JP2011516714A5 - - Google Patents
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- Publication number
- JP2011516714A5 JP2011516714A5 JP2011505086A JP2011505086A JP2011516714A5 JP 2011516714 A5 JP2011516714 A5 JP 2011516714A5 JP 2011505086 A JP2011505086 A JP 2011505086A JP 2011505086 A JP2011505086 A JP 2011505086A JP 2011516714 A5 JP2011516714 A5 JP 2011516714A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- imidazole
- amine
- epoxy resins
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 83
- 229920000647 polyepoxide Polymers 0.000 claims description 41
- 239000003822 epoxy resin Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 37
- 239000003054 catalyst Substances 0.000 claims description 30
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 25
- 150000001412 amines Chemical class 0.000 claims description 21
- 239000007787 solid Substances 0.000 claims description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920000151 polyglycol Polymers 0.000 claims description 6
- 239000010695 polyglycol Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004634 thermosetting polymer Substances 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000012744 reinforcing agent Substances 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4483008P | 2008-04-14 | 2008-04-14 | |
| US61/044,830 | 2008-04-14 | ||
| PCT/US2009/039771 WO2009129088A1 (en) | 2008-04-14 | 2009-04-07 | Epoxy-imidazole catalysts useful for powder coating applications |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013272543A Division JP5934176B2 (ja) | 2008-04-14 | 2013-12-27 | 粉末コーティング用途に有用なエポキシ−イミダゾール触媒 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011516714A JP2011516714A (ja) | 2011-05-26 |
| JP2011516714A5 true JP2011516714A5 (https=) | 2012-05-24 |
Family
ID=40823427
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011505086A Withdrawn JP2011516714A (ja) | 2008-04-14 | 2009-04-07 | 粉末コーティング用途に有用なエポキシ−イミダゾール触媒 |
| JP2013272543A Expired - Fee Related JP5934176B2 (ja) | 2008-04-14 | 2013-12-27 | 粉末コーティング用途に有用なエポキシ−イミダゾール触媒 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013272543A Expired - Fee Related JP5934176B2 (ja) | 2008-04-14 | 2013-12-27 | 粉末コーティング用途に有用なエポキシ−イミダゾール触媒 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110028602A1 (https=) |
| EP (1) | EP2268697B1 (https=) |
| JP (2) | JP2011516714A (https=) |
| KR (2) | KR20160007668A (https=) |
| CN (1) | CN101998970B (https=) |
| BR (1) | BRPI0907275A2 (https=) |
| TW (1) | TWI481636B (https=) |
| WO (1) | WO2009129088A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5420212B2 (ja) | 2007-10-31 | 2014-02-19 | アクゾ ノーベル コーティングス インターナショナル ビー ヴィ | スチール用耐薄チップパウダートップコート |
| PL2240544T3 (pl) | 2008-01-25 | 2017-06-30 | Akzo Nobel Coatings International B.V. | Proszkowe kompozycje powłokowe posiadające podkład zasadniczo nie zawierający cynku |
| EP2236563A3 (en) | 2009-04-03 | 2010-12-08 | Rohm and Haas Company | Powder corrosion and chip-resistant coating |
| WO2011012627A2 (en) | 2009-07-29 | 2011-02-03 | Akzo Nobel Coatings International B.V. | Powder coating compositions capable of having a substantially non-zinc containing primer |
| RU2479601C1 (ru) * | 2012-03-02 | 2013-04-20 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") | Эпоксидная композиция холодного отверждения |
| CN103214796B (zh) * | 2013-04-28 | 2014-04-09 | 纽宝力精化(广州)有限公司 | 环氧树脂组合物、其制备方法以及其所制备的覆铜板 |
| CN103965435B (zh) * | 2014-04-09 | 2016-07-06 | 天津翔盛粉末涂料有限公司 | 一种粉末涂料用咪唑改性环氧胺加合物及其制备方法和应用 |
| JP6413444B2 (ja) * | 2014-07-31 | 2018-10-31 | 味の素株式会社 | 樹脂シート、積層シート、積層板及び半導体装置 |
| US9617373B2 (en) | 2015-02-13 | 2017-04-11 | LCY Chemical Corp. | Curable resin composition, article, and method for fabricating the same |
| KR101741652B1 (ko) * | 2015-05-08 | 2017-06-01 | 주식회사 케이씨씨 | 분체 도료용 잠재성 경화제 및 이를 포함하는 에폭시 분체 도료 조성물 |
| JP6637253B2 (ja) * | 2015-05-12 | 2020-01-29 | 株式会社Adeka | エポキシ樹脂組成物、及び、それを用いた繊維強化プラスチック |
| DE102016203867A1 (de) * | 2016-03-09 | 2017-09-14 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
| KR101958520B1 (ko) * | 2016-10-10 | 2019-03-14 | 주식회사 케이씨씨 | 분체 도료 조성물 |
| US20190330411A1 (en) * | 2018-04-26 | 2019-10-31 | Sabic Global Technologies B.V. | Curable epoxy compositions |
| EP3560977B1 (en) * | 2018-04-26 | 2022-06-01 | SHPP Global Technologies B.V. | Curable epoxy compositions |
| EP3560979B1 (en) * | 2018-04-26 | 2021-06-23 | SHPP Global Technologies B.V. | Curing agent compositions for thermosetting epoxy resin compositions |
| EP3560978A1 (en) * | 2018-04-26 | 2019-10-30 | SABIC Global Technologies B.V. | High heat thermoset epoxy compositions |
| US11820915B2 (en) | 2018-12-14 | 2023-11-21 | Swimc Llc | Fusion bonded epoxy rebar powder coatings |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2750395A (en) | 1954-01-05 | 1956-06-12 | Union Carbide & Carbon Corp | Diepoxides |
| US2890194A (en) * | 1956-05-24 | 1959-06-09 | Union Carbide Corp | Compositions of epoxides and polycarboxylic acid compounds |
| US3018262A (en) | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
| US4066625A (en) * | 1967-05-02 | 1978-01-03 | Amicon Corporation | Unitary curable resin compositions |
| FR1566468A (https=) * | 1968-03-04 | 1969-05-09 | ||
| US5066735A (en) | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
| CN1040810A (zh) | 1988-04-30 | 1990-03-28 | 三井东圧化学株式会社 | 多硫化合物基树脂透镜及其制备方法 |
| JPH03115331A (ja) * | 1989-09-28 | 1991-05-16 | Nippon Oil Co Ltd | プリプレグ用エポキシ樹脂組成物 |
| JPH03275714A (ja) * | 1990-03-23 | 1991-12-06 | Nippon Steel Chem Co Ltd | エポキシ樹脂用硬化剤組成物およびこれを含有するエポキシ樹脂組成物 |
| US5135993A (en) | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
| KR930010077A (ko) * | 1991-11-22 | 1993-06-22 | 알베르투스 빌헬무스 요 아네스 째스트 라텐 | 에폭시 이미다졸 첨가물 및 에폭시 수지 조성물 |
| DE4142575A1 (de) * | 1991-12-21 | 1993-06-24 | Basf Ag | Poly(meth)acrylimide |
| GB9411367D0 (en) | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
| TW448197B (en) * | 1996-07-22 | 2001-08-01 | Dow Chemical Co | A process to make a curable composition, a curable composition, a process to cure the composition, and a catalyst and/or curing agent product for epoxy resins |
| US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| DE59810370D1 (de) * | 1997-02-07 | 2004-01-22 | Vantico Ag | Pulverlack |
| DE69703739T2 (de) | 1997-10-02 | 2001-06-13 | Hexcel Corp., Pleasanton | Epoxidharzhärter |
| US6703070B1 (en) * | 1997-11-04 | 2004-03-09 | Morton International, Inc. | One-component, low temperature curable coating powder |
| JPH11140277A (ja) | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
| US6153719A (en) | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
| CA2269378C (en) * | 1998-04-17 | 2008-04-01 | Ajinomoto Co., Inc. | Curable resin composition |
| GB9827367D0 (en) * | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
| US6632893B2 (en) | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
| US6572971B2 (en) | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
| US6632860B1 (en) | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
| MXPA03002222A (es) * | 2002-03-28 | 2004-10-29 | Rohm & Haas | Polvos de recubrimiento, metodos para su elaboracion y articulos formados a partir de los mismos. |
| GB0212062D0 (en) | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| US7163973B2 (en) | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
| WO2004060956A1 (en) * | 2002-12-17 | 2004-07-22 | Dow Global Technologies Inc. | Amine-epoxy autocatalytic polymers and polyurethane products made therefrom |
| US6887574B2 (en) | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
| JP3837134B2 (ja) * | 2004-01-26 | 2006-10-25 | 富士化成工業株式会社 | 一成分系加熱硬化性エポキシド組成物 |
| RU2395545C2 (ru) | 2004-11-10 | 2010-07-27 | Дау Глобал Текнолоджиз Инк. | Эпоксидные смолы, упрочненные амфифильными блок-сополимерами, и электроизоляционные ламинаты, выполненные с ними |
| US8048819B2 (en) | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
-
2009
- 2009-04-07 KR KR1020157037037A patent/KR20160007668A/ko not_active Ceased
- 2009-04-07 EP EP09733268.8A patent/EP2268697B1/en not_active Not-in-force
- 2009-04-07 BR BRPI0907275-6A patent/BRPI0907275A2/pt not_active IP Right Cessation
- 2009-04-07 CN CN200980112915.9A patent/CN101998970B/zh not_active Expired - Fee Related
- 2009-04-07 KR KR1020107025166A patent/KR101582881B1/ko not_active Expired - Fee Related
- 2009-04-07 JP JP2011505086A patent/JP2011516714A/ja not_active Withdrawn
- 2009-04-07 US US12/935,699 patent/US20110028602A1/en not_active Abandoned
- 2009-04-07 WO PCT/US2009/039771 patent/WO2009129088A1/en not_active Ceased
- 2009-04-13 TW TW098112169A patent/TWI481636B/zh active
-
2013
- 2013-12-27 JP JP2013272543A patent/JP5934176B2/ja not_active Expired - Fee Related
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