JP2011061240A - Device and method for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermal compression bonding apparatus capable of shortening a cycle time, when thermally compression-bonding a component on one side of a substrate, and a component on the other side of the substrate. <P>SOLUTION: The device includes a stage 2, drivably provided for holding the substrate at the upper surface, and a plurality of thermal compression-bonding mechanisms 11, 12 for simultaneously thermally compression-bonding anisotropic conductive members 34 to at least two sides of the substrate held by the stage, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component thermocompression bonding apparatus and a thermocompression bonding method for thermocompression bonding a component such as a tape-like anisotropic conductive member to a side portion of a substrate.

  For example, in a manufacturing process of a flat panel display represented by a liquid crystal display panel or a plasma display panel, a TCP (Tape Carrier Package) as a first component is attached to a terminal portion provided on a side surface of a glass substrate. Is attached via an anisotropic conductive member as a second part formed in a tape shape with a thermosetting resin containing metal particles having a diameter of μm.

  Before sticking the TCP to the terminal part on the upper surface of the side part of the substrate, the anisotropic conductive member cut to a predetermined length is attached to the upper surface of the side part of the substrate. The anisotropic conductive member is wound around the supply reel in a state of being attached to the release tape.

  When sticking TCP to the side part upper surface of a board | substrate with an anisotropic conductive member, first, the anisotropic conductive member drawn | fed out from the supply reel with the peeling tape is cut | disconnected to predetermined length. The cutting length of the anisotropic conductive member at this time is set to a length corresponding to the terminal portion provided on the side surface of the substrate.

  Next, the anisotropic conductive member cut to a predetermined length is pulled out from the supply reel together with the peeling tape so that the cut portion faces the upper surface of one side portion provided with the terminal portion of the substrate. Positioned. The substrate is placed on a stage that is driven in the horizontal direction, and is positioned so that one side portion provided with a terminal portion is opposed to the backup tool.

  Next, the cut portion of the anisotropic conductive member is pasted by being heated under pressure by a pressure tool having a heater arranged so as to be vertically movable above the backup tool. That is, the anisotropic conductive member is temporarily pressure-bonded to the upper surface of one side portion of the substrate. The above-mentioned TCP is temporarily pressure-bonded to the temporarily pressure-bonded anisotropic conductive member and then finally pressure-bonded.

  Patent Document 1 discloses a tape member sticking apparatus that cuts an anisotropic conductive member into a predetermined length and presses the cut portion onto the upper surface of the side portion of the substrate.

JP 2003-51517 A

  When TCP is attached to the substrate, depending on the type of flat panel display, it may be attached not only to one side of the substrate but also to a plurality of sides, for example two or more sides. May be required.

  In such a case, conventionally, a plurality of thermocompression bonding devices are arranged in a row, and an anisotropic conductive member is temporarily pressure-bonded to one side of the substrate by the first thermocompression bonding device, and then the substrate is rotated to produce the next heat. The anisotropic conductive member is thermocompression-bonded to the other side by a crimping device in sequence.

  After sticking an anisotropic conductive member to a plurality of sides of a substrate, even when the TCP is temporarily pressure-bonded or main-bonded, a plurality of rows arranged in a row while rotating the substrate with respect to each side of the substrate This was performed sequentially with the thermocompression bonding apparatus.

  For this reason, in order to thermocompression-bond parts such as anisotropic conductive members and TCP to a plurality of sides of the substrate, a plurality of thermocompression bonding devices must be arranged in a row, resulting in a long production line. In addition, since the components are sequentially thermocompression-bonded to a plurality of side portions of the substrate, the tact time may be increased depending on the number of side portions to which the components are crimped.

  The present invention is capable of shortening the production line by simultaneously thermocompressing components to a plurality of sides of a substrate, and shortening the tact time required for thermocompression bonding, and thermocompression bonding apparatus and thermocompression bonding of the components It is to provide a method.

This invention is a component thermocompression bonding apparatus for thermocompression bonding a component to a substrate,
A stage provided on the upper surface so as to be able to drive while holding the substrate;
A component thermocompression bonding apparatus comprising: a plurality of thermocompression bonding mechanisms for simultaneously thermocompression bonding the component to at least two sides of the substrate held on the stage.

A pair of thermocompression bonding mechanisms for thermocompression bonding the components to a pair of opposing side portions of the substrate, and the thermocompression bonding mechanism is supported by the backup tool for supporting the lower surface of the side portion of the substrate and the backup tool. A pressure tool for thermocompression bonding the component on the side surface of the substrate;
It is preferable that the pressing tool of at least one thermocompression bonding mechanism is provided so as to be driven along the longitudinal direction of the side portion of the substrate.

  The component is a tape-like anisotropic conductive member having adhesiveness, and the anisotropic conductive member may be thermocompression bonded to different regions in the length direction of one side and the other side of the substrate. preferable.

  It is preferable that three thermocompression bonding mechanisms for thermocompression bonding the component are provided on three sides of the substrate.

A first thermocompression bonding mechanism and a second heat for thermocompression bonding the component to one end in the longitudinal direction of the first side of the substrate and a second side adjacent to one end of the first side, respectively. A first crimping stage having a crimping mechanism;
The components are heated on the other end in the longitudinal direction of the first side of the substrate and on the third side adjacent to the other end of the first side and facing the second side, respectively. It is preferable that a third thermocompression bonding mechanism and a second thermocompression bonding mechanism having a fourth thermocompression bonding mechanism are provided.

This invention is a component thermocompression bonding method for thermocompression bonding a component to a substrate,
Supplying the substrate to a drivable stage;
And a step of thermocompression bonding the component to at least two side portions of the substrate supplied to the stage.

  It is preferable that the components are respectively thermocompression bonded to different regions in the longitudinal direction of one of the pair of side portions opposed to the substrate.

  According to this invention, it is not necessary to arrange a plurality of devices in a row by simultaneously thermocompressing the components on opposite sides of the substrate held on the stage, so that the line length can be shortened. Since two parts can be thermocompression-bonded by the time for thermocompression bonding one part, the tact time can be shortened.

The side view which shows schematic structure of the thermocompression bonding apparatus which shows 1st Embodiment of this invention. The front view which shows a 1st thermocompression bonding apparatus. Explanatory drawing when an anisotropic conductive member is crimped | bonded to the area | region where the one side part and other side part of a board | substrate differ. The layout which shows the schematic structure of the thermocompression bonding apparatus which shows 2nd Embodiment of this invention. (A)-(c) is explanatory drawing which shows the pattern from which the anisotropic conductive member stuck by the thermocompression bonding apparatus of 2nd Embodiment differs. The layout which shows the schematic structure of the thermocompression-bonding apparatus which shows the 3rd Embodiment of this invention. (A), (b) is explanatory drawing which shows the pattern from which the anisotropic conductive member stuck by the thermocompression bonding apparatus of 3rd Embodiment differs.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 3 show a first embodiment of the present invention, and the thermocompression bonding apparatus of the present invention shown in FIG. A stage 2 is provided at the center of the base 1 in the width direction indicated by an arrow X so as to be movable along the Y direction intersecting the X direction. This stage 2 has a Y movable body 4. This Y movable body 4 is provided on the upper surface of the base 1 so as to be movable in the Y direction by a pair of Y guide rails 4a provided along the Y direction.

  A Y drive source 3 is provided at one end of the base 1 along the Y direction, and the Y movable body 4 is driven along the Y direction by the Y drive source 3. The Y movable body 4 is provided with a mounting body 6 via a θ movable body 5. The Y movable body 4 is provided with a θ drive source 7, and the θ drive source 7 drives the above-described mounting body 6 in the θ direction, which is a rotation direction centering on an axis perpendicular to the horizontal plane together with the θ movable body 5. It has come to be.

  A substrate W such as a flat panel display is supplied to the upper surface of the above-described mounting body 6 by a robot or the like (not shown). The mounting body 6 is provided with suction means (not shown), and the substrate W supplied to the upper surface is sucked and held.

  The placement body 6 is formed in a rectangular shape smaller than the substrate W. As a result, the substrate W sucked and held by the mounting portion 6 is held with its peripheral portion, at least both side portions along the X direction protruding outward from the mounting body 6.

  A first thermocompression bonding mechanism 11 and a second thermocompression bonding mechanism 12 are provided on one side and the other side of the stage 2 along the X direction. Each thermocompression bonding mechanism 11, 12 has an X movable body 14. As shown in FIG. 2, the X movable body 14 is provided so as to be movable along a pair of X guide rails 15 provided on the base 1 along the X direction.

  At one end and the other end of the base 1 along the X direction, an X drive source 16 for driving the X movable bodies 14 of the thermocompression bonding mechanisms 11 and 12 along the X direction is provided. A long backup tool 17 is provided along the Y direction on the upper surface of one side portion of the X movable body 14 on the stage 2 side.

  A support 18 is provided on the upper surface of the other side portion of the X movable body 14 along the Y direction. A mounting plate 19 is horizontally provided on the upper end surface of the support 18 with one end fixed. A pair of Z guide bodies 21 are vertically provided on the front surface of the support 18. A Z movable body 22 is provided on the Z guide body 21 so as to be movable in the Z direction indicated by an arrow. The Z movable body 22 is driven in the Z direction by a Z drive source 23 provided on the upper surface of the other end of the mounting plate 19.

  A pressing tool 24 is provided on the lower end surface of the Z movable body 22 of the first thermocompression bonding mechanism 11 so as to face the backup tool 17. The pressing tool 24 of the second thermocompression bonding mechanism 12 is a Y movable body 25 provided on the lower end surface of the Z movable body 22 driven in the Z direction by the Z drive source 23 so as to be movable along the Y direction. Is provided. The Y movable body 25 can be driven in the Y direction by a Y drive source 26 provided at one end of the Z movable body 22.

  As shown in FIG. 2, a supply reel 30 is provided on one side of the pressure tool 24 along the Y direction indicated by the arrow, and a take-up reel 32 is provided on the other side. An anisotropic conductive member 34 as a part attached to the peeling tape 33 is wound around the supply reel 30, and the peeling tape 33 fed out from the supply reel 30 is guided by a pair of guide rollers 35 and is described above. The take-up reel 32 is wound up.

  The anisotropic conductive member 34 fed out from the supply reel 30 together with the peeling tape 33 is cut into a predetermined length by a cutter (not shown). When the anisotropic conductive member 34 in which the peeling tape 33 is taken up by the take-up reel 32 and cut to a predetermined length is positioned below the pressure tool 24, the pressure tool 24 is Z-driven. Driven downward by the source 23.

  As a result, the anisotropic conductive member 34 cut to a predetermined length is pressurized and heated at the end along the X direction of the substrate W positioned on the backup tool 17. That is, the anisotropic conductive member 34 is temporarily press-bonded to both side portions of the substrate W in the width direction.

  Although FIG. 2 shows the first thermocompression bonding mechanism 11, the second thermocompression bonding mechanism 12 is also fed from the supply reel 30 to the lower end side of the pressing tool 24 in the same manner as the first thermocompression bonding mechanism 11. Then, the anisotropic conductive member 34 attached to the peeling tape 33 taken up by the take-up reel 32 is supplied and positioned.

  Next, a procedure for temporarily pressure-bonding the anisotropic conductive member 34 to both sides in the width direction of the substrate W by the pressure bonding apparatus having the above configuration will be described.

  First, with the X movable body 14 of the first and second thermocompression bonding mechanisms 11 and 12 retracted in the X direction away from the stage 2, the substrate W is supplied onto the mounting body 6 of the stage 2 by a robot (not shown). And adsorb and hold. The substrate W supplied and held on the mounting body 6 has both side portions along the X direction protruding outward from the mounting body 6.

  Next, the substrate W is imaged by a camera (not shown), the coordinates in the X and Y directions and the rotation angle in the θ direction are recognized, and the mounting body 6 is driven in the θ direction and the Y direction based on the recognition. The substrate W held on the body 6 is positioned in the θ direction and the Y direction.

  Next, based on the position recognition of the substrate W, the X movable body 14 of the first and second thermocompression bonding mechanisms 11 and 12 is driven in the X direction, and the backup tool 17 and the pressure tool 24 are moved in the X direction. Position to.

  That is, the upper end of each backup tool 17 is positioned so as to face the lower surfaces of the one end and the other end located in the X direction of the substrate W. If the first and second thermocompression bonding mechanisms 11 and 12 are positioned in the X direction, the supply reel 30 feeds the anisotropic conductive member 34, and the portion cut to a predetermined length is supplied to the pressing tool 24. Opposite the lower end surface.

  If the substrate W is positioned in the X, Y, and θ directions and the anisotropic conductive member 34 is extended and positioned, the pressurizing tool 24 of the first and second thermocompression bonding mechanisms 11 and 12 is moved to the Z drive source. 23 simultaneously drive in the downward direction. Thereby, the anisotropic conductive member 34 cut into a predetermined length is simultaneously pressurized and heated on the upper surfaces of the one end portion and the other end portion along the X direction of the substrate W, and is temporarily pressure-bonded.

  Thus, in the thermocompression bonding apparatus having the above-described configuration, the first thermocompression bonding mechanism 11 and the second thermocompression bonding mechanism 12 are respectively provided on one side and the other side along the X direction of the stage 2 on which the substrate W is held. The first and second thermocompression bonding mechanisms 11 and 12 are arranged so as to face each other and can be driven in a direction in which the first and second thermocompression bonding mechanisms 11 and 12 are in contact with and away from the stage 2.

  Therefore, the anisotropic conductive member 34 can be temporarily bonded to both sides of the one side and the other side of the substrate W at the same time, so that the tact time required for temporary bonding of the anisotropic conductive member 34 is reduced. It can be shortened. That is, the tact time can be shortened to about a half compared to the case where the anisotropic conductive member 34 is temporarily temporarily bonded to one side and the other side of the substrate W.

  In addition, since the first thermocompression bonding mechanism 11 and the second thermocompression bonding mechanism 12 are arranged to face each other with the stage 2 interposed therebetween, the production line is made in comparison with the case where the two thermocompression bonding mechanisms 11 and 12 are arranged in a row. Can be shortened.

  Depending on the type of substrate W, circuit boards having different lengths may be mounted on one side and the other side via TCP. In this case, it may be required to temporarily press the anisotropic conductive member 34 in different regions on one side and the other side of the substrate W. That is, as shown in FIG. 3, an anisotropic conductive member 34 is temporarily bonded to a region indicated by A on one side of the substrate W, and anisotropic conductive is applied to a region B narrower than the region A on the other side. It may be required to stick the member 34.

  In such a case, the anisotropic conductive member 34 is temporarily crimped to the region A by the first thermocompression bonding mechanism 11, and the anisotropic conductive member 34 is temporarily crimped to the region B by the second thermocompression bonding mechanism 12. To do. At that time, the Y movable body 25 of the second thermocompression bonding mechanism 12 is driven in the Y direction by the Y drive source 26, and one end of the pressure tool 24 provided on the Y movable body 25 coincides with one end of the region B. Position so that. One end of the region B is the upstream side in the feed direction of the anisotropic conductive member 34. That is, the supply reel 30 side.

  Therefore, even if one end of the pressing tool 24 is made to coincide with one end of the region B and the other end protrudes in the Y direction from the other end of the region B by the length indicated by L in FIG. The anisotropic conductive member 34 is already temporarily bonded to the substrate W in the previous step. Therefore, the anisotropic conductive member 34 is not pressurized and heated to the substrate W by the portion protruding from the region B of the pressing tool 24.

  That is, when the anisotropic conductive member 34 is temporarily pressure-bonded to the region B having a shorter length than the region A, the pressurizing tool 24 can be pressed without changing the length of the pressing tool 24 according to the length of the region B. By driving and positioning the tool 24 in the Y direction, the anisotropic conductive member 34 can be temporarily bonded to the substrate W with a length corresponding to the region B. Therefore, it is possible to improve productivity even if it is not necessary to replace the pressurizing tool 24.

  In the above embodiment, the case where the anisotropic conductive member as a component is temporarily pressure-bonded to the substrate has been described. However, the TCP as the component is temporarily pressure-bonded to the substrate on which the anisotropic conductive member is temporarily pressure-bonded, The present invention can be applied to the case where the final pressure bonding is performed after the temporary pressure bonding and the circuit board (PWB) is further pressure bonded to the finally pressure bonded TCP.

  Furthermore, the present invention can also be applied to a case where a circuit board as a component is permanently pressure-bonded to a TCP that is permanently pressure-bonded to a substrate. In other words, the present invention can be applied to the case where the component is heated while being pressed and pressed onto the substrate.

  Further, when the substrate is supplied to the mounting body, the X movable body is retracted in the X direction. However, when the size of the substrate is changed because the X movable body can be driven in the X direction, If the X movable body is driven and positioned in the X direction according to the width dimension, it can cope with substrates of different sizes.

  The mounting body is provided so as to be driven in the Y direction by the Y movable body. However, the mounting body may be configured to be driven not only in the Y direction but also in the X direction. If the mounting body can be driven in the X direction, for example, when a component is thermocompression bonded to only one side of the substrate, the mounting body may be driven in the X direction and the Y direction by fixing the thermocompression bonding mechanism. it can.

  In addition, although the pressurizing tool can be driven in the X direction that is in contact with and away from the side of the substrate, it is necessary to apply an anisotropic conductive member only to a substrate of a certain size. The pressure tool need not be driven in the X direction.

  4 and 5 (a) to 5 (c) show a second embodiment of the present invention. In the second embodiment, similarly to the first embodiment, a stage 2, a first thermocompression bonding mechanism 11, and a second thermocompression bonding mechanism 12 are provided on the base 1. A thermocompression bonding mechanism 41 is provided.

  The third thermocompression bonding mechanism 41 is formed on a pair of side portions located in the X direction of the substrate W held on the mounting body 6 of the stage 2 by the first and second thermocompression bonding mechanisms 11 and 12. When the anisotropic conductive member 34a or 34c is thermocompression bonded as shown in (a), (b), or (c), it is shown in FIG. 5 (a) on one side portion located in the Y direction of the substrate W. Thus, the anisotropic conductive member 34b or the anisotropic conductive member 34d shown in FIG. 5B is arranged so that they can be thermocompression bonded simultaneously. That is, the third thermocompression bonding mechanism 41 is disposed on one end side along the Y direction of the first and second thermocompression bonding mechanisms 11 and 12 that are separated from each other at a predetermined interval in the X direction.

  The first and second thermocompression bonding mechanisms 11 and 12 can be driven in the X direction, and the third thermocompression bonding mechanism 41 can be driven in the Y direction. The mounting body 6 can be driven in the X, Y, and θ directions.

  In the second embodiment, anisotropic conductive members 34a and 34b can be simultaneously thermocompression bonded to three side portions of the substrate W in the form shown in FIGS. 5 (a) to 5 (c), for example. That is, FIG. 5A shows anisotropy that is shorter than the length of the side portion by the first and second thermocompression bonding mechanisms 11 and 12 at the pair of side portions located in the X direction of the substrate W. The conductive member 34a is thermocompression bonded, and an anisotropic conductive member 34b having a length substantially corresponding to the length of the substrate W is formed on one side portion along the Y direction of the substrate W by the third thermocompression bonding mechanism 41. Thermocompression bonded.

  In this case, the first to third thermocompression bonding mechanisms 11, 12, and 41 are provided with a pressure tool 24 having a length corresponding to the anisotropic conductive members 34a and 34b to be thermocompression bonded to the respective side portions. .

  In FIG. 5B, four anisotropic conductive members 34c, which are sufficiently shorter than the length of the side portions, are thermocompression bonded to a pair of side portions located in the X direction of the substrate W. An anisotropic conductive member 34b having a length substantially corresponding to the length of the substrate W is thermocompression bonded to one side portion along the Y direction by the third thermocompression bonding mechanism 41, as in FIG. The

  In this case, the first and second thermocompression bonding mechanisms 11 and 12 include the pressing tool 24 having a length corresponding to the anisotropic conductive member 34c attached to the side portion located in the X direction of the substrate W. A plurality of anisotropic conductive members 34c are provided corresponding to the number of anisotropic conductive members 34c. Thereby, the anisotropic conductive members 34b and 34c can be simultaneously thermocompression bonded to the three side portions of the substrate W, respectively.

  In FIG. 5C, the four anisotropic conductive members 34c are thermocompression bonded to the pair of side portions along the X direction of the substrate W, as in FIG. 5B, and are positioned in the Y direction. Two anisotropic conductive members 34d are thermocompression bonded to the sides.

  In this case, the third thermocompression bonding mechanism 41 includes a pressure tool 24 having a length corresponding to the anisotropic conductive member 34d attached to the side portion located in the Y direction of the substrate W. Two are provided according to the number of 34c. Thereby, the anisotropic conductive members 34c and 34d can be simultaneously thermocompression bonded to the three side portions of the substrate W, respectively.

  6 and 7 (a) and 7 (b) show a third embodiment of the present invention. In the third embodiment, as shown in FIG. 6, a first crimping position 43 and a second crimping position 44 are provided on the base 1 at a predetermined interval in the X direction.

  The first and second crimping positions 43 and 44 are respectively provided with a first mounting body 6A and a second mounting body 6B which can be driven in the X and Y directions. Each mounting body 6A, 6B can be driven in the X, Y, and θ directions.

  As will be described later, the substrate W on which the anisotropic conductive member is thermocompression-bonded at the first crimping position 43 is first transferred by the delivery stage 45 provided between the first crimping position 43 and the second crimping position 44. It is transferred from the first mounting body 6A to the second mounting body 6B.

  As shown in FIG. 7A, the first pressure bonding position 43 has an anisotropic conductive member on one side portion located in the X direction of the substrate W held by the first mounting body 6A. A first thermocompression bonding mechanism 11A for thermocompression bonding 34e and a third thermocompression bonding mechanism 41A for thermocompression bonding of the anisotropic conductive member 34f are provided at one end of one side located in the Y direction. .

  In the second crimping position 44, the other side portion located in the X direction of the substrate W to which the anisotropic conductive members 34e and 34f are stuck at the first crimping position 43 is shown in FIG. As shown, a second thermocompression bonding mechanism 12A for thermocompression bonding the anisotropic conductive member 34g, and a third thermocompression bonding of the anisotropic conductive member 34h on the other end side of one side portion located in the Y direction. A thermocompression bonding mechanism 41B is provided.

  According to such a configuration, at the first pressure-bonding position 43, as shown in FIG. 7A, one side portion located in the X direction of the substrate W and one side portion located in the Y direction are arranged. The anisotropic conductive members 34e and 34f can be thermocompression bonded simultaneously to one end.

  Next, at the second crimping position 44, as shown in FIG. 7B, the other side portion located in the X direction of the substrate W and the other end portion of the one side portion located in the Y direction, The anisotropic conductive members 34g and 34h can be thermocompression bonded simultaneously.

  Therefore, even in such a configuration, it is possible to improve productivity and downsize the apparatus by simultaneously thermocompression bonding the anisotropic conductive member to a plurality of side portions of the substrate W. .

  In the third embodiment, the thermocompression bonding performed at the first crimping position 43 and the second crimping position 44 may be performed simultaneously at one position.

  DESCRIPTION OF SYMBOLS 2 ... Stage, 11 ... 1st thermocompression bonding mechanism, 12 ... 2nd thermocompression bonding mechanism, 17 ... Backup tool, 24 ... Pressing tool, 30 ... Supply reel, 32 ... Take-up reel, 34 ... Anisotropic conduction Element.

Claims (7)

A thermocompression bonding apparatus for thermocompression bonding parts to a board,
A stage provided on the upper surface so as to be able to drive while holding the substrate;
A thermocompression bonding apparatus for a component, comprising: a plurality of thermocompression bonding mechanisms for simultaneously thermocompression bonding the component to at least two sides of the substrate held on the stage. A pair of thermocompression bonding mechanisms for thermocompression bonding the components to a pair of opposing side portions of the substrate, and the thermocompression bonding mechanism is supported by the backup tool for supporting the lower surface of the side portion of the substrate and the backup tool. A pressure tool for thermocompression bonding the component on the side surface of the substrate;
2. The component thermocompression bonding apparatus according to claim 1, wherein the pressing tool of at least one thermocompression bonding mechanism is provided so as to be driven along the longitudinal direction of the side portion of the substrate.   The component is a tape-like anisotropic conductive member having adhesiveness, and the anisotropic conductive member is thermocompression-bonded to different regions in the length direction of one side and the other side of the substrate. The component thermocompression bonding apparatus according to claim 2.   2. The component thermocompression bonding apparatus according to claim 1, further comprising three thermocompression bonding mechanisms for thermocompression bonding the component to three sides of the substrate. A first thermocompression bonding mechanism and a second heat for thermocompression bonding the component to one end in the longitudinal direction of the first side of the substrate and a second side adjacent to one end of the first side, respectively. A first crimping stage having a crimping mechanism;
The components are heated on the other end in the longitudinal direction of the first side of the substrate and on the third side adjacent to the other end of the first side and facing the second side, respectively. 2. The component thermocompression bonding apparatus according to claim 1, further comprising: a third thermocompression bonding mechanism and a second thermocompression bonding stage having a fourth thermocompression bonding mechanism. A component thermocompression bonding method for thermocompression bonding a component to a substrate,
Supplying the substrate to a drivable stage;
And a step of thermocompression bonding the component to at least two side portions of the substrate supplied to the stage.   The component thermocompression bonding method according to claim 6, wherein the component is thermocompression bonded to different regions in the longitudinal direction of one of the pair of opposing side portions of the substrate.

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