JP2011023587A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2011023587A
JP2011023587A JP2009167915A JP2009167915A JP2011023587A JP 2011023587 A JP2011023587 A JP 2011023587A JP 2009167915 A JP2009167915 A JP 2009167915A JP 2009167915 A JP2009167915 A JP 2009167915A JP 2011023587 A JP2011023587 A JP 2011023587A
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JP
Japan
Prior art keywords
heat
chip
semiconductor chip
heat radiating
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009167915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011023587A5 (enExample
Inventor
Shigeaki Suganuma
茂明 菅沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009167915A priority Critical patent/JP2011023587A/ja
Priority to US12/828,844 priority patent/US20110012255A1/en
Publication of JP2011023587A publication Critical patent/JP2011023587A/ja
Publication of JP2011023587A5 publication Critical patent/JP2011023587A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2009167915A 2009-07-16 2009-07-16 半導体装置 Pending JP2011023587A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009167915A JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置
US12/828,844 US20110012255A1 (en) 2009-07-16 2010-07-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009167915A JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置

Publications (2)

Publication Number Publication Date
JP2011023587A true JP2011023587A (ja) 2011-02-03
JP2011023587A5 JP2011023587A5 (enExample) 2012-07-19

Family

ID=43464693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009167915A Pending JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置

Country Status (2)

Country Link
US (1) US20110012255A1 (enExample)
JP (1) JP2011023587A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020570A (ko) * 2011-08-18 2013-02-27 신꼬오덴기 고교 가부시키가이샤 반도체 장치
JP2014138018A (ja) * 2013-01-15 2014-07-28 Fujitsu Semiconductor Ltd 半導体装置とその製造方法
JP2015527734A (ja) * 2012-07-12 2015-09-17 マイクロン テクノロジー， インク． 断熱材を含む半導体デバイスパッケージおよび、係る半導体パッケージの作製および使用の方法
JP2022100009A (ja) * 2020-12-23 2022-07-05 富士通株式会社 半導体装置及び半導体装置の製造方法
JP2024076798A (ja) * 2022-11-25 2024-06-06 Ｎｅｘｔｏｒａｇｅ株式会社 電子機器

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2533281B1 (en) * 2010-02-04 2019-04-03 Panasonic Corporation Heat radiation device and electronic equipment using the same
US9082633B2 (en) * 2011-10-13 2015-07-14 Xilinx, Inc. Multi-die integrated circuit structure with heat sink
US9870978B2 (en) * 2013-02-28 2018-01-16 Altera Corporation Heat spreading in molded semiconductor packages
US9583415B2 (en) * 2013-08-02 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with thermal interface material on the sidewalls of stacked dies
US9082743B2 (en) 2013-08-02 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. 3DIC packages with heat dissipation structures
US20150170989A1 (en) * 2013-12-16 2015-06-18 Hemanth K. Dhavaleswarapu Three-dimensional (3d) integrated heat spreader for multichip packages
US10147666B1 (en) * 2014-07-31 2018-12-04 Xilinx, Inc. Lateral cooling for multi-chip packages
FR3063386B1 (fr) * 2017-02-28 2019-04-12 Alstom Transport Technologies Module de puissance avec systeme de refroidissement des cartes electroniques
JP6906045B2 (ja) * 2017-03-30 2021-07-21 日立Astemo株式会社 電子制御装置
US10296048B1 (en) * 2018-03-14 2019-05-21 Htc Corporation Portable electronic device with dual displays and a hinge structure
US12002728B2 (en) * 2018-06-20 2024-06-04 Qkm Technology (Dong Guan) Co., Ltd Integrated radiator having temperature gradient
JP7311540B2 (ja) * 2019-02-04 2023-07-19 株式会社ソニー・インタラクティブエンタテインメント 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法
TWM585962U (zh) * 2019-05-24 2019-11-01 宇瞻科技股份有限公司 固態硬碟散熱裝置
CN211404486U (zh) * 2019-08-09 2020-09-01 哈曼国际工业有限公司 用于ic元器件的散热器和ic散热组件
JP2022002261A (ja) * 2020-06-22 2022-01-06 キオクシア株式会社 ストレージ装置
US11460895B2 (en) * 2020-09-17 2022-10-04 Dell Products L.P. Thermal module assembly for a computing expansion card port of an information handling system
JP2022147620A (ja) * 2021-03-23 2022-10-06 キオクシア株式会社 メモリシステム、及びラベル部品
US20240006399A1 (en) * 2022-06-29 2024-01-04 Intel Corporation Die-stacked and molded architecture for memory on package (mop)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160311A (ja) * 1991-12-09 1993-06-25 Hitachi Ltd 半導体冷却構造及びそれを搭載したコンピュータ
JPH09283958A (ja) * 1996-04-16 1997-10-31 Nec Corp 集積回路の高効率冷却構造
JPH1012781A (ja) * 1996-06-20 1998-01-16 Hitachi Ltd 強制冷却用ヒートシンク
JP2001015966A (ja) * 1999-07-02 2001-01-19 Hitachi Ltd 半導体装置
JP2003060141A (ja) * 2001-08-20 2003-02-28 Otsuka Denki Kk 超伝熱部材およびそれを用いた冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
US5834337A (en) * 1996-03-21 1998-11-10 Bryte Technologies, Inc. Integrated circuit heat transfer element and method
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
US7714423B2 (en) * 2005-09-30 2010-05-11 Apple Inc. Mid-plane arrangement for components in a computer system
US7808780B2 (en) * 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160311A (ja) * 1991-12-09 1993-06-25 Hitachi Ltd 半導体冷却構造及びそれを搭載したコンピュータ
JPH09283958A (ja) * 1996-04-16 1997-10-31 Nec Corp 集積回路の高効率冷却構造
JPH1012781A (ja) * 1996-06-20 1998-01-16 Hitachi Ltd 強制冷却用ヒートシンク
JP2001015966A (ja) * 1999-07-02 2001-01-19 Hitachi Ltd 半導体装置
JP2003060141A (ja) * 2001-08-20 2003-02-28 Otsuka Denki Kk 超伝熱部材およびそれを用いた冷却装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130020570A (ko) * 2011-08-18 2013-02-27 신꼬오덴기 고교 가부시키가이샤 반도체 장치
JP2013042030A (ja) * 2011-08-18 2013-02-28 Shinko Electric Ind Co Ltd 半導体装置
KR102005313B1 (ko) 2011-08-18 2019-07-30 신꼬오덴기 고교 가부시키가이샤 반도체 장치
JP2015527734A (ja) * 2012-07-12 2015-09-17 マイクロン テクノロジー， インク． 断熱材を含む半導体デバイスパッケージおよび、係る半導体パッケージの作製および使用の方法
JP2014138018A (ja) * 2013-01-15 2014-07-28 Fujitsu Semiconductor Ltd 半導体装置とその製造方法
US9224711B2 (en) 2013-01-15 2015-12-29 Socionext Inc. Method for manufacturing a semiconductor device having multiple heat sinks
US9721866B2 (en) 2013-01-15 2017-08-01 Socionext Inc. Semiconductor device having multiple bonded heat sinks
JP2022100009A (ja) * 2020-12-23 2022-07-05 富士通株式会社 半導体装置及び半導体装置の製造方法
JP2024076798A (ja) * 2022-11-25 2024-06-06 Ｎｅｘｔｏｒａｇｅ株式会社 電子機器

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