JP2011509333A5 - - Google Patents

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Publication number
JP2011509333A5
JP2011509333A5 JP2010542226A JP2010542226A JP2011509333A5 JP 2011509333 A5 JP2011509333 A5 JP 2011509333A5 JP 2010542226 A JP2010542226 A JP 2010542226A JP 2010542226 A JP2010542226 A JP 2010542226A JP 2011509333 A5 JP2011509333 A5 JP 2011509333A5
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JP
Japan
Prior art keywords
value
group
formula
silsesquioxane resin
phsio
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Application number
JP2010542226A
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English (en)
Japanese (ja)
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JP5587791B2 (ja
JP2011509333A (ja
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Priority claimed from PCT/US2008/085643 external-priority patent/WO2009088600A1/en
Publication of JP2011509333A publication Critical patent/JP2011509333A/ja
Publication of JP2011509333A5 publication Critical patent/JP2011509333A5/ja
Application granted granted Critical
Publication of JP5587791B2 publication Critical patent/JP5587791B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010542226A 2008-01-08 2008-12-05 シルセスキオキサン樹脂 Expired - Fee Related JP5587791B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1971408P 2008-01-08 2008-01-08
US61/019,714 2008-01-08
PCT/US2008/085643 WO2009088600A1 (en) 2008-01-08 2008-12-05 Silsesquioxane resins

Publications (3)

Publication Number Publication Date
JP2011509333A JP2011509333A (ja) 2011-03-24
JP2011509333A5 true JP2011509333A5 (enExample) 2011-11-24
JP5587791B2 JP5587791B2 (ja) 2014-09-10

Family

ID=40853360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010542226A Expired - Fee Related JP5587791B2 (ja) 2008-01-08 2008-12-05 シルセスキオキサン樹脂

Country Status (7)

Country Link
US (1) US8318258B2 (enExample)
EP (1) EP2240534B1 (enExample)
JP (1) JP5587791B2 (enExample)
KR (1) KR20100126295A (enExample)
CN (1) CN101910255B (enExample)
TW (1) TWI460232B (enExample)
WO (1) WO2009088600A1 (enExample)

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CN101910253B (zh) 2008-01-15 2013-04-10 陶氏康宁公司 倍半硅氧烷树脂
EP2373722A4 (en) 2008-12-10 2013-01-23 Dow Corning SILSESQUIOXAN RESINS
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JP7154955B2 (ja) * 2018-11-01 2022-10-18 株式会社東芝 剥離液、剥離方法、及び電子部品の製造方法

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