JP2011505072A - チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法 - Google Patents

チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法 Download PDF

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Publication number
JP2011505072A
JP2011505072A JP2010535211A JP2010535211A JP2011505072A JP 2011505072 A JP2011505072 A JP 2011505072A JP 2010535211 A JP2010535211 A JP 2010535211A JP 2010535211 A JP2010535211 A JP 2010535211A JP 2011505072 A JP2011505072 A JP 2011505072A
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JP
Japan
Prior art keywords
connection
chip
assembly
semiconductor chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010535211A
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English (en)
Japanese (ja)
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JP2011505072A5 (https=
Inventor
ヘルベルト ブルーナー
ステファン ケーラー
ライムント シュワルツ
ステファン グローシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2011505072A publication Critical patent/JP2011505072A/ja
Publication of JP2011505072A5 publication Critical patent/JP2011505072A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2010535211A 2007-11-28 2008-11-21 チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法 Pending JP2011505072A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007057242 2007-11-28
DE102008021618A DE102008021618A1 (de) 2007-11-28 2008-04-30 Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung
PCT/DE2008/001931 WO2009067996A2 (de) 2007-11-28 2008-11-21 Chipanordnung, anschlussanordnung, led sowie verfahren zur herstellung einer chipanordnung

Publications (2)

Publication Number Publication Date
JP2011505072A true JP2011505072A (ja) 2011-02-17
JP2011505072A5 JP2011505072A5 (https=) 2011-10-20

Family

ID=40586002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010535211A Pending JP2011505072A (ja) 2007-11-28 2008-11-21 チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法

Country Status (8)

Country Link
US (1) US20100314635A1 (https=)
EP (1) EP2225785B1 (https=)
JP (1) JP2011505072A (https=)
KR (1) KR20100105632A (https=)
CN (1) CN101878544A (https=)
DE (1) DE102008021618A1 (https=)
TW (1) TWI484656B (https=)
WO (1) WO2009067996A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016086189A (ja) * 2016-02-03 2016-05-19 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール

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TWI405307B (zh) * 2009-09-18 2013-08-11 聯詠科技股份有限公司 晶片封裝及其製程
DE102010046790A1 (de) * 2010-09-28 2012-03-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102012201616A1 (de) * 2012-02-03 2013-08-08 Tridonic Jennersdorf Gmbh Kunststoffträger für LED-Chips zur Verwendung in LED-Modulen und LED-Ketten
EP2642538A1 (en) 2012-03-22 2013-09-25 Koninklijke Philips N.V. 3D LED structures
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
US9576935B2 (en) * 2014-04-16 2017-02-21 Infineon Technologies Ag Method for fabricating a semiconductor package and semiconductor package
US9865528B2 (en) * 2015-12-11 2018-01-09 Ubotic Company Limited High power and high frequency plastic pre-molded cavity package
KR102746562B1 (ko) 2019-03-22 2024-12-24 삼성전자주식회사 발광 소자 패키지

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JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
JP2005159045A (ja) * 2003-11-26 2005-06-16 Sumitomo Electric Ind Ltd 半導体発光素子搭載部材とそれを用いた発光ダイオード
JP2006005290A (ja) * 2004-06-21 2006-01-05 Citizen Electronics Co Ltd 発光ダイオード
JP2006049442A (ja) * 2004-08-02 2006-02-16 Sharp Corp 半導体発光装置およびその製造方法
JP2007109945A (ja) * 2005-10-14 2007-04-26 Fujifilm Holdings Corp 光源

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US5167724A (en) * 1991-05-16 1992-12-01 The United States Of America As Represented By The United States Department Of Energy Planar photovoltaic solar concentrator module
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
US6612890B1 (en) * 1998-10-15 2003-09-02 Handy & Harman (Ny Corp.) Method and system for manufacturing electronic packaging units
DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
DE10117889A1 (de) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
JP4646485B2 (ja) * 2002-06-25 2011-03-09 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
JP4174823B2 (ja) * 2003-03-27 2008-11-05 サンケン電気株式会社 半導体発光装置
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JP4966656B2 (ja) * 2003-05-28 2012-07-04 ソウル半導体株式会社 複数のヒートシンクを有する発光ダイオードパッケージ
DE10351934B4 (de) * 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Leuchtdioden-Anordnung mit wärmeabführender Platine
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JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
JP4967347B2 (ja) * 2006-01-24 2012-07-04 サンケン電気株式会社 線状光源及び半導体発光ユニットの製法
US7655957B2 (en) * 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
JP2005159045A (ja) * 2003-11-26 2005-06-16 Sumitomo Electric Ind Ltd 半導体発光素子搭載部材とそれを用いた発光ダイオード
JP2006005290A (ja) * 2004-06-21 2006-01-05 Citizen Electronics Co Ltd 発光ダイオード
JP2006049442A (ja) * 2004-08-02 2006-02-16 Sharp Corp 半導体発光装置およびその製造方法
JP2007109945A (ja) * 2005-10-14 2007-04-26 Fujifilm Holdings Corp 光源

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016086189A (ja) * 2016-02-03 2016-05-19 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール

Also Published As

Publication number Publication date
TW200929627A (en) 2009-07-01
WO2009067996A3 (de) 2009-10-08
DE102008021618A1 (de) 2009-06-04
TWI484656B (zh) 2015-05-11
US20100314635A1 (en) 2010-12-16
CN101878544A (zh) 2010-11-03
WO2009067996A2 (de) 2009-06-04
KR20100105632A (ko) 2010-09-29
EP2225785B1 (de) 2017-03-15
EP2225785A2 (de) 2010-09-08

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