JP2011171531A5 - - Google Patents

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Publication number
JP2011171531A5
JP2011171531A5 JP2010034314A JP2010034314A JP2011171531A5 JP 2011171531 A5 JP2011171531 A5 JP 2011171531A5 JP 2010034314 A JP2010034314 A JP 2010034314A JP 2010034314 A JP2010034314 A JP 2010034314A JP 2011171531 A5 JP2011171531 A5 JP 2011171531A5
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JP
Japan
Prior art keywords
aluminum oxide
wiring board
oxide substrate
layer
connection pad
Prior art date
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Granted
Application number
JP2010034314A
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English (en)
Japanese (ja)
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JP5363377B2 (ja
JP2011171531A (ja
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Priority to JP2010034314A priority Critical patent/JP5363377B2/ja
Priority claimed from JP2010034314A external-priority patent/JP5363377B2/ja
Publication of JP2011171531A publication Critical patent/JP2011171531A/ja
Publication of JP2011171531A5 publication Critical patent/JP2011171531A5/ja
Application granted granted Critical
Publication of JP5363377B2 publication Critical patent/JP5363377B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010034314A 2010-02-19 2010-02-19 配線基板及びその製造方法 Expired - Fee Related JP5363377B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010034314A JP5363377B2 (ja) 2010-02-19 2010-02-19 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010034314A JP5363377B2 (ja) 2010-02-19 2010-02-19 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011171531A JP2011171531A (ja) 2011-09-01
JP2011171531A5 true JP2011171531A5 (enrdf_load_stackoverflow) 2013-01-24
JP5363377B2 JP5363377B2 (ja) 2013-12-11

Family

ID=44685332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010034314A Expired - Fee Related JP5363377B2 (ja) 2010-02-19 2010-02-19 配線基板及びその製造方法

Country Status (1)

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JP (1) JP5363377B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6282425B2 (ja) * 2012-10-29 2018-02-21 新光電気工業株式会社 配線基板の製造方法
JP6375249B2 (ja) 2015-03-02 2018-08-15 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
CN116057681A (zh) * 2020-08-12 2023-05-02 富士胶片株式会社 结构体、结构体的制造方法、接合体的制造方法及器件的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3154713B2 (ja) * 1990-03-16 2001-04-09 株式会社リコー 異方性導電膜およびその製造方法
JPH05291721A (ja) * 1992-04-10 1993-11-05 Cmk Corp プリント配線板
JPH06287774A (ja) * 1993-04-05 1994-10-11 Metsuku Kk 銅および銅合金の表面処理剤
JP3130707B2 (ja) * 1993-08-09 2001-01-31 株式会社日立製作所 プリント基板およびその製造方法
JP3087152B2 (ja) * 1993-09-08 2000-09-11 富士通株式会社 樹脂フィルム多層回路基板の製造方法
JPH09266374A (ja) * 1996-03-28 1997-10-07 Chichibu Onoda Cement Corp 放熱性基板の製造方法
JP3736046B2 (ja) * 1997-06-19 2006-01-18 株式会社トッパンNecサーキットソリューションズ 半導体装置用基板及びその製造方法
JP4558883B2 (ja) * 2000-03-24 2010-10-06 義和 小林 酸性無電解錫めっき液中の銅の定量方法
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置
JP2009099831A (ja) * 2007-10-18 2009-05-07 Nippon Circuit Kogyo Kk 配線基板の製造方法
JP5344667B2 (ja) * 2007-12-18 2013-11-20 太陽誘電株式会社 回路基板およびその製造方法並びに回路モジュール

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