US20090169410A1 - Method of forming a thermo pyrolytic graphite-embedded heatsink - Google Patents

Method of forming a thermo pyrolytic graphite-embedded heatsink Download PDF

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Publication number
US20090169410A1
US20090169410A1 US11/967,307 US96730707A US2009169410A1 US 20090169410 A1 US20090169410 A1 US 20090169410A1 US 96730707 A US96730707 A US 96730707A US 2009169410 A1 US2009169410 A1 US 2009169410A1
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Prior art keywords
tpg
accordance
metal
embedded
block
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Abandoned
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US11/967,307
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English (en)
Inventor
David S. Slaton
David L. McDonald
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Abaco Systems Inc
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US11/967,307 priority Critical patent/US20090169410A1/en
Assigned to GE FANUC INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC. reassignment GE FANUC INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCDONALD, DAVID L., SLATON, DAVID S.
Priority to JP2010540693A priority patent/JP2011508447A/ja
Priority to PCT/US2008/083709 priority patent/WO2009088565A2/en
Priority to CN200880124085.7A priority patent/CN101971310B/zh
Priority to EP08869747A priority patent/EP2232540A2/en
Priority to KR1020107014598A priority patent/KR20100105641A/ko
Publication of US20090169410A1 publication Critical patent/US20090169410A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • thermo pyrolytic graphite (TPG)-embedded metal blocks to serve as heatsinks and, more particularly, to forming metal blocks of aluminum and/or copper material having TPG elements embedded therein to serve as heatsinks.
  • Modern embedded computer systems contain very high thermal power electrical components in a volumetrically constrained environment.
  • the volumes typically do not change as the power dissipation of the components increase, presenting significant challenges in the management of component temperatures.
  • direct cooling techniques such as active or passive heatsinks composed of high thermally conductive materials, such as aluminum and/or copper, have been used to manage rising temperatures.
  • These materials are only sufficient if a relatively large amount of surface area is presented to the airstream, necessitating a physically larger heatsink structure that occupies a large amount of the total available volume.
  • the ability of the material to rapidly carry heat to the extremities of the heatsink, thereby exposing the heat to the airstream is diminished.
  • TPG Thermo Pyrolytic Graphite
  • X-Y single
  • TPG has been found to have an improved overall conductivity as compared to copper.
  • a method has been developed to embed TPG material into an aluminum structure using a diffusion bonding process. The diffusion bonding process, while resulting in a suitable thermal contact between the TPG material and the aluminum structure, has limitations in that specialized equipment is needed to create the TPG-embedded structures in a time-consuming process, resulting in an expensive product.
  • thermo pyrolytic graphite (TPG)-embedded heatsink includes suspending at least one TPG element in a form.
  • the form is filled with a metal material and heated to bond the TPG element within the metal material.
  • the bonded TPG-embedded metal material is cooled.
  • thermo pyrolytic graphite (TPG)-embedded heatsink in another aspect, includes obtaining a foam block. At least one TPG element is deposited into the foam block. The foam block with the at least one TPG element is deposited into a container, and the container is filled with molding sand. The foam block is filled with a molten metal material.
  • TPG thermo pyrolytic graphite
  • thermo pyrolytic graphite (TPG)-embedded heatsink in another aspect, includes separating a foam block into at least two portions. At least one TPG element is deposited between the at least two portions of the foam block. The at least two portions of the foam block are coupled together to form a single block with the TPG element. The single block with the TPG element is deposited into a container, and the container is filled with molding sand. The foam block is filled with a molten metal material.
  • FIG. 1 is a schematic view of a method for forming a thermo pyrolytic graphite (TPG)-embedded heatsink according to a first embodiment of the present disclosure.
  • TPG thermo pyrolytic graphite
  • FIG. 2 is a schematic view of a foam block for depositing a thermo pyrolytic graphite (TPG) therein according to a second embodiment of the present disclosure.
  • TPG thermo pyrolytic graphite
  • FIG. 3 is a schematic view of the foam block of FIG. 2 having a TPG element deposited therein.
  • FIG. 4 is a schematic view of the foam block with the TPG element of FIG. 3 deposited within a container.
  • FIG. 5 depicts two portions of a foam block for depositing a thermo pyrolytic graphite (TPG) therein according to a third embodiment of the present disclosure.
  • TPG thermo pyrolytic graphite
  • thermo pyrolic graphite (TPG)-embedded heatsinks and heatframes.
  • TPG refers to any graphite-based material in which the graphite is aligned in one direction for optimal heat transfer.
  • the materials are typically referred to as “aligned graphite”, “TPG”, and “Highly Oriented Pyrolytic Graphite (HOPG)”.
  • the TPG elements provide improved thermal conductivity in the X-Y plane of the metal blocks. Specifically, it has been found that by using the methods of embedding TPG elements into metal blocks as provided in the present disclosure, temperatures created during the use of electrical systems, such as computer systems, can be lowered by about 10° C.
  • At least one TPG element 10 , 12 is held in form 20 , to embed elements 10 , 12 into a metal block (not shown) for use in a heatsink or a heatframe.
  • the TPG elements 10 , 12 are suspended in a form 20 .
  • the form 20 is filled at least partially with a metal material (not shown) and heated to bond TPG elements 10 , 12 within the metal material.
  • the bonded TPG-embedded metal material is then cooled to form a metal block including embedded TPG elements 10 , 12 (i.e., a TPG-embedded heatsink).
  • TPG elements 10 , 12 can be obtained using any suitable method and/or equipment known in the art for fabricating TPG elements and guided by the teachings herein provided. Alternatively, TPG elements 10 , 12 can be obtained commercially from suppliers, such as Momentive Performance Material located in Wilton, Conn.
  • TPG elements 10 , 12 are configured in a planar TPG strip.
  • TPG elements 10 , 12 are planar TPG strips having 90 degree edges.
  • TPG elements 10 , 12 of one embodiment have a thickness of about 0.06 inches.
  • TPG elements 10 , 12 may have any suitable configuration known in the art without departing from the present disclosure.
  • TPG elements 10 , 12 can be configured in any suitable shape including, without limitation, an oblong or a triangular shape, and including, without limitation, intermediate holes to be filled with metal.
  • TPG elements 10 , 12 are plated with a metal-based coating material (not shown). More specifically, a layer of metal, such as aluminum, copper, iron, silver, gold, nickel, zinc, tin, or a combination thereof, is applied to an outer surface of TPG elements 10 , 12 .
  • the metal-based coating material is a copper coating material with a nickel overcoat.
  • the metal-based coating material suitably provides mechanical strength.
  • the metal-based coating material is typically at least about 0.001 inches thick. More suitably, the metal-based coating material is applied to TPG elements 10 , 12 in an amount of from about 0.0005 inches to about 0.002 inches and, even more suitably, the metal-based coating material has a thickness of from about 0.006 inches to about 0.025 inches.
  • the metal-based coating material can be applied to the outer surface of TPG elements 10 , 12 in any pattern known in the art.
  • the metal-based coating material is applied in a cross-hatched pattern.
  • the metal-based coating material is applied in a striped pattern.
  • At least one TPG element 10 , 12 is suspended in form 20 .
  • Form 20 can be any suitable form known in the art. Dimensions of form 20 depend at least partially upon the desired dimensions of the metal block (i.e., heatsink) to be formed.
  • TPG elements 10 , 12 are suspended, and as such, are “floating” within form 20 , stresses experienced during high temperature heating processes, such as a soldering process as described below, can be avoided.
  • one or more TPG elements 10 , 12 are suspended in form 20 . More specifically, as shown in FIG. 1 , two TPG elements 10 , 12 are suspended in form 20 . While shown in FIG. 1 as including two TPG elements 10 , 12 suspended in form 20 , it should be understood by one skilled in the art and guided by the teachings herein provided that less than two or more than two TPG elements 10 , 12 may be suspended without departing from the scope of the present disclosure.
  • TPG elements may be suspended in the form and, even more suitably, four or more TPG elements may be suspended in the form.
  • FIG. 1 shows in a particular orientation in the form, it should be understood by one skilled in the art and guided by the teachings herein provided that any orientation known in the art may be used.
  • TPG elements 10 , 12 are suspended in form 20 using at least one peg, such as respective pegs 30 , 32 .
  • pegs 30 , 32 for suspending TPG elements 10 , 12 are metal pegs, such as pegs including steel.
  • form 20 is at least partially filled with a metal material (not shown).
  • the metal material includes at least one of aluminum and copper. Both aluminum and copper have been shown to provide high conductivity when used in heatsinks. More specifically, as shown in FIG. 3 , aluminum provides good thermal conductivity in a “Z” plane when used in heatsinks. However, as noted above, aluminum and copper alone fail to provide sufficient heat transfer in the X-Y plane and, as such, the present disclosure has combined TPG with at least one of aluminum and copper.
  • the metal material is a powdered metal material.
  • the metal material may include powdered aluminum and/or powdered copper.
  • the metal material includes a liquid or molten metal material, such as liquid aluminum and/or liquid copper.
  • the molten metal material is introduced into form 20 using a suitable metal injection molding (MIM) process.
  • MIM metal injection molding
  • the metal material to be injected is heated above its liquidus temperature and then forced into form 20 (i.e., mold) by the extension of a piston in an injection chamber of the MIM equipment.
  • the molten metal material is introduced into form 20 using a suitable thixotropic injection molding method.
  • the metal is first heated to a thixotropic state rather than to a completely liquid state, and then injected into form 20 from an injection chamber.
  • a screw rather than a piston is often used to inject the metal material into form 20 .
  • the piston and the screw contain a shaft portion, which is attached to a drive mechanism.
  • the drive mechanism is typically a motor, however, hydraulic mechanisms have also been used.
  • TPG elements 10 , 12 are heated using a sintering process. Generally, sintering strengthens the powdered metal material and normally produces densification and, in powdered metal materials, recrystallization.
  • form 20 containing the bonded TPG-embedded metal material is cooled to form metal block embedded with TPG (i.e., TPG-embedded heatsink).
  • TPG i.e., TPG-embedded heatsink
  • form 20 and the TPG-embedded metal material is stored in a suitable location until it reaches room temperature (approximately 24° C.).
  • a metal block is impregnated with TPG using a lost form casting process.
  • a foam block 100 (shown in FIG. 2 ) is obtained.
  • At least one TPG element 110 is deposited into foam block 100 (shown in FIG. 3 ).
  • Foam block 100 with TPG element 110 is deposited into a container 200 (shown in FIG. 4 ), and container 200 is at least partially filled with molding sand (not shown) with sprues 130 , 132 exposed.
  • Molten metal material (not shown) is poured into the sprues, replacing the foam and forming the TPG-embedded block.
  • foam block 100 is obtained.
  • foam block 100 is made from a medium to high density foam.
  • dimensions of foam block 100 will vary depending upon the desired heatsink.
  • At least one TPG element 110 is deposited in pre-cut slots 120 formed or defined within foam block 100 .
  • slots 120 are sized according to the TPG element 1 10 .
  • slots 120 are 6′′ ⁇ 0.375′′ ⁇ 0.60′′.
  • Slots 120 may have any shape known in the art suitable for use with TPG elements 1 10 .
  • TPG elements 110 are similar to TPG elements 10 , 12 described above.
  • TPG elements 110 are planar TPG strips such as described above and, as such, pre-cut slots 120 are rectangular openings sized to allow TPG element 110 to slide within foam block 100 . While shown in FIG.
  • TPG elements 110 can be any suitable shape known in the art (as described more fully above) and pre-cut slots 120 can be any complementary shape for allowing TPG elements 110 to be deposited therein without departing from the scope of the present disclosure.
  • slots 120 may not be pre-cut, but may be formed by placing pre-heated TPG elements in the foam, allowing them to melt the foam, thereby, forming slot 120 , or that TPG elements 110 may simply be wedged between two pieces of foam without departing from the scope of the present disclosure.
  • foam block 100 includes at least two portions 300 , 302 .
  • Foam block 100 may be separated into any suitable number of portions 300 , 302 using any suitable equipment known in the art for separating foam material.
  • First portion 300 and second portion 302 may be equal or may not be equal.
  • foam block 100 is separated into first portion 300 and second portion 302 , wherein second portion 302 is twice the volume of first portion 300 .
  • foam block 100 may be separate into more than two portions 300 , 302 , for example, foam block 100 may be divided into three portions, four portions, or even five or more portions without departing from the scope of the present disclosure.
  • portions 300 , 302 may be coupled using any means known in the art for coupling foam materials.
  • foam portions 300 , 302 are coupled using any adhesive composition known in the adhesive art.
  • portions 300 , 302 are coupled using mechanical means, such as screws or rivets.
  • foam block 100 with the sprues 130 , 132 is dipped into a plaster (not shown) to form a hard shell around foam block 100 .
  • the plaster provides a smoother finish to an exterior surface of finished metal block that is formed out of foam block 100 .
  • foam block 100 with or without a plaster shell, is deposited into a container 200 with spues 130 , 132 located at a top 202 of the container 200 .
  • Sprues 130 , 132 are used to provide entry for molten metal and to form exhaust vents for gasses that may form during the lost foam casting process.
  • container 200 is a sand-filled container.
  • Sand-filled container 200 facilitates retaining the form of the molten metal until the metal cools and solidifies.
  • molten metal material such as the molten metal material described above, is poured into sprues 130 , 132 , vaporizing the foam and forming the TPG-embedded block.
  • the molten metal material remains in container 200 until all of the foam of foam block 100 is depleted. This results in a metal block embedded with TPG elements 110 (i.e., TPG-embedded heatsink).
  • metal block is further removed from container 200 and machined down in size for use as a heatsink.
  • metal block embedded with the TPG element 110 is created using sintering, metal injection molding, or lost foam casting
  • metal block is machine-configured to have heat fins (generally shown in FIG. 2 at 2 , 4 , 6 , and 8 ).
  • heat fins 2 , 4 , 6 , 8 the surface area of the material that is thermally exposed to the surrounding environment is increased to facilitate heat dissipation.
  • the thickness of heat fins 2 , 4 , 6 , 8 are substantially identical, and distances between two adjacent heat fins 2 , 4 , 6 , 8 are also suitably identical.
  • FIG. 1 it should be understood by one skilled in the art that while FIG.
  • heat fins 2 , 4 , 6 , 8 having substantially identical thickness and substantially identical spacing
  • heat fins 2 , 4 , 6 , 8 may have different thicknesses and/or vary spacing between heat fins 2 , 4 , 6 , 8 without departing from the scope of the present disclosure.
  • Heat fins 2 , 4 , 6 , 8 in one embodiment are approximately 0.24 inches in height and approximately 0.024 inches thick, and the spacing between adjacent heat fins is approximately 0.096 inches.
  • the mold or foam block may be created to incorporate fins or other features prior to injection of molten metal in order to reduce or eliminate machining steps.
  • the mold or foam block may be created to incorporate more complex features prior to injection of molten metal to create conduction-cooled heatframes.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
US11/967,307 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink Abandoned US20090169410A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/967,307 US20090169410A1 (en) 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink
JP2010540693A JP2011508447A (ja) 2007-12-31 2008-11-15 熱分解グラファイト埋込みヒートシンクの形成方法
PCT/US2008/083709 WO2009088565A2 (en) 2007-12-31 2008-11-15 Method of forming a thermo pyrolytic graphite-embedded heatsink
CN200880124085.7A CN101971310B (zh) 2007-12-31 2008-11-15 形成内嵌热解石墨的散热器的方法
EP08869747A EP2232540A2 (en) 2007-12-31 2008-11-15 Method of forming a thermo pyrolytic graphite-embedded heatsink
KR1020107014598A KR20100105641A (ko) 2007-12-31 2008-11-15 열분해 흑연-매설형 히트싱크의 형성 방법

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US11/967,307 US20090169410A1 (en) 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink

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US20090169410A1 true US20090169410A1 (en) 2009-07-02

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US (1) US20090169410A1 (enrdf_load_stackoverflow)
EP (1) EP2232540A2 (enrdf_load_stackoverflow)
JP (1) JP2011508447A (enrdf_load_stackoverflow)
KR (1) KR20100105641A (enrdf_load_stackoverflow)
CN (1) CN101971310B (enrdf_load_stackoverflow)
WO (1) WO2009088565A2 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013173067A1 (en) * 2012-05-18 2013-11-21 3M Innovative Properties Company Injection molding apparatus and method
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US9299906B2 (en) * 2010-09-29 2016-03-29 Valeo Systemes Thermiques Thermoelectric device, in particular intended to generate an electric current in a motor vehicle
US9791704B2 (en) 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US20180112938A1 (en) * 2016-10-26 2018-04-26 Goodrich Aerospace Services Private Limited Die-cast bodies with thermal conductive inserts
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
JP2019096858A (ja) * 2017-11-20 2019-06-20 富士通化成株式会社 複合伝熱部材、及び複合伝熱部材の製造方法
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) * 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6514616B1 (en) * 1998-07-08 2003-02-04 Queen Mary And Westfield College, University Of London Thermal management device and method of making such a device
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20040141291A1 (en) * 2003-01-21 2004-07-22 Chen Chao Ming High-efficiency heat sink and method for manufacturing the same
US7025109B1 (en) * 2005-04-06 2006-04-11 Gm Global Technology Operations, Inc. Method and apparatus for controlling dispersion of molten metal in a mold cavity
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207534A (ja) * 1985-03-11 1986-09-13 Honda Motor Co Ltd 繊維強化金属材料の製造方法
JPH03207549A (ja) * 1990-01-11 1991-09-10 Mitsubishi Motors Corp 消失模型鋳造法
JPH079079A (ja) * 1993-06-28 1995-01-13 Tsuchiyoshi:Kk 消失模型鋳造方法
JP2001259822A (ja) * 2000-03-16 2001-09-25 Tokyo Tekko Co Ltd 複合摺動部材の消失鋳造法
EP1187199A2 (de) * 2000-08-28 2002-03-13 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
JP2003183792A (ja) * 2001-12-20 2003-07-03 Mitsubishi Electric Corp 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置
PT1534451E (pt) * 2002-08-20 2007-05-31 Ex One Corp Processo de fundição
US6898084B2 (en) * 2003-07-17 2005-05-24 The Bergquist Company Thermal diffusion apparatus
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock
US20070204972A1 (en) * 2006-03-01 2007-09-06 Sensis Corporation Method and apparatus for dissipating heat

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) * 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US6514616B1 (en) * 1998-07-08 2003-02-04 Queen Mary And Westfield College, University Of London Thermal management device and method of making such a device
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20040141291A1 (en) * 2003-01-21 2004-07-22 Chen Chao Ming High-efficiency heat sink and method for manufacturing the same
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof
US7025109B1 (en) * 2005-04-06 2006-04-11 Gm Global Technology Operations, Inc. Method and apparatus for controlling dispersion of molten metal in a mold cavity

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9299906B2 (en) * 2010-09-29 2016-03-29 Valeo Systemes Thermiques Thermoelectric device, in particular intended to generate an electric current in a motor vehicle
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
WO2013173067A1 (en) * 2012-05-18 2013-11-21 3M Innovative Properties Company Injection molding apparatus and method
US8663537B2 (en) 2012-05-18 2014-03-04 3M Innovative Properties Company Injection molding apparatus and method
US9791704B2 (en) 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US20180112938A1 (en) * 2016-10-26 2018-04-26 Goodrich Aerospace Services Private Limited Die-cast bodies with thermal conductive inserts
JP2019096858A (ja) * 2017-11-20 2019-06-20 富士通化成株式会社 複合伝熱部材、及び複合伝熱部材の製造方法
EP3715014A4 (en) * 2017-11-20 2021-07-28 Mitsubishi Materials Corporation COMPOSITE HEAT TRANSFER ELEMENT AND METHOD FOR PRODUCING A COMPOSITE HEAT TRANSFER ELEMENT
JP7119671B2 (ja) 2017-11-20 2022-08-17 三菱マテリアル株式会社 複合伝熱部材、及び複合伝熱部材の製造方法

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