JP2011504653A5 - - Google Patents

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Publication number
JP2011504653A5
JP2011504653A5 JP2010534445A JP2010534445A JP2011504653A5 JP 2011504653 A5 JP2011504653 A5 JP 2011504653A5 JP 2010534445 A JP2010534445 A JP 2010534445A JP 2010534445 A JP2010534445 A JP 2010534445A JP 2011504653 A5 JP2011504653 A5 JP 2011504653A5
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JP
Japan
Prior art keywords
liquid
wafer
article
processing unit
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010534445A
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English (en)
Japanese (ja)
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JP5336506B2 (ja
JP2011504653A (ja
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Application filed filed Critical
Priority claimed from PCT/EP2008/065371 external-priority patent/WO2009065757A1/en
Publication of JP2011504653A publication Critical patent/JP2011504653A/ja
Publication of JP2011504653A5 publication Critical patent/JP2011504653A5/ja
Application granted granted Critical
Publication of JP5336506B2 publication Critical patent/JP5336506B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010534445A 2007-11-23 2008-11-12 ウエハ状物品の周縁領域をウェット処理するための装置及び方法 Expired - Fee Related JP5336506B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT19062007 2007-11-23
ATA1906/2007 2007-11-23
PCT/EP2008/065371 WO2009065757A1 (en) 2007-11-23 2008-11-12 Device and process for wet treating a peripheral area of a wafer-shaped article

Publications (3)

Publication Number Publication Date
JP2011504653A JP2011504653A (ja) 2011-02-10
JP2011504653A5 true JP2011504653A5 (https=) 2011-12-01
JP5336506B2 JP5336506B2 (ja) 2013-11-06

Family

ID=40300366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010534445A Expired - Fee Related JP5336506B2 (ja) 2007-11-23 2008-11-12 ウエハ状物品の周縁領域をウェット処理するための装置及び方法

Country Status (7)

Country Link
US (1) US8801865B2 (https=)
EP (1) EP2215651A1 (https=)
JP (1) JP5336506B2 (https=)
KR (1) KR101505700B1 (https=)
CN (1) CN102084458B (https=)
TW (1) TWI433251B (https=)
WO (1) WO2009065757A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5412230B2 (ja) * 2009-10-19 2014-02-12 株式会社半導体エネルギー研究所 コート材除去装置及びコート材除去方法
US8858755B2 (en) * 2011-08-26 2014-10-14 Tel Nexx, Inc. Edge bevel removal apparatus and method
US9038262B2 (en) * 2012-02-23 2015-05-26 Beijing Sevenstar Electronics Co., Ltd. Device for holding disk-shaped articles and method thereof
CN103418563B (zh) * 2012-05-22 2016-12-14 盛美半导体设备（上海）有限公司 晶片边缘清洗装置
JP6140439B2 (ja) * 2012-12-27 2017-05-31 株式会社荏原製作所 研磨装置、及び研磨方法
WO2014129167A1 (ja) * 2013-02-21 2014-08-28 凸版印刷株式会社 塗布膜除去装置
TWI597770B (zh) 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
US10249521B2 (en) * 2016-03-17 2019-04-02 Lam Research Ag Wet-dry integrated wafer processing system
CN107690358B (zh) * 2016-09-30 2020-08-28 深圳市柔宇科技有限公司 柔性触控面板清洗设备
DE102017212887A1 (de) 2017-07-26 2019-01-31 Gebr. Schmid Gmbh Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59407361D1 (de) * 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
AT640U1 (de) * 1993-10-22 1996-02-26 Sez Semiconduct Equip Zubehoer Greifer für halbleiterwafer und andere scheibenförmige gegenstände
JP4127866B2 (ja) * 1996-05-21 2008-07-30 東京応化工業株式会社 基板端縁部被膜の除去方法
US6015467A (en) * 1996-03-08 2000-01-18 Tokyo Ohka Kogyo Co., Ltd. Method of removing coating from edge of substrate
ATE211855T1 (de) * 1999-04-28 2002-01-15 Sez Semiconduct Equip Zubehoer Vorrichtung und verfahren zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
US6186873B1 (en) * 2000-04-14 2001-02-13 International Business Machines Corporation Wafer edge cleaning
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
JP3944368B2 (ja) 2001-09-05 2007-07-11 株式会社荏原製作所 基板処理装置及び基板処理方法
JP3954881B2 (ja) * 2002-03-27 2007-08-08 大日本スクリーン製造株式会社 基板処理装置およびそれを備えたメッキ装置
US20070062647A1 (en) * 2005-09-19 2007-03-22 Bailey Joel B Method and apparatus for isolative substrate edge area processing
KR100481277B1 (ko) * 2002-05-10 2005-04-07 한국디엔에스 주식회사 반도체 제조 장치 및 방법
JP3985250B2 (ja) * 2002-09-13 2007-10-03 和夫 田▲邉▼ ウエーハエッジのエッチング処理装置
JP4095478B2 (ja) * 2003-03-27 2008-06-04 芝浦メカトロニクス株式会社 基板のエッチング装置及びエッチング方法
JP2004214695A (ja) * 2004-03-22 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006060161A (ja) * 2004-08-24 2006-03-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006120666A (ja) * 2004-10-19 2006-05-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4601452B2 (ja) * 2005-02-22 2010-12-22 大日本スクリーン製造株式会社 基板処理装置
JP4594767B2 (ja) 2005-03-09 2010-12-08 積水化学工業株式会社 基材外周処理装置
KR20080005974A (ko) * 2005-04-25 2008-01-15 어플라이드 머티어리얼스, 인코포레이티드 기판의 에지를 세정하기 위한 방법 및 장치
JP2008198667A (ja) * 2007-02-08 2008-08-28 Nec Electronics Corp 半導体製造装置及び半導体装置の製造方法

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