JP2011519796A - 平坦な対象物の支持を局所的に制御するための方法およびシステム - Google Patents
平坦な対象物の支持を局所的に制御するための方法およびシステム Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/22—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/10—Means using fluid made only for exhausting gaseous medium
- B65H2406/11—Means using fluid made only for exhausting gaseous medium producing fluidised bed
- B65H2406/112—Means using fluid made only for exhausting gaseous medium producing fluidised bed for handling material along preferably rectilinear path, e.g. nozzle bed for web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/10—Means using fluid made only for exhausting gaseous medium
- B65H2406/11—Means using fluid made only for exhausting gaseous medium producing fluidised bed
- B65H2406/113—Details of the part distributing the air cushion
- B65H2406/1132—Multiple nozzles arrangement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/30—Suction means
- B65H2406/36—Means for producing, distributing or controlling suction
- B65H2406/364—Means for producing, distributing or controlling suction simultaneously blowing and sucking
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
【選択図】 図1B
Description
12 表面間ギャップ
14 対象物
14a 持ち上げられたセクション
14b 引かれたセクション
15 クッションスペース
16 先端
18 流体流れ矢印
20 矢印
22 突出部
24、24a、24b、26、28、30 流体クッション構成
32、32b、32c ポート
34 排出ポート
36 エッジ
38 角
90b 非接触支持プラットフォームシステム
91 硬性非接触支持面
92 圧力流量制限器
92a 圧力ノズル
92b エッジ圧力ノズル
92c フィンなしノズル
92d 流量制限器
93a、93b 流れ制限フィン
94 真空流量制限器
94a 真空吸引ポート
95 流体クッション
96 圧力マニホールド
96a 圧力源
96b 付加圧力源
97 真空マニホールド
97a 真空源
500 対象物
Claims (14)
- 実質的に平坦な対象物を支持するための非接触支持プラットフォームシステムであって、前記システムが、
プラットフォームからある距離で前記対象物を支持する流体クッションを誘発するための第1の複数の圧力ポートおよび第1の複数の真空吸引ポートを備えたプラットフォームと、
前記プラットフォームの所定のゾーンに位置し、前記所定のゾーンで前記プラットフォームから前記対象物の前記距離を増大するための第2の複数の圧力ポートと、を備えるシステム。 - 請求項1に記載のシステムであって、前記所定のゾーンが、エッジゾーンである、ことを特徴とするシステム。
- 請求項2に記載のシステムであって、前記エッジゾーンが、前記対象物の動きの方向に対して実質的に垂直である前記対象物のエッジを支持するように設計されている、ことを特徴とするシステム。
- 請求項2に記載のシステムであって、前記エッジゾーンが、前記対象物の外側エッジを支持するように設計されている、ことを特徴とするシステム。
- 請求項1に記載のシステムであって、前記所定のゾーンが、角ゾーンである、ことを特徴とするシステム。
- 請求項1に記載のシステムであって、さらに前記所定のゾーンに第2の複数の真空吸引ポートを備えている、システム。
- 請求項1に記載のシステムであって、前記第1の複数および第2の複数の前記圧力ポートが、複数のノズルを含む、ことを特徴とするシステム。
- 請求項4に記載のシステムであって、前記複数のノズルの1つのノズルが、流れ制限フィンを備えたダクトを含む、ことを特徴とするシステム。
- 実質的に平坦な対象物を搬送する方法であって、前記方法が、
実質的に平坦な対象物を支持するための非接触支持プラットフォームシステムを準備するステップであって、
前記システムが、プラットフォームからある距離で前記対象物を支持する流体クッションを誘発するための第1の複数の圧力ポートおよび第1の複数の真空吸引ポートを備えたプラットフォームと、前記プラットフォームの所定のゾーンに位置する第2の複数の圧力ポートと、を含むステップと、
前記第2の複数の前記圧力ポートによって圧力を加えることによって前記所定のゾーンで前記プラットフォームからの前記対象物の前記距離を増大するステップと、を含む方法。 - 請求項9に記載の方法であって、前記所定のゾーンが、エッジゾーンである、ことを特徴とする方法。
- 請求項9に記載の方法であって、前記第1の複数の圧力ポートに供給される前記圧力より大きい圧力を前記第2の複数の圧力ポートに供給するステップを含むことを特徴とする方法。
- 請求項11に記載の方法であって、前記第1の複数の圧力ポートに供給される前記圧力より大きい圧力を前記第2の複数の圧力ポートに供給する前記ステップが、前記対象物のエッジが前記所定のゾーンで支持されるときに実行される、ことを特徴とする方法。
- 請求項9に記載の方法であって、前記対象物の動きの方向に対して実質的に垂直である前記対象物のエッジを支持するステップを含む方法。
- 請求項9に記載の方法であって、前記対象物の外側エッジを支持するステップを含む方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US3545308P | 2008-03-11 | 2008-03-11 | |
US61/035,453 | 2008-03-11 | ||
US4127508P | 2008-04-01 | 2008-04-01 | |
US61/041,275 | 2008-04-01 | ||
PCT/IL2009/000274 WO2009113066A2 (en) | 2008-03-11 | 2009-03-11 | Method and system for locally controlling support of a flat object |
Publications (1)
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JP2011519796A true JP2011519796A (ja) | 2011-07-14 |
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JP2010550328A Pending JP2011519796A (ja) | 2008-03-11 | 2009-03-11 | 平坦な対象物の支持を局所的に制御するための方法およびシステム |
Country Status (6)
Country | Link |
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US (2) | US8690489B2 (ja) |
EP (1) | EP2250109B1 (ja) |
JP (1) | JP2011519796A (ja) |
KR (1) | KR20100130991A (ja) |
CN (1) | CN102026560B (ja) |
WO (1) | WO2009113066A2 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
EP2250109A4 (en) | 2012-09-05 |
US8690489B2 (en) | 2014-04-08 |
WO2009113066A3 (en) | 2010-03-11 |
EP2250109B1 (en) | 2015-01-14 |
US9022699B2 (en) | 2015-05-05 |
US20110023757A1 (en) | 2011-02-03 |
CN102026560B (zh) | 2014-12-17 |
US20140161577A1 (en) | 2014-06-12 |
WO2009113066A2 (en) | 2009-09-17 |
CN102026560A (zh) | 2011-04-20 |
EP2250109A2 (en) | 2010-11-17 |
KR20100130991A (ko) | 2010-12-14 |
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