JP2011066298A5 - 半導体チップ - Google Patents

半導体チップ Download PDF

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Publication number
JP2011066298A5
JP2011066298A5 JP2009217167A JP2009217167A JP2011066298A5 JP 2011066298 A5 JP2011066298 A5 JP 2011066298A5 JP 2009217167 A JP2009217167 A JP 2009217167A JP 2009217167 A JP2009217167 A JP 2009217167A JP 2011066298 A5 JP2011066298 A5 JP 2011066298A5
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JP
Japan
Prior art keywords
semiconductor chip
face
electrode terminals
external terminal
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009217167A
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English (en)
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JP2011066298A (ja
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Application filed filed Critical
Priority to JP2009217167A priority Critical patent/JP2011066298A/ja
Priority claimed from JP2009217167A external-priority patent/JP2011066298A/ja
Priority to US12/885,856 priority patent/US20110068482A1/en
Publication of JP2011066298A publication Critical patent/JP2011066298A/ja
Publication of JP2011066298A5 publication Critical patent/JP2011066298A5/ja
Pending legal-status Critical Current

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Claims (1)

  1. 複数の電極端子を備えた半導体チップであって、
    前記複数の電極端子のうち、外部端子を備えるパッケージ基板に対する前記半導体チップのフェースアップ方式およびフェースダウン方式の実装において接続される外部端子が固定されるべき信号が接続される固定端子が前記半導体チップの対称線を中心として前記半導体チップの幅の５０％の範囲内に配置されている、半導体チップ。
JP2009217167A 2009-09-18 2009-09-18 半導体チップ、及びこれを備えた半導体装置 Pending JP2011066298A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009217167A JP2011066298A (ja) 2009-09-18 2009-09-18 半導体チップ、及びこれを備えた半導体装置
US12/885,856 US20110068482A1 (en) 2009-09-18 2010-09-20 Semiconductor chip and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217167A JP2011066298A (ja) 2009-09-18 2009-09-18 半導体チップ、及びこれを備えた半導体装置

Publications (2)

Publication Number Publication Date
JP2011066298A JP2011066298A (ja) 2011-03-31
JP2011066298A5 true JP2011066298A5 (ja) 2012-04-05

Family

ID=43755928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009217167A Pending JP2011066298A (ja) 2009-09-18 2009-09-18 半導体チップ、及びこれを備えた半導体装置

Country Status (2)

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US (1) US20110068482A1 (ja)
JP (1) JP2011066298A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6194372B2 (ja) * 2014-01-22 2017-09-06 アルプス電気株式会社 センサモジュール、並びに、これに用いるセンサチップ及び処理回路チップ
KR102354986B1 (ko) 2015-07-08 2022-01-24 삼성전자주식회사 솔리드 스테이트 드라이브
JP6663104B2 (ja) * 2015-09-10 2020-03-11 富士通株式会社 半導体装置および半導体装置の制御方法
US11676905B2 (en) * 2020-07-28 2023-06-13 Qualcomm Incorporated Integrated circuit (IC) package with stacked die wire bond connections, and related methods
CN117497462B (zh) * 2023-12-29 2024-03-29 四川弘仁财电科技有限公司 一种精确定位集成电路的自动封装装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633249B2 (ja) * 1987-04-27 1997-07-23 株式会社日立製作所 半導体装置およびその製造方法
JP2943781B2 (ja) * 1997-08-08 1999-08-30 日本電気株式会社 半導体メモリ
JP2005209882A (ja) * 2004-01-22 2005-08-04 Renesas Technology Corp 半導体パッケージ及び半導体装置
JP2007012937A (ja) * 2005-06-30 2007-01-18 Seiko Epson Corp 表示ドライバ

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