JP2011166007A - 反射型led照明装置 - Google Patents
反射型led照明装置 Download PDFInfo
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- JP2011166007A JP2011166007A JP2010028758A JP2010028758A JP2011166007A JP 2011166007 A JP2011166007 A JP 2011166007A JP 2010028758 A JP2010028758 A JP 2010028758A JP 2010028758 A JP2010028758 A JP 2010028758A JP 2011166007 A JP2011166007 A JP 2011166007A
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- led
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- 230000003287 optical effect Effects 0.000 claims description 5
- 238000005286 illumination Methods 0.000 description 20
- 238000004088 simulation Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/06—Optical design with parabolic curvature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】本発明は、内部に出光方向が上方を向く放物曲面の反射面2を有し、かつ、上方に開口する支持体6と、支持体の反射面の上方中央部にリードにて当該反射面に向けて発光するように、かつ1つの軸X軸方向に隣接するように支持された2個のLEDチップ11,12とを備え、2個のLEDチップは反射面2の放物曲面の焦点Fよりも当該反射面に近い位置に位置し、かつ、反射面の放物曲面の中心Cから2個のLEDチップの発光部の中心を結ぶX軸方向の線に下ろす垂直線を、2個のLEDチップの発光面の法線方向であるY軸方向に対して所定角度ωだけずれる位置関係にした反射型LEDパッケージ1A,1Bを2個用意し、2個の反射型LEDパッケージを所定角度ωだけ互いに逆向きにずれる位置関係にしてY軸方向に並べた反射型LED照明装置10を特徴とする。
【選択図】 図1
Description
本発明の第1の実施の形態の反射型LED照明装置10は、図1に示すように、X方向に2個のLEDチップ11,12を並べて搭載している反射型LEDパッケージ1A,1Bを2個、後述するようにY方向に互いに逆向きに並べて回路基板100上に実装した構成である。
本発明の第1の実施の形態の反射型LED照明装置10では、それに用いる反射型LEDパッケージ1A,1Bそれぞれに搭載する第1、第2のLEDチップ11,12を電気的に直列接続して発光させる構成であったが、電気的な接続は直列に限らない。図14には、本発明の第2の実施の形態の反射型LED照明装置10′として、2個の反射型LEDパッケージ1A′,1B′それぞれに搭載する第1、第2のLEDチップ11,12を電気的に並列接続した構成のものを示している。図14において、8′,9′は印加リード、8a′は素子マウント用アーム、9a′はワイヤ接続用アームである。
上記の各実施の形態では、LEDチップ11,12として赤外発光のLEDチップを採用し、特に監視カメラ用の赤外光発光装置として利用する反射型LED照明装置1,1Aについて説明したが、用途が限定されることはなく、広角にして照射強度が強い照明特性が必要な可視光の照明装置として応用できる。そしてその場合には、用途に応じてLEDチップの発光色は任意に選択することができる。
1,1A,1B,1A′,1B′ 反射型LEDパッケージ
2 反射面
6 支持体
7 印加リード
7a ワイヤ接続用アーム
8 中間リード
8a 素子マウント用アーム
8b ワイヤ接続用アーム
8c 位置固定部
9 印加リード
9a 素子マウント用アーム
9b 位置固定部
10,10′ 反射型LED照明装置
11 LEDチップ
12 LEDチップ
Claims (2)
- 内部に出光方向が上方を向く放物曲面の反射面を有し、かつ、上方に開口する支持体と、前記支持体の反射面の上方中央部にリードにて当該反射面に向けて発光するように、かつ1つの軸X軸方向に隣接するように支持された2個のLEDチップとを備え、前記2個のLEDチップは前記反射面の放物曲面の焦点よりも当該反射面に近い位置に位置し、かつ、前記反射面の放物曲面の中心から前記2個のLEDチップの発光部の中心を結ぶX軸方向の線に下ろす垂直線を、前記2個のLEDチップの発光面の法線方向であるY軸方向に対して所定角度ωだけずれる位置関係にした反射型LEDパッケージを2個用意し、
前記2個の反射型LEDパッケージを、前記所定角度ωだけ互いに逆向きにずれる位置関係にして前記Y軸方向に並べたことを特徴とする反射型LED照明装置。 - 前記2個の反射型LEDパッケージを、それぞれの反射面により反射されて出て行く光束の光軸が互いに交わるような向きに並べて成ることを特徴とする請求項1に記載の反射型LED照明装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010028758A JP5678434B2 (ja) | 2010-02-12 | 2010-02-12 | 反射型led照明装置 |
KR1020127013846A KR101398274B1 (ko) | 2010-02-12 | 2010-11-10 | 반사형 led 조명 장치 |
PCT/JP2010/070052 WO2011099204A1 (ja) | 2010-02-12 | 2010-11-10 | 反射型led照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010028758A JP5678434B2 (ja) | 2010-02-12 | 2010-02-12 | 反射型led照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011166007A true JP2011166007A (ja) | 2011-08-25 |
JP5678434B2 JP5678434B2 (ja) | 2015-03-04 |
Family
ID=44367497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010028758A Expired - Fee Related JP5678434B2 (ja) | 2010-02-12 | 2010-02-12 | 反射型led照明装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5678434B2 (ja) |
KR (1) | KR101398274B1 (ja) |
WO (1) | WO2011099204A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183950A1 (ko) * | 2012-06-08 | 2013-12-12 | 엘지이노텍주식회사 | 발광 소자 패키지 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02191379A (ja) * | 1988-10-25 | 1990-07-27 | Iwasaki Electric Co Ltd | 発光ダイオード |
JPH11195307A (ja) * | 1997-12-26 | 1999-07-21 | Kyocera Corp | Ledユニットの照射角度を傾斜させた反射形led照明装置 |
JP2006005337A (ja) * | 2004-05-17 | 2006-01-05 | Tabuchi Electric Co Ltd | 複合型反射型発光装置 |
JP2009290008A (ja) * | 2008-05-29 | 2009-12-10 | Pearl Lighting Co Ltd | 反射型発光ダイオード |
JP2010010334A (ja) * | 2008-06-26 | 2010-01-14 | Kyocera Corp | 発光装置及び照明装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09200604A (ja) * | 1996-01-12 | 1997-07-31 | Canon Inc | ビデオカメラ及びビデオライト |
JPH10335709A (ja) * | 1997-05-29 | 1998-12-18 | Yazaki Corp | 発光ダイオードチップのランプハウス |
JP3891400B2 (ja) * | 2001-07-25 | 2007-03-14 | シチズン電子株式会社 | 発光ダイオード |
-
2010
- 2010-02-12 JP JP2010028758A patent/JP5678434B2/ja not_active Expired - Fee Related
- 2010-11-10 KR KR1020127013846A patent/KR101398274B1/ko active IP Right Grant
- 2010-11-10 WO PCT/JP2010/070052 patent/WO2011099204A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02191379A (ja) * | 1988-10-25 | 1990-07-27 | Iwasaki Electric Co Ltd | 発光ダイオード |
JPH11195307A (ja) * | 1997-12-26 | 1999-07-21 | Kyocera Corp | Ledユニットの照射角度を傾斜させた反射形led照明装置 |
JP2006005337A (ja) * | 2004-05-17 | 2006-01-05 | Tabuchi Electric Co Ltd | 複合型反射型発光装置 |
JP2009290008A (ja) * | 2008-05-29 | 2009-12-10 | Pearl Lighting Co Ltd | 反射型発光ダイオード |
JP2010010334A (ja) * | 2008-06-26 | 2010-01-14 | Kyocera Corp | 発光装置及び照明装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183950A1 (ko) * | 2012-06-08 | 2013-12-12 | 엘지이노텍주식회사 | 발광 소자 패키지 |
US9391117B2 (en) | 2012-06-08 | 2016-07-12 | Lg Innotek Co., Ltd. | Light emitting diode package |
Also Published As
Publication number | Publication date |
---|---|
KR101398274B1 (ko) | 2014-05-23 |
WO2011099204A1 (ja) | 2011-08-18 |
KR20120084773A (ko) | 2012-07-30 |
JP5678434B2 (ja) | 2015-03-04 |
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