US20180112938A1 - Die-cast bodies with thermal conductive inserts - Google Patents
Die-cast bodies with thermal conductive inserts Download PDFInfo
- Publication number
- US20180112938A1 US20180112938A1 US15/411,478 US201715411478A US2018112938A1 US 20180112938 A1 US20180112938 A1 US 20180112938A1 US 201715411478 A US201715411478 A US 201715411478A US 2018112938 A1 US2018112938 A1 US 2018112938A1
- Authority
- US
- United States
- Prior art keywords
- high thermal
- thermal conductive
- conductive insert
- article
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/002—Castings of light metals
- B22D21/005—Castings of light metals with high melting point, e.g. Be 1280 degrees C, Ti 1725 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/002—Castings of light metals
- B22D21/007—Castings of light metals with low melting point, e.g. Al 659 degrees C, Mg 650 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D23/00—Casting processes not provided for in groups B22D1/00 - B22D21/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D29/00—Removing castings from moulds, not restricted to casting processes covered by a single main group; Removing cores; Handling ingots
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/087—Heat exchange elements made from metals or metal alloys from nickel or nickel alloys
Definitions
- Thermal management by conductive heat transfer is utilized in a variety of applications.
- heat-generating electronic components can be designed to dissipate heat by conductive heat transfer through housings or other structures to a heat sink.
- conductive heat transfer can be used in conjunction with components disposed on an aircraft exterior such as sensor components or housings, which can be subject to ice formation during flight or during icing weather conditions on the ground.
- Aircraft total air temperature (TAT) sensors can measure the following four temperatures: (1) Static air temperature (SAT) or (TS), (2) total air temperature (TAT) or (Tt), (3) recovery temperature (Tr), and (4) measured temperature (Tm).
- SAT Static air temperature
- TAT total air temperature
- Tr recovery temperature
- Tm measured temperature
- Static air temperature (SAT) or (TS) is the temperature of the undisturbed air through which the aircraft is about to fly.
- Total air temperature (TAT) or (Tt) is the maximum air temperature that can be attained by 100% conversion of the kinetic energy of the flight.
- the measurement of TAT is derived from the recovery temperature (Tr), which is the adiabatic value of local air temperature on each portion of the aircraft surface due to incomplete recovery of the kinetic energy.
- Temperature (Tr) is in turn obtained from the measured temperature (Tm), which is the actual temperature as measured, and which differs from recovery temperature because of heat transfer effects due to imposed environments.
- the temperature sensor housing should protect the temperature sensing element while delivering a continuous regulated flow of outside air to the temperature sensing element that accurately represents the temperature of the outside air (i.e., avoiding recirculating eddy currents that could lead to a false temperature measurement). It is also important to avoid ice buildup that could interfere with accurate temperature measurement, which is often accomplished by providing a heating element in the housing that conductively transfers heat to icing locations.
- a method of making an article comprises disposing a high thermal conductive insert in a mold.
- a liquid metal composition is introduced into the mold into contact with the high thermal conductive insert.
- the liquid metal composition in the mold is solidified to form a solid metal article comprising the high thermal conductive insert retained therein, and the solid metal article comprising the high thermal conductive insert retained therein is removed from the mold.
- an article comprises a cast metal body and a high thermal conductive insert retained in the cast metal body.
- a method of transferring heat comprises providing a cast metal body and a high thermal conductive insert retained in the cast metal body. Heat is provided from a heat source at a first location of the cast metal body, and is transferred from the first location of the cast metal body through the high thermal conductive insert to a second location of the cast metal body.
- FIG. 1 is a schematic depiction of casting assembly in an example embodiment for fabricating a Pitot tube
- FIG. 2 is a schematic depiction of a cast metal body in an example embodiment of a Pitot tube
- FIG. 3A is a schematic depiction of a cast metal body in an example embodiment of a temperature sensor housing
- FIG. 3B is a magnified view of a portion of the temperature sensor housing depicting high thermal conductive inserts in a cut-out view of the housing;
- FIG. 4A is a schematic depiction of a high thermal conductive insert in a perspective view, and FIG. 4B in an example embodiment of the insert with a thermally conductive metal via.
- FIG. 1 schematically depicts a casting assembly 10 for an example embodiment of fabricating a Pitot tube body.
- cast assembly 10 includes a mold 12 having an inner cavity wall 13 configured in the shape of an outer surface of the Pitot tube body ( 42 , FIG. 2 ).
- the mold can be any type of mold, including but not limited to a metal die that can be used for die casting, ceramic molds prepared from a wax pattern as in investment or lost wax casting, etc.
- a removable molding core 14 having an outer wall 15 configured in the shape of an inner surface of the Pitot tube body 42 ( FIG. 2 ) is disposed is disposed in the mold inner cavity, forming a void space 17 corresponding to the shape of the Pitot tube body 42 ( FIG. 2 ).
- high thermal conductive inserts 16 , 18 , 20 , 22 , 24 , 16 , 28 , and 30 are disposed in the casting assembly 10 between the die inner cavity wall 13 and the core outer wall 15 .
- the high thermal conductive inserts can be formed from any material having higher thermal conductivity than, and compatible melting points and thermal expansion coefficients with the metal composition out of which the cast metal is to be fabricated.
- thermally-conductive carbon materials such as pyrolytic carbon, pyrolytic graphite, compression annealed pyrolytic graphite (APG), highly oriented pyrolytic graphite, and compatible metals having higher thermal conductivity and higher melting point than the metal of the cast body.
- thermally-conductive carbon materials such as pyrolytic carbon, pyrolytic graphite, compression annealed pyrolytic graphite (APG), highly oriented pyrolytic graphite, and compatible metals having higher thermal conductivity and higher melting point than the metal of the cast body.
- APG compression annealed pyrolytic graphite
- compatible metals having higher thermal conductivity and higher melting point than the metal of the cast body.
- the above and various other types and grades of pyrolytic graphite are commercially available, typically in flat sheet format.
- any of the above pyrolytic graphite materials can be formed in arcuate sheets (e.g., to match the arc of the Pitot tube) by chemical vapor de
- FIG. 1 The number and positioning of the inserts depicted in FIG. 1 is an example embodiment, and other arrangements can be utilized.
- the inserts 28 and 30 positioned near the opening of Pitot tube 40 FIG. 2
- the high thermal conductive inserts are depicted in FIG.
- the high thermal conductive inserts can be positioned adjacent one of the mold surfaces such as mold inner cavity wall 13 or core outer wall 15 so that it forms part of the outer surface of the cast body.
- a retention feature can be included by at least partially surrounding (including fully encapsulating) the high conductive thermal insert with the cast metal.
- a retention feature can be incorporated by configuring a sheet- or panel-shaped insert to have a smaller perimeter facing the mold wall than a perimeter of the insert at a position remote from the mold wall so that cast metal can form a retention feature between the mold wall and the insert portion with the larger perimeter.
- retention features can be utilized, including but not limited to notches or recesses in the insert that accept infiltration of liquid metal during casting, surface roughening of the insert, chemical surface treatments such as etching, or coatings applied to the surface of the insert (e.g., physical vapor deposition of a metal that is compatible with metal composition of the cast body).
- a liquid (e.g., molten) metal composition is introduced into the mold cavity 17 , filling the mold cavity 17 .
- a liquid (e.g., molten) metal composition is introduced into the mold cavity 17 , filling the mold cavity 17 .
- Any metal composition suitable for casting can be used.
- the metal composition comprises components for an aluminum alloy.
- the metal composition comprises components for a nickel alloy.
- the casting assembly and the liquid metal composition in the mold cavity 17 are allowed to cool to a solidification temperature of the metal composition, thus forming the Pitot tube body 42 ( FIG. 2 ) within the casting assembly 10 .
- the mold 12 is opened along a parting line (not shown) running parallel with axial length of the Pitot tube body 42 , and the core 17 is separated axially from the Pitot tube body 42 and removed from the Pitot tube internal cavity. Separation of the mold 12 and the core 17 from the Pitot tube body 42 can be promoted with mold component materials (e.g., mold surface morphology, surface treatments), design configuration (e.g., positioning of mold or die parting line, positioning and design of ejection pins and ejection pin receivers), and other techniques known to the skilled person.
- mold component materials e.g., mold surface morphology, surface treatments
- design configuration e.g., positioning of mold or die parting line, positioning and design of ejection pins and ejection pin receivers
- Post-casting fabrication operations can include smoothing and removal of burrs from the cast surfaces of the Pitot tube body 42 , filling of any holes left by the molds or mold tooling that are not part of the Pitot tube design, machining of new holes or channels (e.g., pressure sensing ports, drain holes, wire channels) (not shown), installation of a heating assembly 46 , containing heating element(s) 44 , can be installed and held in place with brazing.
- An end cap 48 and other components (not shown) such as a strut for mounting the Pitot tube to an aircraft body can be attached by brazing or other bonding techniques.
- Some embodiments of integrated high thermal conductive inserts in cast metal bodies can provide various technical effects.
- the use of inserts can provide a robust bond between the insert and the surrounding metal.
- complex shapes and configurations can be achieved with inserts that would be difficult to achieve with other fabrication techniques such as machining a recess for an insert and embedding it into the opening with brazing.
- the higher thermal conductivity of the inserts compared to the thermal conductivity of the cast metal body can promote more effective heat transfer throughout the metal body (e.g., more effective heat transfer for cooling electronic components, or more effective heat transfer for heating ice-forming metal surfaces on sensitive aircraft exterior components).
- a high thermal conductive insert is positioned along a thermal flow path between a heat source (e.g., a heating element or an electronic component) and a heat sink (e.g., an exterior surface exposed to ambient air).
- a heat source e.g., a heating element or an electronic component
- a heat sink e.g., an exterior surface exposed to ambient air.
- inserts 28 and 30 are positioned along a thermal flow path between the forward-most heater elements 44 and the front tip of the Pitot tube 40 where icing can occur.
- Inserts 16 , 18 , 20 , 24 , and 26 are disposed along a thermal flow path between various heater elements 44 and a heat sink at the external surface of the Pitot tube body 42 .
- the heat transfer effect provided by the inserts can allow for fewer or more widely spaced heater elements 44 , resulting in any one or combination of: reduced power requirements, reduced need for added brazing, reduced payload, reduced susceptibility to icing, or broader design options for avoiding hot or cold spots. Similar technical effects can be achieved for the air temperature sensor housing depicted in FIGS. 3A and 3B , where a temperature sensor housing assembly 50 suitable for housing an air temperature such as a TAT sensor includes a cast housing body 72 having integrated high thermal conductive inserts 74 embedded inside the body (shown through imaginary cut-out window 76 ). Other embodiments or configurations, such as a housing box for electronic components (not shown) or electronic support or heat sink structures can be readily utilized as well.
- Another technical effect provided in some embodiments relates to the anisotropic nature of the thermal conductivity of some high thermal conductive materials such as pyrolytic carbon and the various forms of pyrolytic graphite.
- Such materials are typically prepared by chemical vapor deposition (CVD) of carbon onto a temporary substrate.
- CVD-deposited carbon exhibits a certain degree of ordering, which can be increased during subsequent graphitization processing.
- the anisotropic thermal conductivity resulting from such ordering is depicted in FIG. 4A , where a sheet 60 of high thermal conductive insert material has three axes, labeled as x/y/z, or alternatively as a/b/c.
- thermal conductivity is typically high in the x and y (or a and b) directions, and is low in the z or c direction (although materials are available with other orientations such as high thermal conductivity in the z or c direction and low thermal conductivity in the x and y directions).
- thermally conductive metal vias can be readily provided by machining or laser-opening of a hole through the insert in the direction of low thermal conductivity, which is then filled with liquid metal during the cast process without the need for any additional via-forming steps.
- An example embodiment of the high thermal conductive insert 60 having a cast-filled conductive metal via 62 is shown in FIG. 4B .
- the conductive metal via 62 allows for transport of heat (represented by arrows 64 ) through the via 62 .
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
Description
- This patent application claims priority to IN Application No. 201641036695, filed in the Indian Patent Office on Oct. 26, 2016.
- Thermal management by conductive heat transfer is utilized in a variety of applications. For example, heat-generating electronic components can be designed to dissipate heat by conductive heat transfer through housings or other structures to a heat sink. In aerospace applications, conductive heat transfer can be used in conjunction with components disposed on an aircraft exterior such as sensor components or housings, which can be subject to ice formation during flight or during icing weather conditions on the ground.
- For example, aircraft airspeed sensors typically rely on air pressure sensors that measure total pressure in a Pitot tube housing through pressure sensing ports disposed in the Pitot tube's interior walls. Ice formation can block such pressure sensing port or alter the fluid dynamic properties of the Pitot tube openings, which can cause false airspeed readings. Ice buildup on Pitot tubes is commonly addressed by conductively transferring heat from a heating element through the Pitot tube walls to icing locations. Aircraft total air temperature (TAT) sensors can measure the following four temperatures: (1) Static air temperature (SAT) or (TS), (2) total air temperature (TAT) or (Tt), (3) recovery temperature (Tr), and (4) measured temperature (Tm). Static air temperature (SAT) or (TS) is the temperature of the undisturbed air through which the aircraft is about to fly. Total air temperature (TAT) or (Tt) is the maximum air temperature that can be attained by 100% conversion of the kinetic energy of the flight. The measurement of TAT is derived from the recovery temperature (Tr), which is the adiabatic value of local air temperature on each portion of the aircraft surface due to incomplete recovery of the kinetic energy. Temperature (Tr) is in turn obtained from the measured temperature (Tm), which is the actual temperature as measured, and which differs from recovery temperature because of heat transfer effects due to imposed environments. The temperature sensor housing should protect the temperature sensing element while delivering a continuous regulated flow of outside air to the temperature sensing element that accurately represents the temperature of the outside air (i.e., avoiding recirculating eddy currents that could lead to a false temperature measurement). It is also important to avoid ice buildup that could interfere with accurate temperature measurement, which is often accomplished by providing a heating element in the housing that conductively transfers heat to icing locations.
- According to some embodiments of the disclosure, a method of making an article comprises disposing a high thermal conductive insert in a mold. A liquid metal composition is introduced into the mold into contact with the high thermal conductive insert. The liquid metal composition in the mold is solidified to form a solid metal article comprising the high thermal conductive insert retained therein, and the solid metal article comprising the high thermal conductive insert retained therein is removed from the mold.
- According to some embodiments of the disclosure, an article comprises a cast metal body and a high thermal conductive insert retained in the cast metal body.
- According to some embodiments of the disclosure, a method of transferring heat comprises providing a cast metal body and a high thermal conductive insert retained in the cast metal body. Heat is provided from a heat source at a first location of the cast metal body, and is transferred from the first location of the cast metal body through the high thermal conductive insert to a second location of the cast metal body.
- Subject matter of this disclosure is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features, and advantages of the present disclosure are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a schematic depiction of casting assembly in an example embodiment for fabricating a Pitot tube; -
FIG. 2 is a schematic depiction of a cast metal body in an example embodiment of a Pitot tube; -
FIG. 3A is a schematic depiction of a cast metal body in an example embodiment of a temperature sensor housing, andFIG. 3B is a magnified view of a portion of the temperature sensor housing depicting high thermal conductive inserts in a cut-out view of the housing; and -
FIG. 4A is a schematic depiction of a high thermal conductive insert in a perspective view, andFIG. 4B in an example embodiment of the insert with a thermally conductive metal via. - With reference now to the Figures,
FIG. 1 schematically depicts acasting assembly 10 for an example embodiment of fabricating a Pitot tube body. As shown inFIG. 1 ,cast assembly 10 includes amold 12 having aninner cavity wall 13 configured in the shape of an outer surface of the Pitot tube body (42,FIG. 2 ). The mold can be any type of mold, including but not limited to a metal die that can be used for die casting, ceramic molds prepared from a wax pattern as in investment or lost wax casting, etc. Aremovable molding core 14 having anouter wall 15 configured in the shape of an inner surface of the Pitot tube body 42 (FIG. 2 ) is disposed is disposed in the mold inner cavity, forming avoid space 17 corresponding to the shape of the Pitot tube body 42 (FIG. 2 ). - As further shown in
FIG. 1 , high thermalconductive inserts casting assembly 10 between the dieinner cavity wall 13 and the coreouter wall 15. The high thermal conductive inserts can be formed from any material having higher thermal conductivity than, and compatible melting points and thermal expansion coefficients with the metal composition out of which the cast metal is to be fabricated. Examples of materials for the high thermal conductive inserts include, but are not limited to thermally-conductive carbon materials such as pyrolytic carbon, pyrolytic graphite, compression annealed pyrolytic graphite (APG), highly oriented pyrolytic graphite, and compatible metals having higher thermal conductivity and higher melting point than the metal of the cast body. The above and various other types and grades of pyrolytic graphite are commercially available, typically in flat sheet format. In some embodiments, any of the above pyrolytic graphite materials can be formed in arcuate sheets (e.g., to match the arc of the Pitot tube) by chemical vapor deposition of carbon onto an arcuate temporary support during fabrication of the inserts. - The number and positioning of the inserts depicted in
FIG. 1 is an example embodiment, and other arrangements can be utilized. For example, theinserts FIG. 2 ) could be omitted from the casting process, and optionally attached in a post-casting fabrication of a Pitot tube nose assembly as described in Indian patent application 201641003314 filed 29 Jan. 2016 (U.S. patent application Ser. No. 15/090,804 filed Apr. 5, 2016), the disclosure of which is incorporated herein by reference in its entirety. The high thermal conductive inserts are depicted inFIG. 1 positioned to be fully encapsulated by the metal composition of the cast body, and can be held in position during fabrication by various cast techniques or components such as pins (not shown) that can be removed after casting or left in and integrated into the cast body. Details of other cast techniques such as die casting, investment casting and components such as sprue holes, gates, die runners, etc., are not explicitly depicted inFIG. 1 , but it is understood that these and other known components and techniques can be employed by the skilled person. In other example embodiments, the high thermal conductive inserts can be positioned adjacent one of the mold surfaces such as moldinner cavity wall 13 or coreouter wall 15 so that it forms part of the outer surface of the cast body. - In some embodiments, a retention feature can be included by at least partially surrounding (including fully encapsulating) the high conductive thermal insert with the cast metal. In embodiments where an insert is embedded at the surface of the cast body, a retention feature can be incorporated by configuring a sheet- or panel-shaped insert to have a smaller perimeter facing the mold wall than a perimeter of the insert at a position remote from the mold wall so that cast metal can form a retention feature between the mold wall and the insert portion with the larger perimeter. Other retention features can be utilized, including but not limited to notches or recesses in the insert that accept infiltration of liquid metal during casting, surface roughening of the insert, chemical surface treatments such as etching, or coatings applied to the surface of the insert (e.g., physical vapor deposition of a metal that is compatible with metal composition of the cast body).
- After set-up of the casting components (e.g.,
mold 12,core 14, andinserts mold cavity 17, filling themold cavity 17. Any metal composition suitable for casting can be used. In some embodiments, the metal composition comprises components for an aluminum alloy. In some embodiments, the metal composition comprises components for a nickel alloy. The casting assembly and the liquid metal composition in themold cavity 17 are allowed to cool to a solidification temperature of the metal composition, thus forming the Pitot tube body 42 (FIG. 2 ) within thecasting assembly 10. Themold 12 is opened along a parting line (not shown) running parallel with axial length of thePitot tube body 42, and thecore 17 is separated axially from thePitot tube body 42 and removed from the Pitot tube internal cavity. Separation of themold 12 and thecore 17 from thePitot tube body 42 can be promoted with mold component materials (e.g., mold surface morphology, surface treatments), design configuration (e.g., positioning of mold or die parting line, positioning and design of ejection pins and ejection pin receivers), and other techniques known to the skilled person. ThePitot tube body 42 with integrated high thermal conductive inserts, having been separated from themold 12 and thecore 17, is subjected to additional fabrication operations to form thePitot tube 40 depicted inFIG. 2 . Post-casting fabrication operations can include smoothing and removal of burrs from the cast surfaces of thePitot tube body 42, filling of any holes left by the molds or mold tooling that are not part of the Pitot tube design, machining of new holes or channels (e.g., pressure sensing ports, drain holes, wire channels) (not shown), installation of aheating assembly 46, containing heating element(s) 44, can be installed and held in place with brazing. Anend cap 48 and other components (not shown) such as a strut for mounting the Pitot tube to an aircraft body can be attached by brazing or other bonding techniques. - Some embodiments of integrated high thermal conductive inserts in cast metal bodies can provide various technical effects. In some embodiments, the use of inserts can provide a robust bond between the insert and the surrounding metal. In some embodiments, complex shapes and configurations can be achieved with inserts that would be difficult to achieve with other fabrication techniques such as machining a recess for an insert and embedding it into the opening with brazing. In some embodiments, the higher thermal conductivity of the inserts compared to the thermal conductivity of the cast metal body can promote more effective heat transfer throughout the metal body (e.g., more effective heat transfer for cooling electronic components, or more effective heat transfer for heating ice-forming metal surfaces on sensitive aircraft exterior components). In some embodiments, a high thermal conductive insert is positioned along a thermal flow path between a heat source (e.g., a heating element or an electronic component) and a heat sink (e.g., an exterior surface exposed to ambient air). In the example
embodiment Pitot tube 40 depicted inFIG. 2 , inserts 28 and 30 are positioned along a thermal flow path between theforward-most heater elements 44 and the front tip of thePitot tube 40 where icing can occur.Inserts various heater elements 44 and a heat sink at the external surface of thePitot tube body 42. Additionally, the heat transfer effect provided by the inserts can allow for fewer or more widely spacedheater elements 44, resulting in any one or combination of: reduced power requirements, reduced need for added brazing, reduced payload, reduced susceptibility to icing, or broader design options for avoiding hot or cold spots. Similar technical effects can be achieved for the air temperature sensor housing depicted inFIGS. 3A and 3B , where a temperaturesensor housing assembly 50 suitable for housing an air temperature such as a TAT sensor includes a cast housing body 72 having integrated high thermalconductive inserts 74 embedded inside the body (shown through imaginary cut-out window 76). Other embodiments or configurations, such as a housing box for electronic components (not shown) or electronic support or heat sink structures can be readily utilized as well. - Another technical effect provided in some embodiments relates to the anisotropic nature of the thermal conductivity of some high thermal conductive materials such as pyrolytic carbon and the various forms of pyrolytic graphite. Such materials are typically prepared by chemical vapor deposition (CVD) of carbon onto a temporary substrate. CVD-deposited carbon exhibits a certain degree of ordering, which can be increased during subsequent graphitization processing. The anisotropic thermal conductivity resulting from such ordering is depicted in
FIG. 4A , where asheet 60 of high thermal conductive insert material has three axes, labeled as x/y/z, or alternatively as a/b/c. Typically, for sheets of pyrolytic carbon and the various forms of pyrolytic graphite, thermal conductivity is typically high in the x and y (or a and b) directions, and is low in the z or c direction (although materials are available with other orientations such as high thermal conductivity in the z or c direction and low thermal conductivity in the x and y directions). In any case, regardless of the direction of ordering, thermally conductive metal vias can be readily provided by machining or laser-opening of a hole through the insert in the direction of low thermal conductivity, which is then filled with liquid metal during the cast process without the need for any additional via-forming steps. An example embodiment of the high thermalconductive insert 60 having a cast-filled conductive metal via 62 is shown inFIG. 4B . The conductive metal via 62 allows for transport of heat (represented by arrows 64) through the via 62. - While the present disclosure has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the present disclosure is not limited to such disclosed embodiments. Rather, the present disclosure can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the present disclosure. Additionally, while various embodiments of the present disclosure have been described, it is to be understood that aspects of the present disclosure may include only some of the described embodiments. Accordingly, the present disclosure is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN201641036695 | 2016-10-26 | ||
IN201641036695 | 2016-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20180112938A1 true US20180112938A1 (en) | 2018-04-26 |
Family
ID=61970184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/411,478 Abandoned US20180112938A1 (en) | 2016-10-26 | 2017-01-20 | Die-cast bodies with thermal conductive inserts |
Country Status (1)
Country | Link |
---|---|
US (1) | US20180112938A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3623099A1 (en) * | 2018-09-13 | 2020-03-18 | Rosemount Aerospace Inc. | Laser metal deposition methodology on graphite substrates for aerospace components |
US20210172973A1 (en) * | 2018-03-23 | 2021-06-10 | Rosemount Aerospace Inc. | Hybrid material aircraft sensors and method of manufacturing |
US11131686B2 (en) * | 2019-02-01 | 2021-09-28 | Rosemount Aerospace Inc. | Process for manufacturing a pitot tube having a graphite insert embedded therein |
US11745879B2 (en) | 2020-03-20 | 2023-09-05 | Rosemount Aerospace Inc. | Thin film heater configuration for air data probe |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5958572A (en) * | 1997-09-30 | 1999-09-28 | Motorola, Inc. | Hybrid substrate for cooling an electronic component |
US20070009669A1 (en) * | 2005-07-08 | 2007-01-11 | Noritaka Miyamoto | Insert casting component, cylinder block, method for forming coating on insert casting component, and method for manufacturing cylinder block |
US20090169410A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a thermo pyrolytic graphite-embedded heatsink |
US20170141008A1 (en) * | 2015-11-16 | 2017-05-18 | Intel Corporation | Heat spreaders with integrated preforms |
-
2017
- 2017-01-20 US US15/411,478 patent/US20180112938A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5958572A (en) * | 1997-09-30 | 1999-09-28 | Motorola, Inc. | Hybrid substrate for cooling an electronic component |
US20070009669A1 (en) * | 2005-07-08 | 2007-01-11 | Noritaka Miyamoto | Insert casting component, cylinder block, method for forming coating on insert casting component, and method for manufacturing cylinder block |
US20090169410A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a thermo pyrolytic graphite-embedded heatsink |
US20170141008A1 (en) * | 2015-11-16 | 2017-05-18 | Intel Corporation | Heat spreaders with integrated preforms |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210172973A1 (en) * | 2018-03-23 | 2021-06-10 | Rosemount Aerospace Inc. | Hybrid material aircraft sensors and method of manufacturing |
EP3623099A1 (en) * | 2018-09-13 | 2020-03-18 | Rosemount Aerospace Inc. | Laser metal deposition methodology on graphite substrates for aerospace components |
US10640860B2 (en) | 2018-09-13 | 2020-05-05 | Rosemount Aerospace Inc. | Laser metal deposition methodology on graphite substrates for aerospace components |
US11131686B2 (en) * | 2019-02-01 | 2021-09-28 | Rosemount Aerospace Inc. | Process for manufacturing a pitot tube having a graphite insert embedded therein |
US11745879B2 (en) | 2020-03-20 | 2023-09-05 | Rosemount Aerospace Inc. | Thin film heater configuration for air data probe |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20180112938A1 (en) | Die-cast bodies with thermal conductive inserts | |
US6460598B1 (en) | Heat exchanger cast in metal matrix composite and method of making the same | |
CN110248749B (en) | Method for producing a cooling device | |
US10955433B2 (en) | Hybrid material aircraft sensors having an encapsulated insert in a probe wall formed from a higher conductive material than the probe wall | |
EP2516924B1 (en) | Making method for cooling body, cooling body and lighting device comprising the cooling body | |
US9067348B2 (en) | Method for manufacturing blow molds | |
WO2013149955A1 (en) | Molded-in heat pipe | |
KR20100105641A (en) | Method of forming a thermo pyrolytic graphite-embedded heatsink | |
EP3413059A1 (en) | Casting method for manufacturing hybrid material pitot tube | |
CN107787147A (en) | A kind of semisolid communication radiating shell and its production method | |
JP7116769B2 (en) | Manufacturing method of cooling device using heat pipe | |
CN103894546A (en) | Precision casting method for complex casting with concave-convex end | |
CN109195728A (en) | The method and apparatus of shell moulded casting metal alloy | |
WO2020201014A1 (en) | Method for making a mould with a 3d printer | |
US20230219129A1 (en) | Hybrid casting process for structural castings | |
Gowsalya et al. | Heat transfer studies on solidification of casting process | |
JP5307640B2 (en) | Casting core | |
JP2000238103A (en) | Molding die device | |
CA2887458A1 (en) | Device and method for potting coils | |
JPS61121916A (en) | Mold for molding | |
Wang et al. | Deformation study of ceramic mold with complex structure by dimensional measurement of Sn-Bi casting | |
US11041433B2 (en) | Exhaust casing for turbocharger, and method for manufacturing same | |
JP6528741B2 (en) | Heat sink manufacturing method | |
JP2009072803A (en) | Forming die and its manufacturing method | |
Prabhu et al. | Heat flux transients and casting surface macro-profile during downward solidification of Al-12% Si alloy against chills |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: GOODRICH AEROSPACE SERVICES PRIVATE LIMITED, INDIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MAHAPATRA, GURU PRASAD;JACOB, ROBIN;REEL/FRAME:041028/0237 Effective date: 20161111 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |