JP2011209130A5 - - Google Patents
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- JP2011209130A5 JP2011209130A5 JP2010077699A JP2010077699A JP2011209130A5 JP 2011209130 A5 JP2011209130 A5 JP 2011209130A5 JP 2010077699 A JP2010077699 A JP 2010077699A JP 2010077699 A JP2010077699 A JP 2010077699A JP 2011209130 A5 JP2011209130 A5 JP 2011209130A5
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- 239000000758 substrate Substances 0.000 claims description 23
- 239000012528 membrane Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010077699A JP4979788B2 (ja) | 2010-03-30 | 2010-03-30 | 流量センサーおよび流量検出装置 |
| KR1020127023206A KR101358698B1 (ko) | 2010-03-30 | 2010-09-16 | 유량 센서 및 유량 검출 장치 |
| PCT/JP2010/005658 WO2011121680A1 (ja) | 2010-03-30 | 2010-09-16 | 流量センサーおよび流量検出装置 |
| US13/637,872 US20130008263A1 (en) | 2010-03-30 | 2010-09-16 | Flowrate sensor and flowrate detection device |
| CA2794467A CA2794467A1 (en) | 2010-03-30 | 2010-09-16 | Flowrate sensor and flowrate detection device |
| CN2010800654299A CN102792130A (zh) | 2010-03-30 | 2010-09-16 | 流量传感器及流量检测装置 |
| EP10848862.8A EP2554952A4 (en) | 2010-03-30 | 2010-09-16 | FLOW SENSOR AND FLOW DETECTOR |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010077699A JP4979788B2 (ja) | 2010-03-30 | 2010-03-30 | 流量センサーおよび流量検出装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011209130A JP2011209130A (ja) | 2011-10-20 |
| JP2011209130A5 true JP2011209130A5 (enExample) | 2011-12-15 |
| JP4979788B2 JP4979788B2 (ja) | 2012-07-18 |
Family
ID=44711477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010077699A Expired - Fee Related JP4979788B2 (ja) | 2010-03-30 | 2010-03-30 | 流量センサーおよび流量検出装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130008263A1 (enExample) |
| EP (1) | EP2554952A4 (enExample) |
| JP (1) | JP4979788B2 (enExample) |
| KR (1) | KR101358698B1 (enExample) |
| CN (1) | CN102792130A (enExample) |
| CA (1) | CA2794467A1 (enExample) |
| WO (1) | WO2011121680A1 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101398016B1 (ko) * | 2012-08-08 | 2014-05-30 | 앰코 테크놀로지 코리아 주식회사 | 리드 프레임 패키지 및 그 제조 방법 |
| EP2745775A1 (en) * | 2012-12-18 | 2014-06-25 | General Electric Company | Device for measuring respiratory gas property, airway adapter and gas analyzing unit for respiratory gas analysis |
| JP6252241B2 (ja) | 2014-02-27 | 2017-12-27 | セイコーエプソン株式会社 | 力検出装置、およびロボット |
| JP6548067B2 (ja) * | 2014-05-02 | 2019-07-24 | 国立大学法人 東京大学 | ジャイロセンサ |
| DE102015206708A1 (de) * | 2015-04-15 | 2016-10-20 | Robert Bosch Gmbh | Sensor zur Bestimmung wenigstens eines Parameters eines durch einen Messkanal strömenden fluiden Mediums |
| EP3112819B1 (en) * | 2015-06-30 | 2020-03-11 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Miniature differential pressure flow sensor |
| US10139256B2 (en) | 2015-08-03 | 2018-11-27 | Aceinna, Inc. | MEMS flow sensor |
| US10393553B2 (en) * | 2016-02-25 | 2019-08-27 | Idex Health & Science Llc | Modular sensor system |
| US9659838B1 (en) * | 2016-03-28 | 2017-05-23 | Lockheed Martin Corporation | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal |
| USD864004S1 (en) * | 2016-09-26 | 2019-10-22 | Siemens Aktiengesellschaft | Enclosure |
| WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
| CN116907693A (zh) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | 集成数字力传感器和相关制造方法 |
| US11221263B2 (en) | 2017-07-19 | 2022-01-11 | Nextinput, Inc. | Microelectromechanical force sensor having a strain transfer layer arranged on the sensor die |
| JP2019023606A (ja) * | 2017-07-24 | 2019-02-14 | 株式会社デンソー | 物理量計測装置及び物理量計測装置の製造方法 |
| US11423686B2 (en) | 2017-07-25 | 2022-08-23 | Qorvo Us, Inc. | Integrated fingerprint and force sensor |
| WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME |
| US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
| WO2019090057A1 (en) | 2017-11-02 | 2019-05-09 | Nextinput, Inc. | Sealed force sensor with etch stop layer |
| WO2019099821A1 (en) | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
| CN108254031B (zh) * | 2017-12-28 | 2020-07-10 | 上海工程技术大学 | 压差式气体微流量传感器及其制作方法 |
| CN109579928B (zh) * | 2018-11-23 | 2020-10-23 | 北京控制工程研究所 | 一种热式微流量测量传感器流道及密封结构 |
| EP3680211B1 (en) * | 2019-01-10 | 2024-03-06 | TE Connectivity Solutions GmbH | Sensor unit and method of interconnecting a substrate and a carrier |
| US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
| KR102889326B1 (ko) * | 2019-01-25 | 2025-11-20 | 램 리써치 코포레이션 | 차압 기반 유량계들 (differential-pressure-based flow meters) |
| US11300535B2 (en) * | 2019-04-05 | 2022-04-12 | Honeywell International Inc. | Integrated sensor apparatus with pressure sensing element and flow sensing element |
| US11280649B2 (en) * | 2019-10-21 | 2022-03-22 | Flusso Limited | Sensor assembly |
| WO2021124339A1 (en) | 2019-12-20 | 2021-06-24 | Ezmems Ltd | System and methods of measuring properties of fluids |
| CN111551759A (zh) * | 2020-04-13 | 2020-08-18 | 中国电子科技集团公司第四十九研究所 | 一种用于热膜式风速传感器单元的测试夹具 |
| TWI720878B (zh) * | 2020-04-24 | 2021-03-01 | 研能科技股份有限公司 | 致動傳感模組 |
| CN111927751B (zh) * | 2020-07-14 | 2021-07-02 | 西安交通大学 | 一种隔膜压缩机膜片位移无损监测系统及方法 |
| CN112729426B (zh) * | 2020-12-25 | 2021-08-27 | 江苏海讯环境技术有限公司 | 一种烟气流量流速监控系统 |
| US11349431B1 (en) | 2021-05-05 | 2022-05-31 | Robert J. Cerullo | Lift assist solar panel apparatus |
| NL2028203B1 (en) * | 2021-05-12 | 2022-12-08 | Berkin Bv | Device for controlling or measuring a fluid |
| CN116296358B (zh) * | 2023-05-22 | 2024-02-20 | 四川弥韧科技有限公司 | 一种自闭阀自动检测设备及检测方法 |
| US20240390568A1 (en) * | 2023-05-25 | 2024-11-28 | Honeywell International Inc. | Devices for delivering at least one flowing media, associated sensor modules, and associated methods of mechanically and electrically coupling a sensor module to a device for delivering at least one flowing media |
| CN116399578B (zh) * | 2023-06-07 | 2023-08-25 | 宁波瑞丰汽车零部件有限公司 | 减震器活塞主体的流量检测装置 |
| KR102611068B1 (ko) | 2023-08-18 | 2023-12-06 | (주)한울인텍스 | 온도센서 일체형 차압식 유량계 |
| KR102794902B1 (ko) | 2023-08-18 | 2025-04-10 | (주)한울인텍스 | 다배관 유량 측정 시스템 |
| CN118960873B (zh) * | 2024-10-17 | 2024-12-27 | 上海芯龙半导体技术股份有限公司 | 进风量监测传感器 |
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| US4221134A (en) * | 1979-08-20 | 1980-09-09 | Ekstrom Jr Regner A | Differential pressure transducer with strain gauge |
| US5463904A (en) * | 1994-02-04 | 1995-11-07 | The Foxboro Company | Multimeasurement vortex sensor for a vortex-generating plate |
| JPH0882563A (ja) * | 1994-09-12 | 1996-03-26 | Tokin Corp | 半導体圧力センサのパッケージング構造 |
| DE19758462C2 (de) * | 1997-04-22 | 2000-11-30 | Fraunhofer Ges Forschung | Dosiervorrichtungselement |
| US6150681A (en) * | 1998-07-24 | 2000-11-21 | Silicon Microstructures, Inc. | Monolithic flow sensor and pressure sensor |
| JP2001133302A (ja) * | 1999-11-05 | 2001-05-18 | Koganei Corp | 流量検出装置 |
| AU4868901A (en) | 2000-05-04 | 2001-11-12 | Sensirion Ag | Flow sensor |
| US20040025598A1 (en) * | 2000-09-21 | 2004-02-12 | Festo Ag & Co. | Integrated fluid sensing device |
| US6591674B2 (en) * | 2000-12-21 | 2003-07-15 | Honeywell International Inc. | System for sensing the motion or pressure of a fluid, the system having dimensions less than 1.5 inches, a metal lead frame with a coefficient of thermal expansion that is less than that of the body, or two rtds and a heat source |
| KR100407472B1 (ko) * | 2001-06-29 | 2003-11-28 | 삼성전자주식회사 | 트렌치가 형성된 상부 칩을 구비하는 칩 적층형 패키지소자 및 그 제조 방법 |
| US6987032B1 (en) * | 2002-07-19 | 2006-01-17 | Asat Ltd. | Ball grid array package and process for manufacturing same |
| JP2004301521A (ja) * | 2003-03-28 | 2004-10-28 | Mitsui Eng & Shipbuild Co Ltd | 振動検出装置 |
| JP2005300187A (ja) * | 2004-04-06 | 2005-10-27 | Keyence Corp | 分流式流量センサ装置 |
| KR100639702B1 (ko) * | 2004-11-26 | 2006-10-30 | 삼성전자주식회사 | 패키지된 반도체 다이 및 그 제조방법 |
| TWI292178B (en) * | 2005-07-01 | 2008-01-01 | Yu Nung Shen | Stacked semiconductor chip package |
| US7703339B2 (en) * | 2005-12-09 | 2010-04-27 | Analog Devices, Inc. | Flow sensor chip |
| JP4845187B2 (ja) * | 2006-02-07 | 2011-12-28 | 株式会社山武 | センサのパッケージ構造及びこれを有するフローセンサ |
| US7732233B2 (en) * | 2006-07-24 | 2010-06-08 | Touch Micro-System Technology Corp. | Method for making light emitting diode chip package |
| JP2008215825A (ja) * | 2007-02-28 | 2008-09-18 | Yamatake Corp | センサ |
| JP2008249420A (ja) * | 2007-03-29 | 2008-10-16 | Fujikura Ltd | 半導体センサモジュール及び電子機器 |
| JP5052275B2 (ja) * | 2007-09-20 | 2012-10-17 | アズビル株式会社 | フローセンサの取付構造 |
| JP2009109349A (ja) * | 2007-10-30 | 2009-05-21 | Yokogawa Electric Corp | フローセンサ |
| US7603898B2 (en) * | 2007-12-19 | 2009-10-20 | Honeywell International Inc. | MEMS structure for flow sensor |
| JP2009243923A (ja) * | 2008-03-28 | 2009-10-22 | Casio Comput Co Ltd | 流量センサ及びその製造方法 |
| JP2010019693A (ja) | 2008-07-10 | 2010-01-28 | Torex Semiconductor Ltd | 加速度センサー装置 |
| JP2010028025A (ja) | 2008-07-24 | 2010-02-04 | Toyota Motor Corp | 電子装置 |
-
2010
- 2010-03-30 JP JP2010077699A patent/JP4979788B2/ja not_active Expired - Fee Related
- 2010-09-16 CA CA2794467A patent/CA2794467A1/en not_active Abandoned
- 2010-09-16 WO PCT/JP2010/005658 patent/WO2011121680A1/ja not_active Ceased
- 2010-09-16 US US13/637,872 patent/US20130008263A1/en not_active Abandoned
- 2010-09-16 KR KR1020127023206A patent/KR101358698B1/ko not_active Expired - Fee Related
- 2010-09-16 EP EP10848862.8A patent/EP2554952A4/en active Pending
- 2010-09-16 CN CN2010800654299A patent/CN102792130A/zh active Pending
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