CN102261895B - 区别对象区与基底区的方法及用该方法测量三维形状的方法 - Google Patents
区别对象区与基底区的方法及用该方法测量三维形状的方法 Download PDFInfo
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- CN102261895B CN102261895B CN201110096894.5A CN201110096894A CN102261895B CN 102261895 B CN102261895 B CN 102261895B CN 201110096894 A CN201110096894 A CN 201110096894A CN 102261895 B CN102261895 B CN 102261895B
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/143—Sensing or illuminating at different wavelengths
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10028—Range image; Depth image; 3D point clouds
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Multimedia (AREA)
- Quality & Reliability (AREA)
- Artificial Intelligence (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100035347A KR101190127B1 (ko) | 2010-04-16 | 2010-04-16 | 영역구분 방법 |
| KR10-2010-0035255 | 2010-04-16 | ||
| KR10-2010-0035347 | 2010-04-16 | ||
| KR1020100035255A KR101190125B1 (ko) | 2010-04-16 | 2010-04-16 | 3차원 형상 측정 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102261895A CN102261895A (zh) | 2011-11-30 |
| CN102261895B true CN102261895B (zh) | 2014-07-09 |
Family
ID=44788240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110096894.5A Active CN102261895B (zh) | 2010-04-16 | 2011-04-18 | 区别对象区与基底区的方法及用该方法测量三维形状的方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8855403B2 (enExample) |
| JP (3) | JP2011227080A (enExample) |
| CN (1) | CN102261895B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5709009B2 (ja) * | 2011-11-17 | 2015-04-30 | Ckd株式会社 | 三次元計測装置 |
| CN103308530B (zh) * | 2012-03-09 | 2015-04-01 | 致茂电子(苏州)有限公司 | 表面花纹的检测方法 |
| CN102694963B (zh) * | 2012-04-27 | 2014-09-17 | 南京航空航天大学 | 一种获取无阴影目标图像的方法 |
| KR101590831B1 (ko) * | 2013-04-02 | 2016-02-03 | 주식회사 고영테크놀러지 | 기판의 이물질 검사방법 |
| WO2015161388A1 (en) * | 2014-04-24 | 2015-10-29 | Orell Füssli Sicherheitsdruck Ag | Security device for security document |
| US10533952B2 (en) | 2014-12-08 | 2020-01-14 | Koh Young Technology Inc. | Method of inspecting a terminal of a component mounted on a substrate and substrate inspection apparatus |
| US9747520B2 (en) * | 2015-03-16 | 2017-08-29 | Kla-Tencor Corporation | Systems and methods for enhancing inspection sensitivity of an inspection tool |
| CN111788883B (zh) * | 2018-02-26 | 2021-11-05 | 株式会社高迎科技 | 部件贴装状态的检查方法、印刷电路板检查装置及计算机可读记录介质 |
| JP2024058314A (ja) * | 2022-10-14 | 2024-04-25 | オークマ株式会社 | 三次元形状測定システム |
| KR102831163B1 (ko) * | 2023-07-11 | 2025-07-07 | 충북대학교 산학협력단 | Pcb에 실장된 소자 높이 측정 장치 및 방법 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719825A (ja) | 1993-06-23 | 1995-01-20 | Sharp Corp | 基板検査装置 |
| JP3878340B2 (ja) | 1998-09-18 | 2007-02-07 | 株式会社ルネサステクノロジ | パターンの欠陥検査方法およびその装置 |
| CA2277855A1 (fr) | 1999-07-14 | 2001-01-14 | Solvision | Methode et systeme de mesure de la hauteur des billes de soudure d'un circuit imprime |
| US6501554B1 (en) * | 2000-06-20 | 2002-12-31 | Ppt Vision, Inc. | 3D scanner and method for measuring heights and angles of manufactured parts |
| JP4030726B2 (ja) | 2001-03-23 | 2008-01-09 | シーケーディ株式会社 | はんだ印刷検査装置 |
| JP3743319B2 (ja) * | 2001-07-18 | 2006-02-08 | 株式会社日立製作所 | 欠陥検出方法及びその装置 |
| JP3878023B2 (ja) | 2002-02-01 | 2007-02-07 | シーケーディ株式会社 | 三次元計測装置 |
| JP3841719B2 (ja) * | 2002-05-13 | 2006-11-01 | 株式会社神戸製鋼所 | 形状測定装置 |
| US7171036B1 (en) * | 2002-05-22 | 2007-01-30 | Cognex Technology And Investment Corporation | Method and apparatus for automatic measurement of pad geometry and inspection thereof |
| JP3868917B2 (ja) | 2003-03-31 | 2007-01-17 | シーケーディ株式会社 | 三次元計測装置及び検査装置 |
| EP1668595A4 (en) * | 2003-09-23 | 2007-01-03 | Iatia Imaging Pty Ltd | METHOD AND DEVICE FOR DETERMINING THE SURFACE OR CONFLUENCE OF A SAMPLE |
| JP4170875B2 (ja) | 2003-10-14 | 2008-10-22 | 株式会社山武 | 3次元計測装置、3次元計測方法及び3次元計測プログラム |
| JP4383840B2 (ja) | 2003-12-11 | 2009-12-16 | 浜松ホトニクス株式会社 | 3次元形状計測装置 |
| US7522289B2 (en) * | 2004-10-13 | 2009-04-21 | Solvision, Inc. | System and method for height profile measurement of reflecting objects |
| JP4827431B2 (ja) | 2005-04-15 | 2011-11-30 | シーケーディ株式会社 | 三次元計測装置及び基板検査装置 |
| JP2007017283A (ja) | 2005-07-07 | 2007-01-25 | Toshiba Corp | 外観検査方法及び外観検査装置 |
| JP2007139428A (ja) * | 2005-11-14 | 2007-06-07 | Aidin System Kk | 3次元計測装置 |
| US7830528B2 (en) | 2005-12-14 | 2010-11-09 | Koh Young Technology, Inc. | 3D image measuring apparatus and method thereof |
| US7545512B2 (en) | 2006-01-26 | 2009-06-09 | Koh Young Technology Inc. | Method for automated measurement of three-dimensional shape of circuit boards |
| JP4707598B2 (ja) | 2006-04-18 | 2011-06-22 | Juki株式会社 | 対象物の重心検出方法 |
| KR20080043047A (ko) | 2006-11-13 | 2008-05-16 | 주식회사 고영테크놀러지 | 새도우 모아레를 이용한 3차원형상 측정장치 |
| JP5123522B2 (ja) * | 2006-12-25 | 2013-01-23 | パナソニック株式会社 | 3次元計測方法及びそれを用いた3次元形状計測装置 |
| KR100870930B1 (ko) | 2007-05-08 | 2008-11-28 | 주식회사 고영테크놀러지 | 다방향 영사식 모아레 간섭계 및 이를 이용한 검사방법 |
| JP2009145285A (ja) * | 2007-12-18 | 2009-07-02 | Dainippon Screen Mfg Co Ltd | 欠陥検出方法および欠陥検出装置 |
| US8285025B2 (en) * | 2008-03-25 | 2012-10-09 | Electro Scientific Industries, Inc. | Method and apparatus for detecting defects using structured light |
| JP4831703B2 (ja) | 2008-04-23 | 2011-12-07 | 国立大学法人 和歌山大学 | 物体の変位測定方法 |
| EP2362962A1 (en) * | 2008-12-01 | 2011-09-07 | Marvell World Trade Ltd. | Bit resolution enhancement |
| WO2010107434A1 (en) * | 2009-03-19 | 2010-09-23 | General Electric Company | Optical gage and three-dimensional surface profile measurement method |
| KR101547218B1 (ko) * | 2010-11-19 | 2015-08-25 | 주식회사 고영테크놀러지 | 기판 검사방법 |
| US8755043B2 (en) * | 2010-11-19 | 2014-06-17 | Koh Young Technology Inc. | Method of inspecting a substrate |
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2011
- 2011-04-14 US US13/086,879 patent/US8855403B2/en active Active
- 2011-04-18 JP JP2011091979A patent/JP2011227080A/ja active Pending
- 2011-04-18 CN CN201110096894.5A patent/CN102261895B/zh active Active
-
2014
- 2014-07-07 JP JP2014139443A patent/JP2014197023A/ja active Pending
-
2016
- 2016-02-08 JP JP2016021646A patent/JP6211114B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6211114B2 (ja) | 2017-10-11 |
| US20110255771A1 (en) | 2011-10-20 |
| CN102261895A (zh) | 2011-11-30 |
| JP2011227080A (ja) | 2011-11-10 |
| JP2014197023A (ja) | 2014-10-16 |
| US8855403B2 (en) | 2014-10-07 |
| JP2016122010A (ja) | 2016-07-07 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Han Guoshouer Patentee after: Gaoying Technology Co.,Ltd. Address before: Han Guoshouer Patentee before: KOH YOUNG TECHNOLOGY Inc. |
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| CP01 | Change in the name or title of a patent holder |