JP2011508447A5 - - Google Patents
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- Publication number
- JP2011508447A5 JP2011508447A5 JP2010540693A JP2010540693A JP2011508447A5 JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5 JP 2010540693 A JP2010540693 A JP 2010540693A JP 2010540693 A JP2010540693 A JP 2010540693A JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5
- Authority
- JP
- Japan
- Prior art keywords
- tpg
- filling
- mold
- foam block
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006260 foam Substances 0.000 claims 9
- 239000007769 metal material Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 229910002804 graphite Inorganic materials 0.000 claims 3
- 239000010439 graphite Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000004576 sand Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 229910001338 liquidmetal Inorganic materials 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000012255 powdered metal Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Claims (15)
少なくとも1つのTPG要素を型内に懸架するステップと、
前記型を金属材料で充填するステップと、
前記少なくとも1つのTPG要素を前記金属材料内に接合するように前記型を加熱して、TPG埋込みヒートシンクを製作するステップと、
前記接合されたTPG埋込みヒートシンクを冷却するステップとを含む方法。 A method of forming a heat sink with pyrolytic graphite (TPG) embedded therein,
Suspending at least one TPG element in the mold;
Filling the mold with a metallic material;
Heating the mold to bond the at least one TPG element into the metal material to produce a TPG embedded heat sink;
Cooling the bonded TPG embedded heat sink.
発泡体ブロックを得るステップと、
前記発泡体ブロックの中に少なくとも1つのTPG要素を配置するステップと、
前記少なくとも1つのTPG要素を伴う前記発泡体ブロックを容器の中に配置するステップと、
前記容器を鋳物砂で充填するステップと、
前記発泡体ブロックを溶融金属材料で充填するステップとを含む方法。 A method of forming a heat sink with pyrolytic graphite (TPG) embedded therein,
Obtaining a foam block;
Disposing at least one TPG element in the foam block;
Placing the foam block with the at least one TPG element in a container;
Filling the container with foundry sand;
Filling the foam block with a molten metal material.
発泡体を少なくとも2つの部分に分離するステップと、
前記発泡体ブロックの前記少なくとも2つの部分の間に少なくとも1つのTPG要素を配置するステップと、
前記発泡体ブロックの前記少なくとも2つの部分を一緒に結合して、前記少なくとも1つのTPG要素を伴う単一ブロックを形成するステップと、
前記少なくとも1つのTPG要素を伴う前記単一ブロックを容器の中に配置するステップと、
前記容器を鋳物砂で充填するステップと、
前記発泡体ブロックを溶融金属材料で充填するステップとを含む方法。
A method of forming a heat sink with pyrolytic graphite (TPG) embedded therein,
Separating the foam into at least two parts;
Placing at least one TPG element between the at least two portions of the foam block;
Bonding the at least two portions of the foam block together to form a single block with the at least one TPG element;
Placing the single block with the at least one TPG element in a container;
Filling the container with foundry sand;
Filling the foam block with a molten metal material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/967,307 US20090169410A1 (en) | 2007-12-31 | 2007-12-31 | Method of forming a thermo pyrolytic graphite-embedded heatsink |
PCT/US2008/083709 WO2009088565A2 (en) | 2007-12-31 | 2008-11-15 | Method of forming a thermo pyrolytic graphite-embedded heatsink |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011508447A JP2011508447A (en) | 2011-03-10 |
JP2011508447A5 true JP2011508447A5 (en) | 2013-01-10 |
Family
ID=40328462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010540693A Pending JP2011508447A (en) | 2007-12-31 | 2008-11-15 | Method for forming pyrolytic graphite embedded heat sink |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090169410A1 (en) |
EP (1) | EP2232540A2 (en) |
JP (1) | JP2011508447A (en) |
KR (1) | KR20100105641A (en) |
CN (1) | CN101971310B (en) |
WO (1) | WO2009088565A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2965401B1 (en) * | 2010-09-29 | 2012-09-14 | Valeo Systemes Thermiques | THERMO ELECTRIC DEVICE, IN PARTICULAR FOR GENERATING AN ELECTRICAL CURRENT IN A MOTOR VEHICLE. |
US9064852B1 (en) * | 2011-12-05 | 2015-06-23 | The Peregrine Falcon Corporation | Thermal pyrolytic graphite enhanced components |
US8663537B2 (en) * | 2012-05-18 | 2014-03-04 | 3M Innovative Properties Company | Injection molding apparatus and method |
US9791704B2 (en) | 2015-01-20 | 2017-10-17 | Microsoft Technology Licensing, Llc | Bonded multi-layer graphite heat pipe |
US10444515B2 (en) | 2015-01-20 | 2019-10-15 | Microsoft Technology Licensing, Llc | Convective optical mount structure |
US10108017B2 (en) | 2015-01-20 | 2018-10-23 | Microsoft Technology Licensing, Llc | Carbon nanoparticle infused optical mount |
US10028418B2 (en) | 2015-01-20 | 2018-07-17 | Microsoft Technology Licensing, Llc | Metal encased graphite layer heat pipe |
US20180112938A1 (en) * | 2016-10-26 | 2018-04-26 | Goodrich Aerospace Services Private Limited | Die-cast bodies with thermal conductive inserts |
JP7119671B2 (en) * | 2017-11-20 | 2022-08-17 | 三菱マテリアル株式会社 | COMPOSITE HEAT TRANSFER MEMBER AND METHOD FOR MANUFACTURING COMPOSITE HEAT TRANSFER MEMBER |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207534A (en) * | 1985-03-11 | 1986-09-13 | Honda Motor Co Ltd | Manufacture of metal material reinforced with fiber |
FR2654387B1 (en) * | 1989-11-16 | 1992-04-10 | Lorraine Carbone | MULTILAYER MATERIAL COMPRISING FLEXIBLE GRAPHITE MECHANICALLY, ELECTRICALLY AND THERMALLY REINFORCED BY A METAL AND METHOD OF MANUFACTURE. |
JPH03207549A (en) * | 1990-01-11 | 1991-09-10 | Mitsubishi Motors Corp | Lost foam pattern casting method |
JPH079079A (en) * | 1993-06-28 | 1995-01-13 | Tsuchiyoshi:Kk | Lost foam pattern casting method |
GB9814835D0 (en) * | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
US6075701A (en) * | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
US6215661B1 (en) * | 1999-08-11 | 2001-04-10 | Motorola, Inc. | Heat spreader |
JP2001259822A (en) * | 2000-03-16 | 2001-09-25 | Tokyo Tekko Co Ltd | Method for lost foam casting of complex sliding member |
EP1187199A2 (en) * | 2000-08-28 | 2002-03-13 | Alcan Technology & Management AG | Heatsink for Semiconductor Device, Method of Mannufacturing the same, as well as Molding Die therefore |
US6469381B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
JP2003183792A (en) * | 2001-12-20 | 2003-07-03 | Mitsubishi Electric Corp | Thermoconductive substrate, manufacturing method therefor, and semiconductor device having the thermoconductive substrate |
ATE353729T1 (en) * | 2002-08-20 | 2007-03-15 | Ex One Corp | CASTING PROCESS |
TWI220467B (en) * | 2003-01-21 | 2004-08-21 | Jau-Ming Chen | High efficiency heat dissipation sheet and manufacturing method of the same |
US6898084B2 (en) * | 2003-07-17 | 2005-05-24 | The Bergquist Company | Thermal diffusion apparatus |
US7220485B2 (en) * | 2003-09-19 | 2007-05-22 | Momentive Performance Materials Inc. | Bulk high thermal conductivity feedstock and method of making thereof |
JP2005272164A (en) * | 2004-03-23 | 2005-10-06 | Matsushita Electric Ind Co Ltd | High thermal conductive member, method of manufacturing the same and heat radiation system using the same |
US7393587B2 (en) * | 2004-09-17 | 2008-07-01 | Graftech International Holdings Inc. | Sandwiched finstock |
US7025109B1 (en) * | 2005-04-06 | 2006-04-11 | Gm Global Technology Operations, Inc. | Method and apparatus for controlling dispersion of molten metal in a mold cavity |
US20070204972A1 (en) * | 2006-03-01 | 2007-09-06 | Sensis Corporation | Method and apparatus for dissipating heat |
-
2007
- 2007-12-31 US US11/967,307 patent/US20090169410A1/en not_active Abandoned
-
2008
- 2008-11-15 CN CN200880124085.7A patent/CN101971310B/en not_active Expired - Fee Related
- 2008-11-15 EP EP08869747A patent/EP2232540A2/en not_active Withdrawn
- 2008-11-15 WO PCT/US2008/083709 patent/WO2009088565A2/en active Application Filing
- 2008-11-15 KR KR1020107014598A patent/KR20100105641A/en not_active Application Discontinuation
- 2008-11-15 JP JP2010540693A patent/JP2011508447A/en active Pending
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