JP2011090865A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011090865A5 JP2011090865A5 JP2009243028A JP2009243028A JP2011090865A5 JP 2011090865 A5 JP2011090865 A5 JP 2011090865A5 JP 2009243028 A JP2009243028 A JP 2009243028A JP 2009243028 A JP2009243028 A JP 2009243028A JP 2011090865 A5 JP2011090865 A5 JP 2011090865A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- anodized layer
- connection terminal
- linear conductors
- insulating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000010407 anodic oxide Substances 0.000 claims 3
- 238000007743 anodising Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 229910001593 boehmite Inorganic materials 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical group O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009243028A JP2011090865A (ja) | 2009-10-22 | 2009-10-22 | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
| US12/909,096 US20110095419A1 (en) | 2009-10-22 | 2010-10-21 | Conductive film, method of manufacturing the same, semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009243028A JP2011090865A (ja) | 2009-10-22 | 2009-10-22 | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011090865A JP2011090865A (ja) | 2011-05-06 |
| JP2011090865A5 true JP2011090865A5 (enExample) | 2012-08-30 |
Family
ID=43897689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009243028A Pending JP2011090865A (ja) | 2009-10-22 | 2009-10-22 | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110095419A1 (enExample) |
| JP (1) | JP2011090865A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101739742B1 (ko) * | 2010-11-11 | 2017-05-25 | 삼성전자 주식회사 | 반도체 패키지 및 이를 포함하는 반도체 시스템 |
| US9226396B2 (en) * | 2013-03-12 | 2015-12-29 | Invensas Corporation | Porous alumina templates for electronic packages |
| JP2014216552A (ja) * | 2013-04-26 | 2014-11-17 | 富士通株式会社 | 積層構造体及びその製造方法 |
| WO2017150058A1 (ja) * | 2016-02-29 | 2017-09-08 | 富士フイルム株式会社 | 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法 |
| KR102134135B1 (ko) * | 2016-05-27 | 2020-07-15 | 후지필름 가부시키가이샤 | 전자 소자, 및 반도체 소자를 포함하는 구조체 |
| JP6600285B2 (ja) * | 2016-08-31 | 2019-10-30 | 富士フイルム株式会社 | 多層配線基板の製造方法 |
| JP2020107834A (ja) * | 2018-12-28 | 2020-07-09 | 大日本印刷株式会社 | 電子ユニット |
| US11139262B2 (en) | 2019-02-07 | 2021-10-05 | Micron Technology, Inc. | Use of pre-channeled materials for anisotropic conductors |
| KR102608888B1 (ko) * | 2019-06-04 | 2023-12-01 | (주)포인트엔지니어링 | 전기접속용 양극산화막 및 광소자 디스플레이 및 광소자 디스플레이 제조 방법 |
| KR102865650B1 (ko) * | 2020-01-31 | 2025-09-29 | (주)포인트엔지니어링 | 프로브 헤드 및 이를 포함하는 프로브 카드 |
| CN115956144B (zh) * | 2020-08-24 | 2025-07-18 | 富士胶片株式会社 | 金属填充微细结构体的制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0854506A3 (en) * | 1987-03-04 | 1999-03-31 | Canon Kabushiki Kaisha | Electrically connecting member and electric circuit member |
| US5379515A (en) * | 1989-12-11 | 1995-01-10 | Canon Kabushiki Kaisha | Process for preparing electrical connecting member |
| JP3154713B2 (ja) * | 1990-03-16 | 2001-04-09 | 株式会社リコー | 異方性導電膜およびその製造方法 |
| JPH10308565A (ja) * | 1997-05-02 | 1998-11-17 | Shinko Electric Ind Co Ltd | 配線基板 |
| JP2003034894A (ja) * | 2001-07-25 | 2003-02-07 | Kobe Steel Ltd | 耐腐食性に優れたAl合金部材 |
| DE602004018720D1 (de) * | 2003-09-09 | 2009-02-12 | Nitto Denko Corp | Anisotrop-leitender Film , Herstellungs- und Gebrauchsverfahren |
| TWI255466B (en) * | 2004-10-08 | 2006-05-21 | Ind Tech Res Inst | Polymer-matrix conductive film and method for fabricating the same |
| JP5143045B2 (ja) * | 2008-07-09 | 2013-02-13 | 富士フイルム株式会社 | 微細構造体およびその製造方法 |
-
2009
- 2009-10-22 JP JP2009243028A patent/JP2011090865A/ja active Pending
-
2010
- 2010-10-21 US US12/909,096 patent/US20110095419A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011090865A5 (enExample) | ||
| JP7576746B2 (ja) | 電解コンデンサおよびその製造方法 | |
| TWI331760B (en) | Ceramic electronic component and method of producing the same | |
| JP2011090865A (ja) | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 | |
| JP6309112B2 (ja) | パワーモジュール | |
| US9578754B2 (en) | Metal base substrate, power module, and method for manufacturing metal base substrate | |
| JP2023071847A (ja) | 電解コンデンサおよびその製造方法 | |
| JP2008172172A (ja) | 電子制御装置及びその製造方法 | |
| JP6726821B2 (ja) | 半導体装置の製造方法 | |
| JP5306243B2 (ja) | 半導体装置 | |
| CN103380495A (zh) | 压接型半导体装置及其制造方法 | |
| JP2016131242A5 (enExample) | ||
| JP2009182157A (ja) | 固体電解コンデンサ | |
| JP2011091185A (ja) | 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法 | |
| TWI553748B (zh) | Semiconductor device and method for manufacturing semiconductor device | |
| JP2009049285A5 (enExample) | ||
| US11032942B2 (en) | Structure for a heat transfer interface and method of manufacturing the same | |
| JP2008258435A (ja) | 半導体装置及びその製造方法 | |
| JP2010251643A (ja) | 積層型コンデンサの製造方法 | |
| JP2009135458A5 (enExample) | ||
| JP5359579B2 (ja) | 半導体装置の製造方法と半導体装置 | |
| JP4838214B2 (ja) | チップ状固体電解コンデンサおよびその製造方法 | |
| JP6647124B2 (ja) | 固体電解コンデンサ、および固体電解コンデンサの製造方法 | |
| JP5887163B2 (ja) | 固体電解コンデンサ | |
| JP2007165028A (ja) | 異方導電性材料とこれを用いた実装方法 |