JP2009004608A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2009004608A JP2009004608A JP2007164786A JP2007164786A JP2009004608A JP 2009004608 A JP2009004608 A JP 2009004608A JP 2007164786 A JP2007164786 A JP 2007164786A JP 2007164786 A JP2007164786 A JP 2007164786A JP 2009004608 A JP2009004608 A JP 2009004608A
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- Prior art keywords
- gas
- chamber
- oxide film
- manufacturing
- semiconductor device
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H—ELECTRICITY
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/31616—Deposition of Al2O3
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Abstract
【解決手段】成膜装置11のチャンバ12内に半導体ウエハ1Wを配置し、ガス排気口14からチャンバ12内のガスを排気する。それから、ゲートバルブ15を閉じてガス排気口14からの排気を遮断した状態で、チャンバ12内に不活性ガスを導入してチャンバ内の圧力を133Pa以上、好ましくは667Pa以上で、101325Pa未満としてから、チャンバ12内に不活性ガスと金属酸化物成膜用の原料ガスとの混合ガスを導入する。その後、ゲートバルブ15を開けてガス排気口14からチャンバ12内のガスを排気してから、酸化用ガスをチャンバ12内に導入し、半導体ウエハ1Wに吸着されていた原料ガス分子と反応させて、半導体ウエハ1W上に金属酸化物膜を形成する。これらを繰り返すことで、半導体ウエハ1W上に所望の厚みの金属酸化物膜2が成膜される。
【選択図】図1
Description
本実施の形態の半導体装置の製造工程を図面を参照して説明する。
2 金属酸化物膜
11 成膜装置
12 チャンバ
13 ウエハステージ
14 ガス排気口
15 ゲートバルブ
16,17,18,18a,18b,18c ガス経路
19,20,21a,21b,21c,21d,24a,24b,24c,25 バルブ
21 切換バルブ
22 成膜原料室
23a,23b 排気経路
30 排気
31 不活性ガス
32 不活性ガス
33 混合ガス
34 不活性ガス
35 ガス
36 酸化用ガス
41,141 方向
51 半導体製造装置
52 ロード・ロックチャンバ
53 ALDモジュール
54 アニールモジュール
55 搬送室
56 搬送装置
61 半導体基板
62 素子分離領域
63 p型ウエル
64 金属酸化物膜
65 ゲート電極
66 n−型半導体領域
67 サイドウォール
68 n+型半導体領域
71 金属シリサイド層
72 絶縁膜
73 コンタクトホール
74 プラグ
74a バリア導体膜
74b 主導体膜
75 配線
76 絶縁膜
111 成膜装置
112 チャンバ
113 ウエハステージ
114 ガス排気口
115 ゲートバルブ
118 ガス経路
142 領域
Claims (20)
- 以下の工程を有することを特徴とする半導体装置の製造方法;
(a)半導体ウエハが配置されたチャンバ内に不活性ガスを導入して前記チャンバ内の圧力を133Pa以上で101325Pa未満の第1の圧力にする工程、
(b)前記第1の圧力とされ、かつ排気が行われていない状態の前記チャンバ内に、原料ガスを導入する工程、
(c)前記チャンバ内の前記原料ガスを前記チャンバ外に排気する工程、
(d)前記(c)工程の後、酸化用ガスを前記チャンバ内に導入し、前記半導体ウエハに吸着していた前記原料ガスの分子と反応させて、前記半導体ウエハ上に金属酸化物膜を形成する工程。 - 請求項1記載の半導体装置の製造方法において、
前記(c)工程では、吸着した前記原料ガスの分子が前記半導体ウエハ上に残存することを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(a)工程は、
(a1)前記半導体ウエハが配置された前記チャンバ内のガスを前記チャンバ外に排気する工程、
(a2)前記(a1)工程後、排気が行われていない状態の前記チャンバ内に不活性ガスを導入して前記チャンバ内の圧力を前記第1の圧力にする工程、
を有することを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第1の圧力が667Pa以上であることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第1の圧力が2666Pa以下であることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(a)、(b)、(c)および(d)工程を繰り返すことで、前記半導体ウエハ上に所望の厚みの前記金属酸化物膜を形成することを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(a)、(b)、(c)および(d)工程のサイクルを1サイクル以上行った後に、
(e)前記半導体ウエハを熱処理する工程、
を行い、
その後、前記(a)、(b)、(c)および(d)工程のサイクルを1サイクル以上行うことを特徴とする半導体装置の製造方法。 - 請求項7記載の半導体装置の製造方法において、
前記(e)工程の前記熱処理は、スパイクアニール処理であることを特徴とする半導体装置の製造方法。 - 請求項7記載の半導体装置の製造方法において、
前記(e)工程の前記熱処理の熱処理温度は、700〜900℃であることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(b)工程後で前記(c)工程前に、
(c1)前記チャンバに対するガスの導入および排気を行っていない状態でかつ前記原料ガスが前記チャンバ内に存在している状態を維持する工程、
を更に有することを特徴とする半導体装置の製造方法。 - 請求項10記載の半導体装置の製造方法において、
前記(c1)工程は、1〜10秒行われることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(b)工程では、前記原料ガスおよび不活性ガスが前記チャンバ内に導入されることを特徴とする半導体装置の製造方法。 - 請求項12記載の半導体装置の製造方法において、
前記チャンバを備えた成膜装置が、
前記チャンバに接続された第1ガス経路と、
前記原料ガスと不活性ガスとの混合ガスからなる第1のガスを前記第1ガス経路に送るための第2ガス経路と、
前記原料ガスを含まない不活性ガスからなる第2のガスを前記第1ガス経路に送るための第3ガス経路と、
を有し、
前記(b)工程は、
(b1)前記第3ガス経路から前記第1ガス経路への前記第2のガスの流入を遮断しかつ前記第2ガス経路から前記第1ガス経路への前記第1のガスの流入が可能な状態で、前記第2ガス経路および前記第1ガス経路を経由して前記チャンバ内に前記第1のガスを導入する工程と、
(b2)前記(b1)工程後、前記第2ガス経路から前記第1ガス経路への前記第1のガスの流入を遮断しかつ前記第3ガス経路から前記第1ガス経路への前記第2のガスの流入が可能な状態で、前記第3ガス経路および前記第1ガス経路を経由して前記チャンバ内に前記第2のガスを導入する工程と、
を有し、
前記(b1)工程で前記第1ガス経路内に導入された前記第1のガスが、前記(b2)工程で、前記第2のガスとともに前記チャンバ内に導入されることを特徴とする半導体装置の製造方法。 - 請求項13記載の半導体装置の製造方法において、
前記成膜装置は、
前記(b1)工程で前記第2ガス経路から前記第1ガス経路に送られる前記第1のガスの流量よりも、前記(b2)工程で前記第3ガス経路から前記第1ガス経路に送られる前記第2のガスの流量の方が大きいことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記金属酸化物膜は、希土類酸化物膜であることを特徴とする半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、
前記原料ガスはLn(RCp)3の化学式で表され、前記化学式中のLnは希土類元素、Rはアルキル其、Cpはシクロペンタジエニル其であることを特徴とする半導体装置の製造方法。 - 請求項16記載の半導体装置の製造方法において、
前記酸化用ガスは、H2Oガスであることを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記金属酸化物膜は、酸化ランタン膜であることを特徴とする半導体装置の製造方法。 - 請求項18記載の半導体装置の製造方法において、
前記原料ガスはLa(RCp)3の化学式で表され、前記化学式中のRはアルキル其、Cpはシクロペンタジエニル其であることを特徴とする半導体装置の製造方法。 - 請求項19記載の半導体装置の製造方法において、
前記原料ガスは、La(i−C3H7C5H4)3の化学式で表されることを特徴とする半導体装置の製造方法。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011514433A (ja) * | 2007-11-06 | 2011-05-06 | リンデ アクチエンゲゼルシヤフト | 原子層堆積法のための溶液系ランタン前駆体 |
JP2011192768A (ja) * | 2010-03-15 | 2011-09-29 | Mitsui Eng & Shipbuild Co Ltd | 原子層堆積装置及び原子層堆積方法 |
JP2012175057A (ja) * | 2011-02-24 | 2012-09-10 | Tokyo Electron Ltd | 成膜方法および成膜装置 |
JP2014007378A (ja) * | 2012-06-02 | 2014-01-16 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257302B1 (en) | 2004-03-25 | 2016-02-09 | Novellus Systems, Inc. | CVD flowable gap fill |
US9245739B2 (en) | 2006-11-01 | 2016-01-26 | Lam Research Corporation | Low-K oxide deposition by hydrolysis and condensation |
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US9719169B2 (en) | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
JP5869899B2 (ja) * | 2011-04-01 | 2016-02-24 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、基板処理方法及びサセプタカバー |
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US10388546B2 (en) | 2015-11-16 | 2019-08-20 | Lam Research Corporation | Apparatus for UV flowable dielectric |
US9881998B1 (en) * | 2017-02-02 | 2018-01-30 | International Business Machines Corporation | Stacked nanosheet field effect transistor device with substrate isolation |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245089A (ja) * | 2005-03-01 | 2006-09-14 | Mitsui Eng & Shipbuild Co Ltd | 薄膜形成方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7192824B2 (en) * | 2003-06-24 | 2007-03-20 | Micron Technology, Inc. | Lanthanide oxide / hafnium oxide dielectric layers |
US20050045092A1 (en) * | 2003-09-03 | 2005-03-03 | Taiwan Semiconductor Manufacturing Co. | Method of multi-element compound deposition by atomic layer deposition for IC barrier layer applications |
JP4356882B2 (ja) | 2004-02-19 | 2009-11-04 | シャープ株式会社 | 原子層制御薄膜の形成方法 |
JP2006169556A (ja) * | 2004-12-13 | 2006-06-29 | Horiba Ltd | 金属酸化物薄膜の成膜方法 |
WO2006088463A1 (en) * | 2005-02-17 | 2006-08-24 | Selitser Simon I | Atmospheric pressure molecular layer cvd |
JP4228008B2 (ja) * | 2006-08-23 | 2009-02-25 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
US20080274615A1 (en) * | 2007-05-02 | 2008-11-06 | Vaartstra Brian A | Atomic Layer Deposition Methods, Methods of Forming Dielectric Materials, Methods of Forming Capacitors, And Methods of Forming DRAM Unit Cells |
-
2007
- 2007-06-22 JP JP2007164786A patent/JP4863296B2/ja not_active Expired - Fee Related
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP2011192768A (ja) * | 2010-03-15 | 2011-09-29 | Mitsui Eng & Shipbuild Co Ltd | 原子層堆積装置及び原子層堆積方法 |
JP2012175057A (ja) * | 2011-02-24 | 2012-09-10 | Tokyo Electron Ltd | 成膜方法および成膜装置 |
US8734901B2 (en) | 2011-02-24 | 2014-05-27 | Tokyo Electron Limited | Film deposition method and apparatus |
KR101555572B1 (ko) | 2011-02-24 | 2015-09-24 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 및 성막 장치 |
US8987146B2 (en) | 2012-03-09 | 2015-03-24 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium |
US9899211B2 (en) | 2012-03-09 | 2018-02-20 | Hitachi Kokusai Electric, Inc. | Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium |
JP2014007378A (ja) * | 2012-06-02 | 2014-01-16 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
JP2015046588A (ja) * | 2013-07-31 | 2015-03-12 | 京セラ株式会社 | 薄膜形成方法および太陽電池素子の製造方法 |
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