料制备的再生pa塑料粒子及其方法
KR20240002343A (ko) 2022-06-29 2024-01-05 신동호 숙성을 겸한 떡찜기

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080754A1 (ja) * 2006-01-13 2007-07-19 Mitsubishi Engineering-Plastics Corporation 携帯電子機器用ポリアミド樹脂組成物および携帯電子機器用成形品

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BE621846A (enExample) 1961-08-31 1900-01-01
US3869429A (en) 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
JP2610671B2 (ja) * 1988-12-26 1997-05-14 ポリプラスチックス 株式会社 繊維強化熱可塑性樹脂組成物
DE3926904A1 (de) * 1989-08-16 1991-02-21 Basf Ag Verfahren zur herstellung von verstaerkten, zaehmodifizierten thermoplastischen formmassen
JPH10219026A (ja) * 1997-01-31 1998-08-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂組成物
US20030004248A1 (en) * 1997-09-08 2003-01-02 Kazuyuki Wakamura Polyamide resin composition
US6004784A (en) 1998-09-14 1999-12-21 General Electric Co. Fermentation medium and method for producing α, ω -alkanedicarboxylic acids
US6066480A (en) 1998-09-21 2000-05-23 General Electric Company Method for high specific bioproductivity of α,ω-alkanedicarboxylic acids
US6689835B2 (en) * 2001-04-27 2004-02-10 General Electric Company Conductive plastic compositions and method of manufacture thereof
JPWO2007034905A1 (ja) * 2005-09-22 2009-03-26 富士通株式会社 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
US20070155877A1 (en) * 2005-11-23 2007-07-05 Kenichi Shinohara Polyamide resin composition
JP2007291161A (ja) * 2006-04-21 2007-11-08 Toray Ind Inc 熱可塑性樹脂組成物およびそれからなる成形品
JP5282371B2 (ja) * 2006-05-16 2013-09-04 三菱化学株式会社 共重合ポリアミド樹脂
EP2025716A4 (en) * 2006-05-30 2011-05-18 Mitsubishi Eng Plastics Corp POLYAMIDE RESIN COMPOSITION AND FORM BODY
US20100059715A1 (en) * 2006-10-23 2010-03-11 Sony Corporation Resin composition, shaped article and method of manufacturing the same, and electronic device
US20080119603A1 (en) 2006-11-22 2008-05-22 Georgios Topoulos Mobile telephone housing comprising polyamide resin composition
US8859665B2 (en) * 2006-12-05 2014-10-14 E I Du Pont De Nemours And Company Polyamide housings for portable electronic devices
ATE427341T1 (de) * 2006-12-28 2009-04-15 Ems Chemie Ag Mit flachen glasfasern verstarkte polyamidformmassen sowie daraus hergestellte spritzgussteile
FR2912753B1 (fr) * 2007-02-16 2012-10-12 Arkema France Copolyamide, composition comprenant un tel copolyamide et leur utilisation
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080754A1 (ja) * 2006-01-13 2007-07-19 Mitsubishi Engineering-Plastics Corporation 携帯電子機器用ポリアミド樹脂組成物および携帯電子機器用成形品

Also Published As

Publication number Publication date
EP2274375A1 (en) 2011-01-19
US9193866B2 (en) 2015-11-24
KR20110004902A (ko) 2011-01-14
CN102015870A (zh) 2011-04-13
WO2009137548A1 (en) 2009-11-12
JP5411254B2 (ja) 2014-02-12
US20090281229A1 (en) 2009-11-12
JP2011520014A (ja) 2011-07-14

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