JP2011188224A - 温度情報出力装置、撮像装置、温度情報出力方法 - Google Patents

温度情報出力装置、撮像装置、温度情報出力方法 Download PDF

Info

Publication number
JP2011188224A
JP2011188224A JP2010051223A JP2010051223A JP2011188224A JP 2011188224 A JP2011188224 A JP 2011188224A JP 2010051223 A JP2010051223 A JP 2010051223A JP 2010051223 A JP2010051223 A JP 2010051223A JP 2011188224 A JP2011188224 A JP 2011188224A
Authority
JP
Japan
Prior art keywords
signal
period
temperature
count
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2010051223A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011188224A5 (enExample
Inventor
Norito Wakabayashi
準人 若林
Masatoshi Hara
政敏 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2010051223A priority Critical patent/JP2011188224A/ja
Priority to US12/929,600 priority patent/US20110221931A1/en
Publication of JP2011188224A publication Critical patent/JP2011188224A/ja
Publication of JP2011188224A5 publication Critical patent/JP2011188224A5/ja
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/06—Continuously compensating for, or preventing, undesired influence of physical parameters
    • H03M1/0617—Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence
    • H03M1/0619—Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence by dividing out the errors, i.e. using a ratiometric arrangement
    • H03M1/0621—Continuously compensating for, or preventing, undesired influence of physical parameters characterised by the use of methods or means not specific to a particular type of detrimental influence by dividing out the errors, i.e. using a ratiometric arrangement with auxiliary conversion of a value corresponding to the physical parameter(s) to be compensated for
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2219/00—Thermometers with dedicated analog to digital converters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/06—Continuously compensating for, or preventing, undesired influence of physical parameters
    • H03M1/08—Continuously compensating for, or preventing, undesired influence of physical parameters of noise
    • H03M1/089—Continuously compensating for, or preventing, undesired influence of physical parameters of noise of temperature variations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters
    • H03M1/1205—Multiplexed conversion systems
    • H03M1/123—Simultaneous, i.e. using one converter per channel but with common control or reference circuits for multiple converters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters
    • H03M1/50—Analogue/digital converters with intermediate conversion to time interval
    • H03M1/56—Input signal compared with linear ramp

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010051223A 2010-03-09 2010-03-09 温度情報出力装置、撮像装置、温度情報出力方法 Abandoned JP2011188224A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010051223A JP2011188224A (ja) 2010-03-09 2010-03-09 温度情報出力装置、撮像装置、温度情報出力方法
US12/929,600 US20110221931A1 (en) 2010-03-09 2011-02-03 Temperature information output apparatus, imaging apparatus, method of outputting temperature information

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010051223A JP2011188224A (ja) 2010-03-09 2010-03-09 温度情報出力装置、撮像装置、温度情報出力方法

Publications (2)

Publication Number Publication Date
JP2011188224A true JP2011188224A (ja) 2011-09-22
JP2011188224A5 JP2011188224A5 (enExample) 2013-03-28

Family

ID=44559626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010051223A Abandoned JP2011188224A (ja) 2010-03-09 2010-03-09 温度情報出力装置、撮像装置、温度情報出力方法

Country Status (2)

Country Link
US (1) US20110221931A1 (enExample)
JP (1) JP2011188224A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056970A (ja) * 2016-09-30 2018-04-05 キヤノン株式会社 撮像装置、撮像システムおよび移動体
WO2018092269A1 (ja) * 2016-11-18 2018-05-24 オリンパス株式会社 固体撮像素子および撮像装置
JP2018137586A (ja) * 2017-02-21 2018-08-30 株式会社リコー 画像撮像装置及び電子機器
JP2019134318A (ja) * 2018-01-31 2019-08-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
JP2021048606A (ja) * 2020-11-25 2021-03-25 キヤノン株式会社 撮像システムおよび移動体
JPWO2020144996A1 (ja) * 2019-01-10 2021-11-25 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
JP2022144241A (ja) * 2021-03-18 2022-10-03 キヤノン株式会社 光電変換装置、基板及び機器

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5185772B2 (ja) * 2008-10-28 2013-04-17 セイコーインスツル株式会社 Ｐｄｍ出力型温度センサ
JP5736784B2 (ja) * 2011-01-13 2015-06-17 セイコーエプソン株式会社 温度検出装置、電気光学装置および電子機器
GB2497571A (en) 2011-12-15 2013-06-19 St Microelectronics Res & Dev An imaging array with high dynamic range
US9074943B2 (en) * 2012-10-30 2015-07-07 Freescale Semiconductor, Inc. Production-test die temperature measurement
JP5865861B2 (ja) * 2013-03-26 2016-02-17 京セラドキュメントソリューションズ株式会社 画像読取装置および画像形成装置
US9574951B2 (en) 2013-09-09 2017-02-21 Semiconductor Components Industries, Llc Image sensor including temperature sensor and electronic shutter function
JP6350863B2 (ja) 2013-12-20 2018-07-04 ソニー株式会社 撮像素子、撮像装置、および電子装置
JP6541347B2 (ja) * 2014-03-27 2019-07-10 キヤノン株式会社 固体撮像装置および撮像システム
TWI648986B (zh) * 2014-04-15 2019-01-21 Sony Corporation 攝像元件、電子機器
US11107384B2 (en) * 2019-04-19 2021-08-31 Silicon Works Co., Ltd. Display driving device including voltage limiter for sensing voltage variation and limiting voltage level of sensing line
KR20230008370A (ko) 2021-07-07 2023-01-16 삼성전자주식회사 온도 변화에 따른 전압 레벨을 보상하는 전자 회로 및 이를 포함하는 이미지 센서
CN114034411B (zh) * 2021-11-10 2023-05-23 四川创安微电子有限公司 图像传感器温度测量系统及方法
CN115396610B (zh) * 2022-08-03 2025-03-11 江南大学 浮栅型图像传感器斜坡电压的温度校正方法及读出电路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100795013B1 (ko) * 2006-09-13 2008-01-16 주식회사 하이닉스반도체 밴드 갭 레퍼런스 회로와 이를 이용한 온도 정보 출력장치
US7738019B2 (en) * 2006-10-11 2010-06-15 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for providing automatic gain control in an imaging device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056970A (ja) * 2016-09-30 2018-04-05 キヤノン株式会社 撮像装置、撮像システムおよび移動体
WO2018092269A1 (ja) * 2016-11-18 2018-05-24 オリンパス株式会社 固体撮像素子および撮像装置
US10863132B2 (en) 2016-11-18 2020-12-08 Olympus Corporation Solid-state image pickup device and image pickup apparatus
JP2018137586A (ja) * 2017-02-21 2018-08-30 株式会社リコー 画像撮像装置及び電子機器
JP7078818B2 (ja) 2018-01-31 2022-06-01 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
JP2019134318A (ja) * 2018-01-31 2019-08-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
US11686630B2 (en) 2018-01-31 2023-06-27 Sony Semiconductor Solutions Corporation Imaging device and calibration method
JPWO2020144996A1 (ja) * 2019-01-10 2021-11-25 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
JP7477464B2 (ja) 2019-01-10 2024-05-01 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびキャリブレーション方法
US12111215B2 (en) 2019-01-10 2024-10-08 Sony Semiconductor Solutions Corporation Imaging device and calibration method
JP7145925B2 (ja) 2020-11-25 2022-10-03 キヤノン株式会社 撮像システムおよび移動体
JP2021048606A (ja) * 2020-11-25 2021-03-25 キヤノン株式会社 撮像システムおよび移動体
JP2022144241A (ja) * 2021-03-18 2022-10-03 キヤノン株式会社 光電変換装置、基板及び機器
JP7791653B2 (ja) 2021-03-18 2025-12-24 キヤノン株式会社 光電変換装置、基板及び機器

Also Published As

Publication number Publication date
US20110221931A1 (en) 2011-09-15

Similar Documents

Publication Publication Date Title
US20110221931A1 (en) Temperature information output apparatus, imaging apparatus, method of outputting temperature information
US7502061B2 (en) Method for image sensor calibration and associated devices
JP5858695B2 (ja) 固体撮像装置及び固体撮像装置の駆動方法
JP4725608B2 (ja) 比較器、比較器の校正方法、固体撮像素子、およびカメラシステム
JP4442515B2 (ja) 固体撮像装置、固体撮像装置におけるアナログ−デジタル変換方法および撮像装置
JP4529834B2 (ja) 固体撮像装置、固体撮像装置の駆動方法および撮像装置
JP5034610B2 (ja) 固体撮像装置、固体撮像装置の信号処理方法および撮像装置
US9307173B2 (en) Signal processing circuit, solid-state imaging device, and camera system
CN105379250B (zh) 信号处理装置、成像装置和成像设备
US10630912B2 (en) Image sensor, image capturing apparatus, and method for controlling image sensor
US20080062296A1 (en) Photoelectric conversion device and imaging device
KR20180134277A (ko) 고체 촬상 소자, 전자 기기, 및, 고체 촬상 소자의 제어 방법
US8908066B2 (en) Solid state imaging device
JP6272085B2 (ja) 撮像装置及びその制御方法、プログラム、記憶媒体
US20110205386A1 (en) Solid-state imaging device and camera system
KR20120088602A (ko) 모바일 어플리케이션용의 ｃｍｏｓ 이미지 센서에 대한 다이나믹 레인지 확장
JP5953074B2 (ja) 撮像装置
JP2015115736A (ja) 撮像装置、撮像素子、撮像装置の駆動方法
JP6384546B2 (ja) 固体撮像装置および電子機器
US11558575B2 (en) Analog-to-digital converter having reference signal, image sensor, and image capturing apparatus
JP5106596B2 (ja) 撮像装置
JP4320693B2 (ja) 固体撮像装置
JP6112871B2 (ja) 撮像素子及び撮像装置
JP2011171889A (ja) 固体撮像素子及び撮像機器
JP2011109612A (ja) 固体撮像装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130212

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130212

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20130416