JP2011508447A - 熱分解グラファイト埋込みヒートシンクの形成方法 - Google Patents

熱分解グラファイト埋込みヒートシンクの形成方法 Download PDF

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JP2011508447A
JP2011508447A JP2010540693A JP2010540693A JP2011508447A JP 2011508447 A JP2011508447 A JP 2011508447A JP 2010540693 A JP2010540693 A JP 2010540693A JP 2010540693 A JP2010540693 A JP 2010540693A JP 2011508447 A JP2011508447 A JP 2011508447A
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Prior art keywords
tpg
mold
block
embedded
metal
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Japanese (ja)
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JP2011508447A5 (enExample
Inventor
スレイトン，デイビッド・エス
マクドナルド，デイビッド・エル
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ジーイー・インテリジェント・プラットフォームズ・エンベデッド・システムズ，インコーポレイテッド
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Publication of JP2011508447A publication Critical patent/JP2011508447A/ja
Publication of JP2011508447A5 publication Critical patent/JP2011508447A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
JP2010540693A 2007-12-31 2008-11-15 熱分解グラファイト埋込みヒートシンクの形成方法 Pending JP2011508447A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/967,307 US20090169410A1 (en) 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink
PCT/US2008/083709 WO2009088565A2 (en) 2007-12-31 2008-11-15 Method of forming a thermo pyrolytic graphite-embedded heatsink

Publications (2)

Publication Number Publication Date
JP2011508447A true JP2011508447A (ja) 2011-03-10
JP2011508447A5 JP2011508447A5 (enExample) 2013-01-10

Family

ID=40328462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010540693A Pending JP2011508447A (ja) 2007-12-31 2008-11-15 熱分解グラファイト埋込みヒートシンクの形成方法

Country Status (6)

Country Link
US (1) US20090169410A1 (enExample)
EP (1) EP2232540A2 (enExample)
JP (1) JP2011508447A (enExample)
KR (1) KR20100105641A (enExample)
CN (1) CN101971310B (enExample)
WO (1) WO2009088565A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2965401B1 (fr) * 2010-09-29 2012-09-14 Valeo Systemes Thermiques Dispositif thermo electrique, notamment destine a générer un courant électrique dans un véhicule automobile.
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US8663537B2 (en) * 2012-05-18 2014-03-04 3M Innovative Properties Company Injection molding apparatus and method
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US9791704B2 (en) 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US20180112938A1 (en) * 2016-10-26 2018-04-26 Goodrich Aerospace Services Private Limited Die-cast bodies with thermal conductive inserts
JP7119671B2 (ja) * 2017-11-20 2022-08-17 三菱マテリアル株式会社 複合伝熱部材、及び複合伝熱部材の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207534A (ja) * 1985-03-11 1986-09-13 Honda Motor Co Ltd 繊維強化金属材料の製造方法
JP2003183792A (ja) * 2001-12-20 2003-07-03 Mitsubishi Electric Corp 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
JPH03207549A (ja) * 1990-01-11 1991-09-10 Mitsubishi Motors Corp 消失模型鋳造法
JPH079079A (ja) * 1993-06-28 1995-01-13 Tsuchiyoshi:Kk 消失模型鋳造方法
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
JP2001259822A (ja) * 2000-03-16 2001-09-25 Tokyo Tekko Co Ltd 複合摺動部材の消失鋳造法
EP1187199A2 (de) * 2000-08-28 2002-03-13 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
WO2004018132A1 (en) * 2002-08-20 2004-03-04 Extrude Hone Corporation Casting process and articles for performing the same
TWI220467B (en) * 2003-01-21 2004-08-21 Jau-Ming Chen High efficiency heat dissipation sheet and manufacturing method of the same
US6898084B2 (en) * 2003-07-17 2005-05-24 The Bergquist Company Thermal diffusion apparatus
US7220485B2 (en) * 2003-09-19 2007-05-22 Momentive Performance Materials Inc. Bulk high thermal conductivity feedstock and method of making thereof
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock
US7025109B1 (en) * 2005-04-06 2006-04-11 Gm Global Technology Operations, Inc. Method and apparatus for controlling dispersion of molten metal in a mold cavity
US20070204972A1 (en) * 2006-03-01 2007-09-06 Sensis Corporation Method and apparatus for dissipating heat

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207534A (ja) * 1985-03-11 1986-09-13 Honda Motor Co Ltd 繊維強化金属材料の製造方法
JP2003183792A (ja) * 2001-12-20 2003-07-03 Mitsubishi Electric Corp 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム

Also Published As

Publication number Publication date
US20090169410A1 (en) 2009-07-02
CN101971310B (zh) 2013-09-25
CN101971310A (zh) 2011-02-09
KR20100105641A (ko) 2010-09-29
WO2009088565A3 (en) 2009-11-26
EP2232540A2 (en) 2010-09-29
WO2009088565A2 (en) 2009-07-16

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