JP2011176124A - 銅カラム及びその製造方法 - Google Patents
銅カラム及びその製造方法 Download PDFInfo
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- JP2011176124A JP2011176124A JP2010039096A JP2010039096A JP2011176124A JP 2011176124 A JP2011176124 A JP 2011176124A JP 2010039096 A JP2010039096 A JP 2010039096A JP 2010039096 A JP2010039096 A JP 2010039096A JP 2011176124 A JP2011176124 A JP 2011176124A
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- copper
- copper column
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- copper wire
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 277
- 239000010949 copper Substances 0.000 title claims abstract description 192
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 180
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 52
- 239000004593 Epoxy Substances 0.000 claims abstract description 50
- 239000011521 glass Substances 0.000 claims abstract description 50
- 238000000137 annealing Methods 0.000 claims abstract description 44
- 238000005520 cutting process Methods 0.000 claims abstract description 44
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 238000005491 wire drawing Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000005304 joining Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 28
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 14
- 150000001412 amines Chemical class 0.000 claims description 8
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 7
- 239000012756 surface treatment agent Substances 0.000 claims description 7
- 230000008646 thermal stress Effects 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 239000013078 crystal Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000465 moulding Methods 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910020220 Pb—Sn Inorganic materials 0.000 description 4
- 238000005482 strain hardening Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910016338 Bi—Sn Inorganic materials 0.000 description 2
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Abstract
【解決手段】線形状に成形された銅線を所定の径にするために伸線する伸線工程と、伸線工程で伸線した銅線を所定の長さに切断する切断工程と、切断工程で切断された銅線の一端を長手方向に向かってプレスして銅カラム部材を形成するプレス工程と、プレス工程で形成された銅カラム部材を、加熱時間が600℃以上で、60分間以上保持して焼鈍する焼鈍工程とによって、銅カラムを形成する。これにより、銅カラムのビッカース硬さが55HV以下になって、銅カラムを軟化し、セラミック基板とガラスエポキシ基板とを当該銅カラムを介して接合する際に、セラミック基板の熱膨張とガラスエポキシ基板の熱膨張との差に起因する熱ストレスを当該銅カラムによって吸収することができる。この結果、セラミック基板とガラスエポキシ基板との接合の破壊を防止できる。
【選択図】図4
Description
[銅カラム30の製造例]
<伸線工程、切断工程及びプレス工程>
まずは、銅カラム30の製造方法に係る伸線工程、切断工程及びプレス工程について説明する。本実施の形態に係る銅線10は、予め伸線工程で伸線されていることを前提とする。伸線とは、銅線の側面を叩いた後ダイスを通すことにより、銅線を伸ばして所定の径に形成する処理のことである。
次に、銅カラム30の製造方法に係る焼鈍工程について説明する。銅カラム部材の製造装置100で製造された銅カラム部材20は、焼鈍炉に投入され、図4に示す温度プロファイルで焼鈍される。図4の縦軸は焼鈍炉内の温度(℃)であり、横軸は銅カラム部材20を焼鈍炉に投入してからの経過時間(分)である。
次に、銅カラム30の製造方法に係る表面処理工程及びめっき工程について説明する。上述のように焼鈍された銅カラム部材20をアミン系の表面処理剤で表面を処理する。すると、銅カラム部材20の表面が粗くなり、めっき液が付着しやすくなる。
次に、上述の銅カラム30の製造方法で製造された銅カラム30の形状例について説明する。図5A及び図5Bに示すように、銅カラム30は、カラム本体部30a及びカラムヘッド部30bで構成される。本実施の形態では、銅カラム30の長さL1は、1.524mmであり、カラム本体部30aの径D1は、0.25mmであり、カラムヘッド部30bの長さL2は0.13mmであり、カラムヘッド部30bの径D2は、0.5mmである。このような銅カラム30は、カラム本体部30aの径D1が0.25mmと小さいので、端面が平坦なカラムヘッド部30bを設けることで、図1で説明したセラミック基板40とのはんだ付け強度を増強している。
(1)無酸素銅で構成された直径6mmの線形状の銅線の側面を叩き、ダイスを通して直径2.6mmまで伸線した。
(2)直径2.6mmまで伸線した銅線の側面を更に叩き、ダイスを通して直径0.25mmまで伸線した。
(3)図2及び図3に示したように、直径0.25mmまで伸線した銅線を長さ1.941mmに切断し、該切断した銅線の一端をハンマでプレスしてカラムヘッド部を形成して、銅カラム部材を作製した。この銅カラム部材の長さは1.524mmである。
(4)このように作製された銅カラム部材をSUS製バットに入れて、連続コンベア式電気抵抗加熱炉(焼鈍炉)に通して焼鈍した。この焼鈍条件は、コンベアスピードが30mm/分、670℃までの昇温時間が52分、670℃保持時間が90分、空冷ファンによる冷却時間が39分である。銅カラムの酸化防止のために焼鈍炉内を窒素ガス雰囲気にした。
(5)焼鈍された銅カラム部材をIPA(Isopropyl alcohol)で洗浄後、アミン系の表面処理剤で銅カラム部材の表面を処理した。
(6)メタンスルフォン酸系のSnめっき液に焼鈍済の銅カラム部材を投入し、めっき厚が略0.5μmになるように時間を設定して、Snめっきした。
(7)めっき後の銅カラム部材をIPAで洗浄後、乾燥した。
Claims (6)
- セラミック基板とガラスエポキシ基板とを接合する銅カラムであって、ビッカース硬さが55HV以下であることを特徴とする銅カラム。
- セラミック基板とガラスエポキシ基板とを接合する、めっきされた銅カラムであって、ビッカース硬さが55HV以下であることを特徴とする銅カラム。
- 銅線を所定の径にするために伸線する伸線工程と、前記伸線工程で伸線した銅線を所定の長さに切断する切断工程とを有する銅カラムの製造方法であって、
前記切断工程で切断した銅線を、加熱温度が600℃以上で、60分間以上保持して焼鈍する焼鈍工程を有することを特徴とする銅カラムの製造方法。 - 銅線を所定の径にするために伸線する伸線工程と、前記伸線工程で伸線した銅線を所定の長さに切断する切断工程と、前記切断工程で切断された銅線の一端を長手方向に向かってプレスして銅カラム部材を形成するプレス工程とを有する銅カラムの製造方法であって、
前記プレス工程で形成された銅カラム部材を、加熱温度が600℃以上で、60分間以上保持して焼鈍する焼鈍工程を有することを特徴とする銅カラムの製造方法。 - 前記焼鈍工程で焼鈍した銅線若しくは銅カラム部材を、アミン系の表面処理剤で表面処理する表面処理工程を有することを特徴とする請求項3又は4に記載の銅カラムの製造方法。
- 前記焼鈍工程で焼鈍した銅線若しくは銅カラム部材、又は、前記表面処理工程で表面処理した銅線若しくは銅カラム部材を、メタンスルフォン酸系のめっき液でめっきするめっき工程を有することを特徴とする請求項3乃至5のいずれかに記載の銅カラムの製造方法。
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