JP2011035182A5 - - Google Patents

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Publication number
JP2011035182A5
JP2011035182A5 JP2009180388A JP2009180388A JP2011035182A5 JP 2011035182 A5 JP2011035182 A5 JP 2011035182A5 JP 2009180388 A JP2009180388 A JP 2009180388A JP 2009180388 A JP2009180388 A JP 2009180388A JP 2011035182 A5 JP2011035182 A5 JP 2011035182A5
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JP
Japan
Prior art keywords
layer
via hole
wiring
resin
resin layer
Prior art date
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Application number
JP2009180388A
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English (en)
Japanese (ja)
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JP5419583B2 (ja
JP2011035182A (ja
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Priority to JP2009180388A priority Critical patent/JP5419583B2/ja
Priority claimed from JP2009180388A external-priority patent/JP5419583B2/ja
Publication of JP2011035182A publication Critical patent/JP2011035182A/ja
Publication of JP2011035182A5 publication Critical patent/JP2011035182A5/ja
Application granted granted Critical
Publication of JP5419583B2 publication Critical patent/JP5419583B2/ja
Active legal-status Critical Current
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JP2009180388A 2009-08-03 2009-08-03 配線基板の製造方法 Active JP5419583B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009180388A JP5419583B2 (ja) 2009-08-03 2009-08-03 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009180388A JP5419583B2 (ja) 2009-08-03 2009-08-03 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011035182A JP2011035182A (ja) 2011-02-17
JP2011035182A5 true JP2011035182A5 (enExample) 2012-08-09
JP5419583B2 JP5419583B2 (ja) 2014-02-19

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ID=43763960

Family Applications (1)

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JP2009180388A Active JP5419583B2 (ja) 2009-08-03 2009-08-03 配線基板の製造方法

Country Status (1)

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JP (1) JP5419583B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150024093A (ko) * 2013-08-26 2015-03-06 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조 방법
WO2020027022A1 (ja) 2018-07-31 2020-02-06 京セラ株式会社 印刷配線板及び印刷配線板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3790063B2 (ja) * 1999-03-08 2006-06-28 新光電気工業株式会社 多層配線基板及びその製造方法並びに半導体装置
JP2001044589A (ja) * 1999-07-30 2001-02-16 Nitto Denko Corp 回路基板
JP2001267747A (ja) * 2000-03-22 2001-09-28 Nitto Denko Corp 多層回路基板の製造方法
JP4448610B2 (ja) * 2000-10-18 2010-04-14 日東電工株式会社 回路基板の製造方法
JP2004193520A (ja) * 2002-12-13 2004-07-08 Sumitomo Bakelite Co Ltd プリント配線板の製造方法
JP2005109108A (ja) * 2003-09-30 2005-04-21 Ibiden Co Ltd ビルドアッププリント配線板及びその製造方法
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法

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