JP2011508447A5 - - Google Patents
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- Publication number
- JP2011508447A5 JP2011508447A5 JP2010540693A JP2010540693A JP2011508447A5 JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5 JP 2010540693 A JP2010540693 A JP 2010540693A JP 2010540693 A JP2010540693 A JP 2010540693A JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5
- Authority
- JP
- Japan
- Prior art keywords
- tpg
- filling
- mold
- foam block
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 16
- 239000006260 foam Substances 0.000 claims 9
- 239000007769 metal material Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 229910002804 graphite Inorganic materials 0.000 claims 3
- 239000010439 graphite Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000004576 sand Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 229910001338 liquidmetal Inorganic materials 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000012255 powdered metal Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/967,307 US20090169410A1 (en) | 2007-12-31 | 2007-12-31 | Method of forming a thermo pyrolytic graphite-embedded heatsink |
| PCT/US2008/083709 WO2009088565A2 (en) | 2007-12-31 | 2008-11-15 | Method of forming a thermo pyrolytic graphite-embedded heatsink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011508447A JP2011508447A (ja) | 2011-03-10 |
| JP2011508447A5 true JP2011508447A5 (enrdf_load_stackoverflow) | 2013-01-10 |
Family
ID=40328462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010540693A Pending JP2011508447A (ja) | 2007-12-31 | 2008-11-15 | 熱分解グラファイト埋込みヒートシンクの形成方法 |
Country Status (6)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2965401B1 (fr) * | 2010-09-29 | 2012-09-14 | Valeo Systemes Thermiques | Dispositif thermo electrique, notamment destine a générer un courant électrique dans un véhicule automobile. |
| US9064852B1 (en) * | 2011-12-05 | 2015-06-23 | The Peregrine Falcon Corporation | Thermal pyrolytic graphite enhanced components |
| US8663537B2 (en) * | 2012-05-18 | 2014-03-04 | 3M Innovative Properties Company | Injection molding apparatus and method |
| US10028418B2 (en) | 2015-01-20 | 2018-07-17 | Microsoft Technology Licensing, Llc | Metal encased graphite layer heat pipe |
| US10108017B2 (en) | 2015-01-20 | 2018-10-23 | Microsoft Technology Licensing, Llc | Carbon nanoparticle infused optical mount |
| US9791704B2 (en) | 2015-01-20 | 2017-10-17 | Microsoft Technology Licensing, Llc | Bonded multi-layer graphite heat pipe |
| US10444515B2 (en) | 2015-01-20 | 2019-10-15 | Microsoft Technology Licensing, Llc | Convective optical mount structure |
| US20180112938A1 (en) * | 2016-10-26 | 2018-04-26 | Goodrich Aerospace Services Private Limited | Die-cast bodies with thermal conductive inserts |
| JP7119671B2 (ja) * | 2017-11-20 | 2022-08-17 | 三菱マテリアル株式会社 | 複合伝熱部材、及び複合伝熱部材の製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207534A (ja) * | 1985-03-11 | 1986-09-13 | Honda Motor Co Ltd | 繊維強化金属材料の製造方法 |
| FR2654387B1 (fr) * | 1989-11-16 | 1992-04-10 | Lorraine Carbone | Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication. |
| JPH03207549A (ja) * | 1990-01-11 | 1991-09-10 | Mitsubishi Motors Corp | 消失模型鋳造法 |
| JPH079079A (ja) * | 1993-06-28 | 1995-01-13 | Tsuchiyoshi:Kk | 消失模型鋳造方法 |
| GB9814835D0 (en) * | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
| US6075701A (en) * | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
| US6215661B1 (en) * | 1999-08-11 | 2001-04-10 | Motorola, Inc. | Heat spreader |
| JP2001259822A (ja) * | 2000-03-16 | 2001-09-25 | Tokyo Tekko Co Ltd | 複合摺動部材の消失鋳造法 |
| EP1187199A2 (de) * | 2000-08-28 | 2002-03-13 | Alcan Technology & Management AG | Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür |
| US6469381B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
| US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
| JP2003183792A (ja) * | 2001-12-20 | 2003-07-03 | Mitsubishi Electric Corp | 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置 |
| PT1534451E (pt) * | 2002-08-20 | 2007-05-31 | Ex One Corp | Processo de fundição |
| TWI220467B (en) * | 2003-01-21 | 2004-08-21 | Jau-Ming Chen | High efficiency heat dissipation sheet and manufacturing method of the same |
| US6898084B2 (en) * | 2003-07-17 | 2005-05-24 | The Bergquist Company | Thermal diffusion apparatus |
| US7220485B2 (en) * | 2003-09-19 | 2007-05-22 | Momentive Performance Materials Inc. | Bulk high thermal conductivity feedstock and method of making thereof |
| JP2005272164A (ja) * | 2004-03-23 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム |
| US7393587B2 (en) * | 2004-09-17 | 2008-07-01 | Graftech International Holdings Inc. | Sandwiched finstock |
| US7025109B1 (en) * | 2005-04-06 | 2006-04-11 | Gm Global Technology Operations, Inc. | Method and apparatus for controlling dispersion of molten metal in a mold cavity |
| US20070204972A1 (en) * | 2006-03-01 | 2007-09-06 | Sensis Corporation | Method and apparatus for dissipating heat |
-
2007
- 2007-12-31 US US11/967,307 patent/US20090169410A1/en not_active Abandoned
-
2008
- 2008-11-15 CN CN200880124085.7A patent/CN101971310B/zh not_active Expired - Fee Related
- 2008-11-15 EP EP08869747A patent/EP2232540A2/en not_active Withdrawn
- 2008-11-15 KR KR1020107014598A patent/KR20100105641A/ko not_active Ceased
- 2008-11-15 WO PCT/US2008/083709 patent/WO2009088565A2/en active Application Filing
- 2008-11-15 JP JP2010540693A patent/JP2011508447A/ja active Pending
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