PL2285924T3 - Artykuł przylepny - Google Patents

Artykuł przylepny

Info

Publication number
PL2285924T3
PL2285924T3 PL09733966T PL09733966T PL2285924T3 PL 2285924 T3 PL2285924 T3 PL 2285924T3 PL 09733966 T PL09733966 T PL 09733966T PL 09733966 T PL09733966 T PL 09733966T PL 2285924 T3 PL2285924 T3 PL 2285924T3
Authority
PL
Poland
Prior art keywords
adhesive article
article
adhesive
Prior art date
Application number
PL09733966T
Other languages
English (en)
Inventor
Jayshree Seth
Marie A Boulos
Janet A Venne
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of PL2285924T3 publication Critical patent/PL2285924T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H04L12/40032—Details regarding a bus interface enhancer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/005—Presence of polyolefin in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/005—Presence of halogenated polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L2012/40208—Bus networks characterized by the use of a particular bus standard
    • H04L2012/40254—Actuator Sensor Interface ASI
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L2012/4026—Bus for use in automation systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
PL09733966T 2008-04-22 2009-03-27 Artykuł przylepny PL2285924T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4700008P 2008-04-22 2008-04-22
EP09733966.7A EP2285924B1 (en) 2008-04-22 2009-03-27 Adhesive article
PCT/US2009/038478 WO2009131792A1 (en) 2008-04-22 2009-03-27 Adhesive article

Publications (1)

Publication Number Publication Date
PL2285924T3 true PL2285924T3 (pl) 2014-11-28

Family

ID=41217124

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09733966T PL2285924T3 (pl) 2008-04-22 2009-03-27 Artykuł przylepny

Country Status (7)

Country Link
US (1) US9065675B2 (pl)
EP (1) EP2285924B1 (pl)
JP (2) JP2011518063A (pl)
CN (1) CN102015938B (pl)
BR (1) BRPI0910661A2 (pl)
PL (1) PL2285924T3 (pl)
WO (1) WO2009131792A1 (pl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8302366B2 (en) * 2009-03-09 2012-11-06 Custom Building Products, Inc. Mortarless tile installation system and method for installing tiles
US8490356B2 (en) * 2009-03-09 2013-07-23 Custom Building Products, Inc. Mortarless tile installation system and method for installing tiles
TWM411562U (en) * 2010-09-16 2011-09-11 Tung-Yuan Tsaur System for measuring peeling force of adhesives
KR20130138294A (ko) 2010-12-16 2013-12-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 상호침투 중합체 층
WO2013181133A1 (en) * 2012-05-31 2013-12-05 3M Innovative Properties Company An adhesive article
DE102013218985A1 (de) * 2013-09-20 2015-03-26 Tesa Se Trennbeschichtung mit definierter Oberflächenstruktur
US20160324241A2 (en) * 2014-08-08 2016-11-10 Yo Han Lee An adhesive device for attaching a false eyelash and a false eyelash kit
GB2544335A (en) 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6779820B2 (ja) 2017-03-24 2020-11-04 株式会社東芝 電極、二次電池、電池パック及び車両
KR102568434B1 (ko) * 2018-06-22 2023-08-18 산진 옵토일렉트로닉스 (쑤저우) 컴퍼니 리미티드 편광판의 적정 재단 조건 도출 방법
EP3587527A1 (en) 2018-06-30 2020-01-01 3M Innovative Properties Company Full (per)fluoro polymer liner for adhesive tapes
CN112469792B (zh) 2018-07-29 2024-02-27 Bvw控股公司 带有吸力的图案化表面
EP3838591B1 (en) 2019-12-20 2024-05-01 Mondi AG Release liner for repositionable adhesive articles
EP4019602A1 (en) * 2020-12-27 2022-06-29 3M Innovative Properties Company Low tack structural adhesive for shear bonding of magnets in electrical motors

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5154974A (en) * 1986-06-23 1992-10-13 Norman Alfred W Adhesive composition having improved cutting properties
US5290842A (en) * 1991-09-03 1994-03-01 Avery Dennison Corporation Pressure-sensitive adhesives based on preferentially tackified immiscible elastomers
JPH05732A (ja) 1991-03-29 1993-01-08 Fuji Photo Film Co Ltd 用紙捌き機能を備えた自動給紙装置
JP2519775Y2 (ja) * 1991-06-14 1996-12-11 新王子製紙株式会社 ダブル粘着シート
JPH0734045A (ja) * 1993-07-21 1995-02-03 Sekisui Chem Co Ltd 粘着テープの側面処理方法
US6440880B2 (en) * 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
CA2173855C (en) * 1993-10-29 2007-06-26 Mieczyslaw H. Mazurek Pressure-sensitive adhesives having microstructured surfaces
US5468815A (en) * 1994-01-12 1995-11-21 Minnesota Mining And Manufacturing Low coefficient of friction silicone release formulations incorporating higher alkenyl-functional silicone gums
US6074747A (en) * 1995-06-06 2000-06-13 Avery Dennison Corporation Ink-imprintable release coatings, and pressure sensitive adhesive constructions
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
US6521309B1 (en) * 1999-11-11 2003-02-18 Tyco Adhesives Lp Double-sided single-liner pressure-sensitive adhesive tape
US20010052384A1 (en) * 2000-04-24 2001-12-20 Michael Hannington Adhesive articles with improved air egress and methods of making the same
US6579941B1 (en) * 2000-06-12 2003-06-17 Avery Dennison Corporatoin Adhesive compositions and constructions with outstanding cutting performance
BR0112352B1 (pt) * 2000-06-27 2013-03-19 adesivo para a fabricaÇço de etiquetas ou fitas adesivas compreendendo um copolÍmero estirÊnico em blocos tornado aderente e processo para a produÇço de etiquetas.
US20030017291A1 (en) 2001-03-14 2003-01-23 Fleming Danny L. Adhesive layers and release liners with pyramidal structures
US6805933B2 (en) * 2001-07-31 2004-10-19 3M Innovative Properties Company Articles comprising a release liner having a high coefficient of friction and good roll stability
JP4398629B2 (ja) 2002-05-24 2010-01-13 リンテック株式会社 粘着シート
EP1685206B1 (en) * 2003-11-21 2012-09-05 3M Innovative Properties Company Structured paper release liner, adhesive-backed article assembly and method of making same
WO2006076116A1 (en) * 2005-01-12 2006-07-20 Avery Dennison Corporation Adhesive article having improved application properties
US20060228480A1 (en) * 2005-03-30 2006-10-12 David Lin Method of manufacturing a release liner
US7687126B2 (en) * 2005-08-22 2010-03-30 3M Innovative Properties Company Adhesive articles and release liners
US7279210B2 (en) * 2005-09-07 2007-10-09 3M Innovative Properties Company Curable compositions, methods of making and using the same, and articles therefrom
EP1946365A2 (en) * 2005-10-13 2008-07-23 CPFilms Inc. An electrically conductive release liner
DE102005061766A1 (de) * 2005-12-23 2007-06-28 Lohmann Gmbh & Co Kg Abdeckung mit feinen Oberflächenstrukturen zur Verminderung der Luftblasenbildung bei der Applikation klebender Erzeugnisse
DE102006043259A1 (de) * 2006-09-11 2008-06-19 Tesa Ag Verfahren zur Herstellung eines doppelseitigen Haftklebebandes und seine Verwendung
US20080226698A1 (en) 2007-03-16 2008-09-18 Mylan Technologies, Inc. Amorphous drug transdermal systems, manufacturing methods, and stabilization
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
US8309207B2 (en) * 2009-02-05 2012-11-13 Avery Dennison Corporation Adhesive articles with improved air egress

Also Published As

Publication number Publication date
CN102015938A (zh) 2011-04-13
EP2285924B1 (en) 2014-06-11
JP2014177123A (ja) 2014-09-25
WO2009131792A1 (en) 2009-10-29
EP2285924A1 (en) 2011-02-23
JP2011518063A (ja) 2011-06-23
BRPI0910661A2 (pt) 2017-05-16
US9065675B2 (en) 2015-06-23
CN102015938B (zh) 2014-12-17
US20110039067A1 (en) 2011-02-17

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