JP2011514433A - 原子層堆積法のための溶液系ランタン前駆体 - Google Patents
原子層堆積法のための溶液系ランタン前駆体 Download PDFInfo
- Publication number
- JP2011514433A JP2011514433A JP2010533170A JP2010533170A JP2011514433A JP 2011514433 A JP2011514433 A JP 2011514433A JP 2010533170 A JP2010533170 A JP 2010533170A JP 2010533170 A JP2010533170 A JP 2010533170A JP 2011514433 A JP2011514433 A JP 2011514433A
- Authority
- JP
- Japan
- Prior art keywords
- lanthanum
- precursor
- ald
- tris
- cyclopentadienyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Abstract
【選択図】図1
Description
この出願は、2007年11月6日出願の、米国特許仮出願第61/001,969号からの優先権を請求する。
Claims (9)
- ランタンアルキルシクロペンタジエニル化合物を含む原子層堆積法のための前駆体。
- ランタン(III)イソプロポキシド、トリス(N,N−ビス(トリメチルシリル)アミド)ランタン、トリス(シクロペンタジエニル)ランタン、又はトリス(イソプロピル−シクロペンタジエニル)ランタンを含む、請求項1に記載の前駆体。
- トリス(イソプロピル−シクロペンタジエニル)ランタンを含む、請求項2に記載の前駆体。
- ランタンアルキルシクロペンタジエニル化合物を含む前駆体を用いた原子層堆積法によって堆積させたランタン酸化物層。
- ランタンアルキルシクロペンタジエニル化合物は、ランタン(III)イソプロポキシド、トリス(N,N−ビス(トリメチルシリル)アミド)ランタン、トリス(シクロペンタジエニル)ランタン、又はトリス(イソプロピル−シクロペンタジエニル)ランタンである、請求項4に記載のランタン酸化物層。
- ランタンアルキルシクロペンタジエニル化合物は、トリス(イソプロピル−シクロペンタジエニル)ランタンである、請求項5に記載のランタン酸化物層。
- ランタンアルキルシクロペンタジエニル化合物を含む前駆体を用いる原子層堆積法を実行することを含む、ランタン酸化物層を堆積させる方法。
- ランタンアルキルシクロペンタジエニル化合物は、ランタン(III)イソプロポキシド、トリス(N,N−ビス(トリメチルシリル)アミド)ランタン、トリス(シクロペンタジエニル)ランタン、又はトリス(イソプロピル−シクロペンタジエニル)ランタンである、請求項7に記載の方法。
- ランタンアルキルシクロペンタジエニル化合物は、トリス(イソプロピル−シクロペンタジエニル)ランタンである、請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US196907P | 2007-11-06 | 2007-11-06 | |
US12/261,169 US20090117274A1 (en) | 2007-11-06 | 2008-10-30 | Solution based lanthanum precursors for atomic layer deposition |
PCT/US2008/081912 WO2009061668A1 (en) | 2007-11-06 | 2008-10-31 | Solution based lanthanum precursors for atomic layer deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011514433A true JP2011514433A (ja) | 2011-05-06 |
Family
ID=40588325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010533170A Pending JP2011514433A (ja) | 2007-11-06 | 2008-10-31 | 原子層堆積法のための溶液系ランタン前駆体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090117274A1 (ja) |
EP (1) | EP2220266A4 (ja) |
JP (1) | JP2011514433A (ja) |
KR (1) | KR20100084182A (ja) |
TW (1) | TW200938653A (ja) |
WO (1) | WO2009061668A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012532193A (ja) * | 2009-07-06 | 2012-12-13 | リンデ アクチエンゲゼルシャフト | 溶液型の先駆物質 |
WO2015093389A1 (ja) * | 2013-12-18 | 2015-06-25 | 文彦 廣瀬 | 酸化物薄膜の形成方法および装置 |
JP2017019777A (ja) * | 2015-07-07 | 2017-01-26 | 三星電子株式会社Samsung Electronics Co.,Ltd. | ランタン化合物及びその製造方法、ランタン前駆体組成物、並びにそれを利用した薄膜形成方法、及び集積回路素子の製造方法 |
US10913754B2 (en) | 2015-07-07 | 2021-02-09 | Samsung Electronics Co., Ltd. | Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound |
JP2022512155A (ja) * | 2018-12-19 | 2022-02-02 | ハンソル ケミカル カンパニー リミテッド | 希土類前駆体、その製造方法およびこれを用いて薄膜を形成する方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9524962B2 (en) | 2013-12-20 | 2016-12-20 | Globalfoundries Inc. | Semiconductor device comprising an e-fuse and a FET |
US9515155B2 (en) * | 2013-12-20 | 2016-12-06 | Globalfoundries Inc. | E-fuse design for high-K metal-gate technology |
US10249189B1 (en) * | 2015-01-26 | 2019-04-02 | State Farm Mutual Automobile Insurance Company | Generating emergency vehicle warnings |
US9466685B2 (en) | 2015-02-23 | 2016-10-11 | Globalfoundries Inc. | Semiconductor structure including at least one electrically conductive pillar, semiconductor structure including a contact contacting an outer layer of an electrically conductive structure and method for the formation thereof |
KR102551351B1 (ko) * | 2018-03-16 | 2023-07-04 | 삼성전자 주식회사 | 란타넘 화합물과 이를 이용한 박박 형성 방법 및 집적회로 소자의 제조 방법 |
KR102446629B1 (ko) * | 2019-12-27 | 2022-09-26 | 주식회사 유피케미칼 | 이트륨/란탄족 금속 전구체 화합물, 이를 포함하는 막 형성용 조성물 및 이를 이용한 이트륨/란탄족 금속 함유 막의 형성 방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212746A (ja) * | 1999-01-18 | 2000-08-02 | Nihon Yamamura Glass Co Ltd | フッ化物薄膜 |
JP2001295048A (ja) * | 2000-04-07 | 2001-10-26 | Nihon Yamamura Glass Co Ltd | フッ化物薄膜 |
JP2003017683A (ja) * | 2001-06-29 | 2003-01-17 | Hitachi Ltd | 半導体装置の製造方法とその製造用cvd原料 |
JP2004332033A (ja) * | 2003-05-06 | 2004-11-25 | Asahi Denka Kogyo Kk | 組成物、該組成物からなる化学気相成長用原料、及びこれを用いた薄膜の製造方法 |
JP2004331542A (ja) * | 2003-05-06 | 2004-11-25 | Asahi Denka Kogyo Kk | 組成物、該組成物からなる化学気相成長用原料、及びこれを用いた薄膜の製造方法 |
JP2005068074A (ja) * | 2003-08-25 | 2005-03-17 | Asahi Denka Kogyo Kk | 希土類金属錯体、薄膜形成用原料及び薄膜の製造方法 |
JP2009004608A (ja) * | 2007-06-22 | 2009-01-08 | Renesas Technology Corp | 半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW439151B (en) * | 1997-12-31 | 2001-06-07 | Samsung Electronics Co Ltd | Method for forming conductive layer using atomic layer deposition process |
EP1772534A3 (en) * | 2000-09-28 | 2007-04-25 | The President and Fellows of Harvard College | Tungsten-containing and hafnium-containing precursors for vapor deposition |
GB2391555A (en) * | 2002-08-09 | 2004-02-11 | Epichem Ltd | Vapour phase deposition of silicate and oxide films |
KR100519800B1 (ko) * | 2004-01-13 | 2005-10-10 | 삼성전자주식회사 | 란타늄 산화막의 제조방법 및 이를 이용한 모스 전계효과트랜지스터 및 캐패시터의 제조방법 |
US7220671B2 (en) * | 2005-03-31 | 2007-05-22 | Intel Corporation | Organometallic precursors for the chemical phase deposition of metal films in interconnect applications |
US7514119B2 (en) * | 2005-04-29 | 2009-04-07 | Linde, Inc. | Method and apparatus for using solution based precursors for atomic layer deposition |
-
2008
- 2008-10-30 US US12/261,169 patent/US20090117274A1/en not_active Abandoned
- 2008-10-31 WO PCT/US2008/081912 patent/WO2009061668A1/en active Application Filing
- 2008-10-31 JP JP2010533170A patent/JP2011514433A/ja active Pending
- 2008-10-31 EP EP08847732A patent/EP2220266A4/en not_active Withdrawn
- 2008-10-31 KR KR1020107012108A patent/KR20100084182A/ko not_active Application Discontinuation
- 2008-11-06 TW TW097142896A patent/TW200938653A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212746A (ja) * | 1999-01-18 | 2000-08-02 | Nihon Yamamura Glass Co Ltd | フッ化物薄膜 |
JP2001295048A (ja) * | 2000-04-07 | 2001-10-26 | Nihon Yamamura Glass Co Ltd | フッ化物薄膜 |
JP2003017683A (ja) * | 2001-06-29 | 2003-01-17 | Hitachi Ltd | 半導体装置の製造方法とその製造用cvd原料 |
JP2004332033A (ja) * | 2003-05-06 | 2004-11-25 | Asahi Denka Kogyo Kk | 組成物、該組成物からなる化学気相成長用原料、及びこれを用いた薄膜の製造方法 |
JP2004331542A (ja) * | 2003-05-06 | 2004-11-25 | Asahi Denka Kogyo Kk | 組成物、該組成物からなる化学気相成長用原料、及びこれを用いた薄膜の製造方法 |
JP2005068074A (ja) * | 2003-08-25 | 2005-03-17 | Asahi Denka Kogyo Kk | 希土類金属錯体、薄膜形成用原料及び薄膜の製造方法 |
JP2009004608A (ja) * | 2007-06-22 | 2009-01-08 | Renesas Technology Corp | 半導体装置の製造方法 |
Non-Patent Citations (1)
Title |
---|
JPN6013025942; No, Sang Yong et al,: 'Properties of lanthanum oxide thin films deposited by cyclic chemical vapor deposition using tris(is' Journal of Applied Physics Volume:100, Issue:2, 20060728, 024111 - 024111-9 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012532193A (ja) * | 2009-07-06 | 2012-12-13 | リンデ アクチエンゲゼルシャフト | 溶液型の先駆物質 |
WO2015093389A1 (ja) * | 2013-12-18 | 2015-06-25 | 文彦 廣瀬 | 酸化物薄膜の形成方法および装置 |
JP2017019777A (ja) * | 2015-07-07 | 2017-01-26 | 三星電子株式会社Samsung Electronics Co.,Ltd. | ランタン化合物及びその製造方法、ランタン前駆体組成物、並びにそれを利用した薄膜形成方法、及び集積回路素子の製造方法 |
US10752645B2 (en) | 2015-07-07 | 2020-08-25 | Samsung Electronics Co., Ltd. | Method of forming a thin film |
US10913754B2 (en) | 2015-07-07 | 2021-02-09 | Samsung Electronics Co., Ltd. | Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound |
JP2022512155A (ja) * | 2018-12-19 | 2022-02-02 | ハンソル ケミカル カンパニー リミテッド | 希土類前駆体、その製造方法およびこれを用いて薄膜を形成する方法 |
JP7161621B2 (ja) | 2018-12-19 | 2022-10-26 | ハンソル ケミカル カンパニー リミテッド | 希土類前駆体、その製造方法およびこれを用いて薄膜を形成する方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090117274A1 (en) | 2009-05-07 |
WO2009061668A1 (en) | 2009-05-14 |
EP2220266A4 (en) | 2012-05-02 |
KR20100084182A (ko) | 2010-07-23 |
WO2009061668A8 (en) | 2009-07-30 |
EP2220266A1 (en) | 2010-08-25 |
TW200938653A (en) | 2009-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011514433A (ja) | 原子層堆積法のための溶液系ランタン前駆体 | |
TWI393803B (zh) | 用於使用溶液為主先質以供原子層沉積之方法及裝置 | |
JP4355656B2 (ja) | 金属有機アミンと金属有機酸化物を用いて金属酸化物を形成するシステムおよび方法 | |
TWI398543B (zh) | 使用β-二酮亞胺金屬化合物之原子層沉積系統及方法 | |
TWI390070B (zh) | β-二亞胺配位子來源及其含金屬之化合物與包含彼等之系統與方法 | |
US7462559B2 (en) | Systems and methods for forming metal-containing layers using vapor deposition processes | |
TWI410514B (zh) | 不對稱配位體源,對稱性減少之含金屬的化合物類,及包括彼之系統和方法 | |
JP2020511797A (ja) | 強誘電体材料としてのケイ素ドープ酸化ハフニウムの堆積のための新規配合物 | |
JP2005537639A (ja) | アルコールを用いて金属酸化物を形成するシステムおよび方法 | |
JP2004529495A (ja) | 誘電体薄膜をcvd形成するための金属アミド前駆体およびアミノシラン前駆体 | |
KR101676060B1 (ko) | 보조 금속 종과 함께 루테늄을 침착시키기 위한 방법 및 조성물 | |
EP4301896A1 (en) | Reagents to remove oxygen from metal oxyhalide precursors in thin film deposition processes | |
KR20150101318A (ko) | 지르코늄 함유막 형성용 전구체 조성물 및 이를 이용한 지르코늄 함유막 형성 방법 | |
KR20100117500A (ko) | 지르코늄 함유 필름의 원자층 증착에 유용한 지르코늄 전구체 | |
KR101372162B1 (ko) | 배향된 탄탈륨 펜트옥사이드 막을 제조하는 방법 | |
KR20130049020A (ko) | 탄탈륨 전구체 화합물 및 이의 제조방법 | |
US20100290945A1 (en) | Solution based zirconium precursors for atomic layer deposition | |
JP2004250431A (ja) | 有機金属化合物及びその合成方法並びに該化合物を含む溶液原料、金属含有薄膜 | |
JP2012526919A (ja) | 原子層堆積のための溶液ベースのランタニド及び第iii族前駆体 | |
JP2004256510A (ja) | Cvd用ビスマス原料溶液及びこれを用いたビスマス含有薄膜の製造方法 | |
WO2023199853A1 (ja) | ルテニウム錯体、その製造方法、及びルテニウム含有薄膜の製造方法 | |
JPH10324970A (ja) | Cvd用原料およびこれを用いた成膜法 | |
JP2004183046A (ja) | 化学気相成長用原料及びこれを用いたアルミニウム元素を含有する薄膜の製造方法 | |
WO2023122471A1 (en) | Homoleptic bismuth precursors for depositing bismuth oxide containing thin films |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110927 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130530 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130829 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130905 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130927 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131004 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131024 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20131128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140327 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20140327 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140417 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20140516 |