CN102015938B - 粘合剂制品 - Google Patents
粘合剂制品 Download PDFInfo
- Publication number
- CN102015938B CN102015938B CN200980114227.6A CN200980114227A CN102015938B CN 102015938 B CN102015938 B CN 102015938B CN 200980114227 A CN200980114227 A CN 200980114227A CN 102015938 B CN102015938 B CN 102015938B
- Authority
- CN
- China
- Prior art keywords
- adhesive
- release
- release layer
- adhesive article
- microstructured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L12/40006—Architecture of a communication node
- H04L12/40032—Details regarding a bus interface enhancer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2421/00—Presence of unspecified rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/005—Presence of polyolefin in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40208—Bus networks characterized by the use of a particular bus standard
- H04L2012/40254—Actuator Sensor Interface ASI
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/4026—Bus for use in automation systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4700008P | 2008-04-22 | 2008-04-22 | |
| US61/047,000 | 2008-04-22 | ||
| PCT/US2009/038478 WO2009131792A1 (en) | 2008-04-22 | 2009-03-27 | Adhesive article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102015938A CN102015938A (zh) | 2011-04-13 |
| CN102015938B true CN102015938B (zh) | 2014-12-17 |
Family
ID=41217124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980114227.6A Expired - Fee Related CN102015938B (zh) | 2008-04-22 | 2009-03-27 | 粘合剂制品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9065675B2 (enExample) |
| EP (1) | EP2285924B1 (enExample) |
| JP (2) | JP2011518063A (enExample) |
| CN (1) | CN102015938B (enExample) |
| BR (1) | BRPI0910661A2 (enExample) |
| PL (1) | PL2285924T3 (enExample) |
| WO (1) | WO2009131792A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8302366B2 (en) * | 2009-03-09 | 2012-11-06 | Custom Building Products, Inc. | Mortarless tile installation system and method for installing tiles |
| US8490356B2 (en) * | 2009-03-09 | 2013-07-23 | Custom Building Products, Inc. | Mortarless tile installation system and method for installing tiles |
| TWM411562U (en) * | 2010-09-16 | 2011-09-11 | Tung-Yuan Tsaur | System for measuring peeling force of adhesives |
| CN103261291B (zh) | 2010-12-16 | 2015-01-28 | 3M创新有限公司 | 互穿聚合物层 |
| CN104321397B (zh) * | 2012-05-31 | 2017-04-05 | 3M创新有限公司 | 粘合剂制品 |
| DE102013218985A1 (de) * | 2013-09-20 | 2015-03-26 | Tesa Se | Trennbeschichtung mit definierter Oberflächenstruktur |
| US20160324241A2 (en) * | 2014-08-08 | 2016-11-10 | Yo Han Lee | An adhesive device for attaching a false eyelash and a false eyelash kit |
| GB2544335A (en) | 2015-11-13 | 2017-05-17 | Oculus Vr Llc | A method and apparatus for use in the manufacture of a display element |
| JP6779820B2 (ja) | 2017-03-24 | 2020-11-04 | 株式会社東芝 | 電極、二次電池、電池パック及び車両 |
| KR102568434B1 (ko) * | 2018-06-22 | 2023-08-18 | 산진 옵토일렉트로닉스 (쑤저우) 컴퍼니 리미티드 | 편광판의 적정 재단 조건 도출 방법 |
| EP3587527A1 (en) | 2018-06-30 | 2020-01-01 | 3M Innovative Properties Company | Full (per)fluoro polymer liner for adhesive tapes |
| CN112469792B (zh) | 2018-07-29 | 2024-02-27 | Bvw控股公司 | 带有吸力的图案化表面 |
| WO2021084703A1 (ja) * | 2019-10-31 | 2021-05-06 | リンテック株式会社 | 剥離ライナーおよび粘着シート |
| HUE068030T2 (hu) | 2019-12-20 | 2024-12-28 | Mondi Ag | Lehúzható védõfólia áthelyezhetõ ragadó cikkekhez |
| EP4019602A1 (en) * | 2020-12-27 | 2022-06-29 | 3M Innovative Properties Company | Low tack structural adhesive for shear bonding of magnets in electrical motors |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1352674A (zh) * | 1999-05-13 | 2002-06-05 | 3M创新有限公司 | 背面有粘合剂的制品 |
| US20070054080A1 (en) * | 2005-09-07 | 2007-03-08 | 3M Innovative Properties Company | Curable compositions, methods of making and using the same, and articles therefrom |
| WO2008031751A1 (de) * | 2006-09-11 | 2008-03-20 | Tesa Ag | Verfahren zur herstellung eines doppelseitigen haftklebebandes und seine verwendung |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5154974A (en) * | 1986-06-23 | 1992-10-13 | Norman Alfred W | Adhesive composition having improved cutting properties |
| US5290842A (en) * | 1991-09-03 | 1994-03-01 | Avery Dennison Corporation | Pressure-sensitive adhesives based on preferentially tackified immiscible elastomers |
| JPH05732A (ja) | 1991-03-29 | 1993-01-08 | Fuji Photo Film Co Ltd | 用紙捌き機能を備えた自動給紙装置 |
| JP2519775Y2 (ja) * | 1991-06-14 | 1996-12-11 | 新王子製紙株式会社 | ダブル粘着シート |
| JPH0734045A (ja) * | 1993-07-21 | 1995-02-03 | Sekisui Chem Co Ltd | 粘着テープの側面処理方法 |
| KR100314563B1 (ko) * | 1993-10-29 | 2002-04-24 | 스프레이그 로버트 월터 | 미세구조표면을갖는압감접착제 |
| US6440880B2 (en) * | 1993-10-29 | 2002-08-27 | 3M Innovative Properties Company | Pressure-sensitive adhesives having microstructured surfaces |
| US5468815A (en) * | 1994-01-12 | 1995-11-21 | Minnesota Mining And Manufacturing | Low coefficient of friction silicone release formulations incorporating higher alkenyl-functional silicone gums |
| US6074747A (en) * | 1995-06-06 | 2000-06-13 | Avery Dennison Corporation | Ink-imprintable release coatings, and pressure sensitive adhesive constructions |
| US6312800B1 (en) * | 1997-02-10 | 2001-11-06 | Lintec Corporation | Pressure sensitive adhesive sheet for producing a chip |
| US6521309B1 (en) * | 1999-11-11 | 2003-02-18 | Tyco Adhesives Lp | Double-sided single-liner pressure-sensitive adhesive tape |
| US20010052384A1 (en) * | 2000-04-24 | 2001-12-20 | Michael Hannington | Adhesive articles with improved air egress and methods of making the same |
| US6579941B1 (en) * | 2000-06-12 | 2003-06-17 | Avery Dennison Corporatoin | Adhesive compositions and constructions with outstanding cutting performance |
| WO2002000806A2 (en) * | 2000-06-27 | 2002-01-03 | Exxonmobil Chemical Patents Inc. | Adhesives with improved die-cutting performance |
| US20030017291A1 (en) * | 2001-03-14 | 2003-01-23 | Fleming Danny L. | Adhesive layers and release liners with pyramidal structures |
| US6805933B2 (en) * | 2001-07-31 | 2004-10-19 | 3M Innovative Properties Company | Articles comprising a release liner having a high coefficient of friction and good roll stability |
| JP4398629B2 (ja) | 2002-05-24 | 2010-01-13 | リンテック株式会社 | 粘着シート |
| WO2005052082A1 (en) * | 2003-11-21 | 2005-06-09 | 3M Innovative Properties Company | Structured paper release liner, adhesive-backed article assembly and method of making same |
| US8252407B2 (en) * | 2005-01-12 | 2012-08-28 | Avery Dennison Corporation | Adhesive article having improved application properties |
| US20060228480A1 (en) * | 2005-03-30 | 2006-10-12 | David Lin | Method of manufacturing a release liner |
| US7687126B2 (en) * | 2005-08-22 | 2010-03-30 | 3M Innovative Properties Company | Adhesive articles and release liners |
| WO2007042772A2 (en) * | 2005-10-13 | 2007-04-19 | Cpfilms Inc | An electrically conductive release liner |
| DE102005061766A1 (de) * | 2005-12-23 | 2007-06-28 | Lohmann Gmbh & Co Kg | Abdeckung mit feinen Oberflächenstrukturen zur Verminderung der Luftblasenbildung bei der Applikation klebender Erzeugnisse |
| US20080226698A1 (en) * | 2007-03-16 | 2008-09-18 | Mylan Technologies, Inc. | Amorphous drug transdermal systems, manufacturing methods, and stabilization |
| US8334037B2 (en) * | 2007-05-11 | 2012-12-18 | 3M Innovative Properties Company | Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same |
| US8309207B2 (en) * | 2009-02-05 | 2012-11-13 | Avery Dennison Corporation | Adhesive articles with improved air egress |
-
2009
- 2009-03-27 BR BRPI0910661A patent/BRPI0910661A2/pt not_active IP Right Cessation
- 2009-03-27 PL PL09733966T patent/PL2285924T3/pl unknown
- 2009-03-27 JP JP2011506329A patent/JP2011518063A/ja not_active Withdrawn
- 2009-03-27 WO PCT/US2009/038478 patent/WO2009131792A1/en not_active Ceased
- 2009-03-27 EP EP09733966.7A patent/EP2285924B1/en not_active Not-in-force
- 2009-03-27 US US12/988,114 patent/US9065675B2/en not_active Expired - Fee Related
- 2009-03-27 CN CN200980114227.6A patent/CN102015938B/zh not_active Expired - Fee Related
-
2014
- 2014-03-12 JP JP2014049048A patent/JP2014177123A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1352674A (zh) * | 1999-05-13 | 2002-06-05 | 3M创新有限公司 | 背面有粘合剂的制品 |
| US20070054080A1 (en) * | 2005-09-07 | 2007-03-08 | 3M Innovative Properties Company | Curable compositions, methods of making and using the same, and articles therefrom |
| WO2008031751A1 (de) * | 2006-09-11 | 2008-03-20 | Tesa Ag | Verfahren zur herstellung eines doppelseitigen haftklebebandes und seine verwendung |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009131792A1 (en) | 2009-10-29 |
| EP2285924B1 (en) | 2014-06-11 |
| JP2011518063A (ja) | 2011-06-23 |
| EP2285924A1 (en) | 2011-02-23 |
| JP2014177123A (ja) | 2014-09-25 |
| BRPI0910661A2 (pt) | 2017-05-16 |
| US20110039067A1 (en) | 2011-02-17 |
| PL2285924T3 (pl) | 2014-11-28 |
| US9065675B2 (en) | 2015-06-23 |
| CN102015938A (zh) | 2011-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20200327 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |