JP2011166029A5 - - Google Patents
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- Publication number
- JP2011166029A5 JP2011166029A5 JP2010029352A JP2010029352A JP2011166029A5 JP 2011166029 A5 JP2011166029 A5 JP 2011166029A5 JP 2010029352 A JP2010029352 A JP 2010029352A JP 2010029352 A JP2010029352 A JP 2010029352A JP 2011166029 A5 JP2011166029 A5 JP 2011166029A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating layer
- conductive
- forming
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 77
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 2
- 239000004202 carbamide Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000007770 graphite material Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- -1 polyeletane Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010029352A JP2011166029A (ja) | 2010-02-12 | 2010-02-12 | 配線基板、それを用いた電子装置、及び配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010029352A JP2011166029A (ja) | 2010-02-12 | 2010-02-12 | 配線基板、それを用いた電子装置、及び配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011166029A JP2011166029A (ja) | 2011-08-25 |
| JP2011166029A5 true JP2011166029A5 (enExample) | 2013-01-24 |
Family
ID=44596329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010029352A Pending JP2011166029A (ja) | 2010-02-12 | 2010-02-12 | 配線基板、それを用いた電子装置、及び配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011166029A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011101805B4 (de) * | 2011-05-17 | 2016-08-25 | Fela Holding Gmbh | Schaltungsträger |
| JP7080322B2 (ja) * | 2018-07-12 | 2022-06-03 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472462A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chemical Co Ltd | Preparation of substrate for metallic core print plug board |
| JPS63233599A (ja) * | 1987-03-23 | 1988-09-29 | 松下電器産業株式会社 | 金属ベ−ス印刷配線板の製造方法 |
| JP4316483B2 (ja) * | 2004-12-08 | 2009-08-19 | ユーアイ電子株式会社 | プリント基板の製造方法及びプリント基板 |
| JP2006339440A (ja) * | 2005-06-02 | 2006-12-14 | Fujitsu Ltd | スルービアをもつ基板及びその製造方法 |
| JP4997954B2 (ja) * | 2006-12-15 | 2012-08-15 | 富士通株式会社 | 回路基板、その製造方法及び半導体装置 |
| KR100968278B1 (ko) * | 2008-03-28 | 2010-07-06 | 삼성전기주식회사 | 절연시트 및 그 제조방법과 이를 이용한 인쇄회로기판 및그 제조방법 |
-
2010
- 2010-02-12 JP JP2010029352A patent/JP2011166029A/ja active Pending
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