JP2011516620A - マイクロエレクトロニクス基板洗浄用組成物 - Google Patents
マイクロエレクトロニクス基板洗浄用組成物 Download PDFInfo
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- JP2011516620A JP2011516620A JP2010548782A JP2010548782A JP2011516620A JP 2011516620 A JP2011516620 A JP 2011516620A JP 2010548782 A JP2010548782 A JP 2010548782A JP 2010548782 A JP2010548782 A JP 2010548782A JP 2011516620 A JP2011516620 A JP 2011516620A
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- tetrafluoroborate
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- 239000000203 mixture Substances 0.000 title claims abstract description 85
- 238000004140 cleaning Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 238000004377 microelectronic Methods 0.000 title claims abstract description 23
- -1 tetrafluoroborate ions Chemical class 0.000 claims abstract description 30
- 239000006117 anti-reflective coating Substances 0.000 claims abstract description 17
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 15
- 150000003457 sulfones Chemical class 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 14
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000004380 ashing Methods 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 abstract description 8
- 239000010949 copper Substances 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- HRSFRSLKOPFWMZ-UHFFFAOYSA-N (3,4,5-trifluorophenyl)methanol Chemical compound OCC1=CC(F)=C(F)C(F)=C1 HRSFRSLKOPFWMZ-UHFFFAOYSA-N 0.000 description 1
- AIDFJGKWTOULTC-UHFFFAOYSA-N 1-butylsulfonylbutane Chemical compound CCCCS(=O)(=O)CCCC AIDFJGKWTOULTC-UHFFFAOYSA-N 0.000 description 1
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- 229910016553 CuOx Inorganic materials 0.000 description 1
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- HEBKCHPVOIAQTA-QWWZWVQMSA-N D-arabinitol Chemical compound OC[C@@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-QWWZWVQMSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- ZTOGYGRJDIWKAQ-UHFFFAOYSA-N cyclohexene-1,2-diamine Chemical compound NC1=C(N)CCCC1 ZTOGYGRJDIWKAQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- VBQUDDWATQWCPP-UHFFFAOYSA-N ethylsulfonylbenzene Chemical compound CCS(=O)(=O)C1=CC=CC=C1 VBQUDDWATQWCPP-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- JCDWETOKTFWTHA-UHFFFAOYSA-N methylsulfonylbenzene Chemical compound CS(=O)(=O)C1=CC=CC=C1 JCDWETOKTFWTHA-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910001495 sodium tetrafluoroborate Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000000811 xylitol Substances 0.000 description 1
- 235000010447 xylitol Nutrition 0.000 description 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 1
- 229960002675 xylitol Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
本発明は、プラズマエッチング後またはエッチング/アッシング後の残渣ならびにシリコン系反射防止コーティングを除去してマイクロエレクトロニクス基板を洗浄する際に有用な組成物であって、さらにそのような能力を有する一方でアルミニウム、銅および低k誘電体、特に多孔質低k誘電体と親和性を有する組成物に関する。特に、本発明は、実質的に溶媒系の除去剤組成物を提供するとともに、マイクロエレクトロニクス基板を洗浄する方法ならびにそのような組成物を用いたデバイスも提供する。
半導体デバイスは、無機基板をフォトレジストでコーティングする工程と;フォトレジスト膜を露光した後に現像してパターン化する工程と;無機基板の露光領域をパターン化したフォトレジスト膜をマスクとして用いてエッチングし、微細回路を形成する工程と;パターン化したフォトレジスト膜を無機基板から除去する工程により製造されている。代替的には、上記と同様に微細回路を形成した後に、パターン化したフォトレジスト膜をアッシングし、その後に残ったレジスト残渣を無機基板から除去する。
本発明の残渣除去洗浄用組成物は、酸性のテトラフルオロホウ酸塩含有溶媒系組成物である。これらの組成物は、pHが3以下であり、約80重量パーセント〜約99重量パーセントのスルホン溶媒、約0.25重量パーセント〜19重量パーセントの水、テトラフルオロホウ酸塩イオン(BF4 ̄)を提供する約0.25重量パーセント〜10重量パーセントの少なくとも1つの成分を含有する。上記組成物は、キレート剤、多価アルコール、界面活性剤および酸を含有してもよい。本発明の組成物は、特に、Si含有反射防止コーティングを含有し、下側に低k誘電体層、特に、任意の多孔質低k誘電体層を有するマイクロエレクトロニクス基板から、マイクロエレクトロニクス基板の洗浄によりエッチング/アッシング残渣を除去するために用いてもよい。マイクロエレクトロニクス基板またはデバイスの洗浄を行うために、マイクロエレクトロニクス基板またはデバイスを本発明の組成物に対して、そのような洗浄を達成するために十分な時間と温度で接触させる。
本発明の残渣除去洗浄用組成物は、酸性のテトラフルオロホウ酸塩を含有する有機スルホン溶媒系組成物である。これらの組成物は、pHが3以下であり、約80重量%〜約99重量%の少なくとも1つのスルホン溶媒、約0.25重量%〜約19重量%の水および約0.25重量%〜約10重量%のテトラフルオロホウ酸塩イオン(BF4 ̄)を提供する少なくとも1つの成分を含有する。
Claims (16)
- マイクロエレクトロニクス基板洗浄用組成物であって、該組成物は、
a)該組成物の約80重量%〜約99重量%の少なくとも1つの有機スルホンと;
b)該組成物約0.25重量%〜約19重量%の水と;
c)該組成物の約0.25重量%〜約10重量%のテトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分と、を含み、
該組成物の10重量%水溶液としての該組成物のpHは3以下である、マイクロエレクトロニクス基板洗浄用組成物。 - 約1重量%〜約10重量%の少なくとも1つの多価アルコールをさらに含む、請求項1に記載のマイクロエレクトロニクス基板洗浄用組成物。
- 前記スルホンはスルホランを含む、請求項1に記載のマイクロエレクトロニクス基板洗浄用組成物。
- 前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項1に記載のマイクロエレクトロニクス基板洗浄用組成物。
- 前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項3に記載のマイクロエレクトロニクス基板洗浄用組成物。
- 多価アルコールはグリセロールを含む、請求項2に記載のマイクロエレクトロニクス基板洗浄用組成物。
- 前記少なくとも1つのスルホンはスルホランを含み、前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項6に記載のマイクロエレクトロニクス基板洗浄用組成物。
- マイクロエレクトロニクス基板またはデバイスのエッチング/アッシング後の残渣を洗浄するプロセスであって、前記プロセスは、
該マイクロエレクトロニクス基板またはデバイスと、下記:
a)該組成物の約80重量%〜約99重量%の少なくとも1つの有機スルホン;
b)該組成物の約0.25重量%〜約19重量%の水;および
c)該組成物の約0.25重量%〜約10重量%のテトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分
を含む洗浄用組成物とを接触させる工程を包含し、
該組成物の10重量%水溶液としての該組成物のpHは3以下である、プロセス。 - 前記洗浄用組成物は約1重量%〜約10重量%の少なくとも1つの多価アルコールをさらに含む、請求項8に記載のプロセス。
- 前記スルホンはスルホランを含む、請求項8に記載のプロセス。
- 前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項8に記載のプロセス。
- 前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項10に記載のプロセス。
- 多価アルコールはグリセロールを含む、請求項9に記載のプロセス。
- 前記少なくとも1つのスルホンはスルホランを含み、前記テトラフルオロホウ酸塩イオンを提供する少なくとも1つの成分はテトラフルオロホウ酸を含む、請求項13に記載のプロセス。
- 前記マイクロエレクトロニクス基板またはデバイスはSi系反射防止コーティングおよび低k誘電体を含む、請求項8に記載のプロセス。
- 前記マイクロエレクトロニクス基板またはデバイスはSi系反射防止コーティングおよび低k誘電体を含む、請求項14に記載のプロセス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3244908P | 2008-02-29 | 2008-02-29 | |
US61/032,449 | 2008-02-29 | ||
PCT/US2009/033148 WO2009108474A1 (en) | 2008-02-29 | 2009-02-05 | Microelectronic substrate cleaning compositions |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011516620A true JP2011516620A (ja) | 2011-05-26 |
JP2011516620A5 JP2011516620A5 (ja) | 2012-03-22 |
JP5512554B2 JP5512554B2 (ja) | 2014-06-04 |
Family
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WO2018181901A1 (ja) * | 2017-03-31 | 2018-10-04 | 関東化學株式会社 | 洗浄液組成物 |
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CN101838483B (zh) * | 2010-05-11 | 2012-07-04 | 华北电网有限公司北京超高压公司 | 一种溶解型防污闪涂层清除剂及其制备方法 |
CN115386954A (zh) * | 2022-09-17 | 2022-11-25 | 中国科学院新疆理化技术研究所 | 化合物氟硼酸锂钠和氟硼酸锂钠双折射晶体及制备方法和用途 |
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- 2009-02-05 KR KR1020107019104A patent/KR101570256B1/ko active IP Right Grant
- 2009-02-05 JP JP2010548782A patent/JP5512554B2/ja active Active
- 2009-02-05 BR BRPI0908905A patent/BRPI0908905A2/pt not_active IP Right Cessation
- 2009-02-05 EP EP09714861.3A patent/EP2247672B1/en not_active Not-in-force
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Also Published As
Publication number | Publication date |
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CN101959977B (zh) | 2013-12-04 |
TW200942608A (en) | 2009-10-16 |
BRPI0908905A2 (pt) | 2015-09-22 |
EP2247672A1 (en) | 2010-11-10 |
US8168577B2 (en) | 2012-05-01 |
WO2009108474A1 (en) | 2009-09-03 |
IL207605A0 (en) | 2010-12-30 |
KR101570256B1 (ko) | 2015-11-18 |
US20110046036A1 (en) | 2011-02-24 |
ZA201005419B (en) | 2011-04-28 |
CN101959977A (zh) | 2011-01-26 |
EP2247672B1 (en) | 2013-06-05 |
IL207605A (en) | 2014-02-27 |
JP5512554B2 (ja) | 2014-06-04 |
CA2716641A1 (en) | 2009-09-03 |
KR20100125270A (ko) | 2010-11-30 |
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