JP2011503668A - 集積化カラーマスク - Google Patents
集積化カラーマスク Download PDFInfo
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- JP2011503668A JP2011503668A JP2010534935A JP2010534935A JP2011503668A JP 2011503668 A JP2011503668 A JP 2011503668A JP 2010534935 A JP2010534935 A JP 2010534935A JP 2010534935 A JP2010534935 A JP 2010534935A JP 2011503668 A JP2011503668 A JP 2011503668A
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Abstract
Description
a) 表側と裏側とを有する透明支持体を用意する工程;
b) 該透明支持体の該表側又は該裏側のいずれか一方の側に、色パターンを有するカラーマスクを形成工程;
c) 該カラーマスクを形成した後、該透明支持体の表側に、可視光に対して感光するフォトパターン化可能材料層を被覆する工程;
d) 該フォトパターン化可能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能材料から成り;そして
e) 該機能材料層が、該カラーマスクの色パターンに対応する、結果として生じるパターンを有するように、該フォトパターンを使用して機能材料層をパターン化する工程、
該機能材料層は、該フォトパターン化可能材料層であるか、又は該フォトパターン化可能材料層とは別個の層であってよく、該結果としてのパターンが、該機能材料層の所定の領域を除去することにより、又は該機能材料層を選択的領域堆積することにより形成される、
各工程を含んで成る構造を形成する方法によって達成される。
b) 該透明支持体の該表側又は該裏側のいずれか一方の側に、色パターンを有するカラーマスクを形成する工程;
c) 該カラーマスクを形成した後、該透明支持体の表側に、可視光に対して感光するフォトパターン化可能材料層を被覆する工程;
d) 該フォトパターン化可能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能材料から成り;
e) 該フォトパターン化可能材料層を被覆する前又は後に、機能材料層を堆積する工程;そして
f) 該機能材料層が、該カラーマスクの色パターンに対応する、結果として生じるパターン化された機能材料層を有するように、該フォトパターンを使用して該機能材料層をパターン化する工程
を含んで成る。
a) 透明支持体を用意する工程;
b) 該透明支持体の第1の側に、色パターンを有するカラーマスクを形成する工程;
c) 該カラーマスクを形成した後、該透明支持体の第1の側に、可視光に対して感光するフォトパターン化可能機能材料層を被覆する工程;
d) 該フォトパターン化可能機能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能機能材料から成り;そして
e) 該フォトパターンに対応する該フォトパターン化可能機能材料層領域を除去することにより形成される、結果として生じるパターン化された機能材料層を有するように、該フォトパターン化可能機能材料層をパターン化する工程
を含んで成る方法によって構造を形成することができる。
上記式中、bminは最小ラインギャップ周期であり、λは露光波長であり、sはマスクとウェハーとの間の分離距離であり、そしてzはレジスト厚である。
CH2=C(R)COOCH2CH(R’)OH
(R及びR’はそれぞれH又はCH3である)
によって表されるヒドロキシル基を有するビニルモノマーを付加することにより得られる。
[BR4]-Z+
によって表される。Zはカチオンを形成することができる基を表し、そして感光性ではなく、また[BR4]-は、アルキル基、置換型アルキル基、アリール基、置換型アリール基、アラルキル基、置換型アラルキル基、アルカリル基、置換型アルカリル基、アルケニル基、置換型アルケニル基、アルキニル基、置換型アルキニル基、脂環式基、置換型脂環式基、複素環式基、置換型複素環式基、及びこれらの誘導体から選択される4つのR基を有するホウ酸塩化合物である。複数のRは、互いに同じか又は異なるものであってよい。加えて、これらの基のうちの2つ又は3つ以上は直接に結合するか又は置換基を介して結合し、そしてホウ素含有複素環を形成することができる。Z+は、光を吸収せず、そしてアルカリ金属、第四アンモニウム、ピリジニウム、キノリニウム、ジアゾニウム、モルホリニウム、テトラゾリウム、アクリジニウム、ホスホニウム、スルホニウム、オキソスルホニウム、ヨードニウム、S、P、Cu、Ag、Hg、Pd、Fe、Co、Sn、Mo、Cr、Ni、As又はSeを表す。
下記材料及び被覆溶液を使用することにより、可視光パターン化可能被膜を調製した。
製作されたデバイスの電気的特徴付けを、Hewlett Packard HP 4156(登録商標)パラメータ分析装置を用いて実施した。デバイス試験は暗い密閉容器内で空気中で行った。
次のようなカラーマスクを使用してフォトパターンを生成するために、青感光性被膜C−1、緑感光性被膜C−2、及び赤感光性被膜C−3を調製した。表2に示す3.9gのCF−1と0.5gの光開始剤溶液とを含有する溶液から、感光性被膜を調製した。Kodak Professional 8670 Thermal Printerを使用して、赤吸収(シアン)、緑吸収(マゼンタ)、及び青吸収(黄)カラーマスクを調製した。1分間にわたって1000RPMでスピン塗布することにより、感光性被膜を調製し、これらを1分間にわたって80℃で乾燥させ、そして窒素でパージされたガラス・セル内にローディングした。結果として生じた感光性被膜のピーク波長λmaxを表2に示す。露光用の光が感光性被膜に達する前にガラス支持体及びカラーマスクを通過するように、被膜を着色光で照明した。未露光の感光性被膜部分を、D−1中で1分間にわたって現像することにより除去した。これらの工程の結果、カラーマスク上の色パターンに対応するネガティブ・パターン化されたポリマー被膜が形成された。結果を下記表2にまとめる。
次のようなカラーマスクを使用してフォトパターンを生成するために、青感光性被膜C−4、緑感光性被膜C−5、及び赤感光性被膜C−6を調製した。表2に示す4gのCF−2と0.5gの光開始剤溶液とを含有する溶液から、感光性被膜を調製した。露光用の光が感光性被膜に達する前にガラス支持体及びカラーマスクを通過するように、被膜を着色光で照明した。未露光の感光性被膜部分を、D−2中で1分間にわたって現像することにより除去した。これらの工程の結果、カラーマスク上の色パターンに対応するネガティブ・パターン化されたポリマー被膜が形成された。結果を下記表3にまとめる。
次のようなカラーマスクを使用してフォトパターンを生成するために、青感光性被膜C−7、緑感光性被膜C−8、及び青感光性被膜C−9を調製した。これらの感光性被膜はポジ型である。
透明TFTゲート、誘電体、及び半導体構成部品のためのアラインメント工程を単純にするために、裏側のカラーマスクを使用してトランジスタを調製した。次の方法によって、クリーンなガラス支持体に緑色吸収層GCA−1を適用した。Fujifilm Electronic Materials Co., Ltd.から入手したマゼンタ・フォトレジストSM3000Lで、試料をスピン塗布し(1000RPM)、1分間にわたって95℃でベーキングし、そしてレーザーで書き込まれたモリブデン・マスクを使用して露光した。被膜を現像し、そして5分間にわたって200℃でベーキングして、緑色吸収層GCA−1を形成した。緑色吸収パターンGCA−1は、所望の半導体パターンのネガティブであった。
Claims (24)
- a) 表側と裏側とを有する透明支持体を用意する工程;
b) 該透明支持体の該表側又は該裏側のいずれか一方の側に、色パターンを有するカラーマスクを形成する工程;
c) 該カラーマスクを形成した後、該透明支持体の表側に、可視光に対して感光するフォトパターン化可能材料層を被覆する工程;
d) 該フォトパターン化可能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能材料から成り;
e) 該フォトパターン化可能材料層を被覆する前又は後に、機能材料層を堆積する工程;そして
f) 該機能材料層が、該カラーマスクの色パターンに対応する、結果として生じるパターン化された機能材料層を有するように、該フォトパターンを使用して該機能材料層をパターン化する工程
を含んで成る構造を形成する方法。 - 該透明支持体上に形成されたいかなるカラーマスク内にも、別のパターン化された機能材料層を形成するために使用される、異なる色の他の色パターンが存在しない、請求項1に記載の方法。
- 該カラーマスクが該透明支持体の表側にある、請求項1に記載の方法。
- 該カラーマスクと、透明支持体と、パターン化された機能材料層とが、該構造内に残る、請求項2に記載の方法。
- a) 透明支持体を用意する工程;
b) 該透明支持体の第1の側に、色パターンを有するカラーマスクを形成する工程;
c) 該カラーマスクを形成した後、該透明支持体の第1の側に、可視光に対して感光するフォトパターン化可能機能材料層を被覆する工程;
d) 該フォトパターン化可能機能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能機能材料から成り;そして
e) 該フォトパターンに対応する該フォトパターン化可能機能材料層領域を除去することにより形成される、結果として生じるパターン化された機能材料層を有するように、該フォトパターン化可能機能材料層をパターン化する工程
を含んで成る構造を形成する方法。 - 該透明支持体上に形成されたいかなるカラーマスク内にも、フォトパターン化可能機能材料の別のパターン化された層を形成するために使用される、異なる色の他の色パターンが存在しない、請求項5に記載の方法。
- 該カラーマスクと、透明支持体と、パターン化された機能材料とが、該構造内に残る、請求項5に記載の方法。
- 該フォトパターン化可能材料層の、該可視光に暴露されていない領域が、工程(e)の前に除去される、請求項1に記載の方法。
- 該フォトパターン化可能材料層を露光するために利用される可視光が、該カラーマスクの該色パターンの色とマッチする光スペクトルを有している、請求項1に記載の方法。
- 該フォトパターン化可能材料層を露光するために使用される可視光が白光であり、そしてフォトパターン化可能材料が、該カラーマスクの色パターンの色にマッチする光スペクトルによってのみ硬化されることができる、請求項1に記載の方法。
- 該フォトパターン化可能材料が、該カラーマスクの色パターンの色にマッチする光スペクトルを有する可視光によって、第2の露光された状態に変化させられ、そして該フォトパターン化可能材料を露光するために利用される該可視光も同じ色を有している、請求項1に記載の方法。
- 前記カラーマスクが、前記透明基板上にマスターカラー画像の写真複製によって、形成された層を含む、請求項1に記載の方法。
- 前記カラーマスクが、該透明支持体とは別個の基板上に予め形成された後で、前記透明支持体上に積層される、請求項1に記載の方法。
- 前記カラーマスクが、前記透明支持体上に直接に印刷される、請求項1に記載の方法。
- 前記透明支持体が、ガラス又は可撓性ポリマーを含む、請求項1に記載の方法。
- 前記可視光によって該第2の露光された状態へ変化する該フォトパターン化可能材料が、単一の色に対して感光する材料を含む、請求項1に記載の方法。
- 該フォトパターン化可能層が、特定の色波長領域内でのみ励起状態に達するように、画像形成輻射線を吸収することができる色素光開始剤を含む、エチレン系付加重合のための開始剤系を含有している、請求項1に記載の方法。
- 前記パターン化された機能材料層上に少なくとも1つの更なる追加の機能材料層を被覆し、そして前記パターン化された機能材料層とレジスタリングされた状態で前記追加の機能材料層をパターン化する工程をさらに含む、請求項1に記載の方法。
- 透明支持体と、該透明支持体上の色パターンを有するカラーマスクと、該透明支持体の、該色パターンと同じ側のパターン化された機能材料層とを含む物品であって、該パターン化された機能材料層が、該透明支持体上の色パターンとレジスタリングされている、物品。
- 該パターン化された機能材料層が、導体性、誘電性、もしくは半導体特性、又は保護特性を有する、請求項19に記載の物品。
- 該パターン化された機能材料層が透明でない、請求項19に記載の物品。
- 該パターン化された機能材料層が、酸化アルミニウム、酸化ケイ素、及び窒化ケイ素、有機ポリマー並びにこれらの混合物から成る群から選択された誘電体材料;又は酸化インジウム錫(ITO)、ZnO、SnO2、もしくはIn2O3のような透明導体、金属、変性ドープ型半導体、導電性ポリマー、カーボンインク、銀-エポキシ、焼結性金属ナノ粒子懸濁液、及びこれらの混合物から成る群から選択された導電性材料;又は酸化亜鉛、酸化錫、及びこれらの混合物から成る群から選択された半導体材料を含む、請求項19に記載の物品。
- 前記物品がトランジスタを含む、請求項19に記載の物品。
- a) 表側と裏側とを有する透明支持体を用意する工程;
b) 該透明支持体の該表側又は該裏側のいずれか一方の側に、色パターンを有するカラーマスクを形成工程;
c) 該カラーマスクを形成した後、該透明支持体の表側に、可視光に対して感光するフォトパターン化可能材料層を被覆する工程;
d) 該フォトパターン化可能材料層を、該カラーマスクを通して可視光に暴露して、該カラーマスクの色パターンに対応するフォトパターンを形成する工程、
該フォトパターンは、被覆されたままの第1状態とは異なる露光された第2状態に変化したフォトパターン化可能材料から成り;そして
e) 該機能材料層が、該カラーマスクの色パターンに対応する、結果として生じるパターンを有するように、該フォトパターンを使用して機能材料層をパターン化する工程、
該機能材料層は、該フォトパターン化可能材料層であるか、又は該フォトパターン化可能材料層とは別個の層であってよく、該結果としてのパターンが、該機能材料層の所定の領域を除去することにより、又は該機能材料層を選択的領域堆積することにより形成される、
各工程を含んで成る構造を形成する方法。
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JP2011505589A (ja) * | 2007-11-20 | 2011-02-24 | イーストマン コダック カンパニー | 選択的領域堆積と組み合わせて着色マスクを使用する方法 |
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JP2014529728A (ja) * | 2011-08-02 | 2014-11-13 | アルマ・マテール・ストゥディオルム・ウニベルシータ・ディ・ボローニャAlma Mater Studiorum Universita Di Bologna | 電離放射線のイントリンジックな直接検出器およびその検出器の製造方法 |
JP2016191937A (ja) * | 2012-01-12 | 2016-11-10 | 株式会社ニコン | 基板処理装置、基板処理方法、及び円筒状マスク |
Also Published As
Publication number | Publication date |
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EP2212743A1 (en) | 2010-08-04 |
US20090130610A1 (en) | 2009-05-21 |
US8715894B2 (en) | 2014-05-06 |
US8221964B2 (en) | 2012-07-17 |
US20120231239A1 (en) | 2012-09-13 |
WO2009067147A1 (en) | 2009-05-28 |
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