JP2011518063A - 接着物品 - Google Patents
接着物品 Download PDFInfo
- Publication number
- JP2011518063A JP2011518063A JP2011506329A JP2011506329A JP2011518063A JP 2011518063 A JP2011518063 A JP 2011518063A JP 2011506329 A JP2011506329 A JP 2011506329A JP 2011506329 A JP2011506329 A JP 2011506329A JP 2011518063 A JP2011518063 A JP 2011518063A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive article
- release layer
- release
- liner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 107
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 107
- 229920001296 polysiloxane Polymers 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 6
- 229920006243 acrylic copolymer Polymers 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000010985 leather Substances 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 26
- 238000005520 cutting process Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 15
- 238000000576 coating method Methods 0.000 description 10
- 229920001903 high density polyethylene Polymers 0.000 description 10
- 239000004700 high-density polyethylene Substances 0.000 description 10
- 238000004049 embossing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 229920001684 low density polyethylene Polymers 0.000 description 6
- 239000004702 low-density polyethylene Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000006872 improvement Effects 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- -1 polydimethylsiloxane Polymers 0.000 description 4
- 101100021265 Caenorhabditis elegans lin-5 gene Proteins 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000002386 leaching Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000013441 quality evaluation Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013310 covalent-organic framework Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000009474 hot melt extrusion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 108091053735 lin-4 stem-loop Proteins 0.000 description 1
- 108091032363 lin-4-1 stem-loop Proteins 0.000 description 1
- 108091028008 lin-4-2 stem-loop Proteins 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
- H04L12/40032—Details regarding a bus interface enhancer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2421/00—Presence of unspecified rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/005—Presence of polyolefin in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40208—Bus networks characterized by the use of a particular bus standard
- H04L2012/40254—Actuator Sensor Interface ASI
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/4026—Bus for use in automation systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4700008P | 2008-04-22 | 2008-04-22 | |
| US61/047,000 | 2008-04-22 | ||
| PCT/US2009/038478 WO2009131792A1 (en) | 2008-04-22 | 2009-03-27 | Adhesive article |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014049048A Division JP2014177123A (ja) | 2008-04-22 | 2014-03-12 | 接着物品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011518063A true JP2011518063A (ja) | 2011-06-23 |
| JP2011518063A5 JP2011518063A5 (enExample) | 2012-05-17 |
Family
ID=41217124
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011506329A Withdrawn JP2011518063A (ja) | 2008-04-22 | 2009-03-27 | 接着物品 |
| JP2014049048A Pending JP2014177123A (ja) | 2008-04-22 | 2014-03-12 | 接着物品 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014049048A Pending JP2014177123A (ja) | 2008-04-22 | 2014-03-12 | 接着物品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9065675B2 (enExample) |
| EP (1) | EP2285924B1 (enExample) |
| JP (2) | JP2011518063A (enExample) |
| CN (1) | CN102015938B (enExample) |
| BR (1) | BRPI0910661A2 (enExample) |
| PL (1) | PL2285924T3 (enExample) |
| WO (1) | WO2009131792A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150018840A (ko) * | 2012-05-31 | 2015-02-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착 용품 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8490356B2 (en) * | 2009-03-09 | 2013-07-23 | Custom Building Products, Inc. | Mortarless tile installation system and method for installing tiles |
| US8302366B2 (en) * | 2009-03-09 | 2012-11-06 | Custom Building Products, Inc. | Mortarless tile installation system and method for installing tiles |
| TWM411562U (en) * | 2010-09-16 | 2011-09-11 | Tung-Yuan Tsaur | System for measuring peeling force of adhesives |
| JP2014501295A (ja) | 2010-12-16 | 2014-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | 相互貫入ポリマー層 |
| DE102013218985A1 (de) * | 2013-09-20 | 2015-03-26 | Tesa Se | Trennbeschichtung mit definierter Oberflächenstruktur |
| US20160324241A2 (en) * | 2014-08-08 | 2016-11-10 | Yo Han Lee | An adhesive device for attaching a false eyelash and a false eyelash kit |
| GB2544335A (en) * | 2015-11-13 | 2017-05-17 | Oculus Vr Llc | A method and apparatus for use in the manufacture of a display element |
| JP6779820B2 (ja) | 2017-03-24 | 2020-11-04 | 株式会社東芝 | 電極、二次電池、電池パック及び車両 |
| KR102568434B1 (ko) * | 2018-06-22 | 2023-08-18 | 산진 옵토일렉트로닉스 (쑤저우) 컴퍼니 리미티드 | 편광판의 적정 재단 조건 도출 방법 |
| EP3587527A1 (en) | 2018-06-30 | 2020-01-01 | 3M Innovative Properties Company | Full (per)fluoro polymer liner for adhesive tapes |
| KR102559210B1 (ko) | 2018-07-29 | 2023-07-25 | 비브이더블유 홀딩 에이쥐 | 흡인을 갖는 패터닝된 표면 |
| WO2021084703A1 (ja) * | 2019-10-31 | 2021-05-06 | リンテック株式会社 | 剥離ライナーおよび粘着シート |
| PL3838591T3 (pl) | 2019-12-20 | 2024-09-16 | Mondi Ag | Przekładka antyadhezyjna do przemieszczalnych artykułów przylepnych |
| EP4019602A1 (en) * | 2020-12-27 | 2022-06-29 | 3M Innovative Properties Company | Low tack structural adhesive for shear bonding of magnets in electrical motors |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05732U (ja) * | 1991-06-14 | 1993-01-08 | 神崎製紙株式会社 | ダブル粘着シート |
| JPH0734045A (ja) * | 1993-07-21 | 1995-02-03 | Sekisui Chem Co Ltd | 粘着テープの側面処理方法 |
| JP2003342533A (ja) * | 2002-05-24 | 2003-12-03 | Lintec Corp | 粘着シート |
| JP2004525223A (ja) * | 2001-03-14 | 2004-08-19 | スリーエム イノベイティブ プロパティズ カンパニー | 角錐構造を有する接着剤層および剥離ライナー |
| WO2007042772A2 (en) * | 2005-10-13 | 2007-04-19 | Cpfilms Inc | An electrically conductive release liner |
| JP2007512163A (ja) * | 2003-11-21 | 2007-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | 構造的紙剥離ライナ、接着剤付き物品組み立て品およびその製造方法 |
| WO2007079913A1 (de) * | 2005-12-23 | 2007-07-19 | Lohmann Gmbh & Co. Kg | Abdeckung mit feinen oberflächenstrukturen zur verminderung der luftblasenbildung bei der applikation klebender erzeugnisse |
| JP2009507126A (ja) * | 2005-09-07 | 2009-02-19 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物、硬化性組成物の製造方法及び使用方法、並びに硬化性組成物を用いた物品 |
| JP2010502803A (ja) * | 2006-09-11 | 2010-01-28 | テーザ・ソシエタス・ヨーロピア | 両面感圧接着テープの製造方法及びその用途 |
| JP2010521525A (ja) * | 2007-03-16 | 2010-06-24 | マイラン・テクノロジーズ,インコーポレイテッド | 非晶質薬物の経皮系、製造方法、および安定化 |
| JP2010526910A (ja) * | 2007-05-11 | 2010-08-05 | スリーエム イノベイティブ プロパティズ カンパニー | 多層アセンブリ、多層延伸剥離型感圧接着剤アセンブリ並びにその製造及び使用方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5154974A (en) | 1986-06-23 | 1992-10-13 | Norman Alfred W | Adhesive composition having improved cutting properties |
| US5290842A (en) | 1991-09-03 | 1994-03-01 | Avery Dennison Corporation | Pressure-sensitive adhesives based on preferentially tackified immiscible elastomers |
| JPH05732A (ja) | 1991-03-29 | 1993-01-08 | Fuji Photo Film Co Ltd | 用紙捌き機能を備えた自動給紙装置 |
| WO1995011945A1 (en) * | 1993-10-29 | 1995-05-04 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesives having microstructured surfaces |
| US6440880B2 (en) | 1993-10-29 | 2002-08-27 | 3M Innovative Properties Company | Pressure-sensitive adhesives having microstructured surfaces |
| US5468815A (en) | 1994-01-12 | 1995-11-21 | Minnesota Mining And Manufacturing | Low coefficient of friction silicone release formulations incorporating higher alkenyl-functional silicone gums |
| US6074747A (en) | 1995-06-06 | 2000-06-13 | Avery Dennison Corporation | Ink-imprintable release coatings, and pressure sensitive adhesive constructions |
| US6312800B1 (en) * | 1997-02-10 | 2001-11-06 | Lintec Corporation | Pressure sensitive adhesive sheet for producing a chip |
| US6524675B1 (en) | 1999-05-13 | 2003-02-25 | 3M Innovative Properties Company | Adhesive-back articles |
| US6521309B1 (en) | 1999-11-11 | 2003-02-18 | Tyco Adhesives Lp | Double-sided single-liner pressure-sensitive adhesive tape |
| US20010052384A1 (en) * | 2000-04-24 | 2001-12-20 | Michael Hannington | Adhesive articles with improved air egress and methods of making the same |
| US6579941B1 (en) | 2000-06-12 | 2003-06-17 | Avery Dennison Corporatoin | Adhesive compositions and constructions with outstanding cutting performance |
| EP1299496B1 (en) | 2000-06-27 | 2005-06-15 | Exxonmobil Chemical Patents Inc. | Adhesives with improved die-cutting performance |
| US6805933B2 (en) * | 2001-07-31 | 2004-10-19 | 3M Innovative Properties Company | Articles comprising a release liner having a high coefficient of friction and good roll stability |
| US8252407B2 (en) * | 2005-01-12 | 2012-08-28 | Avery Dennison Corporation | Adhesive article having improved application properties |
| US20060228480A1 (en) * | 2005-03-30 | 2006-10-12 | David Lin | Method of manufacturing a release liner |
| US7687126B2 (en) * | 2005-08-22 | 2010-03-30 | 3M Innovative Properties Company | Adhesive articles and release liners |
| US8309207B2 (en) * | 2009-02-05 | 2012-11-13 | Avery Dennison Corporation | Adhesive articles with improved air egress |
-
2009
- 2009-03-27 PL PL09733966T patent/PL2285924T3/pl unknown
- 2009-03-27 CN CN200980114227.6A patent/CN102015938B/zh not_active Expired - Fee Related
- 2009-03-27 WO PCT/US2009/038478 patent/WO2009131792A1/en not_active Ceased
- 2009-03-27 BR BRPI0910661A patent/BRPI0910661A2/pt not_active IP Right Cessation
- 2009-03-27 JP JP2011506329A patent/JP2011518063A/ja not_active Withdrawn
- 2009-03-27 EP EP09733966.7A patent/EP2285924B1/en not_active Not-in-force
- 2009-03-27 US US12/988,114 patent/US9065675B2/en not_active Expired - Fee Related
-
2014
- 2014-03-12 JP JP2014049048A patent/JP2014177123A/ja active Pending
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| JPH05732U (ja) * | 1991-06-14 | 1993-01-08 | 神崎製紙株式会社 | ダブル粘着シート |
| JPH0734045A (ja) * | 1993-07-21 | 1995-02-03 | Sekisui Chem Co Ltd | 粘着テープの側面処理方法 |
| JP2004525223A (ja) * | 2001-03-14 | 2004-08-19 | スリーエム イノベイティブ プロパティズ カンパニー | 角錐構造を有する接着剤層および剥離ライナー |
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| JP2009507126A (ja) * | 2005-09-07 | 2009-02-19 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物、硬化性組成物の製造方法及び使用方法、並びに硬化性組成物を用いた物品 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150018840A (ko) * | 2012-05-31 | 2015-02-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착 용품 |
| KR102169342B1 (ko) * | 2012-05-31 | 2020-10-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착 용품 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2285924A1 (en) | 2011-02-23 |
| BRPI0910661A2 (pt) | 2017-05-16 |
| US9065675B2 (en) | 2015-06-23 |
| CN102015938B (zh) | 2014-12-17 |
| WO2009131792A1 (en) | 2009-10-29 |
| US20110039067A1 (en) | 2011-02-17 |
| JP2014177123A (ja) | 2014-09-25 |
| EP2285924B1 (en) | 2014-06-11 |
| CN102015938A (zh) | 2011-04-13 |
| PL2285924T3 (pl) | 2014-11-28 |
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