JP2011054760A - 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置 - Google Patents

半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置 Download PDF

Info

Publication number
JP2011054760A
JP2011054760A JP2009202379A JP2009202379A JP2011054760A JP 2011054760 A JP2011054760 A JP 2011054760A JP 2009202379 A JP2009202379 A JP 2009202379A JP 2009202379 A JP2009202379 A JP 2009202379A JP 2011054760 A JP2011054760 A JP 2011054760A
Authority
JP
Japan
Prior art keywords
driven
circuit
light emitting
composite device
drive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009202379A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011054760A5 (enExample
Inventor
Akira Nagumo
章 南雲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Oki Digital Imaging Corp
Original Assignee
Oki Data Corp
Oki Digital Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Data Corp, Oki Digital Imaging Corp filed Critical Oki Data Corp
Priority to JP2009202379A priority Critical patent/JP2011054760A/ja
Priority to US12/873,445 priority patent/US8704862B2/en
Publication of JP2011054760A publication Critical patent/JP2011054760A/ja
Publication of JP2011054760A5 publication Critical patent/JP2011054760A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
    • G03G15/04036—Details of illuminating systems, e.g. lamps, reflectors
    • G03G15/04045—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
    • G03G15/326—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by application of light, e.g. using a LED array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Facsimile Heads (AREA)
  • Thyristors (AREA)
  • Led Device Packages (AREA)
JP2009202379A 2009-09-02 2009-09-02 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置 Pending JP2011054760A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009202379A JP2011054760A (ja) 2009-09-02 2009-09-02 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置
US12/873,445 US8704862B2 (en) 2009-09-02 2010-09-01 Semiconductor composite device, method of manufacturing the same, optical print head and image forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009202379A JP2011054760A (ja) 2009-09-02 2009-09-02 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置

Publications (2)

Publication Number Publication Date
JP2011054760A true JP2011054760A (ja) 2011-03-17
JP2011054760A5 JP2011054760A5 (enExample) 2012-05-17

Family

ID=43624280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009202379A Pending JP2011054760A (ja) 2009-09-02 2009-09-02 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置

Country Status (2)

Country Link
US (1) US8704862B2 (enExample)
JP (1) JP2011054760A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014110291A (ja) * 2012-11-30 2014-06-12 Oki Data Corp 発光デバイス、発光デバイスの製造方法、発光素子プリントヘッド、及び画像形成装置
JP2015126189A (ja) * 2013-12-27 2015-07-06 株式会社沖データ 半導体装置、半導体装置の製造方法、光プリントヘッド及び画像形成装置
JP2017084992A (ja) * 2015-10-29 2017-05-18 株式会社沖データ 半導体複合装置、光プリントヘッド及び画像形成装置
JP2017135328A (ja) * 2016-01-29 2017-08-03 株式会社沖データ 発光素子装置及び光プリントヘッド
JP2019062046A (ja) * 2017-09-26 2019-04-18 株式会社沖データ 発光サイリスタ、光プリントヘッド、及び画像形成装置
JP2019079939A (ja) * 2017-10-25 2019-05-23 株式会社沖データ 半導体装置、光プリントヘッド、及び画像形成装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5366511B2 (ja) * 2008-11-14 2013-12-11 株式会社沖データ 駆動回路、光プリントヘッド及び画像形成装置
US8852994B2 (en) 2010-05-24 2014-10-07 Masimo Semiconductor, Inc. Method of fabricating bifacial tandem solar cells
US8455290B2 (en) * 2010-09-04 2013-06-04 Masimo Semiconductor, Inc. Method of fabricating epitaxial structures

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123908A (ja) * 1992-08-31 1994-05-06 Matsushita Electric Ind Co Ltd 光双安定素子を有するシフトレジスタ
JPH09283794A (ja) * 1996-04-08 1997-10-31 Nippon Sheet Glass Co Ltd 面発光素子および自己走査型発光装置
JP2001223319A (ja) * 1999-11-30 2001-08-17 Nissan Motor Co Ltd 半導体実装構造およびこれに用いる半導体チップセット
JP2004128175A (ja) * 2002-10-02 2004-04-22 Nippon Sheet Glass Co Ltd 発光素子および自己走査型発光素子アレイチップ
JP2004207444A (ja) * 2002-12-25 2004-07-22 Oki Data Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817774B2 (ja) * 2005-09-14 2011-11-16 株式会社沖データ 半導体複合装置光プリントヘッドおよび画像形成装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123908A (ja) * 1992-08-31 1994-05-06 Matsushita Electric Ind Co Ltd 光双安定素子を有するシフトレジスタ
JPH09283794A (ja) * 1996-04-08 1997-10-31 Nippon Sheet Glass Co Ltd 面発光素子および自己走査型発光装置
JP2001223319A (ja) * 1999-11-30 2001-08-17 Nissan Motor Co Ltd 半導体実装構造およびこれに用いる半導体チップセット
JP2004128175A (ja) * 2002-10-02 2004-04-22 Nippon Sheet Glass Co Ltd 発光素子および自己走査型発光素子アレイチップ
JP2004207444A (ja) * 2002-12-25 2004-07-22 Oki Data Corp 半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014110291A (ja) * 2012-11-30 2014-06-12 Oki Data Corp 発光デバイス、発光デバイスの製造方法、発光素子プリントヘッド、及び画像形成装置
JP2015126189A (ja) * 2013-12-27 2015-07-06 株式会社沖データ 半導体装置、半導体装置の製造方法、光プリントヘッド及び画像形成装置
JP2017084992A (ja) * 2015-10-29 2017-05-18 株式会社沖データ 半導体複合装置、光プリントヘッド及び画像形成装置
JP2017135328A (ja) * 2016-01-29 2017-08-03 株式会社沖データ 発光素子装置及び光プリントヘッド
JP2019062046A (ja) * 2017-09-26 2019-04-18 株式会社沖データ 発光サイリスタ、光プリントヘッド、及び画像形成装置
JP2019079939A (ja) * 2017-10-25 2019-05-23 株式会社沖データ 半導体装置、光プリントヘッド、及び画像形成装置

Also Published As

Publication number Publication date
US20110050838A1 (en) 2011-03-03
US8704862B2 (en) 2014-04-22

Similar Documents

Publication Publication Date Title
US8035115B2 (en) Semiconductor apparatus, print head, and image forming apparatus
JP2011054760A (ja) 半導体複合装置、この製造方法、光プリントヘッド及び画像形成装置
JP4817774B2 (ja) 半導体複合装置光プリントヘッドおよび画像形成装置
JP5132725B2 (ja) 半導体装置の製造方法
US8542262B2 (en) Light emitting element array, drive circuit, optical print head, and image forming apparatus
US8497893B2 (en) Semiconductor device, optical print head and image forming apparatus
JP4672329B2 (ja) 半導体装置、及び、それを用いたｌｅｄプリントヘッド、画像形成装置、半導体装置の製造方法
US8581946B2 (en) Driving device, optical print head and image forming device
JP2011194810A (ja) 駆動装置、プリントヘッド及び画像形成装置
JP4601464B2 (ja) 半導体装置、プリントヘッド、及びそれを用いた画像形成装置
US8471884B2 (en) Driving device, print head and image forming device
JP4326884B2 (ja) 半導体装置、ｌｅｄヘッド、及び画像形成装置
US20120001996A1 (en) Driving device, print head and image forming device
US8836743B2 (en) Drive device, print head and image forming apparatus
JP2005167062A (ja) 半導体装置、ｌｅｄヘッド、及びプリンタ
JP2015126189A (ja) 半導体装置、半導体装置の製造方法、光プリントヘッド及び画像形成装置
JP5460350B2 (ja) 駆動回路、駆動装置及び画像形成装置
JP2006237303A (ja) 半導体装置、ｌｅｄヘッド、及びこれを用いた画像形成装置
JP5197318B2 (ja) 駆動回路、記録ヘッド、画像形成装置および表示装置
US8587628B2 (en) Driver apparatus, print head, and image forming apparatus
JP5676342B2 (ja) 駆動装置、プリントヘッド及び画像形成装置
JP2015193169A (ja) 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120322

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120322

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140603

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20141111