JP2011023587A5 - - Google Patents

Download PDF

Info

Publication number
JP2011023587A5
JP2011023587A5 JP2009167915A JP2009167915A JP2011023587A5 JP 2011023587 A5 JP2011023587 A5 JP 2011023587A5 JP 2009167915 A JP2009167915 A JP 2009167915A JP 2009167915 A JP2009167915 A JP 2009167915A JP 2011023587 A5 JP2011023587 A5 JP 2011023587A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat radiating
heat
radiating means
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009167915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011023587A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009167915A priority Critical patent/JP2011023587A/ja
Priority claimed from JP2009167915A external-priority patent/JP2011023587A/ja
Priority to US12/828,844 priority patent/US20110012255A1/en
Publication of JP2011023587A publication Critical patent/JP2011023587A/ja
Publication of JP2011023587A5 publication Critical patent/JP2011023587A5/ja
Pending legal-status Critical Current

Links

Images

JP2009167915A 2009-07-16 2009-07-16 半導体装置 Pending JP2011023587A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009167915A JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置
US12/828,844 US20110012255A1 (en) 2009-07-16 2010-07-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009167915A JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置

Publications (2)

Publication Number Publication Date
JP2011023587A JP2011023587A (ja) 2011-02-03
JP2011023587A5 true JP2011023587A5 (enExample) 2012-07-19

Family

ID=43464693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009167915A Pending JP2011023587A (ja) 2009-07-16 2009-07-16 半導体装置

Country Status (2)

Country Link
US (1) US20110012255A1 (enExample)
JP (1) JP2011023587A (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2533281B1 (en) * 2010-02-04 2019-04-03 Panasonic Corporation Heat radiation device and electronic equipment using the same
JP5779042B2 (ja) * 2011-08-18 2015-09-16 新光電気工業株式会社 半導体装置
US9082633B2 (en) * 2011-10-13 2015-07-14 Xilinx, Inc. Multi-die integrated circuit structure with heat sink
US8816494B2 (en) * 2012-07-12 2014-08-26 Micron Technology, Inc. Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
JP6056490B2 (ja) 2013-01-15 2017-01-11 株式会社ソシオネクスト 半導体装置とその製造方法
US9870978B2 (en) * 2013-02-28 2018-01-16 Altera Corporation Heat spreading in molded semiconductor packages
US9583415B2 (en) * 2013-08-02 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with thermal interface material on the sidewalls of stacked dies
US9082743B2 (en) 2013-08-02 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. 3DIC packages with heat dissipation structures
US20150170989A1 (en) * 2013-12-16 2015-06-18 Hemanth K. Dhavaleswarapu Three-dimensional (3d) integrated heat spreader for multichip packages
US10147666B1 (en) * 2014-07-31 2018-12-04 Xilinx, Inc. Lateral cooling for multi-chip packages
FR3063386B1 (fr) * 2017-02-28 2019-04-12 Alstom Transport Technologies Module de puissance avec systeme de refroidissement des cartes electroniques
JP6906045B2 (ja) * 2017-03-30 2021-07-21 日立Astemo株式会社 電子制御装置
US10296048B1 (en) * 2018-03-14 2019-05-21 Htc Corporation Portable electronic device with dual displays and a hinge structure
US12002728B2 (en) * 2018-06-20 2024-06-04 Qkm Technology (Dong Guan) Co., Ltd Integrated radiator having temperature gradient
JP7311540B2 (ja) * 2019-02-04 2023-07-19 株式会社ソニー・インタラクティブエンタテインメント 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法
TWM585962U (zh) * 2019-05-24 2019-11-01 宇瞻科技股份有限公司 固態硬碟散熱裝置
CN211404486U (zh) * 2019-08-09 2020-09-01 哈曼国际工业有限公司 用于ic元器件的散热器和ic散热组件
JP2022002261A (ja) * 2020-06-22 2022-01-06 キオクシア株式会社 ストレージ装置
US11460895B2 (en) * 2020-09-17 2022-10-04 Dell Products L.P. Thermal module assembly for a computing expansion card port of an information handling system
JP7484700B2 (ja) * 2020-12-23 2024-05-16 富士通株式会社 半導体装置及び半導体装置の製造方法
JP2022147620A (ja) * 2021-03-23 2022-10-06 キオクシア株式会社 メモリシステム、及びラベル部品
US20240006399A1 (en) * 2022-06-29 2024-01-04 Intel Corporation Die-stacked and molded architecture for memory on package (mop)
JP2024076798A (ja) * 2022-11-25 2024-06-06 Ｎｅｘｔｏｒａｇｅ株式会社 電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3030526B2 (ja) * 1991-12-09 2000-04-10 株式会社日立製作所 半導体冷却構造
US5886408A (en) * 1994-09-08 1999-03-23 Fujitsu Limited Multi-chip semiconductor device
US5834337A (en) * 1996-03-21 1998-11-10 Bryte Technologies, Inc. Integrated circuit heat transfer element and method
JPH09283958A (ja) * 1996-04-16 1997-10-31 Nec Corp 集積回路の高効率冷却構造
JPH1012781A (ja) * 1996-06-20 1998-01-16 Hitachi Ltd 強制冷却用ヒートシンク
JP2001015966A (ja) * 1999-07-02 2001-01-19 Hitachi Ltd 半導体装置
JP2003060141A (ja) * 2001-08-20 2003-02-28 Otsuka Denki Kk 超伝熱部材およびそれを用いた冷却装置
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
US7714423B2 (en) * 2005-09-30 2010-05-11 Apple Inc. Mid-plane arrangement for components in a computer system
US7808780B2 (en) * 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation

Similar Documents

Publication Publication Date Title
JP2011023587A5 (enExample)
JP2011023587A (ja) 半導体装置
EP2984652B1 (en) Thermal management for solid-state drive
JP2011134956A5 (enExample)
KR20110015160A (ko) 반도체 모듈
JP2014112606A5 (enExample)
JP6917287B2 (ja) 電子制御装置
US9076749B2 (en) Electronic system comprising stacked electronic devices comprising integrated-circuit chips
JPWO2010050087A1 (ja) 積層型半導体装置及びその製造方法
JP2017108130A5 (enExample)
WO2011087117A1 (ja) ヒートシンク
JP4887273B2 (ja) 電子制御装置
US20170010642A1 (en) Electronic assembly and electronic device
JP2013251545A5 (enExample)
JP2012079733A (ja) 電子部品回路基板
TW201427583A (zh) 散熱裝置
TW201351582A (zh) 電子裝置
JP2009252894A5 (enExample)
JP2013165117A (ja) 半導体装置
JP2017126668A (ja) 半導体パッケージ
JP6371245B2 (ja) 熱伝導性部材、冷却構造及び装置
CN103533812A (zh) 一种合体散热器
CN207369500U (zh) 一种元件散热结构
JP6494855B2 (ja) 電子モジュール
TWI388973B (zh) 電子構裝結構