JP2011518444A5 - - Google Patents

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Publication number
JP2011518444A5
JP2011518444A5 JP2011506361A JP2011506361A JP2011518444A5 JP 2011518444 A5 JP2011518444 A5 JP 2011518444A5 JP 2011506361 A JP2011506361 A JP 2011506361A JP 2011506361 A JP2011506361 A JP 2011506361A JP 2011518444 A5 JP2011518444 A5 JP 2011518444A5
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JP
Japan
Prior art keywords
chamber
wall
excimer lamp
tubular body
excimer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011506361A
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English (en)
Japanese (ja)
Other versions
JP5319758B2 (ja
JP2011518444A (ja
Filing date
Publication date
Priority claimed from US12/107,281 external-priority patent/US8022377B2/en
Application filed filed Critical
Publication of JP2011518444A publication Critical patent/JP2011518444A/ja
Publication of JP2011518444A5 publication Critical patent/JP2011518444A5/ja
Application granted granted Critical
Publication of JP5319758B2 publication Critical patent/JP5319758B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011506361A 2008-04-22 2009-04-16 エキシマ硬化処理のための装置 Expired - Fee Related JP5319758B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/107,281 US8022377B2 (en) 2008-04-22 2008-04-22 Method and apparatus for excimer curing
US12/107,281 2008-04-22
PCT/US2009/040809 WO2009131889A2 (en) 2008-04-22 2009-04-16 Method and apparatus for excimer curing

Publications (3)

Publication Number Publication Date
JP2011518444A JP2011518444A (ja) 2011-06-23
JP2011518444A5 true JP2011518444A5 (enExample) 2012-06-07
JP5319758B2 JP5319758B2 (ja) 2013-10-16

Family

ID=41200336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011506361A Expired - Fee Related JP5319758B2 (ja) 2008-04-22 2009-04-16 エキシマ硬化処理のための装置

Country Status (6)

Country Link
US (1) US8022377B2 (enExample)
JP (1) JP5319758B2 (enExample)
KR (1) KR20110005721A (enExample)
CN (1) CN102017100B (enExample)
TW (1) TW201009947A (enExample)
WO (1) WO2009131889A2 (enExample)

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CN103872557B (zh) * 2012-12-11 2016-09-28 中国科学院大连化学物理研究所 一种非均匀电极单重态氧发生装置
US20140230770A1 (en) * 2013-02-20 2014-08-21 University Of Southern California Transient plasma electrode for radical generation
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US10224210B2 (en) 2014-12-09 2019-03-05 Applied Materials, Inc. Plasma processing system with direct outlet toroidal plasma source
US10573496B2 (en) 2014-12-09 2020-02-25 Applied Materials, Inc. Direct outlet toroidal plasma source
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US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
FR3053169B1 (fr) * 2016-06-28 2018-08-10 Thales Dispositif de generation d'un rayonnement laser et procede de fabrication associe
CN108242412B (zh) * 2016-12-26 2020-06-23 台湾积体电路制造股份有限公司 半导体元件固化装置、基材处理系统以及半导体元件固化方法
US10381200B2 (en) * 2017-03-08 2019-08-13 Applied Materials, Inc. Plasma chamber with tandem processing regions
KR102453361B1 (ko) * 2018-05-18 2022-10-07 삼성전자주식회사 다중 경화 장치 및 다중 경화 장치를 이용한 반도체 칩의 제조 방법
US20210057864A1 (en) * 2019-08-19 2021-02-25 Iradion Laser, Inc. Enhanced waveguide surface in gas lasers

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