CN102261895B - 区别对象区与基底区的方法及用该方法测量三维形状的方法 - Google Patents

区别对象区与基底区的方法及用该方法测量三维形状的方法 Download PDF

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Publication number
CN102261895B
CN102261895B CN201110096894.5A CN201110096894A CN102261895B CN 102261895 B CN102261895 B CN 102261895B CN 201110096894 A CN201110096894 A CN 201110096894A CN 102261895 B CN102261895 B CN 102261895B
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area
image
measurement target
target
light
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Chinese (zh)
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CN102261895A (zh
Inventor
权达颜
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Gaoying Technology Co ltd
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Koh Young Technology Inc
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Priority claimed from KR1020100035347A external-priority patent/KR101190127B1/ko
Priority claimed from KR1020100035255A external-priority patent/KR101190125B1/ko
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Publication of CN102261895A publication Critical patent/CN102261895A/zh
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0006Industrial image inspection using a design-rule based approach
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/50Depth or shape recovery
    • G06T7/521Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof
    • G06V10/14Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/143Sensing or illuminating at different wavelengths
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof
    • G06V10/14Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145Illumination specially adapted for pattern recognition, e.g. using gratings
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10028Range image; Depth image; 3D point clouds
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
CN201110096894.5A 2010-04-16 2011-04-18 区别对象区与基底区的方法及用该方法测量三维形状的方法 Active CN102261895B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020100035347A KR101190127B1 (ko) 2010-04-16 2010-04-16 영역구분 방법
KR10-2010-0035255 2010-04-16
KR10-2010-0035347 2010-04-16
KR1020100035255A KR101190125B1 (ko) 2010-04-16 2010-04-16 3차원 형상 측정 방법

Publications (2)

Publication Number Publication Date
CN102261895A CN102261895A (zh) 2011-11-30
CN102261895B true CN102261895B (zh) 2014-07-09

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Country Status (3)

Country Link
US (1) US8855403B2 (enExample)
JP (3) JP2011227080A (enExample)
CN (1) CN102261895B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709009B2 (ja) * 2011-11-17 2015-04-30 Ckd株式会社 三次元計測装置
CN103308530B (zh) * 2012-03-09 2015-04-01 致茂电子(苏州)有限公司 表面花纹的检测方法
CN102694963B (zh) * 2012-04-27 2014-09-17 南京航空航天大学 一种获取无阴影目标图像的方法
KR101590831B1 (ko) * 2013-04-02 2016-02-03 주식회사 고영테크놀러지 기판의 이물질 검사방법
WO2015161388A1 (en) * 2014-04-24 2015-10-29 Orell Füssli Sicherheitsdruck Ag Security device for security document
US10533952B2 (en) 2014-12-08 2020-01-14 Koh Young Technology Inc. Method of inspecting a terminal of a component mounted on a substrate and substrate inspection apparatus
US9747520B2 (en) * 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
CN111788883B (zh) * 2018-02-26 2021-11-05 株式会社高迎科技 部件贴装状态的检查方法、印刷电路板检查装置及计算机可读记录介质
JP2024058314A (ja) * 2022-10-14 2024-04-25 オークマ株式会社 三次元形状測定システム
KR102831163B1 (ko) * 2023-07-11 2025-07-07 충북대학교 산학협력단 Pcb에 실장된 소자 높이 측정 장치 및 방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719825A (ja) 1993-06-23 1995-01-20 Sharp Corp 基板検査装置
JP3878340B2 (ja) 1998-09-18 2007-02-07 株式会社ルネサステクノロジ パターンの欠陥検査方法およびその装置
CA2277855A1 (fr) 1999-07-14 2001-01-14 Solvision Methode et systeme de mesure de la hauteur des billes de soudure d'un circuit imprime
US6501554B1 (en) * 2000-06-20 2002-12-31 Ppt Vision, Inc. 3D scanner and method for measuring heights and angles of manufactured parts
JP4030726B2 (ja) 2001-03-23 2008-01-09 シーケーディ株式会社 はんだ印刷検査装置
JP3743319B2 (ja) * 2001-07-18 2006-02-08 株式会社日立製作所 欠陥検出方法及びその装置
JP3878023B2 (ja) 2002-02-01 2007-02-07 シーケーディ株式会社 三次元計測装置
JP3841719B2 (ja) * 2002-05-13 2006-11-01 株式会社神戸製鋼所 形状測定装置
US7171036B1 (en) * 2002-05-22 2007-01-30 Cognex Technology And Investment Corporation Method and apparatus for automatic measurement of pad geometry and inspection thereof
JP3868917B2 (ja) 2003-03-31 2007-01-17 シーケーディ株式会社 三次元計測装置及び検査装置
EP1668595A4 (en) * 2003-09-23 2007-01-03 Iatia Imaging Pty Ltd METHOD AND DEVICE FOR DETERMINING THE SURFACE OR CONFLUENCE OF A SAMPLE
JP4170875B2 (ja) 2003-10-14 2008-10-22 株式会社山武 3次元計測装置、3次元計測方法及び3次元計測プログラム
JP4383840B2 (ja) 2003-12-11 2009-12-16 浜松ホトニクス株式会社 3次元形状計測装置
US7522289B2 (en) * 2004-10-13 2009-04-21 Solvision, Inc. System and method for height profile measurement of reflecting objects
JP4827431B2 (ja) 2005-04-15 2011-11-30 シーケーディ株式会社 三次元計測装置及び基板検査装置
JP2007017283A (ja) 2005-07-07 2007-01-25 Toshiba Corp 外観検査方法及び外観検査装置
JP2007139428A (ja) * 2005-11-14 2007-06-07 Aidin System Kk 3次元計測装置
US7830528B2 (en) 2005-12-14 2010-11-09 Koh Young Technology, Inc. 3D image measuring apparatus and method thereof
US7545512B2 (en) 2006-01-26 2009-06-09 Koh Young Technology Inc. Method for automated measurement of three-dimensional shape of circuit boards
JP4707598B2 (ja) 2006-04-18 2011-06-22 Juki株式会社 対象物の重心検出方法
KR20080043047A (ko) 2006-11-13 2008-05-16 주식회사 고영테크놀러지 새도우 모아레를 이용한 3차원형상 측정장치
JP5123522B2 (ja) * 2006-12-25 2013-01-23 パナソニック株式会社 3次元計測方法及びそれを用いた3次元形状計測装置
KR100870930B1 (ko) 2007-05-08 2008-11-28 주식회사 고영테크놀러지 다방향 영사식 모아레 간섭계 및 이를 이용한 검사방법
JP2009145285A (ja) * 2007-12-18 2009-07-02 Dainippon Screen Mfg Co Ltd 欠陥検出方法および欠陥検出装置
US8285025B2 (en) * 2008-03-25 2012-10-09 Electro Scientific Industries, Inc. Method and apparatus for detecting defects using structured light
JP4831703B2 (ja) 2008-04-23 2011-12-07 国立大学法人 和歌山大学 物体の変位測定方法
EP2362962A1 (en) * 2008-12-01 2011-09-07 Marvell World Trade Ltd. Bit resolution enhancement
WO2010107434A1 (en) * 2009-03-19 2010-09-23 General Electric Company Optical gage and three-dimensional surface profile measurement method
KR101547218B1 (ko) * 2010-11-19 2015-08-25 주식회사 고영테크놀러지 기판 검사방법
US8755043B2 (en) * 2010-11-19 2014-06-17 Koh Young Technology Inc. Method of inspecting a substrate

Also Published As

Publication number Publication date
JP6211114B2 (ja) 2017-10-11
US20110255771A1 (en) 2011-10-20
CN102261895A (zh) 2011-11-30
JP2011227080A (ja) 2011-11-10
JP2014197023A (ja) 2014-10-16
US8855403B2 (en) 2014-10-07
JP2016122010A (ja) 2016-07-07

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Patentee after: Gaoying Technology Co.,Ltd.

Address before: Han Guoshouer

Patentee before: KOH YOUNG TECHNOLOGY Inc.

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