JP2011227080A - オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。 - Google Patents

オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。 Download PDF

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Publication number
JP2011227080A
JP2011227080A JP2011091979A JP2011091979A JP2011227080A JP 2011227080 A JP2011227080 A JP 2011227080A JP 2011091979 A JP2011091979 A JP 2011091979A JP 2011091979 A JP2011091979 A JP 2011091979A JP 2011227080 A JP2011227080 A JP 2011227080A
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Japan
Prior art keywords
area
ground
image
pattern
measurement
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Pending
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JP2011091979A
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English (en)
Japanese (ja)
Inventor
Dal Yeon Kwon
達 顔 權
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koh Young Technology Inc
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Koh Young Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100035255A external-priority patent/KR101190125B1/ko
Priority claimed from KR1020100035347A external-priority patent/KR101190127B1/ko
Application filed by Koh Young Technology Inc filed Critical Koh Young Technology Inc
Publication of JP2011227080A publication Critical patent/JP2011227080A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/143—Sensing or illuminating at different wavelengths
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10028—Range image; Depth image; 3D point clouds
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP2011091979A 2010-04-16 2011-04-18 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。 Pending JP2011227080A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020100035255A KR101190125B1 (ko) 2010-04-16 2010-04-16 3차원 형상 측정 방법
KR10-2010-0035255 2010-04-16
KR1020100035347A KR101190127B1 (ko) 2010-04-16 2010-04-16 영역구분 방법
KR10-2010-0035347 2010-04-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014139443A Division JP2014197023A (ja) 2010-04-16 2014-07-07 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。

Publications (1)

Publication Number Publication Date
JP2011227080A true JP2011227080A (ja) 2011-11-10

Family

ID=44788240

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011091979A Pending JP2011227080A (ja) 2010-04-16 2011-04-18 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。
JP2014139443A Pending JP2014197023A (ja) 2010-04-16 2014-07-07 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。
JP2016021646A Active JP6211114B2 (ja) 2010-04-16 2016-02-08 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2014139443A Pending JP2014197023A (ja) 2010-04-16 2014-07-07 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。
JP2016021646A Active JP6211114B2 (ja) 2010-04-16 2016-02-08 オブジェクト領域とグラウンド領域とを区別する方法及び３次元形状測定方法。

Country Status (3)

Country Link
US (1) US8855403B2 (enExample)
JP (3) JP2011227080A (enExample)
CN (1) CN102261895B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018516451A (ja) * 2015-03-16 2018-06-21 ケーエルエー−テンカー コーポレイション 検査ツールの検査感度を高めるシステム及び方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709009B2 (ja) * 2011-11-17 2015-04-30 Ckd株式会社 三次元計測装置
CN103308530B (zh) * 2012-03-09 2015-04-01 致茂电子(苏州)有限公司 表面花纹的检测方法
CN102694963B (zh) * 2012-04-27 2014-09-17 南京航空航天大学 一种获取无阴影目标图像的方法
KR101590831B1 (ko) 2013-04-02 2016-02-03 주식회사 고영테크놀러지 기판의 이물질 검사방법
US9870669B2 (en) * 2014-04-24 2018-01-16 Orell Füssli Sicherheitsdruck Ag Security device for security document
US10533952B2 (en) 2014-12-08 2020-01-14 Koh Young Technology Inc. Method of inspecting a terminal of a component mounted on a substrate and substrate inspection apparatus
KR20220163513A (ko) * 2018-02-26 2022-12-09 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치 및 부품의 실장 상태를 검사하기 위한 방법
JP2024058314A (ja) * 2022-10-14 2024-04-25 オークマ株式会社 三次元形状測定システム
KR102831163B1 (ko) * 2023-07-11 2025-07-07 충북대학교 산학협력단 Pcb에 실장된 소자 높이 측정 장치 및 방법

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JPH0719825A (ja) * 1993-06-23 1995-01-20 Sharp Corp 基板検査装置
JP2000097869A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd パターンの欠陥検査方法およびその装置
JP2002286427A (ja) * 2001-03-23 2002-10-03 Ckd Corp はんだ印刷検査装置
JP2003504634A (ja) * 1999-07-14 2003-02-04 ソルビジョン インコーポレイティド 物体の凹凸を測定する方法とシステム
JP2003279334A (ja) * 2002-02-01 2003-10-02 Ckd Corp 三次元計測装置、フィルタ格子縞板及び照明手段
JP2004301621A (ja) * 2003-03-31 2004-10-28 Ckd Corp 三次元計測装置及び検査装置
JP2005121397A (ja) * 2003-10-14 2005-05-12 Yamatake Corp ３次元計測装置、３次元計測方法及び３次元計測プログラム
JP2005172622A (ja) * 2003-12-11 2005-06-30 Hamamatsu Photonics Kk ３次元形状計測装置
JP2006300539A (ja) * 2005-04-15 2006-11-02 Ckd Corp 三次元計測装置及び基板検査装置
JP2007017283A (ja) * 2005-07-07 2007-01-25 Toshiba Corp 外観検査方法及び外観検査装置
JP2007163498A (ja) * 2005-12-14 2007-06-28 Koh Young Technology Inc ３次元形状測定装置及び方法
JP2007199070A (ja) * 2006-01-26 2007-08-09 Koh Young Technology Inc ３次元形状測定方法
JP2007286930A (ja) * 2006-04-18 2007-11-01 Juki Corp 対象物の重心検出方法
JP2008122361A (ja) * 2006-11-13 2008-05-29 Koh Young Technology Inc シャドウモアレを用いた３次元形状測定装置
JP2008281543A (ja) * 2007-05-08 2008-11-20 Koh Young Technology Inc 多方向映写式モアレ干渉計及びこれを用いた検査方法
JP2009264852A (ja) * 2008-04-23 2009-11-12 Wakayama Univ 格子画像の位相解析方法およびそれを用いた物体の変位測定方法ならびに物体の形状測定方法

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US6501554B1 (en) * 2000-06-20 2002-12-31 Ppt Vision, Inc. 3D scanner and method for measuring heights and angles of manufactured parts
JP3743319B2 (ja) * 2001-07-18 2006-02-08 株式会社日立製作所 欠陥検出方法及びその装置
JP3841719B2 (ja) * 2002-05-13 2006-11-01 株式会社神戸製鋼所 形状測定装置
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WO2005029413A1 (en) * 2003-09-23 2005-03-31 Iatia Imaging Pty Ltd Method and apparatus for determining the area or confluency of a sample
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JP2007139428A (ja) * 2005-11-14 2007-06-07 Aidin System Kk ３次元計測装置
JP5123522B2 (ja) * 2006-12-25 2013-01-23 パナソニック株式会社 ３次元計測方法及びそれを用いた３次元形状計測装置
JP2009145285A (ja) * 2007-12-18 2009-07-02 Dainippon Screen Mfg Co Ltd 欠陥検出方法および欠陥検出装置
US8285025B2 (en) * 2008-03-25 2012-10-09 Electro Scientific Industries, Inc. Method and apparatus for detecting defects using structured light
US9007395B2 (en) * 2008-12-01 2015-04-14 Marvell World Trade Ltd. Bit resolution enhancement
CA2754812A1 (en) * 2009-03-19 2010-09-23 General Electric Company Optical gage and three-dimensional surface profile measurement method
KR101547218B1 (ko) * 2010-11-19 2015-08-25 주식회사 고영테크놀러지 기판 검사방법
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719825A (ja) * 1993-06-23 1995-01-20 Sharp Corp 基板検査装置
JP2000097869A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd パターンの欠陥検査方法およびその装置
JP2003504634A (ja) * 1999-07-14 2003-02-04 ソルビジョン インコーポレイティド 物体の凹凸を測定する方法とシステム
JP2002286427A (ja) * 2001-03-23 2002-10-03 Ckd Corp はんだ印刷検査装置
JP2003279334A (ja) * 2002-02-01 2003-10-02 Ckd Corp 三次元計測装置、フィルタ格子縞板及び照明手段
JP2004301621A (ja) * 2003-03-31 2004-10-28 Ckd Corp 三次元計測装置及び検査装置
JP2005121397A (ja) * 2003-10-14 2005-05-12 Yamatake Corp ３次元計測装置、３次元計測方法及び３次元計測プログラム
JP2005172622A (ja) * 2003-12-11 2005-06-30 Hamamatsu Photonics Kk ３次元形状計測装置
JP2006300539A (ja) * 2005-04-15 2006-11-02 Ckd Corp 三次元計測装置及び基板検査装置
JP2007017283A (ja) * 2005-07-07 2007-01-25 Toshiba Corp 外観検査方法及び外観検査装置
JP2007163498A (ja) * 2005-12-14 2007-06-28 Koh Young Technology Inc ３次元形状測定装置及び方法
JP2007199070A (ja) * 2006-01-26 2007-08-09 Koh Young Technology Inc ３次元形状測定方法
JP2007286930A (ja) * 2006-04-18 2007-11-01 Juki Corp 対象物の重心検出方法
JP2008122361A (ja) * 2006-11-13 2008-05-29 Koh Young Technology Inc シャドウモアレを用いた３次元形状測定装置
JP2008281543A (ja) * 2007-05-08 2008-11-20 Koh Young Technology Inc 多方向映写式モアレ干渉計及びこれを用いた検査方法
JP2009264852A (ja) * 2008-04-23 2009-11-12 Wakayama Univ 格子画像の位相解析方法およびそれを用いた物体の変位測定方法ならびに物体の形状測定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018516451A (ja) * 2015-03-16 2018-06-21 ケーエルエー−テンカー コーポレイション 検査ツールの検査感度を高めるシステム及び方法

Also Published As

Publication number Publication date
US8855403B2 (en) 2014-10-07
CN102261895A (zh) 2011-11-30
JP2016122010A (ja) 2016-07-07
JP6211114B2 (ja) 2017-10-11
US20110255771A1 (en) 2011-10-20
CN102261895B (zh) 2014-07-09
JP2014197023A (ja) 2014-10-16

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