TWI484656B - 晶片配置，連接配置，發光二極體和晶片配置的製造方法 - Google Patents

晶片配置，連接配置，發光二極體和晶片配置的製造方法 Download PDF

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Publication number
TWI484656B
TWI484656B TW097145591A TW97145591A TWI484656B TW I484656 B TWI484656 B TW I484656B TW 097145591 A TW097145591 A TW 097145591A TW 97145591 A TW97145591 A TW 97145591A TW I484656 B TWI484656 B TW I484656B
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TW
Taiwan
Prior art keywords
plane
wafer
configuration
connection
semiconductor wafer
Prior art date
Application number
TW097145591A
Other languages
English (en)
Chinese (zh)
Other versions
TW200929627A (en
Inventor
荷伯特布魯納
史帝芬葛羅屈
史帝芬柯勒
雷孟得史瓦茲
Original Assignee
歐斯朗奧托半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐斯朗奧托半導體股份有限公司 filed Critical 歐斯朗奧托半導體股份有限公司
Publication of TW200929627A publication Critical patent/TW200929627A/zh
Application granted granted Critical
Publication of TWI484656B publication Critical patent/TWI484656B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
TW097145591A 2007-11-28 2008-11-26 晶片配置，連接配置，發光二極體和晶片配置的製造方法 TWI484656B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007057242 2007-11-28
DE102008021618A DE102008021618A1 (de) 2007-11-28 2008-04-30 Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung

Publications (2)

Publication Number Publication Date
TW200929627A TW200929627A (en) 2009-07-01
TWI484656B true TWI484656B (zh) 2015-05-11

Family

ID=40586002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145591A TWI484656B (zh) 2007-11-28 2008-11-26 晶片配置，連接配置，發光二極體和晶片配置的製造方法

Country Status (8)

Country Link
US (1) US20100314635A1 (https=)
EP (1) EP2225785B1 (https=)
JP (1) JP2011505072A (https=)
KR (1) KR20100105632A (https=)
CN (1) CN101878544A (https=)
DE (1) DE102008021618A1 (https=)
TW (1) TWI484656B (https=)
WO (1) WO2009067996A2 (https=)

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* Cited by examiner, † Cited by third party
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TWI405307B (zh) * 2009-09-18 2013-08-11 聯詠科技股份有限公司 晶片封裝及其製程
DE102010046790A1 (de) * 2010-09-28 2012-03-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102012201616A1 (de) * 2012-02-03 2013-08-08 Tridonic Jennersdorf Gmbh Kunststoffträger für LED-Chips zur Verwendung in LED-Modulen und LED-Ketten
EP2642538A1 (en) 2012-03-22 2013-09-25 Koninklijke Philips N.V. 3D LED structures
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
US9576935B2 (en) * 2014-04-16 2017-02-21 Infineon Technologies Ag Method for fabricating a semiconductor package and semiconductor package
US9865528B2 (en) * 2015-12-11 2018-01-09 Ubotic Company Limited High power and high frequency plastic pre-molded cavity package
JP6110528B2 (ja) * 2016-02-03 2017-04-05 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール
KR102746562B1 (ko) 2019-03-22 2024-12-24 삼성전자주식회사 발광 소자 패키지

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US20030142500A1 (en) * 2000-07-10 2003-07-31 Bernhard Bachl LED module and methods for producing and using the module
CN1960016A (zh) * 2005-11-02 2007-05-09 西铁城电子股份有限公司 发光二极管单元

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JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
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US20030142500A1 (en) * 2000-07-10 2003-07-31 Bernhard Bachl LED module and methods for producing and using the module
CN1960016A (zh) * 2005-11-02 2007-05-09 西铁城电子股份有限公司 发光二极管单元

Also Published As

Publication number Publication date
TW200929627A (en) 2009-07-01
WO2009067996A3 (de) 2009-10-08
DE102008021618A1 (de) 2009-06-04
US20100314635A1 (en) 2010-12-16
CN101878544A (zh) 2010-11-03
WO2009067996A2 (de) 2009-06-04
KR20100105632A (ko) 2010-09-29
EP2225785B1 (de) 2017-03-15
JP2011505072A (ja) 2011-02-17
EP2225785A2 (de) 2010-09-08

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