JP5411254B2 - 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー - Google Patents

再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー Download PDF

Info

Publication number
JP5411254B2
JP5411254B2 JP2011508622A JP2011508622A JP5411254B2 JP 5411254 B2 JP5411254 B2 JP 5411254B2 JP 2011508622 A JP2011508622 A JP 2011508622A JP 2011508622 A JP2011508622 A JP 2011508622A JP 5411254 B2 JP5411254 B2 JP 5411254B2
Authority
JP
Japan
Prior art keywords
polyamide
weight
resin composition
section
device cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011508622A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011520014A5 (enExample
JP2011520014A (ja
Inventor
トポウロス ゲオルギオス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011520014A publication Critical patent/JP2011520014A/ja
Publication of JP2011520014A5 publication Critical patent/JP2011520014A5/ja
Application granted granted Critical
Publication of JP5411254B2 publication Critical patent/JP5411254B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011508622A 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー Expired - Fee Related JP5411254B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12687908P 2008-05-08 2008-05-08
US61/126,879 2008-05-08
PCT/US2009/042938 WO2009137548A1 (en) 2008-05-08 2009-05-06 Portable electronic device cover comprising renewable polyamide resin composition

Publications (3)

Publication Number Publication Date
JP2011520014A JP2011520014A (ja) 2011-07-14
JP2011520014A5 JP2011520014A5 (enExample) 2012-06-21
JP5411254B2 true JP5411254B2 (ja) 2014-02-12

Family

ID=40810269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011508622A Expired - Fee Related JP5411254B2 (ja) 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー

Country Status (6)

Country Link
US (1) US9193866B2 (enExample)
EP (1) EP2274375A1 (enExample)
JP (1) JP5411254B2 (enExample)
KR (1) KR20110004902A (enExample)
CN (1) CN102015870B (enExample)
WO (1) WO2009137548A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体
US8465287B2 (en) * 2010-04-21 2013-06-18 Jeffrey M Drazan Alternative energy powered electronic reader having preloaded educational data
US20130048136A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Copolyamide compositions derived from triacylglycerides
US8845934B2 (en) * 2011-09-12 2014-09-30 Sabic Global Technologies B.V. Compatibilized biopolyamide-poly(arylene ether) thermoplastic resin
JP6276692B2 (ja) * 2011-09-20 2018-02-07 ティコナ・エルエルシー ポータブル電子機器用のハウジング
US20150024158A1 (en) * 2012-01-12 2015-01-22 Shakespeare Company, Llc Light transmitting copolymers
US20140066568A1 (en) * 2012-08-28 2014-03-06 E I Du Pont De Nemours And Company Polyamide resin blends
CN103044901B (zh) * 2012-12-17 2014-11-19 株洲时代新材料科技股份有限公司 一种高流动性无卤阻燃增强尼龙复合材料及其制备方法
HU4487U (en) * 2014-08-01 2015-01-28 Molnár Marianna Juhászné Protective device to reduce the impact of electromagnetic radiation
JP2019515241A (ja) * 2016-05-06 2019-06-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 外傷低減性ボディアーマーとしての軽量のコーティングされた布
US10763911B1 (en) 2020-04-03 2020-09-01 Open Mind Developments Corporation Protective covering for an electronic device
CN113480845B (zh) * 2021-07-16 2022-08-23 江西省铭新科技有限公司 一种利用废旧布料制备的再生pa塑料粒子及其方法
KR20240002343A (ko) 2022-06-29 2024-01-05 신동호 숙성을 겸한 떡찜기

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE621846A (enExample) 1961-08-31 1900-01-01
US3869429A (en) 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
JP2610671B2 (ja) * 1988-12-26 1997-05-14 ポリプラスチックス 株式会社 繊維強化熱可塑性樹脂組成物
DE3926904A1 (de) * 1989-08-16 1991-02-21 Basf Ag Verfahren zur herstellung von verstaerkten, zaehmodifizierten thermoplastischen formmassen
JPH10219026A (ja) * 1997-01-31 1998-08-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂組成物
US20030004248A1 (en) * 1997-09-08 2003-01-02 Kazuyuki Wakamura Polyamide resin composition
US6004784A (en) 1998-09-14 1999-12-21 General Electric Co. Fermentation medium and method for producing α, ω -alkanedicarboxylic acids
US6066480A (en) 1998-09-21 2000-05-23 General Electric Company Method for high specific bioproductivity of α,ω-alkanedicarboxylic acids
US6689835B2 (en) * 2001-04-27 2004-02-10 General Electric Company Conductive plastic compositions and method of manufacture thereof
JPWO2007034905A1 (ja) * 2005-09-22 2009-03-26 富士通株式会社 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
US20070155877A1 (en) * 2005-11-23 2007-07-05 Kenichi Shinohara Polyamide resin composition
KR101443766B1 (ko) * 2006-01-13 2014-09-23 미쓰비시 엔지니어링-플라스틱스 코포레이션 휴대 전자 기기용 폴리아미드 수지 조성물 및 휴대 전자 기기용 성형품
JP2007291161A (ja) * 2006-04-21 2007-11-08 Toray Ind Inc 熱可塑性樹脂組成物およびそれからなる成形品
JP5282371B2 (ja) * 2006-05-16 2013-09-04 三菱化学株式会社 共重合ポリアミド樹脂
EP2025716A4 (en) * 2006-05-30 2011-05-18 Mitsubishi Eng Plastics Corp POLYAMIDE RESIN COMPOSITION AND FORM BODY
US20100059715A1 (en) * 2006-10-23 2010-03-11 Sony Corporation Resin composition, shaped article and method of manufacturing the same, and electronic device
US20080119603A1 (en) 2006-11-22 2008-05-22 Georgios Topoulos Mobile telephone housing comprising polyamide resin composition
US8859665B2 (en) * 2006-12-05 2014-10-14 E I Du Pont De Nemours And Company Polyamide housings for portable electronic devices
ATE427341T1 (de) * 2006-12-28 2009-04-15 Ems Chemie Ag Mit flachen glasfasern verstarkte polyamidformmassen sowie daraus hergestellte spritzgussteile
FR2912753B1 (fr) * 2007-02-16 2012-10-12 Arkema France Copolyamide, composition comprenant un tel copolyamide et leur utilisation
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体

Also Published As

Publication number Publication date
EP2274375A1 (en) 2011-01-19
US9193866B2 (en) 2015-11-24
KR20110004902A (ko) 2011-01-14
CN102015870A (zh) 2011-04-13
WO2009137548A1 (en) 2009-11-12
CN102015870B (zh) 2013-07-24
US20090281229A1 (en) 2009-11-12
JP2011520014A (ja) 2011-07-14

Similar Documents

Publication Publication Date Title
JP5411254B2 (ja) 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー
JP5539726B2 (ja) 携帯用電子デバイス用のポリアミドハウジング
JP5393472B2 (ja) ポリアミド樹脂組成物を含む携帯電話ハウジング
CN101754599B (zh) 注塑级木塑在生产电器外壳上的应用
JP6660318B2 (ja) 農業廃棄物から得られる熱可塑性デンプン組成物
US20100249282A1 (en) Environmentally friendly electronic device housings
Hung et al. Mechanical and interfacial properties of plastic composite panels made from esterified bamboo particles
JP2010510374A (ja) ポリアミド樹脂組成物を含む携帯電話ハウジング
CN111454497B (zh) 石墨烯修饰木质素增强型聚烯烃木塑复合材料及其制备方法
CN114517006B (zh) 一种生物基可降解塑料及其制备方法
CN115521528A (zh) 一种环保木塑复合材料及其制备方法
CN103450647B (zh) 一种聚对苯二甲酸丁二醇酯复合材料及其制备方法和应用
CN111171502A (zh) 一种abs再生料及其制备工艺
CN111117086A (zh) 一种环保型再生塑料颗粒及其制备方法
Febraianto et al. Influence of Impact Modifier–Coupling agent Combination on Mechanical Properties of Wood Flour–Reinforced Polypropylene Composit
CN111518354A (zh) 一种阻尼水声透声塑料功能母粒的生产工艺
CN109535567B (zh) 一种可光氧降解的聚丙烯复合材料及其制备方法与应用
CN107778634A (zh) 一种纤维增强生物质材料及其制备方法
Kaci et al. Influence of ethylene-butyl acrylate-glycidyl methacrylate terpolymer on compatibility of ethylene vinyl acetate copolymer/olive husk flour composites
CN114763422B (zh) 一种耐冲击建筑材料及其制备方法
CN119505488A (zh) 一种高耐水解玻纤增强聚酯材料
Haque et al. Design and development of rice husk reinforced polypropylene composite as an alternate boat building material
Forsgren Physical properties of dispersions and composites containing surface-grafted cellulose nanocrystals

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120426

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120426

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130123

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130424

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130528

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130827

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131008

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131107

R150 Certificate of patent or registration of utility model

Ref document number: 5411254

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees